Method for path planning of a laser machining device and related products

Abstract

This application discloses a path planning method for laser processing equipment and related products. The method includes: dividing the design to be processed along a first direction based on a first segmentation width to obtain multiple sub-designs, wherein the first segmentation width is less than or equal to the width of the processing area formed by the first motion platform in the first direction; and generating a processing path for processing the design to be processed based on the multiple sub-designs, wherein the processing path includes a first working path of the first motion platform and a second working path of the second motion platform. The implementation method of this application is beneficial for improving the processing effect of the workpiece.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a path planning method, path planning device, electronic device, laser processing equipment, laser processing system, and computer-readable storage medium for laser processing equipment. Background Technology

[0002] Laser processing equipment mainly includes galvanometer laser processing equipment and gantry laser equipment. Gantry laser equipment achieves engraving by moving the laser head on a gantry, while galvanometer laser processing equipment processes workpieces by deflecting the laser beam through a galvanometer.

[0003] To improve processing efficiency, a laser processing device combining a galvanometer and a gantry has been developed. By controlling the movement of the gantry and the coordination of the galvanometer, high processing efficiency and a large processing area can be achieved. However, in large-format processing, gaps can easily appear in the patterns processed on the workpiece, affecting the processing results. Summary of the Invention

[0004] This application proposes a path planning method, path planning device, electronic device, laser processing equipment, laser processing system, and computer-readable storage medium for laser processing equipment, which can reduce splicing gaps and improve the processing effect of workpieces.

[0005] This application adopts the following technical solution.

[0006] In a first aspect, embodiments of this application provide a path planning method for a laser processing device. The laser processing device includes a first motion platform and a second motion platform. The first motion platform is used to drive a laser beam to move along the U-axis and V-axis on a workpiece. The second motion platform is used to drive the first motion platform or the workpiece to move along the X-axis and / or Y-axis. The U-axis and the X-axis are parallel, and the Y-axis and the V-axis are parallel.

[0007] The path planning method includes:

[0008] The design to be processed is divided along the first direction based on the first segmentation width to obtain multiple sub-designs. The first segmentation width is determined based on error information. The first surface is used to process the design to be processed. The first segmentation width is less than or equal to the width of the processing area formed by the first motion platform in the first direction.

[0009] Based on the multiple sub-designs, a processing path is generated for processing the design to be processed. The processing path includes a first working path of the first motion platform and a second working path of the second motion platform.

[0010] When machining a workpiece, the flatness of its first surface affects the actual landing point of the laser beam, resulting in machining gaps between each sub-design and the previous sub-design. The width of these gaps is correlated with the flatness of the first surface. This embodiment determines a first segmentation width based on the flatness of the first surface of the workpiece, dividing the design to be machined into multiple sub-designs along a first direction. This controls the width of the gaps caused by the flatness of the first surface within a preset range. Therefore, based on these multiple sub-designs, a machining path is generated to process the design to be machined, allowing adjacent sub-designs to connect almost seamlessly after machining. This eliminates or reduces gaps between adjacent sub-designs, improving the machining effect of the workpiece.

[0011] Secondly, embodiments of this application provide a path planning device for a laser processing equipment. The laser processing equipment includes a first motion platform and a second motion platform. The first motion platform is used to drive a laser beam to move along the U-axis and V-axis on a workpiece. The second motion platform is used to drive the first motion platform or the workpiece to move along the X-axis and / or Y-axis. The U-axis and the X-axis are parallel, and the Y-axis and the V-axis are parallel.

[0012] The path planning device includes:

[0013] The segmentation module is used to segment the design to be processed along a first direction based on a first segmentation width to obtain multiple sub-designs. The first segmentation width is determined based on the flatness of the first surface of the workpiece. The first surface is used to process the design to be processed. The first segmentation width is less than or equal to the width of the processing area formed by the first motion platform in the first direction.

[0014] The generation module is used to generate a processing path for processing the design to be processed based on the plurality of sub-designs. The processing path includes a first working path of the first motion platform and a second working path of the second motion platform.

[0015] Thirdly, an electronic device provided in the embodiments of this application includes a processor, a memory, and a computer program or instructions stored in the memory, wherein the processor executes the computer program or instructions to implement the steps in the method designed in the first aspect above.

[0016] Fourthly, embodiments of this application provide a laser processing device.

[0017] The laser processing equipment includes a first motion platform and a second motion platform. The first motion platform is used to drive the laser beam to move along the U-axis and V-axis on the workpiece. The second motion platform is used to drive the first motion platform or the workpiece to move along the X-axis and / or Y-axis. The U-axis and the X-axis are parallel, and the Y-axis and the V-axis are parallel.

[0018] The first motion platform is used for a first path motion planned based on the steps of the method designed in the first aspect above, and the second motion platform is used for a second path motion planned based on the steps of the method designed in the first aspect above, so as to process the workpiece.

[0019] Fifthly, embodiments of this application provide a laser processing system, the laser processing system comprising:

[0020] A laser processing device, comprising a first motion platform and a second motion platform, wherein the first motion platform is used to drive a laser beam to move along the U-axis and V-axis on a workpiece, and the second motion platform is used to drive the first motion platform or the workpiece to move along the X-axis and / or Y-axis, wherein the U-axis and the X-axis are parallel, and the Y-axis and the V-axis are parallel;

[0021] The host computer, which is communicatively connected to the laser processing equipment, is used to: acquire the design to be processed and, based on the steps in the method designed in the first aspect above, plan the working paths of the first motion platform and the second motion platform so that the laser processing equipment processes the design to be processed.

[0022] A sixth aspect is a computer-readable storage medium provided for embodiments of this application, wherein a computer program or instructions are stored thereon, which, when executed, implement the steps of the method designed in the first aspect described above. For example, the computer program or instructions are executed by a processor.

[0023] A seventh aspect provides a computer program product for embodiments of this application, comprising a computer program or instructions, wherein when the computer program or instructions are executed, the steps in the method designed in the first aspect described above are performed. For example, the computer program or instructions are executed by a processor.

[0024] The beneficial effects of the technical solutions in aspects two through seven can be found in the technical effects of the technical solution in aspect one, and will not be repeated here. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 A schematic diagram illustrating the division of a design to be processed into multiple sub-designs, provided for an embodiment of this application;

[0027] Figure 2 A schematic diagram of the movement path of a macro platform and the processing path of a light spot provided for an embodiment of this application;

[0028] Figure 3 A schematic diagram illustrating the generation of a gap, provided for an embodiment of this application;

[0029] Figure 4 A schematic diagram illustrating the presence of gaps between adjacent processing areas, provided for an embodiment of this application;

[0030] Figure 5 A schematic diagram of a laser processing device provided for an embodiment of this application;

[0031] Figure 6 This is a schematic diagram of a laser processing system according to an embodiment of this application;

[0032] Figure 7 A schematic diagram illustrating the effect of flatness on the landing point of a laser beam, provided for an embodiment of this application;

[0033] Figure 8 A schematic flowchart illustrating a path planning method for a laser processing device provided in this application embodiment;

[0034] Figure 9 A schematic diagram of the processing area on the workpiece corresponding to the design to be processed, provided for an embodiment of this application;

[0035] Figure 10 A schematic diagram illustrating a reduction in the splicing gap after dividing the width, provided for an embodiment of this application;

[0036] Figure 11 A schematic diagram of a first surface provided for an embodiment of this application;

[0037] Figure 12 A schematic diagram of a processing area j and a flatness signal provided for an embodiment of this application;

[0038] Figure 13 A schematic diagram of a processing path provided for an embodiment of this application;

[0039] Figure 14 A functional module block diagram of a path planning device for laser processing equipment provided for embodiments of this application;

[0040] Figure 15 This is a schematic diagram of the structure of an electronic device provided for an embodiment of this application. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0042] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “the,” and “the” used in the embodiments, descriptions, and claims of this application are also intended to include the plural forms unless the context clearly indicates otherwise. It should be understood that the term “and / or” as used herein is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character “ / ” in this document generally indicates that the preceding and following related objects are in an “or” relationship. It should be understood that although the terms “first,” “second,” and similar words may be used in the embodiments of this application, they do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, “a” or “one,” and similar words do not indicate a quantity limitation, but rather indicate the existence of at least one. “A plurality” in the embodiments of this application refers to two or more.

[0043] To facilitate understanding of the technical solution of this application, the relevant terms involved in this application will first be explained and described.

[0044] Host computer: User-level devices, such as users' computers, smartphones, PCs, etc.

[0045] Workpieces: Various raw materials to be processed, such as wood, glass, marble, metal, etc., placed on the processing platform of the laser processing equipment.

[0046] Gantry laser processing equipment: Equipment that performs laser processing by moving a laser head along the X and Y axes;

[0047] Galvanometer laser processing equipment mainly consists of a field mirror, a galvanometer, and a driver. The galvanometer includes reflectors along the U and V axes. The working principle of the galvanometer laser processing equipment is to incident a laser beam onto the two reflectors, and then the driver controls the rotation of the U-axis and V-axis reflectors, thereby changing the direction of the laser beam. This allows the laser beam with a certain power density to focus on the workpiece as required, leaving a permanent mark on the workpiece surface and completing the processing.

[0048] Multi-axis linkage: Multi-axis refers to the linkage between the U and V axes of a galvanometer controlled by a motor, and the X and Y axes of the gantry or the workpiece controlled by a mechanical guide rail. Multi-axis linkage can be three-axis, four-axis, five-axis, or six-axis, primarily involving the coordinated operation of one or more high-speed motion axes and one or more low-speed motion axes. "High-speed" and "low-speed" are relative concepts, indicating a significant difference in speed between the two.

[0049] Multi-axis linkage laser processing equipment: This type of laser processing equipment features multi-axis linkage capabilities. In terms of hardware, it can be a gantry-type motion frame with a galvanometer module containing U and V-axis degrees of freedom mounted on it. This allows the equipment to control one or two of the galvanometer's U and V-axis degrees of freedom to move synchronously with one or two of the X and Y-axis degrees of freedom of the guide platform (gantry). This enables coordinated control of the X, Y, U, and V axes to achieve planar machining of the workpiece, resulting in high-precision and high-efficiency laser processing. Alternatively, multi-axis linkage laser processing equipment can be a device that uses a laser head with a galvanometer module to drive the workpiece to move along the X and Y axes.

[0050] First motion platform: the galvanometer platform in the laser head of a multi-axis linkage laser processing equipment.

[0051] Second motion platform: The platform on which the gantry is located on a multi-axis linkage laser processing equipment or the platform that drives the workpiece to move along the X-axis or Y-axis.

[0052] To facilitate understanding of the technical solution of this application, the following explanation, in conjunction with the accompanying drawings, explains the reason why gaps exist between adjacent processing areas when laser processing equipment processes in separate areas.

[0053] like Figure 1 As shown, the design to be processed is divided into multiple sub-designs, each corresponding to a processing area of ​​the workpiece. Then, using these multiple sub-designs, the working path of the second motion platform can be planned, and based on this working path, the working path of the laser beam can be determined. For example... Figure 2As shown, the dashed line represents the working path of the second motion platform. Driven by the second motion platform, the first motion platform moves along this working path to adjust the relative position between the first motion platform and the workpiece. The solid line represents the working path of the laser beam in the first motion platform. The working path of the second motion platform shows that after moving the second motion platform to the corresponding position, the U-axis reflector of the galvanometer in the second motion platform can be driven by a driver to deflect the laser beam. This allows the laser beam to scan each processing area line by line in the X-axis direction of the first motion platform, thereby achieving processing of each processing area.

[0054] However, in the actual processing, such as Figure 3 As shown, due to the flatness of the workpiece surface, the laser spot cannot be focused at the expected position. Therefore, on the side of the Y-axis of the processing area, due to the flatness of the workpiece surface, a deviation will occur between the actual position and the expected position of the laser spot, such as... Figure 4 As shown, the dots represent the actual landing points of the laser, and the triangles represent the expected landing points. Therefore, adjacent processing areas cannot be seamlessly connected at the dividing points, resulting in gaps between them and poor processing quality of the workpiece.

[0055] See Figure 5 , Figure 5 This is a schematic diagram of a laser processing apparatus provided for an embodiment of this application. The laser processing apparatus of this application is a laser processing apparatus with multi-axis linkage capability; for example, the laser processing apparatus includes three-axis, four-axis, or five-axis components. For ease of description, this application will primarily use a laser processing apparatus with four-axis linkage capability as an example for illustration.

[0056] like Figure 5 As shown, the laser processing equipment 500 includes a first motion platform 510 and a second motion platform 520. The first motion platform 510 has a higher motion speed than the second motion platform 520. Therefore, limited by the motion speed of the second motion platform 520, the workpiece can be divided into multiple processing areas. In each processing area, the laser beam is driven to move rapidly along the U-axis and V-axis on the workpiece, thereby improving the processing efficiency of the workpiece.

[0057] The first motion platform 510 drives the laser beam to move along the U-axis and V-axis on the workpiece, and the second motion platform 520 drives the first motion platform 510 or the workpiece to move along the X-axis and / or Y-axis. The U-axis and X-axis are parallel, and the Y-axis and V-axis are parallel. Since the U-axis and X-axis are parallel, the U-axis direction and the X-axis direction are the same direction. Similarly, the Y-axis direction and the V-axis direction are the same direction. For simplicity, when referring to the U-axis or X-axis direction, the X-axis direction will be used as an example, and when referring to the Y-axis or V-axis direction, the Y-axis direction will be used as an example.

[0058] Specifically, such as Figure 5 As shown, the first motion platform 510 includes a galvanometer module 511, which includes a first angle driver 512, a galvanometer U-axis reflector 513, a galvanometer V-axis reflector 514, a second angle driver 515, and a field lens 516. The first angle driver 512 is used to adjust the reflection angle of the galvanometer U-axis reflector, thereby driving the laser beam to move along the U-axis on the workpiece. The second angle driver 515 is used to adjust the reflection angle of the V-axis reflector, thereby driving the laser beam to move along the V-axis on the workpiece.

[0059] Specifically, such as Figure 5 As shown, the second motion platform 520 includes an X-axis linear module 521 and a Y-axis linear module 522. The X-axis linear module 521 is used to control the second motion platform 520 to move along the X-axis, thereby moving the first motion platform 510 or the workpiece along the X-axis and adjusting the position of the laser beam focused on the X-axis. The Y-axis linear module 522 is used to control the second motion platform 520 to move along the Y-axis, thereby moving the first motion platform 510 or the workpiece along the Y-axis and adjusting the position of the laser beam focused on the Y-axis.

[0060] Optionally, in another embodiment, the second motion platform may include only the X-axis linear module 521 or the Y-axis linear module 522, and this application does not limit this.

[0061] The galvanometer module 511 is mounted on the second motion platform 520. The movement of the X-axis linear module 521 and / or the Y-axis linear module 522 of the second motion platform 520 can drive the galvanometer module 511 to move synchronously. Furthermore, when the galvanometer module 511 moves, it can control the movement of the galvanometer U-axis reflector 513 and / or the galvanometer V-axis reflector 514, thereby realizing the four-axis linkage of the laser processing equipment to process the workpiece.

[0062] Optionally, in another embodiment, the laser processing equipment 500 may further include a processor (not shown) that, during workpiece processing, controls the second motion platform 520 to move along the X-axis and / or Y-axis according to a planned working path, thereby driving the first motion platform 510 or the workpiece to move along the X-axis and Y-axis. The processor may also control the first motion platform 510 to drive the laser beam along the U-axis and V-axis on the workpiece according to a planned working path, thereby achieving workpiece processing. The working paths of the second and first motion platforms can be obtained based on the path planning methods provided in the following embodiments.

[0063] See Figure 6 , Figure 6 This is a schematic diagram of a laser processing system according to an embodiment of this application. Figure 6 As shown, the laser processing system 600 includes a host computer 601 and a... Figure 5 The laser processing equipment 500 is shown. A communication connection is established between the host computer 601 and the laser processing equipment 500 for information exchange and data transmission.

[0064] For example, the host computer 601 can be a terminal device located on the user side, such as a computer, smartphone, or PC. The user can configure the parameters required for path planning to the host computer 601. For instance, the user can input the workpiece's design to be processed, or the segmentation direction and width of the design, etc., into the host computer 601. Accordingly, the host computer 601 can perform path planning based on the workpiece's design to be processed.

[0065] Specifically, the host computer 601 may include a path planning device, which can obtain the processing path to be processed by executing the path planning method provided in the following embodiments.

[0066] For example, the path planning device can be used to: divide the design to be processed along a first direction based on a first segmentation width to obtain multiple sub-designs, wherein the first segmentation width is determined based on the flatness of a first surface of the workpiece, the first surface being used to process the design to be processed, and the first segmentation width is less than or equal to the width of the processing area formed by the first motion platform in the first direction; and generate a processing path for processing the design to be processed based on the multiple sub-designs, wherein the processing path includes a first working path of the first motion platform and a second working path of the second motion platform. The path planning device returns the first working path of the first motion platform and the second working path of the second motion platform to the laser processing equipment. Accordingly, the laser processing equipment can control the second motion platform to move based on the second working path of the second motion platform in the processing path, and drive the first working platform to move based on the first working path of the first motion platform, so as to move the laser beam and realize the processing of the workpiece. The first working path of the first motion platform can be the path through which the laser spot moves on the workpiece under the movement of the first motion platform.

[0067] As can be seen in the embodiments of this application, when processing the workpiece, the flatness of the first surface of the workpiece affects the actual landing point of the laser beam, resulting in processing gaps between each sub-design and the previous sub-design, and the width of these gaps is correlated with the flatness of the first surface. The following will combine... Figure 7 The effect of the flatness of the first surface on the landing point of the laser beam and the resulting gap width are explained.

[0068] Specifically, such as Figure 7 As shown, when the first surface is uneven, the landing point of the light spot will deviate from its intended position due to the uneven surface. This results in the actual landing point of the light spot in the first direction being closer to the projection position of the field lens of the laser processing equipment along the optical axis than the expected landing point. Visually, the actual width of the processed sub-design will be narrower than the preset width, leading to gaps between adjacent sub-designs.

[0069] At the same time, when the segment width is reduced, such as Figure 7 The segmentation widths are w1 and w2, with w1 being greater than w2. It's easy to see that when the segmentation width is w2, the distance difference d2 between the actual and expected landing points of the laser spot due to the flatness effect is smaller than d1 under segmentation width w1. Therefore, the larger the segmentation width, the wider the processing amplitude of the laser beam in the first direction, and the larger the width of the resulting gap.

[0070] Based on this, the embodiments of this application determine the first segmentation width based on the flatness of the first surface of the workpiece, divide the design to be processed into multiple sub-designs along the first direction, and then control the width of the gap caused by the flatness of the first surface within a preset range. Thus, based on the multiple sub-designs, a processing path for processing the design to be processed is generated, allowing adjacent sub-designs to be almost seamlessly connected after processing, thereby eliminating or reducing the gaps between adjacent sub-designs and improving the processing effect of the workpiece.

[0071] See Figure 8 , Figure 8 This is a flowchart illustrating a path planning method for a laser processing device proposed in an embodiment of this application. The method is applied to... Figure 6 The laser processing system shown can be implemented by a host computer within the laser processing system, or by a path planning device within the host computer. For example... Figure 8 As shown, the method includes:

[0072] 801: Based on the first segmentation width, the design to be processed is divided along the first direction to obtain multiple sub-designs.

[0073] In this embodiment, the design to be processed can be input by the user through a path planning device. Specifically, the width of the design to be processed in the first direction of the workpiece can be greater than the processing range of the first motion platform in the first direction, and / or, the width of the design to be processed in the second direction of the workpiece can also be greater than the processing range of the first motion platform in the second direction. The design to be processed can be a bitmap or a vector graphic; this application does not limit this.

[0074] In this embodiment, the first direction can be the X-axis direction, or the U-axis direction, that is, dividing the design to be processed into multiple sub-designs along the length direction of the design to be processed. Correspondingly, the second direction is the Y-axis direction, or the V-axis direction. Of course, the first direction can also be other directions, for example: the first direction can be the Y-axis direction, or the V-axis direction, that is, dividing the design to be processed into multiple sub-designs along the width direction of the design to be processed. Correspondingly, the second direction is the X-axis direction, or the U-axis direction. This application does not limit this. For ease of description, this application mainly uses the X-axis direction as the first direction for illustration.

[0075] In this embodiment, the first segmentation width is determined based on error information and is less than or equal to the width of the processing area formed by the first motion platform in the first direction. Specifically, the first surface is the surface on the workpiece used for processing the design to be processed, typically the upper surface of the workpiece when placed in the laser processing equipment. Of course, based on actual usage scenarios, the first surface can also be any surface of the workpiece, and this application does not impose any restrictions on this. The error information refers to parameters that will cause splicing gaps in the processed section, such as the flatness of the first surface of the workpiece, and / or the distance between the field lens and the first surface of the workpiece, and / or the field lens error, etc.

[0076] In some embodiments, the error information includes the flatness of the first surface, a preset error value, and the distance from the field lens of the laser processing equipment to the workpiece surface. The first segmentation width is determined based on the flatness of the first surface, the preset error value, and the distance from the field lens of the laser processing equipment to the workpiece surface. The laser beam deflected by the first motion platform passes through the field lens and exits onto the workpiece.

[0077] For example, the first segment width is positively correlated with the preset error value and distance, and negatively correlated with the flatness of the first surface.

[0078] Based on the above regarding Figure 7 As can be seen from the description, in some embodiments, combined with Figure 7 The triangular relationship shown, taking gap d1 as an example, shows that the width of gap d1 can be expressed by formula ①:

[0079]

[0080] Where w1 is half of the first segmentation width corresponding to the gap d1, e is the flatness of the first surface, and L is the distance from the field lens of the laser processing equipment to the first surface.

[0081] Therefore, the width of the first segment can be determined using formula ①.

[0082] Specifically, the first segment width can be obtained by pre-setting a maximum acceptable gap width, dmax, and substituting this dmax into formula ① above. The maximum value dmax can be a preset error value.

[0083] In some embodiments, a second segment width can be determined first, and a width that needs to be reduced can be determined based on the second segment width and error information. The second segment width can be adjusted based on the reduced width to obtain a first segment width that is smaller than the second segment width.

[0084] In some embodiments, the error information includes the flatness of the first surface, and after the second segmentation width, the width that needs to be reduced can be determined based on the flatness of the first surface.

[0085] For example, the second segment width can be determined based on the processing area formed by the first motion platform. Generally, the second segment width can be equal to the width of the processing area formed by the first motion platform, or it can be any value smaller than the width of the processing area formed by the first motion platform; this application does not impose any restrictions on this.

[0086] In some implementations, such as Figure 9 As shown, after determining the second segmentation width, the design to be processed can first be divided based on its distribution on the workpiece, resulting in multiple sub-designs and their corresponding processing areas on the workpiece. Then, based on the flatness of the processing area of ​​the first sub-design on the first surface, the width of the gap generated during laser processing in that area can be determined. Subsequently, if the gap width does not meet the requirements, the second segmentation width is adjusted based on the flatness of the processing area to obtain the first segmentation width.

[0087] In some embodiments, the gap width to be reduced can be calculated based on the gap width corresponding to the second segment width and the target gap width (equivalent to a preset error value), thereby obtaining the first segment width. For example, assuming the gap width d = 0.1 mm under the second segment width, if d is required to be less than or equal to 0.05 mm, then the width to be reduced is Δw = (0.1 - 0.05) * L / e, and the first segment width can be obtained by subtracting Δw from the second segment width.

[0088] In some embodiments, the splicing gap caused by the flatness of the first surface can be pre-calibrated. Based on the flatness of the first surface, the splicing gap can be determined, and then the first segment width is obtained by subtracting the splicing gap from the second segment width. Alternatively, if there is a functional mapping relationship between the flatness of the first surface and the reduced width, then the required reduction in segment width can be determined by combining the second segment width with the desired reduction in segment width to obtain the first segment width.

[0089] In some embodiments, the second segmentation width is adjusted based on the flatness of the first surface and a preset error value to obtain the first segmentation width. The error information includes the flatness of the first surface and the preset error value. The preset error value may be dmax as described in the above embodiments.

[0090] For example, the flatness of the first surface and the splicing gap caused by a preset error value can be pre-calibrated. Based on the flatness of the first surface and the preset error value, the splicing gap can be determined, and then the first segment width can be obtained by subtracting the splicing gap from the second segment width. As another example, if there is a functional mapping relationship between the flatness of the first surface, the preset error value, and the reduced width, then the first segment width can be obtained by combining the required reduction in segment width with the second segment width.

[0091] In some embodiments, the second segmentation width is adjusted based on the flatness of the first surface, a preset error value, and the distance from the field lens of the laser processing equipment to the workpiece surface to obtain the first segmentation width. The laser beam deflected by the first motion platform passes through the field lens and is emitted onto the workpiece. The error information includes the flatness of the first surface, the preset error value, and the distance from the field lens to the workpiece surface.

[0092] For example, the flatness of the first surface, a preset error value, and the distance from the field lens to the workpiece surface can be pre-calibrated to determine the resulting splicing gap. Based on the flatness of the first surface and the preset error value, the splicing gap can be determined, and then the first segmentation width can be obtained by subtracting the splicing gap from the second segmentation width. As another example, if there is a functional mapping relationship between the flatness of the first surface, the preset error value, the distance from the field lens to the workpiece surface, and the target width to be reduced, then the first segmentation width can be determined by combining the target width to be reduced with the second segmentation width.

[0093] In this embodiment, if the first surface of the workpiece has multiple regions with different flatness in the first direction, the first segment width corresponding to the regions with different flatness in the design to be processed is different.

[0094] Specifically, since the first segmentation width is determined based on the flatness of the machining area of ​​the first sub-design on the first surface, the width of the resulting gap during machining of the first sub-design meets the requirements. Therefore, it can be determined that the first sub-design is segmented using the first segmentation width. However, since the first surface of the workpiece has multiple areas with different flatness in the first direction, after re-segmenting the design to be processed based on the first segmentation width, the flatness of the machining areas corresponding to other sub-designs besides the first sub-design may differ from the flatness of the machining area of ​​the first sub-design. Therefore, under the first segmentation width, the width of the resulting gap during laser processing of the machining areas corresponding to other sub-designs besides the first sub-design may also not meet the requirements.

[0095] At this point, based on the flatness of the processing area on the first surface of the second sub-design, the width of the gap generated during laser processing in that processing area can be determined. Then, if the gap width does not meet the requirements, the first segment width determined by the first sub-design is adjusted based on the flatness of the processing area to obtain the first segment width of the second sub-design. This process is repeated until the first segment width of the last sub-design is determined.

[0096] In this embodiment, a preset error value can be established, which can be the maximum acceptable gap width, dmax, configured by the user through the visual interface of the path planning device. When calculating the gap width d1 under the second segmentation width, if d1 is greater than dmax, then the gap width d1 does not meet the requirements. In this case, the difference Δd = d1 - dmax, which reduces d1 by dmax, can be calculated based on d1 and dmax. Subsequently, the second segmentation width is adjusted in conjunction with the flatness of the processing area to obtain the first segmentation width.

[0097] Specifically, Δd can be substituted into formula ① above, and combined with the flatness e1 of the processing boundary and the distance L from the field lens of the laser processing equipment to the first surface, the segmentation width adjustment value Δw can be obtained. Finally, since formula ① uses half the segmentation width when calculating the gap width, the calculated segmentation width adjustment value Δw also corresponds to half the segmentation width adjustment value. Therefore, the second segmentation width w2 needs to be reduced by a factor of the segmentation width adjustment value Δw to obtain the first segmentation width w1, i.e., w1 = w2 - 2 * Δw. Figure 10 As shown, by using a reduced first segment width w1 to segment the design to be processed, the width of the gap can be reduced to an acceptable dmax, thereby reducing the splicing gap and improving the processing effect of the workpiece.

[0098] In this embodiment, the flatness of the first surface can be determined by a projection module and a camera in the laser processing equipment. Specifically, a structured light pattern is first projected onto the first surface by the projection module, and an image of the first surface including the structured light pattern is acquired by the camera. It should be noted that the structured light pattern can be speckle, periodic stripes, a sine wave, or other characteristic patterns. Then, the deformation information of the structured light pattern on the first surface can be determined based on the image. Specifically, this deformation information refers to the offset between the current actual position of each point in the structured light pattern and its reference position on the flat surface. Thus, the depth information of the first surface can be determined. Finally, the flatness of each point on the first surface can be determined based on the depth information of the first surface. Specifically, the height difference between the point and the calibration height of the first surface can be calculated using the deformation information of each point, and this height difference is taken as the flatness of that point.

[0099] For example, the calibrated height of the first surface refers to the height of the first surface of the workpiece during laser processing. For instance, if the height of the first surface of the workpiece during laser processing is 1 cm, then the laser processing plane is a plane 1 cm high, and 1 cm can be used as the calibrated height of the first surface. The flatness of the first surface can be understood as the difference between the actual height of each point on the first surface and the calibrated height, that is, the height of each point on the first surface relative to the calibrated height of the first surface. For example, if the actual height of a point on the first surface is 1.02 cm, then the height difference between that point and the calibrated height of the first surface is 1.02 - 1 = 0.02 cm, and the flatness of that point is 0.02 cm.

[0100] In this embodiment, the height difference of each point on the first surface relative to the calibration height of the first surface can be expressed by the following formula ②:

[0101]

[0102] Where Z is the height of point 1 on the first surface, B is the baseline distance between the projection module and the camera, f is the focal length of the camera, P is the horizontal distance from the pixel corresponding to any point on the first surface to the reference plane, the reference plane is a horizontal plane with a height of the calibration height, and q is the deformation offset of point 1 determined based on the deformation information, that is, the offset between the expected position of the point on the structured light pattern corresponding to point 1 on the flat surface and the position of point 1.

[0103] Therefore, for each point on the first surface, the height difference of that point relative to the calibrated height of the first surface can be determined, and the flatness of each point can be obtained.

[0104] In this embodiment, if the first surface of the workpiece has multiple regions with different flatness in the second direction, the first segmentation width corresponding to the regions with different flatness in the design to be processed is different.

[0105] Specifically, in real-world scenarios, the flatness of each point on the first surface may vary. For example, such as... Figure 11 As shown, if the first surface has 9 regions distributed in a 3x3 pattern, where the flatness of the first region in the first row is 0.01, the second region is 0, and the third region is 0.03; the flatness of the first region in the second row is 0.02, the second region is 0.01, and the third region is 0.01; and the flatness of the first region in the third row is 0, the second region is 0, and the third region is 0.02, then the flatness matrix of the first surface is as follows:

[0106]

[0107] If the processing area is located in the third column, then in the second direction of this processing area, there are three regions with different flatnesses, namely 0.03, 0.01, and 0.02. For each region, the first segmentation distance when processing that region can be calculated based on its flatness.

[0108] Alternatively, in another implementation, the average of the three different flatnesses can be used as the average of the processed area. For example, the average of flatnesses 0.03, 0.01, and 0.02 can be calculated as 0.02, and the flatness of the processed area is then the average value of 0.02.

[0109] Optionally, in another implementation, the flatness signal of the processing area can be obtained based on the location of each area and the flatness of each area, and then the flatness of the processing area can be determined based on the flatness information.

[0110] For example, the flatness of each region on the processing area can be arranged according to the position of each region on the processing area to obtain the flatness signal of the processing area.

[0111] Specifically, such as Figure 12 As shown, there are 5 regions in processing area j, which are: region 1, region 2, region 3, region 4 and region 5 in top-to-bottom order. The flatness of each region is P1=0.01, P2=0, P3=0.02, P4=0.01 and P5=0, respectively. If they are arranged in top-to-bottom order, the flatness signal s1=(0.01,0,0.02,0.01,0); if they are arranged in bottom-to-top order, the flatness signal s2=(0,0.01,0.02,0,0.01).

[0112] In this embodiment, after determining the smoothness signal of the processing area j, the smoothness signal can be decomposed based on wavelet transform to obtain high-frequency and low-frequency components. Specifically, wavelet transform decomposes the signal into different scale or frequency components through a series of filtering operations. In this embodiment, discrete wavelet transform can be used to decompose the smoothness signal to obtain its components in the high-frequency and low-frequency bands. The high-frequency components in the high-frequency band contain the detail components of the original smoothness signal, representing microscopic irregularities (such as minute roughness); the low-frequency components in the low-frequency band contain the smoothing components of the original smoothness signal, representing large-scale surface changes (such as macroscopic fluctuations).

[0113] Then, the high-frequency value corresponding to each region can be determined based on the high-frequency component, and the low-frequency value corresponding to each region can be determined based on the low-frequency component. Next, the variation amplitude of the high-frequency characteristics of the smoothness of each region is quantified by calculating the root mean square of the high-frequency value corresponding to each region, and the variation amplitude of the low-frequency characteristics of the smoothness of each region is quantified by calculating the standard deviation of the low-frequency value corresponding to each region. Finally, based on the root mean square and the standard deviation, the first smoothness of the processed region j is determined. For example, the first smoothness of the processed region j can be obtained by weighted summation of the root mean square and the standard deviation based on preset weights.

[0114] Therefore, by decomposing the smoothness signal into high-frequency and low-frequency components using wavelet transform and processing them separately, both macroscopic fluctuations and details in the smoothness signal can be taken into account, resulting in a more accurate and suitable smoothness for the processing area j. Subsequently, the segmentation width of the processing area j can be adjusted based on this first smoothness.

[0115] 802: Generate a processing path for the design to be processed based on multiple sub-designs.

[0116] In this embodiment, the processing path includes a first working path of the first motion platform and a second working path of the second motion platform. Specifically, a first sub-path of the first motion platform and a second sub-path of the second motion platform can be planned for processing each sub-design. Then, based on the endpoint of the preceding sub-design and the starting point of the following sub-design in two adjacent sub-designs, a third sub-path of the second motion platform is planned. The first working path includes the first sub-path, and the second working path includes both the second and third sub-paths.

[0117] For example, if the design to be processed is divided in a first direction, for each sub-design, the second motion platform can move along the second direction to drive the first motion platform through the entire processing area of ​​the sub-design in the second direction. Therefore, the second sub-path can be planned along the second direction, with the upper part of the processing area of ​​the sub-design as the starting point and the lower part as the ending point. The path from the starting point to the ending point of the processing area of ​​the sub-design is planned along the second direction as the second sub-path. Simultaneously, as the second motion platform drives the first motion platform through the processing area corresponding to the entire sub-design along the second sub-path, the first motion platform will scan the processing area line by line, processing the sub-design into that area. Then, the first sub-path, i.e., the processing path of the laser beam, can be planned in a line-by-line back-and-forth scanning manner. Finally, after processing one sub-design, the second motion platform needs to bring the first motion platform to the starting point of the processing area of ​​the next sub-design. The third sub-path can then be the path from the ending point of the processing area of ​​the previous sub-design to the starting point of the processing area of ​​the next sub-design.

[0118] Specifically, if the midpoint above the processing area corresponding to each sub-design is taken as the starting point of the processing area of ​​that sub-design, and the midpoint below the processing area corresponding to each sub-design is taken as the ending point of the processing area of ​​that sub-design, then... Figure 13 As shown, Figure 13 In the diagram, the solid line represents the first sub-path, which is the processing path of the laser beam; the vertical dashed line represents the second sub-path, which is the movement path of the second motion platform; and the diagonal dashed line represents the third sub-path, which is the movement path of the second motion platform to the starting point of the next sub-design after processing the previous sub-design.

[0119] Specifically, if two adjacent sub-designs in the processing sequence are the first sub-design and the second sub-design, then the second working path of the second motion platform also includes a fourth sub-path. The second sub-path controls the second motion platform to move along a second direction to process the first sub-design; the third sub-path controls the second motion platform to move along a first direction to adjust the position of the first motion platform relative to the workpiece in the first direction; and the fourth sub-path controls the second motion platform to move along a second direction to process the second sub-design, wherein the second direction is perpendicular to the first direction.

[0120] As can be seen, in the solution of this application, when processing the workpiece, the flatness of the first surface of the workpiece affects the actual landing point of the laser beam, resulting in processing gaps between each sub-design and the previous sub-design, and the width of these gaps is related to the flatness of the first surface. The embodiment of this application determines a first segmentation width based on the flatness of the first surface of the workpiece, dividing the design to be processed into multiple sub-designs along a first direction, thereby controlling the width of the gaps caused by the flatness of the first surface within a preset range. Thus, based on multiple sub-designs, a processing path for processing the design to be processed is generated, allowing adjacent sub-designs to be almost seamlessly connected after processing, thereby eliminating or reducing gaps between adjacent sub-designs and improving the processing effect of the workpiece.

[0121] The above primarily describes the implementation scheme of this application from a methodological perspective. It is understood that, in order to achieve the above functions, the host computer includes the corresponding hardware structure and / or software modules for executing each function. Those skilled in the art should readily recognize that, in conjunction with the units and algorithm steps of the various examples described in the embodiments disclosed herein, this application can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed in a hardware or software-driven manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0122] The embodiments of this application can divide the terminal device into functional units according to the above method examples. For example, each function can be divided into a separate functional module, or two or more functions can be integrated into one functional module. The integrated module can be implemented in hardware or as a software program module. It should be noted that the module division in the embodiments of this application is illustrative and is only a logical functional division, while other division methods may be used in actual implementation.

[0123] When using integrated modules, Figure 14 This is a functional block diagram of a path planning device for a laser processing equipment according to an embodiment of this application. The path planning device 1400 includes a segmentation module 1401 and a generation module 1402.

[0124] In this embodiment, the laser processing equipment includes a first motion platform and a second motion platform. The first motion platform is used to drive the laser beam to move along the U-axis and V-axis on the workpiece. The second motion platform is used to drive the first motion platform or the workpiece to move along the X-axis and / or Y-axis. The U-axis and the X-axis are parallel, and the Y-axis and the V-axis are parallel.

[0125] In this embodiment, the path planning device 1400 includes a segmentation module 1401 and a generation module 1402. These modules can be used to receive and process signals, information, etc., or to determine monitoring mechanisms, and there are no specific limitations on this.

[0126] In this embodiment, the route planning device 1400 may further include a storage module for executing computer program code or instructions. The storage module may be a memory.

[0127] In this embodiment, the path planning device 1400 may be a chip or a chip module.

[0128] In this embodiment, the path planning device 1400 includes a segmentation module 1401 and a generation module 1402, which can be integrated into the communication module. The communication module can be a communication interface, transceiver, transceiver circuit, etc.

[0129] In this embodiment, the path planning device 1400 includes a segmentation module 1401 and a generation module 1402, which can be integrated into the processor.

[0130] It should be noted that the processor can be a baseband processor, baseband chip, central processing unit (CPU), general-purpose processor, digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic device, transistor logic device, hardware component, or any combination thereof. It can implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this application. A processing module can also be a combination that implements computational functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, etc.

[0131] In this embodiment, the path planning device 1400 is used to perform any of the steps performed by the terminal device / chip / chip module, etc., as described in the above method embodiment.

[0132] In specific implementation, the path planning device 1400 includes a segmentation module 1401 and a generation module 1402 for performing any of the steps in the above method embodiments, and when performing actions such as sending, it can selectively call other modules to complete the corresponding operations. A detailed description follows.

[0133] The segmentation module 1401 is used to segment the design to be processed along a first direction based on a first segmentation width to obtain multiple sub-designs. The first segmentation width is determined based on error information. The first surface is used to process the design to be processed. The first segmentation width is less than or equal to the width of the processing area formed by the first motion platform in the first direction.

[0134] The generation module 1402 is used to generate a processing path for processing the design to be processed based on the plurality of sub-designs. The processing path includes a first working path of the first motion platform and a second working path of the second motion platform.

[0135] In this embodiment, before dividing the design to be processed into multiple sub-designs based on the first segmentation width along the first direction, the segmentation module 1401 is further configured to:

[0136] The second segmentation width is determined based on the processing area formed by the first motion platform;

[0137] The second segment width is adjusted based on the flatness of the first surface to obtain the first segment width, wherein the first segment width is smaller than the second segment width, and the error information includes the flatness of the first surface.

[0138] In this embodiment, before dividing the design to be processed into multiple sub-designs based on the first segmentation width along the first direction, the segmentation module 1401 is further configured to:

[0139] The second segmentation width is determined based on the processing area formed by the first motion platform;

[0140] The second segment width is adjusted based on the flatness of the first surface and a preset error value to obtain the first segment width, wherein the first segment width is smaller than the second segment width, and the error information includes the flatness of the first surface and the preset error value.

[0141] In this embodiment, before dividing the design to be processed into multiple sub-designs based on the first segmentation width along the first direction, the segmentation module 1401 is further configured to:

[0142] The second segmentation width is determined based on the processing area formed by the first motion platform;

[0143] The second segmentation width is adjusted based on the flatness of the first surface, the preset error value, and the distance from the field lens of the laser processing equipment to the workpiece surface to obtain the first segmentation width. The first segmentation width is smaller than the second segmentation width. The laser beam deflected by the first motion platform is emitted onto the workpiece through the field lens. The flatness of the first surface, the preset error value, and the distance from the field lens of the laser processing equipment to the workpiece surface are all considered.

[0144] In this embodiment, the segmentation module 1401 is further configured to:

[0145] The projection module of the laser processing equipment is controlled to project a structured light pattern onto the first surface, and the camera of the laser processing equipment is controlled to acquire an image of the first surface including the structured light pattern.

[0146] The flatness of the first surface is determined based on the image.

[0147] In this embodiment, if the first surface of the workpiece has multiple regions with different flatness in the second direction, the first segmentation width corresponding to the regions with different flatness in the design to be processed is different.

[0148] In this embodiment, regarding the generation of the processing path for the design to be processed based on the plurality of sub-designs, the generation module 1402 is specifically used for:

[0149] Plan and process the first sub-path of the first motion platform and the second sub-path of the second motion platform corresponding to each of the sub-designs;

[0150] Based on the endpoint of the previous sub-design and the starting point of the next sub-design in two adjacent sub-designs, the third sub-path of the second motion platform is planned;

[0151] The first working path includes the first sub-path, and the second working path includes the second sub-path and the third sub-path.

[0152] In this embodiment, the two sub-designs with adjacent processing sequences are respectively the first sub-design and the second sub-design, and the second working path of the second motion platform also includes a fourth sub-path;

[0153] The second sub-path is used to control the second motion platform to move along the second direction to process the first sub-design;

[0154] The third sub-path is used to control the second motion platform to move along the first direction, so as to adjust the position of the first motion platform relative to the workpiece in the first direction;

[0155] The fourth sub-path is used to control the second motion platform to move along a second direction to process the second sub-design, the second direction being perpendicular to the first direction.

[0156] See Figure 15 , Figure 15 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application. The electronic device 1500 may include a processor 1510, a memory 1520, and a communication bus for connecting the processor 1510 and the memory 1520.

[0157] Optionally, the memory 1520 may include, but is not limited to, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), or compact disc read-only memory (CD-ROM), and the memory 1520 is used to store program code executed by the electronic device 1500 and data transmitted therefrom.

[0158] In this embodiment, the electronic device 1500 also includes a communication interface for receiving and sending data.

[0159] In this embodiment, the processor 1510 may be one or more CPUs. When the processor 1510 is a CPU, the CPU may be a single-core CPU or a multi-core CPU.

[0160] In this embodiment, the processor 1510 can be a baseband chip, a chip, a CPU, a general-purpose processor, a DSP, an ASIC, an FPGA, or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof.

[0161] In specific implementation, the processor 1510 in the electronic device 1500 executes the computer program or instructions 1521 stored in the memory 1520 to perform the following operations:

[0162] The design to be processed is divided along the first direction based on the first dividing width to obtain multiple sub-designs. The first dividing width is determined based on the flatness of the first surface of the workpiece. The first surface is used to process the design to be processed. The first dividing width is less than or equal to the width of the processing area formed by the first motion platform in the first direction.

[0163] Based on the multiple sub-designs, a processing path is generated for processing the design to be processed. The processing path includes a first working path of the first motion platform and a second working path of the second motion platform.

[0164] In this embodiment, the electronic device 1500 can be Figure 6 The host computer 601 or laser processing equipment 500 in the laser processing system shown.

[0165] It should be noted that, Figure 15 The specific implementation of each operation in the above-described method implementation can be found in the description of the method implementation, and will not be repeated here.

[0166] This application also provides a computer-readable storage medium storing a computer program or instructions that, when executed, implement the steps described in the above-described method embodiments.

[0167] This application also provides a computer program product, including a computer program or instructions that, when executed, implement the steps described in the above method embodiments.

[0168] It should be noted that, for the sake of simplicity, the various embodiments described above are all presented as a series of actions. Those skilled in the art should understand that this application is not limited by the described order of actions, as some steps in the embodiments of this application can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions, steps, modules, or units involved are not necessarily essential to the embodiments of this application.

[0169] In the above embodiments, the descriptions of each embodiment in this application have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0170] The steps of the methods or algorithms described in this application can be implemented in hardware or by a processor executing software instructions. The software instructions can consist of corresponding software modules, which can be stored in RAM, flash memory, ROM, EPROM, electrically erasable programmable read-only memory (EEPROM), registers, hard disk, portable hard disk, read-only optical disk (CD-ROM), or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and storage medium can reside in an ASIC. Furthermore, the ASIC can reside in a terminal device or management device. Alternatively, the processor and storage medium can exist as discrete components in the terminal device or management device.

[0171] Those skilled in the art will recognize that, in one or more of the examples above, the functions described in the embodiments of this application can be implemented, in whole or in part, by software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., digital video discs (DVDs)), or semiconductor media (e.g., solid-state disks (SSDs)).

[0172] The modules / units included in the various devices and products described in the above embodiments can be software modules / units, hardware modules / units, or a combination of both. For example, for devices and products applied to or integrated into a chip, all modules / units can be implemented using hardware methods such as circuits, or at least some modules / units can be implemented using software programs that run on a processor integrated within the chip, while the remaining (if any) modules / units can be implemented using hardware methods such as circuits. For devices and products applied to or integrated into a chip module, all modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components of the chip module, or at least some modules / units can be implemented using hardware methods such as circuits. The implementation is achieved through a software program that runs on a processor integrated within the chip module. The remaining modules / units (if any) can be implemented using hardware methods such as circuits. For various devices and products applied to or integrated into terminal equipment, each of their modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components within the terminal equipment. Alternatively, at least some modules / units can be implemented using a software program that runs on a processor integrated within the terminal equipment, while the remaining modules / units (if any) can be implemented using hardware methods such as circuits.

[0173] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above description is only a specific embodiment of the embodiments of this application and is not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solution of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A path planning method for laser processing equipment, characterized in that, The laser processing equipment includes a first motion platform and a second motion platform. The first motion platform is used to drive the laser beam to move along the U-axis and V-axis on the workpiece. The second motion platform is used to drive the first motion platform or the workpiece to move along the X-axis and / or Y-axis. The U-axis and the X-axis are parallel, and the Y-axis and the V-axis are parallel. The path planning method includes: The design to be processed is divided along a first direction based on a first segmentation width to obtain multiple sub-designs. The first segmentation width is determined based on error information. The first surface is used to process the design to be processed. The first segmentation width is less than or equal to the width of the processing area formed by the first motion platform in the first direction. Based on the multiple sub-designs, a processing path is generated for processing the design to be processed. The processing path includes a first working path of the first motion platform and a second working path of the second motion platform.

2. The method according to claim 1, characterized in that, Before dividing the design to be processed into multiple sub-designs based on the first segmentation width along the first direction, the method further includes: The second segmentation width is determined based on the processing area formed by the first motion platform; The second segment width is adjusted based on the flatness of the first surface to obtain the first segment width, wherein the first segment width is smaller than the second segment width, and the error information includes the flatness of the first surface.

3. The method according to claim 1, characterized in that, Before dividing the design to be processed into multiple sub-designs based on the first segmentation width along the first direction, the method further includes: The second segmentation width is determined based on the processing area formed by the first motion platform; The second segment width is adjusted based on the flatness of the first surface and a preset error value to obtain the first segment width, wherein the first segment width is smaller than the second segment width, and the error information includes the flatness of the first surface and the preset error value.

4. The method according to claim 1, characterized in that, Before dividing the design to be processed into multiple sub-designs based on the first segmentation width along the first direction, the method further includes: The second segmentation width is determined based on the processing area formed by the first motion platform; The second segmentation width is adjusted based on the flatness of the first surface, the preset error value, and the distance from the field lens of the laser processing equipment to the surface of the workpiece to obtain the first segmentation width. The first segmentation width is smaller than the second segmentation width. The laser beam deflected by the first motion platform passes through the field lens and is emitted onto the workpiece. The error information includes the flatness of the first surface, the preset error value, and the distance from the field lens of the laser processing equipment to the surface of the workpiece.

5. The method according to claim 1, characterized in that, The error information includes the flatness of the first surface, a preset error value, and the distance from the field lens of the laser processing equipment to the workpiece surface. The first segmentation width is positively correlated with the preset error value and the distance, and negatively correlated with the flatness of the first surface.

6. The method according to any one of claims 2 to 5, characterized in that, The method further includes: The projection module of the laser processing equipment is controlled to project a structured light pattern onto the first surface, and the camera of the laser processing equipment is controlled to acquire an image of the first surface including the structured light pattern. The flatness of the first surface is determined based on the image.

7. The method according to any one of claims 1 to 5, characterized in that, The process of generating a processing path for the design to be processed based on the multiple sub-designs includes: Plan and process the first sub-path of the first motion platform and the second sub-path of the second motion platform corresponding to each of the sub-designs; Based on the endpoint of the previous sub-design and the starting point of the next sub-design in two adjacent sub-designs, the third sub-path of the second motion platform is planned; The first working path includes the first sub-path, and the second working path includes the second sub-path and the third sub-path.

8. The method according to claim 7, characterized in that, The two sub-designs that are adjacent in the processing sequence are respectively the first sub-design and the second sub-design, and the second working path of the second motion platform also includes a fourth sub-path; The second sub-path is used to control the second motion platform to move along the second direction to process the first sub-design; The third sub-path is used to control the second motion platform to move along the first direction, so as to adjust the position of the first motion platform relative to the workpiece in the first direction; The fourth sub-path is used to control the second motion platform to move along a second direction to process the second sub-design, the second direction being perpendicular to the first direction.

9. A path planning device for laser processing equipment, characterized in that, The laser processing equipment includes a first motion platform and a second motion platform. The first motion platform is used to drive the laser beam to move along the U-axis and V-axis on the workpiece. The second motion platform is used to drive the first motion platform or the workpiece to move along the X-axis and / or Y-axis. The U-axis and the X-axis are parallel, and the Y-axis and the V-axis are parallel. The path planning device includes: The segmentation module is used to segment the design to be processed along a first direction based on a first segmentation width to obtain multiple sub-designs. The first segmentation width is determined based on the flatness of the first surface of the workpiece. The first surface is used to process the design to be processed. The first segmentation width is less than or equal to the width of the processing area formed by the first motion platform in the first direction. The generation module is used to generate a processing path for processing the design to be processed based on the plurality of sub-designs. The processing path includes a first working path of the first motion platform and a second working path of the second motion platform.

10. An electronic device comprising a processor, a memory, and a computer program or instructions stored in the memory, characterized in that, The processor executes the computer program or instructions to implement the steps of the method according to any one of claims 1 to 8.

11. A laser processing device, characterized in that, The laser processing equipment includes a first motion platform and a second motion platform. The first motion platform is used to drive the laser beam to move along the U-axis and V-axis on the workpiece. The second motion platform is used to drive the first motion platform or the workpiece to move along the X-axis and / or Y-axis. The U-axis and the X-axis are parallel, and the Y-axis and the V-axis are parallel. The first motion platform is used for a first path motion planned based on the method according to any one of claims 1 to 8, and the second motion platform is used for a second path motion planned based on the method according to any one of claims 1 to 8, to process the workpiece.

12. A laser processing system, characterized in that, The laser processing system includes: A laser processing device, comprising a first motion platform and a second motion platform, wherein the first motion platform is used to drive a laser beam to move along the U-axis and V-axis on a workpiece, and the second motion platform is used to drive the first motion platform or the workpiece to move along the X-axis and / or Y-axis, wherein the U-axis and the X-axis are parallel, and the Y-axis and the V-axis are parallel; The host computer, which is communicatively connected to the laser processing equipment, is used to: acquire the design to be processed and, based on the method described in any one of claims 1 to 8, plan the working paths of the first motion platform and the second motion platform so that the laser processing equipment processes the design to be processed.

13. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that is executed by a processor to implement the method as described in any one of claims 1 to 8.

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