Double-sided nanoimprint method and system

By employing a double-sided nanoimprinting method with an alignment system and error compensation mechanism on a single substrate, the problem that existing technologies can only produce nanoscale patterns on a single surface is solved, enabling the simultaneous formation of nanostructures on both sides, reducing costs and improving alignment accuracy.

CN123047191APending Publication Date: 2026-11-06HIMAX TECH LTD
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Patent Information

Application Number
CN202511907118.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2025-05-05
Filing Date
2025-12-17
Publication Date
2026-11-06

AI Technical Summary

Technical Problem

Existing photolithography technology can only create nanoscale patterns on a single surface of a substrate, requiring multiple imprinting processes, which increases manufacturing costs and time, and may cause misalignment problems.

Method used

A double-sided nanoimprinting method is employed, using an alignment system and error compensation mechanism. Alignment marks and a CCD camera are used to align the first and second working molds, and a roller and curing step are combined to simultaneously form nanostructures on both sides of a single substrate.

Benefits of technology

This technology enables the simultaneous formation of nanostructures on both sides of a single substrate, reducing process steps, lowering costs, and improving alignment accuracy and efficiency.

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Abstract

The present application provides a double-sided nanoimprint method. First, a substrate is loaded into an imprint machine table and fixed by a clamp. The substrate has a first resin layer and a second resin layer on a first surface and a second surface of the substrate, respectively. A first working mold and a second working mold are provided and located on the first resin layer and the second resin layer, respectively. The first working mold comprises a first alignment mark, and the second working mold comprises a second alignment mark. An alignment system is used to perform an alignment step on the first working mold and the second working mold, so that the first alignment mark is aligned with the second alignment mark. A nanoimprint step is performed on the first resin layer and the second resin layer simultaneously using the first working mold and the second working mold. The first resin layer and the second resin layer are cured.
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Description

Technical Field

[0001] This invention relates to the field of nanoimprint technology, and more particularly to a double-sided nanoimprint technology. Background Technology

[0002] Nanoimprinting is a precision manufacturing technique that uses a mold with nanoscale patterns to transfer these tiny structures onto a resin material coated on a substrate. This process typically involves applying pressure, combined with ultraviolet irradiation or heating, to cure the resin and ultimately replicate the nanoscale pattern from the mold onto the substrate.

[0003] However, the main limitation of existing lithography technology is that it can only create microstructures on a single surface of the substrate in a single manufacturing process. This means that if nanoscale patterns need to be formed on both surfaces of the substrate, multiple lithography processes are required, increasing manufacturing costs and time, and potentially causing misalignment problems. Summary of the Invention

[0004] The main objective of this invention is to provide a double-sided nanoimprinting method and system to address the shortcomings or deficiencies of existing technologies.

[0005] This invention provides a method for performing double-sided nanoimprinting on a single substrate, comprising the following steps: loading a substrate into an imprinting machine and fixing it with a clamp, wherein the substrate has a first resin layer on a first surface of the substrate and a second resin layer on a second surface of the substrate; providing a first working mold and a second working mold, respectively located on the first resin layer and the second resin layer of the substrate, wherein the first working mold includes a first alignment mark and the second working mold includes a second alignment mark; performing an alignment step on the first working mold and the second working mold using an alignment system, so that the first alignment mark aligns with the second alignment mark; simultaneously performing a nanoimprinting step on the first resin layer and the second resin layer of the substrate using the first working mold and the second working mold; and performing a curing step to cure the first resin layer and the second resin layer to form a double-sided nanostructure on the substrate.

[0006] According to an embodiment of the present invention, the alignment step includes capturing the position of the first alignment mark on the first working mold using an alignment CCD camera.

[0007] According to an embodiment of the present invention, the alignment step further includes aligning the second alignment mark on the second working mold based on the position of the captured first alignment mark.

[0008] According to an embodiment of the present invention, the alignment step includes using an error compensation mechanism to adjust the position of the second working mold based on the positions of the first alignment mark and the second alignment mark.

[0009] According to an embodiment of the present invention, the nanoimprinting step includes simultaneously using a first roller and a second roller to press a first nanostructure of the first working mold into the first resin layer and to press a second nanostructure of the second working mold roller into the second resin layer.

[0010] According to an embodiment of the present invention, the curing step includes irradiating the first resin layer and the second resin layer with ultraviolet light.

[0011] According to an embodiment of the present invention, the curing step includes applying a vacuum and irradiating the first resin layer and the second resin layer with ultraviolet light.

[0012] According to an embodiment of the present invention, the curing step includes applying heat to the first resin layer and the second resin layer.

[0013] According to an embodiment of the present invention, before performing the nanoimprinting step, the first working mold and the second working mold are tilted at an angle relative to the substrate to prevent premature contact.

[0014] According to an embodiment of the present invention, the angle is between 2 and 7 degrees, but is not limited to this angle.

[0015] Another aspect of the present invention provides a system for performing double-sided nanoimprinting on a single substrate, comprising: an imprinting machine including a clamp for fixing a substrate having a first resin layer on a first surface of the substrate and a second resin layer on a second surface of the substrate; a first working die and a second working die, respectively located on the first resin layer and the second resin layer of the substrate, wherein the first working die includes a first alignment mark and the second working die includes a second alignment mark; and an alignment system for aligning the first working die and the second working die based on the first alignment mark and the second alignment mark.

[0016] According to an embodiment of the present invention, the alignment system includes at least one CCD camera for detecting the first alignment mark and the second alignment mark, and an error compensation mechanism for accurately aligning the first working mold and the second working mold based on the detection result.

[0017] In another aspect, the present invention provides a method for performing double-sided nanoimprinting on a single substrate, comprising the following steps: providing a substrate, wherein the substrate has a first surface and a second surface opposite to each other, the first surface or the second surface being a curved surface, and the substrate having a first resin layer located on the first surface of the substrate; providing a first working mold and a second working mold, respectively located on the first surface and the second surface of the substrate, wherein the first working mold includes a first alignment mark, the second working mold includes a second alignment mark, and wherein a second resin layer is disposed on the second working mold; performing an alignment step using an alignment system to align the first alignment mark with the second alignment mark; performing a nanoimprinting step by pressing the first working mold down onto the first resin layer of the substrate and pressing the second working mold down onto the second surface of the substrate, so that the second resin layer directly contacts the second surface; and performing a curing step to cure the first resin layer and the second resin layer to form a double-sided nanostructure on the substrate.

[0018] According to an embodiment of the present invention, the alignment step includes capturing the position of the first alignment mark on the first working mold using an alignment CCD camera.

[0019] According to an embodiment of the present invention, the alignment step further includes aligning the second alignment mark on the second working mold based on the position of the captured first alignment mark.

[0020] According to an embodiment of the present invention, the alignment step includes using an error compensation mechanism to adjust the position of the second working mold based on the positions of the first alignment mark and the second alignment mark.

[0021] According to an embodiment of the present invention, the nanoimprinting step includes simultaneously using a first elastomer and a second elastomer to press a first nanostructure of the first working mold into the first resin layer, and fixing the second resin layer to the second surface of the substrate.

[0022] According to an embodiment of the present invention, the first elastomer and the second elastomer comprise transparent rubber or an air bladder.

[0023] According to an embodiment of the present invention, the curing step includes irradiating the first resin layer and the second resin layer with ultraviolet light.

[0024] According to an embodiment of the present invention, the curing step includes applying a vacuum and irradiating the first resin layer and the second resin layer with ultraviolet light.

[0025] According to an embodiment of the present invention, the curing step includes applying heat to the first resin layer and the second resin layer. Attached Figure Description

[0026] Figures 1 to 4 This is a schematic diagram of a method for performing double-sided nanoimprinting on a single substrate according to an embodiment of the present invention.

[0027] Figures 5 to 8 This is a schematic diagram of a method for performing double-sided nanoimprinting on a single substrate according to another embodiment of the present invention.

[0028] The attached figures are labeled as follows: 1 Imprinting machine 10. Shell 100 substrates 102 Fixture 104 Error Compensation Mechanism AD Alignment System HP Curing Process M1 First Alignment Mark M2 Second Alignment Mark N1 First Nanopattern N2 Second Nanopattern R1 First Roller R2 Second Roller RB1 First elastic body RB2 Second Elastomer RL1 First Resin Layer RL2 Second Resin Layer S1 First Surface S2 Second Surface ST1 First Working Mold ST2 Second Working Mold θ angle Detailed Implementation

[0029] In the following description, details will be illustrated with reference to the accompanying drawings, the contents of which form part of the detailed description of the specification, and specific examples of which the embodiments can be implemented. The embodiments described below are given sufficient detail to enable those skilled in the art to implement them.

[0030] Of course, other embodiments may be adopted, or any structural, logical, and electrical changes may be made without departing from the embodiments described herein. Therefore, the detailed description below should not be regarded as limiting; rather, the embodiments included therein will be defined by the appended claims.

[0031] Please see Figures 1 to 4 This is a schematic diagram illustrating a method for performing double-sided nanoimprinting on a single substrate according to an embodiment of the present invention. Figure 1As shown, a substrate 100 is first provided and loaded into an imprinting machine 1, and fixed with a clamp 102. According to an embodiment of the present invention, the imprinting machine 1 includes a housing 10, and the substrate 100 and the clamp 102 are located within the housing 10. According to an embodiment of the present invention, the substrate 100 may be a light-transmitting substrate, including, but not limited to, a plastic substrate, a glass substrate, an oxide substrate, a metal substrate, or a semiconductor substrate. According to an embodiment of the present invention, the thickness of the substrate 100 is, for example, 0.2-1.0 mm, for example, 0.6 mm, but is not limited thereto.

[0032] According to an embodiment of the present invention, a substrate 100 has a first resin layer RL1 located on a first surface S1 of the substrate 100 and a second resin layer RL2 located on a second surface S2 of the substrate 100. According to an embodiment of the present invention, for example, the first resin layer RL1 and the second resin layer RL2 may comprise a pre-cured polymer resin, but are not limited thereto. According to an embodiment of the present invention, the first resin layer RL1 and the second resin layer RL2 may be any suitable curable coating. In other embodiments, the first resin layer RL1 and the second resin layer RL2 may comprise a photosensitive polymer or a thermosensitive polymer.

[0033] Next, a first working mold ST1 and a second working mold ST2 are provided in the imprinting machine 1, and the first working mold ST1 and the second working mold ST2 are disposed on the first resin layer RL1 and the second resin layer RL2 of the substrate 100. According to an embodiment of the present invention, for example, the first working mold ST1 and the second working mold ST2 may contain materials such as silicon carbide, silicon nitride, or silicon carbonitride, but are not limited thereto. According to an embodiment of the present invention, for example, the first working mold ST1 and the second working mold ST2 may respectively contain a first nanopattern N1 and a second nanopattern N2.

[0034] According to an embodiment of the present invention, the first working die ST1 includes a first alignment mark M1, and the second working die ST2 includes a second alignment mark M2. According to an embodiment of the present invention, the printing press 1 includes an alignment system AD, such as a CCD (Charge-Coupled Device) camera. Then, the first working die ST1 and the second working die ST2 are aligned using the alignment system AD, so that the first alignment mark M1 is aligned with the second alignment mark M2.

[0035] According to an embodiment of the present invention, for example, the above alignment step includes using an alignment CCD camera to capture the position of the first alignment mark M1 on the first working mold ST1, then aligning the second alignment mark M1 on the second working mold ST2 based on the captured position of the first alignment mark M1, and then using an error compensation mechanism 104 to adjust the position of the second working mold ST2 according to the positions of the first alignment mark M1 and the second alignment mark M2.

[0036] like Figure 2 As shown, next, a nanoimprinting step is performed on the first resin layer RL1 and the second resin layer RL2 of the substrate 100 simultaneously using a first working mold ST1 and a second working mold ST2. According to an embodiment of the present invention, the above-mentioned nanoimprinting step includes simultaneously using a first roller R1 and a second roller R2 to press a first nanostructure N1 of the first working mold ST1 into the first resin layer RL1, and to press a second nanostructure N2 of the second working mold ST2 into the second resin layer RL2.

[0037] According to an embodiment of the present invention, before performing the above-described nanoimprinting step, the first working mold ST1 and the second working mold ST2 are tilted relative to the substrate 100 at an angle θ to prevent premature contact. According to an embodiment of the present invention, the angle θ is, for example, between 2 and 7 degrees, but is not limited thereto.

[0038] After pressing the first resin layer RL1 and the second resin layer RL2 onto the first working mold ST1 and the second working mold ST2, a curing process HP is then performed to cure the first resin layer RL1 and the second resin layer RL2, thereby forming a double-sided nanostructure on the substrate 100. According to an embodiment of the invention, the curing step HP includes, for example, irradiating the first resin layer RL1 and the second resin layer RL2 with ultraviolet light. According to another embodiment of the invention, the curing step HP includes applying a vacuum and irradiating the first resin layer RL1 and the second resin layer RL2 with ultraviolet light. According to another embodiment of the invention, the curing step HP includes applying heat to the first resin layer RL1 and the second resin layer RL2.

[0039] like Figure 4 As shown, after the curing process HP is completed, the demolding process is carried out, for example, by using the first roller R1 and the second roller R2 to roll in opposite directions and lift the first working mold ST1 and the second working mold ST2 at a predetermined angle.

[0040] like Figure 1As shown, another aspect of the present invention discloses a system for performing double-sided nanoimprinting on a single substrate, comprising: an imprinting machine 1, including a clamp 102 for fixing a substrate 100, the substrate 100 having a first resin layer RL1 located on a first surface S1 of the substrate 100 and a second resin layer RL2 located on a second surface S2 of the substrate 100; a first working mold ST1 and a second working mold ST2, respectively located on the first resin layer RL1 and the second resin layer RL2 of the substrate 100, wherein the first working mold ST1 includes a first alignment mark M1 and the second working mold ST2 includes a second alignment mark M2; and an alignment system AD for aligning the first working mold ST1 and the second working mold ST2 based on the first alignment mark M1 and the second alignment mark M2.

[0041] According to an embodiment of the present invention, the alignment system AD includes at least one CCD camera for detecting a first alignment mark M1 and a second alignment mark M2, and an error compensation mechanism 104 for accurately aligning a first working mold ST1 and a second working mold ST2 according to the detection results.

[0042] Please see Figures 5 to 8 This is a schematic diagram illustrating a method for double-sided nanoimprinting on a single substrate according to another embodiment of the present invention, wherein the same components, regions, layers, or materials are still represented by the same symbols. For simplicity, Figures 5 to 8 Omitted Figures 1 to 4 The components include the housing 10 and the clamp 102.

[0043] like Figure 5 As shown, a substrate 100 is first provided, for example, a substrate with a curved surface. According to an embodiment of the invention, the substrate 100 has a first surface S1 and a second surface S2, wherein the first surface S1 may be a convex surface and the second surface S2 may be a concave surface, but the invention is not limited thereto. In other embodiments, the substrate 100 may also have two convex surfaces or two concave surfaces. According to an embodiment of the invention, the substrate 100 may be a light-transmitting substrate, including but not limited to, a plastic substrate, a glass substrate, an oxide substrate, a metal substrate, or a semiconductor substrate. According to an embodiment of the invention, the thickness of the substrate 100 is, for example, 0.2-1.0 mm, for example, 0.6 mm, but is not limited thereto.

[0044] According to an embodiment of the present invention, a first resin layer RL1 is disposed on the first surface S1 of the substrate 100. According to an embodiment of the present invention, the first resin layer RL1 may, for example, comprise a pre-cured polymer resin, but is not limited thereto. According to an embodiment of the present invention, the first resin layer RL1 may be any suitable curable coating. In other embodiments, the first resin layer RL1 may comprise a photosensitive polymer or a thermosensitive polymer.

[0045] Next, a first working mold ST1 and a second working mold ST2 are provided in the imprinting machine 1, and the first working mold ST1 and the second working mold ST2 are respectively disposed on the first surface S1 and the second surface S2 of the substrate 100. According to an embodiment of the present invention, for example, the first working mold ST1 and the second working mold ST2 may contain materials such as silicon carbide, silicon nitride, or silicon carbonitride, but are not limited thereto. According to an embodiment of the present invention, for example, the first working mold ST1 and the second working mold ST2 may respectively contain a first nanopattern N1 and a second nanopattern N2.

[0046] According to an embodiment of the present invention, a second resin layer RL2 is disposed on the second nanopattern N2, and the second nanopattern N2 on the second working mold ST2 has been transferred into the second resin layer RL2. According to an embodiment of the present invention, for example, the second resin layer RL2 may contain a pre-cured polymer resin, but is not limited thereto. According to an embodiment of the present invention, the second resin layer RL2 may be any suitable curable coating. In other embodiments, the second resin layer RL2 may contain a photosensitive polymer or a thermosensitive polymer.

[0047] According to an embodiment of the present invention, a first working mold ST1 includes a first alignment mark M1, and a second working mold ST2 includes a second alignment mark M2. According to an embodiment of the present invention, an alignment system AD can be used to perform an alignment step on the first working mold ST1 and the second working mold ST2, so that the first alignment mark M1 is aligned with the second alignment mark M2.

[0048] According to an embodiment of the present invention, for example, the alignment step described above includes using an alignment CCD camera to capture the position of the first alignment mark M1 on the first working mold ST1, then aligning the second alignment mark M1 on the second working mold ST2 based on the captured position of the first alignment mark M1, then performing error compensation, and adjusting the position of the second working mold ST2 according to the positions of the first alignment mark M1 and the second alignment mark M2 until precise alignment is achieved.

[0049] like Figures 6 to 7As shown, a nanoimprinting step is then performed, in which the first working mold ST1 presses down on the first resin layer RL1 of the substrate 100, and the second working mold ST2 presses down on the second surface S2 of the substrate 100, so that the second resin layer RL2 directly contacts the second surface S2 of the substrate 100. According to an embodiment of the present invention, the above nanoimprinting step includes simultaneously using a first elastomer RB1 and a second elastomer RB2 to press the first nanostructure N1 of the first working mold ST1 into the first resin layer RL1, and to fix the second resin layer RL2 to the second surface S2 of the substrate 100. According to an embodiment of the present invention, the first elastomer RB1 and the second elastomer RB2 are, for example, transparent elastic materials, but are not limited thereto. According to an embodiment of the present invention, the first elastomer RB1 and the second elastomer RB2 are, for example, transparent rubber or air bladders, but are not limited thereto.

[0050] Following the nanoimprinting step, a curing process HP is then performed to cure the first resin layer RL1 and the second resin layer RL2, thereby forming a double-sided nanostructure on the substrate 100. According to an embodiment of the invention, the curing step HP includes, for example, irradiating the first resin layer RL1 and the second resin layer RL2 with ultraviolet light. According to another embodiment of the invention, the curing step HP includes applying a vacuum and irradiating the first resin layer RL1 and the second resin layer RL2 with ultraviolet light. According to another embodiment of the invention, the curing step HP includes applying heat to the first resin layer RL1 and the second resin layer RL2.

[0051] like Figure 8 As shown, after completing the curing process HP, the demolding process is then carried out. For example, the first elastomer RB1 and the second elastomer RB2 are moved first, and then the first working mold ST1 and the second working mold ST2 are removed using a clamp.

[0052] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made in accordance with the claims of the present invention should be included within the scope of the present invention.

Claims

1. A method for performing double-sided nanoimprinting on a single substrate, characterized in that, The method includes the following steps: A substrate is loaded into an imprinting machine and fixed with a clamp, wherein the substrate has a first resin layer on a first surface of the substrate and a second resin layer on a second surface of the substrate. A first working mold and a second working mold are provided, respectively located on the first resin layer and the second resin layer of the substrate, wherein the first working mold includes a first alignment mark and the second working mold includes a second alignment mark; The alignment system is used to perform an alignment step on the first working mold and the second working mold, so that the first alignment mark is aligned with the second alignment mark; The first working mold and the second working mold are used to simultaneously perform a nanoimprinting step on the first resin layer and the second resin layer of the substrate; as well as A curing step is performed to cure the first resin layer and the second resin layer to form a double-sided nanostructure on the substrate.

2. The method as described in claim 1, characterized in that, The alignment step involves using a positioning CCD camera to capture the position of the first alignment mark on the first working mold.

3. The method as described in claim 2, characterized in that, The alignment step further includes aligning the second alignment mark on the second working mold based on the position of the captured first alignment mark.

4. The method as described in claim 3, characterized in that, The alignment step includes using an error compensation mechanism to adjust the position of the second working mold according to the positions of the first alignment mark and the second alignment mark.

5. The method as described in claim 1, characterized in that, The nanoimprinting step includes simultaneously using a first roller and a second roller to press a first nanostructure of a first working mold into the first resin layer and to press a second nanostructure of a second working mold into the second resin layer.

6. The method as described in claim 1, characterized in that, The curing step involves irradiating the first resin layer and the second resin layer with ultraviolet light.

7. The method as described in claim 1, characterized in that, The curing step includes applying a vacuum and irradiating the first resin layer and the second resin layer with ultraviolet light.

8. The method as described in claim 1, characterized in that, The curing step involves applying heat to the first resin layer and the second resin layer.

9. The method as described in claim 1, characterized in that, Before performing the nanoimprinting step, the first working mold and the second working mold are tilted at an angle relative to the substrate to prevent premature contact.

10. The method as described in claim 9, characterized in that, The angle is between 2 and 7 degrees.

11. A system for performing double-sided nanoimprinting on a single substrate, characterized in that, Include: An imprinting machine includes a clamp for fixing a substrate having a first resin layer on a first surface of the substrate and a second resin layer on a second surface of the substrate; A first working mold and a second working mold are respectively located on the first resin layer and the second resin layer of the substrate, wherein the first working mold includes a first alignment mark, and the second working mold includes a second alignment mark; and A pair of alignment systems for aligning the first working mold and the second working mold based on the first alignment mark and the second alignment mark.

12. The system as claimed in claim 11, characterized in that, The alignment system includes at least one CCD camera for detecting the first alignment mark and the second alignment mark, and an error compensation mechanism for accurately aligning the first working mold and the second working mold based on the detection results.

13. A method for performing double-sided nanoimprinting on a single substrate, characterized in that, The method includes the following steps: A substrate is provided, wherein the substrate has a first surface and a second surface opposite to each other, the first surface or the second surface being a curved surface, and the substrate has a first resin layer located on the first surface of the substrate; A first working mold and a second working mold are provided, respectively located on the first surface and the second surface of the substrate, wherein the first working mold includes a first alignment mark, the second working mold includes a second alignment mark, and a second resin layer is disposed on the second working mold; The alignment system is used to perform an alignment step on the first working mold and the second working mold, so that the first alignment mark is aligned with the second alignment mark; The nanoimprinting step involves pressing a first working mold against the first resin layer of the substrate and pressing a second working mold against the second surface of the substrate, so that the second resin layer directly contacts the second surface; and A curing step is performed to cure the first resin layer and the second resin layer to form a double-sided nanostructure on the substrate.

14. The method as described in claim 13, characterized in that, The alignment step involves using a positioning CCD camera to capture the position of the first alignment mark on the first working mold.

15. The method as described in claim 14, characterized in that, The alignment step further includes aligning the second alignment mark on the second working mold based on the position of the captured first alignment mark.

16. The method as described in claim 15, characterized in that, The alignment step includes using an error compensation mechanism to adjust the position of the second working mold according to the positions of the first alignment mark and the second alignment mark.

17. The method as described in claim 13, characterized in that, The nanoimprinting step includes simultaneously using a first elastomer and a second elastomer to press a first nanostructure of a first working mold into the first resin layer, pressing a second nanostructure of a second working mold into the second resin layer, and fixing the second resin layer to the second surface of the substrate.

18. The method as described in claim 17, characterized in that, The first elastomer and the second elastomer comprise transparent rubber or an air bladder.

19. The method as described in claim 13, characterized in that, The curing step involves irradiating the first resin layer and the second resin layer with ultraviolet light.

20. The method as described in claim 13, characterized in that, The curing step includes applying a vacuum and irradiating the first resin layer and the second resin layer with ultraviolet light.

21. The method as described in claim 13, characterized in that, The curing step involves applying heat to the first resin layer and the second resin layer.