Heat pipe heat conduction performance detection device

Abstract

This invention relates to the field of heat pipe testing technology, specifically disclosing a heat pipe thermal conductivity testing device, including a machine base and a testing mechanism. The testing mechanism is located on the top surface of the machine base and includes a pair of support plates and a water-cooling assembly. The pair of support plates are located on the machine base, and a heat sink and a first motor are mounted on the top surface of the support plates. A first temperature sensor is located inside the heat sink. The first motor is mounted on the top surface of the support plates, and a first electric actuator is coaxially mounted on the output end of the first motor. A fixing plate is located at the output end of the first electric actuator. A heating block is located on the bottom surface of the end of the fixing plate. A second temperature sensor is located inside the heating block. The water-cooling assembly is located on the machine base. A control system electrically connected to both the first and second temperature sensors is located on the machine base. By independently controlling the temperature of the two heating blocks and sharing a cooling circuit with the two heat sinks, the device simulates the temperature uniformity and heat transfer limit of the heat pipe when multiple heat sources are working simultaneously, making the test results closer to reality and improving the accuracy of the test data.

Description

Technical Field

[0001] This invention relates to the field of heat pipe testing technology, and in particular to a device for testing the thermal conductivity of heat pipes. Background Technology

[0002] Heat pipes, with their excellent thermal conductivity, are widely used in the heat dissipation systems of electronic devices such as laptops, servers, and graphics cards. As the core heat transfer element connecting the heat-generating chip and the heat sink fins, the thermal conductivity of the heat pipe directly determines the heat dissipation capacity of the entire cooling system. Therefore, the thermal conductivity of the heat pipe must be strictly tested before the finished product leaves the factory to eliminate substandard products and ensure the consistency of the final heat dissipation module quality.

[0003] In the existing technology, the heat pipe thermal conductivity testing device adopts a single heating-single heat dissipation structure, that is, each station can only apply one heating source and one heat dissipation reference surface to a single heat pipe. This testing method will overestimate or underestimate the performance of the heat pipe in actual use with multiple heat sources, resulting in the heat dissipation performance of qualified heat pipes failing to meet the standards after installation, or the performance of unqualified heat pipes meeting the requirements after actual installation, which is prone to misjudgment and waste of resources. Summary of the Invention

[0004] This application provides a heat pipe thermal conductivity testing device. By independently controlling the temperature of the two heating blocks and sharing a cooling circuit with the two heat sinks, it simulates the temperature uniformity and heat transfer limit of the heat pipe when multiple heat sources are working simultaneously. This makes the test results closer to the actual use scenario, improves the accuracy of the test data, and avoids misjudgment and waste of resources.

[0005] The heat pipe thermal conductivity testing device provided in this application adopts the following technical solution: A heat pipe thermal conductivity testing device includes a machine base and a testing mechanism. The testing mechanism is located on the top surface of the machine base and includes a pair of support plates and a water-cooling assembly. The pair of support plates are mounted on the machine base, and a heat sink and a first motor are mounted on the top surface of the support plates. A first temperature sensor is installed inside the heat sink. The detection end of the first temperature sensor is flush with the top surface of the heat sink. The first motor is vertically mounted on the top surface of the support plate outside one side of the heat sink, and a first electric actuator is coaxially mounted on the output end of the first motor. A fixing plate is horizontally mounted on the output end of the first electric actuator. A heating block is mounted on the bottom surface of the end of the fixing plate away from the first electric actuator. A second temperature sensor is installed inside the heating block. The detection end of the second temperature sensor is flush with the bottom surface of the heating block. The water-cooling assembly is located on the machine base and can provide water cooling for the two heat sinks. A control system is provided on the machine base. The control system is electrically connected to both the first and second temperature sensors.

[0006] By adopting the above technical solution, when testing the thermal conductivity of a heat pipe, the heat pipe to be tested is placed on two heat sinks. The first motor drives the fixing plate to rotate, causing the heating block to move to the top of the heat sink. The first electric push rod drives the fixing plate to move down and press the heat pipe, and the heating end of the heating block begins to heat up. The water cooling assembly continuously cools the two heat sinks. The first temperature sensor and the second temperature sensor are used to collect the temperature data of the hot and cold ends of the heat pipe. By adopting independent temperature control for the two heating blocks and a shared cooling circuit for the two heat sinks, the uniformity of the heat pipe and the heat transfer limit when multiple heat sources work simultaneously are simulated, so that the test results are closer to the actual use scenario and the accuracy of the test results is guaranteed.

[0007] Preferably, the water-cooling assembly includes a water tank and a water pump; the water tank is installed on the bottom surface of the machine; the water pump is installed on the top surface of the machine, with an inlet pipe connected to the water tank at the pump input end and an outlet pipe at the pump output end; a water-cooling channel is provided inside the heat sink; the end of the outlet pipe away from the water pump is connected to the inlet end of the water-cooling channel in each of the two heat sinks; and a return pipe connected to the water tank is installed at the outlet end of the water-cooling channel in each of the two heat sinks.

[0008] By adopting the above technical solution, when testing the thermal conductivity of the heat pipe, the water pump extracts the coolant from the water tank and delivers it to the water cooling channel of the two heat sinks to cool them down, so that the temperature of the two heat sinks is the same, thereby simulating the real thermal coupling state of multiple heat sources sharing the same heat dissipation module. The return water pipe is set up for the return flow of coolant so that the coolant can be circulated.

[0009] Preferably, the outer wall of the water tank is evenly distributed with multiple semiconductor cooling chips.

[0010] By adopting the above technical solution, the semiconductor cooling chip can be used to cool the coolant in the water tank in a timely manner, so that the coolant can maintain a good water cooling effect on the heat sink during the circulation process.

[0011] Preferably, a stacking rack is installed on the top surface of the machine platform; a vertical plate is vertically installed on the top surface of the machine platform; an electromagnetic slide rail electrically connected to the control system is installed on the side wall of the vertical plate; the electromagnetic slide rail is horizontally arranged along the stacking rack towards the detection mechanism, and an electromagnetic sliding plate is slidably mounted on the electromagnetic slide rail; a straight plate is horizontally fixed to the outer wall of the electromagnetic sliding plate; an adsorption component electrically connected to the control system is provided on the straight plate; the adsorption component can adsorb the workpieces on the stacking rack and place them on two heat dissipation blocks.

[0012] By adopting the above technical solution, the heat pipes to be tested are stacked on the stacking rack. When the heat pipes are tested, the control system controls the electromagnetic slide rail to drive the electromagnetic slide plate to move, so that the straight plate moves to the stacking rack. Then, the adsorption component adsorbs and grabs the heat pipes, and the electromagnetic slide plate drives the straight plate to the testing station to release the heat pipes, thus completing the automatic loading, unloading and transfer of heat pipes, so as to realize the automated testing of heat pipes.

[0013] Preferably, the adsorption assembly includes a second electric actuator and a vacuum pump; the second electric actuator is vertically mounted on a straight plate, and a connecting plate is horizontally mounted on the output end of the second electric actuator; multiple vacuum suction cups are evenly distributed on the bottom surface of the connecting plate; the vacuum pump is mounted on the top surface of the connecting plate, and the vacuum pump input end is provided with a suction pipe that communicates with multiple vacuum suction cups, and the vacuum pump output end is provided with an exhaust pipe; the control system is electrically connected to both the second electric actuator and the vacuum pump.

[0014] By adopting the above technical solution, when the heat pipe is adsorbed and gripped, the control system controls the second electric push rod to move the connecting plate down, so that the vacuum suction cup comes into contact with the heat pipe. The vacuum pump discharges the air in the vacuum suction cup, so that the heat pipe is adsorbed at the bottom of the vacuum suction cup, so as to realize the transfer of the heat pipe and avoid damage to the surface of the heat pipe by gripping.

[0015] Preferably, each of the vacuum suction cups is provided with a pressure relief valve electrically connected to the control system on its outer wall.

[0016] By adopting the above technical solutions, the pressure relief valve can achieve rapid and controllable workpiece release, significantly improving the efficiency, reliability and safety of the entire automated testing process.

[0017] Preferably, a receiving box is provided on the top surface of the machine; the receiving box has two receiving cavities.

[0018] By adopting the above technical solution, the two cavities of the receiving box are respectively the qualified area and the unqualified area. According to the test results, they can be used to store qualified and unqualified heat pipes respectively, thereby realizing automatic sorting and storage after heat pipe testing.

[0019] Preferably, the top surface of the machine base is provided with a support seat located at the bottom of the two support plates; the top surface of the support seat is provided with a sliding groove, and a second motor is installed on the outer wall of one end of the support seat; the output end of the second motor is coaxially fixed to a lead screw extending into the groove; a pair of sliders that are threadedly engaged with the lead screw are sleeved on the outside of the lead screw; the sliders are slidably engaged with the inner wall of the groove; the threads on the outer wall of the lead screw that engage with the two sliders are symmetrically arranged; the two support plates are respectively fixed to the top surface of the two sliders.

[0020] By adopting the above technical solution, starting the second motor can drive the lead screw to rotate, causing the two sliders to move towards or away from each other along the lead screw axis, adjusting the position of the two support plates, and thus adjusting the distance between the two support plates according to the length of the heat pipe to be tested, thereby improving the versatility of the equipment.

[0021] Preferably, a stirring motor is installed on the outer wall of one end of the water tank; a stirring shaft extending into the water tank is coaxially fixed to the output end of the stirring motor; and a stirring plate is provided on the outer wall of the stirring shaft.

[0022] By adopting the above technical solution, during the circulation of coolant in the water tank, the stirring motor is started to drive the stirring shaft to rotate, causing the stirring plate to agitate the coolant in the water tank, so that the semiconductor cooling chip can uniformly cool the coolant and reduce the phenomenon of temperature stratification in the coolant in the water tank.

[0023] Preferably, a third electric actuator is vertically mounted on the machine base at the bottom of the stacking rack; the third electric actuator is electrically connected to the control system, and the output end of the third electric actuator is provided with a top plate that can push the heat pipe.

[0024] By adopting the above technical solution, the control system can control the third electric push rod to drive the top plate to extend and push the heat pipe upward from the bottom of the heat pipe, so that the heat pipe located at the bottom layer can automatically move upward to a suitable position for easy adsorption and clamping.

[0025] In summary, this application has the following beneficial effects: 1. Place the heat pipe to be tested on two heat sinks. The first motor drives the fixing plate to rotate, moving the heating block to the top of the heat sink. The first electric push rod drives the fixing plate to move down, so that the heating block presses the heat pipe. During the test, the heating end of the heating block starts to heat up, and the water cooling assembly continuously cools the two heat sinks. The first temperature sensor and the second temperature sensor collect the temperature data of the hot and cold ends of the heat pipe and transmit it to the control system for judgment. By adopting independent temperature control of the two heating blocks and sharing a cooling circuit between the two heat sinks, the uniformity of the heat pipe and the heat transfer limit when multiple heat sources work at the same time are simulated, so that the test results are closer to reality and the accuracy of the test results is guaranteed. 2. When adsorbing and gripping the heat pipe, the control system controls the second electric push rod to move the connecting plate down, so that the vacuum suction cup comes into contact with the heat pipe. The vacuum pump is used to expel the air in the vacuum suction cup, so that the heat pipe is adsorbed at the bottom of the vacuum suction cup, so as to realize the heat pipe transfer and avoid damage to the heat pipe by using a clamping method for heat pipe transfer. 3. Starting the second motor can drive the lead screw to rotate, causing the two sliders to move towards or away from each other along the lead screw axis. This adjusts the position of the two support plates so that the distance between the two support plates can be adjusted according to the length of the heat pipe to be tested, thus improving the versatility of the equipment. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the heat pipe thermal conductivity testing device; Figure 2 This is a schematic diagram of the structure of the testing organization in this application; Figure 3 This is a schematic diagram of the mating structure of the fixing plate and the heating block in this application; Figure 4 This is a schematic diagram of the internal structure of the water tank in this application; Figure 5 This is a schematic diagram of the support structure in this application; Figure 6 This is a schematic diagram of the cooperation structure between the stacking rack and the third electric actuator in this application; Figure 7 This is a schematic diagram of the adsorption component in this application.

[0027] Explanation of reference numerals in the attached drawings: 1. Machine base; 11. Vertical plate; 12. Receiving box; 2. Detection mechanism; 21. Support plate; 22. Water cooling assembly; 221. Water tank; 222. Water pump; 223. Inlet pipe; 224. Outlet pipe; 225. Return pipe; 226. Semiconductor cooling chip; 23. Heat sink; 231. First temperature sensor; 24. First motor; 25. First electric actuator; 26. Fixing plate; 27. Heating block; 28. Second temperature sensor; 29. Support base; 291, second motor; 292, lead screw; 293, slider; 3, control system; 4, stacking rack; 41, third electric actuator; 411, top plate; 5, electromagnetic slide rail; 51, electromagnetic sliding plate; 52, straight plate; 6, adsorption assembly; 61, second electric actuator; 62, vacuum pump; 621, air extraction pipe; 622, exhaust pipe; 63, connecting plate; 64, vacuum suction cup; 641, pressure relief valve; 7, stirring motor; 71, stirring shaft; 72, stirring plate. Detailed Implementation

[0028] The present invention will be further described in detail below with reference to the accompanying drawings. Identical components are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "upper," "lower," "bottom," and "top" used in the following description refer to directions in the drawings, while the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0029] This invention discloses a heat pipe thermal conductivity testing device, such as... Figure 1 , Figure 2 and Figure 3As shown, the system includes a machine base 1. Multiple detection mechanisms 2 are evenly distributed along the length of the top surface of the machine base 1. Each detection mechanism 2 includes a pair of support plates 21 and a water-cooling assembly 22 mounted on the machine base 1. Heat sinks 23, made of copper, are mounted on the top surfaces of both support plates 21, and have water-cooling channels inside. A first motor 24 is vertically mounted on the top surface of the support plates 21. A vertically arranged first electric push rod 25 is coaxially mounted on the output end of the first motor 24. A fixing plate 26 is horizontally fixed to the output end of the first electric push rod 25. A heating block 27, made of copper, is mounted on the bottom surface of the fixing plate 26 away from the first electric push rod 25, and has a heating rod embedded inside as a heating element. The water-cooling assembly 22, mounted on the machine base 1, is used to continuously dissipate cooling water to the two water-cooling channels to cool the two heat sinks 23. A first temperature sensor 231 is installed inside the heat sink 23, and the detection end of the first temperature sensor 231 is flush with the top surface of the heat sink 23. A second temperature sensor 28 is installed inside the heating block 27, and the detection end of the second temperature sensor 28 is flush with the bottom surface of the heating block 27. A control system 3 is installed on the machine base 1, and the input end of the control system 3 is electrically connected to both the first temperature sensor 231 and the second temperature sensor 28.

[0030] The heat pipe to be tested is placed on two heat sinks 23. The first motor 24 drives the fixing plate 26 to rotate, causing the heating block 27 to move to the top of the heat sink 23. The first electric push rod 25 drives the fixing plate 26 to move down and press the heat pipe. When the heat pipe is tested for thermal conductivity, the heating end of the heating block 27 starts to heat up. The water cooling component 22 continuously cools the two heat sinks 23. The first temperature sensor 231 and the second temperature sensor 28 collect the temperature data of the hot and cold ends of the heat pipe and send it to the control system 3. This enables the test of whether the heat pipe's thermal conductivity is qualified. By using independent temperature control for the two heating blocks 27 and a shared cooling circuit for the two heat sinks 23, the uniformity of the heat pipe and the heat transfer limit when multiple heat sources work simultaneously are simulated, making the test results closer to reality and improving the accuracy of the test results.

[0031] like Figure 1 and Figure 2 As shown, the water-cooling assembly 22 includes a water tank 221 installed on the bottom surface of the machine base 1 and a water pump 222 installed on the top surface of the machine base 1. The output end of the water pump 222 is provided with an inlet pipe 223 that communicates with the inside of the water tank 221, and the output end of the water pump 222 is provided with an outlet pipe 224. The outlet pipe 224 is a T-shaped pipe. The two ends of the outlet pipe 224 away from the water pump 222 are respectively connected to the inlet end of the water-cooling channel in the two heat sinks 23. The outlet end of the water-cooling channel in the two heat sinks 23 is fixedly connected with a return pipe 225 that communicates with the water tank 221.

[0032] Starting the water pump 222 can deliver the coolant in the water tank 221 to the water cooling channel of the two heat sinks 23 to cool the heat sinks 23 with water, so that the temperature of the two heat sinks 23 is the same, simulating the real thermal coupling state of multiple heat sources sharing the same heat dissipation module. The return water pipe 225 is set for the return flow of coolant, so as to realize the circulation of coolant and save resources.

[0033] like Figure 1 and Figure 4 As shown, a plurality of semiconductor cooling chips 226 are evenly distributed on two mutually distant outer walls of the water tank 221; a stirring motor 7 is horizontally mounted on one end of the outer wall of the water tank 221, and a stirring shaft 71 extending into the water tank 221 is coaxially fixed to the output end of the stirring motor 7; a plurality of stirring plates 72 are fixed to the outer wall of the stirring shaft 71.

[0034] During the circulation of coolant, the semiconductor refrigeration chip 226 can cool the coolant in a timely manner. By starting the stirring motor 7, the stirring shaft 71 can be driven to rotate, causing the stirring plate 72 to stir the coolant, so that the semiconductor refrigeration chip 226 can cool the coolant evenly, reduce the occurrence of temperature stratification in the coolant, and ensure the cooling effect of the coolant.

[0035] like Figure 1 , Figure 2 and Figure 5 As shown, each pair of support plates 21 has a support base 29 fixed to the machine base 1 on its bottom surface. The top surface of the support base 29 has a groove arranged along the line connecting the two support plates 21. A second motor 291 is horizontally installed on the outer wall of one end of the support base 29. The output end of the second motor 291 is coaxially fixed to a lead screw 292 extending into the groove. A pair of sliders 293 are sleeved on the outside of the lead screw 292 and are threadedly driven to engage with the lead screw 292. The sliders 293 are slidably engaged with the inner wall of the groove. The top surfaces of the two sliders 293 are fixed to the bottom surfaces of the two connecting plates 63 respectively. The threads on the outer wall of the lead screw 292 that engage with the two sliders 293 are symmetrically arranged.

[0036] When the second motor 291 is started and drives the lead screw 292 to rotate, the two sliders 293 will move towards or away from each other along the axial direction of the lead screw 292 to adjust their positions, so as to adjust the distance between the two support plates 21 according to the length of the heat pipe to be tested, thereby improving the versatility of the equipment.

[0037] like Figure 1 and Figure 6As shown, a pair of stacking racks 4 for stacking heat pipes are provided on the top surface of the machine base 1. A vertical plate 11 is vertically installed on the top surface of the machine base 1. An electromagnetic slide rail 5 electrically connected to the output terminal of the control system 3 is installed on the outer wall of the vertical plate 11. The electromagnetic slide rail 5 is arranged horizontally along the line connecting the multiple stacking racks 4 and the support base 29. An electromagnetic slide plate 51 is slidably installed on the electromagnetic slide rail 5. A straight plate 52 is horizontally fixed to the outer wall of the electromagnetic slide plate 51. A pair of adsorption components 6 for adsorbing and clamping heat pipes are provided at the end of the straight plate 52 away from the electromagnetic slide plate 51. The adsorption components 6 are electrically connected to the output terminal of the control system 3. A third electric push rod 41 is vertically installed on the top surface of the machine base 1 at the position corresponding to the stacking rack 4. The third electric push rod 41 is electrically connected to the output terminal of the control system 3, and a top plate 411 for pushing the heat pipes on the stacking rack 4 is horizontally fixed to the top of the third electric push rod 41.

[0038] The heat pipes to be tested are stacked on the stacking rack 4. The control system 3 controls the electromagnetic slide rail 5 to drive the electromagnetic slide plate 51 to move, so that the straight plate 52 moves to the stacking rack 4. After the adsorption component 6 adsorbs and grabs the heat pipes, the electromagnetic slide plate 51 drives the straight plate 52 to move to the detection station to release the heat pipes, thus completing the automatic loading, unloading and transfer of heat pipes, so as to realize the automated detection of heat pipes. The third electric push rod 41 can drive the top plate 411 to move up and push the heat pipes, so that the bottom heat pipes can automatically move up to a suitable position for easy adsorption and clamping.

[0039] like Figure 1 and Figure 7 As shown, the adsorption assembly 6 includes a second electric actuator 61 and a vacuum pump 62. The second electric actuator 61 is vertically mounted at the end of the straight plate 52. A connecting plate 63 is horizontally mounted at the output end of the second electric actuator 61. Multiple vacuum suction cups 64 are evenly distributed on the bottom surface of the connecting plate 63 along the direction of the heat pipe. The vacuum pump 62 is mounted on the top surface of the connecting plate 63. The input end of the vacuum pump 62 is provided with a suction pipe 621 that communicates with multiple vacuum suction cups 64. The output end of the vacuum pump 62 is provided with an exhaust pipe 622. Each vacuum suction cup 64 is provided with a pressure relief valve 641 on its outer wall. The output end of the control system 3 is electrically connected to the second electric actuator 61, the vacuum pump 62, and the pressure relief valve 641.

[0040] When gripping the heat pipe, the control system 3 controls the second electric push rod 61 to move down, so that the vacuum suction cup 64 contacts the top surface of the heat pipe. Then, the vacuum pump 62 is started to extract the air in the vacuum suction cup 64, realizing the adsorption and gripping of the heat pipe. When the control system 3 controls the pressure relief valve 641 to open, the heat pipe can be released quickly and controllably, thus facilitating the gripping and release of the heat pipe at different work positions.

[0041] like Figure 1 As shown, a receiving box 12 is provided on the top surface of the machine 1, and a pair of receiving cavities are provided inside the receiving box 12 for placing qualified products and unqualified products respectively.

[0042] The two cavities of the receiving box 12 can be used to place qualified and unqualified products respectively, thereby realizing the classified collection of the tested heat pipes.

[0043] Working principle: When performing heat pipe thermal conductivity testing, the heat pipes to be tested are stacked on the stacking rack 4. The control system 3 controls the electromagnetic slide rail 5 to drive the electromagnetic slide plate 51 to move, so that the straight plate 52 drives the vacuum suction cup 64 to the top of the heat pipe at the stacking rack 4. The control system 3 then controls the second electric push rod 61 to drive the connecting plate 63 to move down, so that the vacuum suction cup 64 contacts the heat pipe. The vacuum pump 62 expels the air in the vacuum suction cup 64. When the heat pipe is attracted to the bottom of the vacuum suction cup 64, the second electric push rod 61 drives the heat pipe to move up, realizing the heat pipe gripping. Then the electromagnetic slide plate 51 and the straight plate 52 move to move the heat pipe to the heat sink 23. Control system 3 controls the second electric push rod 61 to move the heat pipe down and place it on the two heat sinks 23. The first motor 24 drives the fixing plate 26 to rotate, so that the heating block 27 moves to the top of the heat sink 23. The first electric push rod 25 drives the fixing plate 26 down and presses the heat pipe. The heating end of the heating block 27 starts to heat up. The water pump 222 draws the coolant from the water tank 221 and delivers it to the water cooling channel of the two heat sinks 23 to circulate and cool the heat sinks 23. The first temperature sensor 231 and the second temperature sensor 28 collect the temperature data of the hot and cold ends of the heat pipe and transmit the detected temperature data to control system 3. Control system 3 judges whether the heat pipe's thermal conductivity is qualified. By using independent temperature control of the two heating blocks 27 and a shared cooling circuit for the two heat sinks 23, the uniformity of the heat pipe and the heat transfer limit when multiple heat sources work at the same time are simulated, making the test results closer to the actual scenario. After the test is completed, the first electric push rod 25 drives the fixed plate 26 to move upward, the first motor 24 drives the fixed plate 26 to rotate so that the heating block 27 moves away from the top of the heat sink 23, the first electric push rod 25 drives the vacuum suction cup 64 to move downward to grab the heat pipe, the control system 3 then controls the electromagnetic slide rail 5 to move the heat pipe, and according to the test results, the heat pipe is moved to the designated position in the receiving box 12 for placement, thereby realizing the automated testing of the heat pipe's thermal conductivity.

[0044] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heat pipe thermal conductivity testing device, characterized in that: The system includes a machine base (1) and a testing mechanism (2); the testing mechanism (2) is located on the top surface of the machine base (1), and the testing mechanism (2) includes a pair of support plates (21) and a water-cooling assembly (22); the pair of support plates (21) are located on the machine base (1), and a heat sink (23) and a first motor (24) are installed on the top surface of the support plates (21); a first temperature sensor (231) is installed inside the heat sink (23); the detection end of the first temperature sensor (231) is flush with the top surface of the heat sink (23); the first motor (24) is vertically installed on the top surface of the support plate (21) outside one side of the heat sink (23), and a first electric actuator is coaxially installed on the output end of the first motor (24). The first electric actuator (25) has a horizontally mounted fixing plate (26) at its output end; a heating block (27) is mounted on the bottom surface of the fixing plate (26) away from the first electric actuator (25); a second temperature sensor (28) is installed inside the heating block (27); the detection end of the second temperature sensor (28) is flush with the bottom surface of the heating block (27); the water cooling assembly (22) is set on the machine base (1), and the water cooling assembly (22) can perform water cooling on the two heat sinks (23); a control system (3) is set on the machine base (1); the control system (3) is electrically connected to the first temperature sensor (231) and the second temperature sensor (28).

2. The heat pipe thermal conductivity testing device according to claim 1, characterized in that: The water-cooling assembly (22) includes a water tank (221) and a water pump (222); the water tank (221) is installed on the bottom surface of the machine base (1); the water pump (222) is installed on the top surface of the machine base (1), the input end of the water pump (222) is provided with an inlet pipe (223) communicating with the water tank (221), and the output end of the water pump (222) is provided with an outlet pipe (224); the heat sink (23) is provided with a water-cooling channel inside; the end of the outlet pipe (224) away from the water pump (222) is respectively connected to the inlet end of the water-cooling channel in the two heat sinks (23); the outlet end of the water-cooling channel in the two heat sinks (23) is provided with a return pipe (225) communicating with the water tank (221).

3. The heat pipe thermal conductivity testing device according to claim 2, characterized in that: Multiple semiconductor cooling chips (226) are evenly distributed on the outer wall of the water tank (221).

4. The heat pipe thermal conductivity testing device according to claim 1, characterized in that: A stacking rack (4) is installed on the top surface of the machine base (1); a vertical plate (11) is vertically installed on the top surface of the machine base (1); an electromagnetic slide rail (5) electrically connected to the control system (3) is installed on the side wall of the vertical plate (11); the electromagnetic slide rail (5) is horizontally arranged along the stacking rack (4) toward the detection mechanism (2), and an electromagnetic slide plate (51) is slidably installed on the electromagnetic slide rail (5); a straight plate (52) is horizontally fixed to the outer wall of the electromagnetic slide plate (51); an adsorption component (6) electrically connected to the control system (3) is installed on the straight plate (52); the adsorption component (6) can adsorb the workpiece on the stacking rack (4) and place it on two heat sinks (23).

5. The heat pipe thermal conductivity testing device according to claim 4, characterized in that: The adsorption assembly (6) includes a second electric actuator (61) and a vacuum pump (62); the second electric actuator (61) is vertically mounted on a straight plate (52), and a connecting plate (63) is horizontally mounted on the output end of the second electric actuator (61); a plurality of vacuum suction cups (64) are evenly distributed on the bottom surface of the connecting plate (63); the vacuum pump (62) is mounted on the top surface of the connecting plate (63), and the input end of the vacuum pump (62) is provided with a suction pipe (621) that is connected to the plurality of vacuum suction cups (64), and the output end of the vacuum pump (62) is provided with an exhaust pipe (622); the control system (3) is electrically connected to the second electric actuator (61) and the vacuum pump (62).

6. The heat pipe thermal conductivity testing device according to claim 5, characterized in that: Each of the vacuum suction cups (64) is provided with a pressure relief valve (641) electrically connected to the control system (3) on its outer wall.

7. The heat pipe thermal conductivity testing device according to claim 1, characterized in that: The top surface of the machine base (1) is provided with a receiving box (12); the receiving box (12) has two receiving cavities.

8. The heat pipe thermal conductivity testing device according to claim 1, characterized in that: The machine base (1) is provided with a support seat (29) located at the bottom of the two support plates (21) on its top surface; the support seat (29) has a sliding groove on its top surface, and a second motor (291) is installed on the outer wall of one end of the support seat (29); the output end of the second motor (291) is coaxially fixed to a lead screw (292) extending into the groove; a pair of sliders (293) are sleeved on the outside of the lead screw (292) and are threadedly engaged with the lead screw (292); the sliders (293) are slidably engaged with the inner wall of the groove; the threads on the outer wall of the lead screw (292) that engage with the two sliders (293) are symmetrically arranged; the two support plates (21) are respectively fixed to the top surface of the two sliders (293).

9. The heat pipe thermal conductivity testing device according to claim 2, characterized in that: A stirring motor (7) is installed on the outer wall of one end of the water tank (221); a stirring shaft (71) extending into the water tank (221) is coaxially fixed to the output end of the stirring motor (7); a stirring plate (72) is provided on the outer wall of the stirring shaft (71).

10. The heat pipe thermal conductivity testing device according to claim 4, characterized in that: The machine base (1) is vertically mounted with a third electric push rod (41) located at the bottom of the stacking rack (4); the third electric push rod (41) is electrically connected to the control system (3), and the output end of the third electric push rod (41) is provided with a top plate (411) that can push the heat pipe.

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