A plasma cleaning machine based on chip packaging

Abstract

This invention discloses a plasma cleaner based on chip packaging, belonging to the field of plasma cleaner technology. It includes a body, with a base installed at the bottom of a cavity above the body. A vacuum chamber is connected to the base via a sealing ring. Sliding frames are fixed on the left and right sides of the vacuum chamber. The sliding frames are slidably connected to mounting frames via multiple columns at the top. The mounting frames are fixed to the top of the cavity above the body, and a drive cylinder is fixed inside the mounting frames. Through the cooperation between the screw and adjusting rod cleaning components, the adjusting rod abuts and limits the flexible scraper to adhere to the top of the vacuum chamber cavity, effectively removing deposits from the top of the cavity. A linked, follow-up jet structure is used; the top strip slides and squeezes the pressure block to unlock the gas path, allowing nitrogen to enter the air inlet chamber through the adjusting rod and mounting hole and be ejected, achieving simultaneous blowing and wiping actions. Combined with the negative pressure suction of the vacuum pump, a triple cleaning mode is formed, eliminating dead corners in the vacuum chamber cleaning.

Description

Technical Field

[0001] This invention relates to the field of plasma cleaning machine technology, specifically a plasma cleaning machine based on chip packaging. Background Technology

[0002] In chip packaging processes, vacuum plasma cleaners are mainly used for cleaning and activating the surface of chip substrates. They are key process equipment for ensuring chip packaging accuracy and improving product yield.

[0003] However, the internal cleaning methods of existing vacuum plasma cleaners are relatively simple. After the chip plasma cleaning operation is completed, the equipment mainly relies on a fixed-position nitrogen inlet structure to spray nitrogen for purging, while a vacuum pump is used for real-time negative pressure suction to remove residual cleaning gases and impurities from the cavity. In practical applications, this traditional cleaning structure has a fixed nitrogen inlet position and a limited purging coverage area, resulting in a large number of cleaning dead corners at the top of the vacuum chamber, making it difficult to achieve uniform cleaning over the entire area. On the other hand, some volatile residues and plasma reaction deposits generated during chip plasma cleaning are adhesive and easily adhere to the top of the vacuum chamber. The gas cleaning method of nitrogen purging and negative pressure suction alone is not easy to remove them. It is necessary to manually wipe and clean the top of the cavity periodically after the equipment is shut down, which reduces the chip packaging processing efficiency.

[0004] To address the aforementioned issues, innovative designs are urgently needed based on existing approaches. Summary of the Invention

[0005] The purpose of this invention is to provide a plasma cleaner based on chip packaging to solve the problems mentioned in the background. The technical solution of this invention addresses the problem that the existing technical solutions are too simplistic and provides a solution that is significantly different from the existing technology.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A plasma cleaner based on chip packaging includes a body, a base installed at the bottom of the cavity above the body, a vacuum chamber connected to the base via a sealing ring, sliding frames fixed on the left and right sides of the vacuum chamber, mounting frames slidably connected to the sliding frames via multiple columns at the top, the mounting frames fixed to the top of the cavity above the body, a drive cylinder fixed inside the mounting frame, the output end of the drive cylinder connected to the top of the sliding frame, an automatic feeding mechanism and an automatic unloading mechanism respectively provided on the left and right sides of the base, screws rotatably connected to the grooves on the left and right sides of the vacuum chamber, a motor connected to the rear of the left screw, the motor mounted in the groove on the rear side of the vacuum chamber via a bracket, the two screws connected by a rear belt and pulley, an adjusting rod below each of the two screws, the inner cavity of the two adjusting rods connected to an external air supply mechanism via a rear tube and hose, the two adjusting rods respectively installed in the grooves on the left and right sides of the vacuum chamber, a cleaning component and an air intake component provided between the screws and the adjusting rods.

[0007] Optionally, the top of the vacuum chamber is designed with an arc-shaped structure, and the central elongated opening at the top of the vacuum chamber is connected to the external vacuum pump body through pipes and hoses. A nozzle radio frequency electrode is provided in the circular groove at the top of the vacuum chamber.

[0008] Optionally, the cleaning assembly includes a carriage, with two screws threadedly connected to the left and right sides of the carriage respectively. A top bar is vertically slidably installed inside the carriage, and a flexible scraper is fixed in the groove at the top of the top bar.

[0009] Optionally, both the carriage and the top bar are designed as arc-shaped structures. The arc-shaped structure of the carriage corresponds to the arc-shaped grooves on the front and rear walls of the vacuum chamber. The arc-shaped grooves on the front and rear walls of the vacuum chamber are used for storing the carriage in its initial state.

[0010] Optionally, the top bar is slidably connected to the top of the adjusting rod through the bottom notches on the left and right sides. The front and rear sides of the top protrusion of the adjusting rod are designed as slopes, and the top protrusion of the adjusting rod is used for adjusting the position of the top bar.

[0011] Optionally, the air intake assembly includes multiple mounting holes arranged on the top of the adjustment rod protrusion. The mounting holes communicate with the internal cavity of the adjustment rod, and a pressure block is vertically slidably installed in each mounting hole by means of a spring.

[0012] Optionally, the air intake assembly further includes an air intake chamber formed within the top bar, with air intake ports on the left and right sides of the air intake chamber located at the lower notches on the left and right sides of the top bar. Multiple air outlets are arranged on both sides of the top groove of the top bar, and all of the multiple air outlets of the top bar are connected to the air intake chamber.

[0013] Optionally, the two protrusions on the top of the pressure block are designed with sloping surfaces on both sides. The pressure block supports the two sloping protrusions for sliding contact with the horizontal bar at the air inlet of the air inlet chamber. The pressure block is used to open and close the air inlet chamber and the internal cavity of the adjusting rod.

[0014] Compared with the prior art, the beneficial effects of the present invention are: This invention incorporates an automated reciprocating wiping structure, effectively improving upon the shortcomings of traditional plasma cleaners where residues adhere to the top of the vacuum chamber cavity and cleaning is incomplete. During nitrogen purging, the equipment uses a motor to drive two sets of screws to reciprocate, causing the carriage and top bar to slide smoothly back and forth. The top bar automatically rises due to the resistive limiting effect of the protrusion on the top of the adjusting rod, ensuring the flexible scraper closely adheres to the top wall of the vacuum chamber cavity. This reciprocating wiping by the flexible scraper efficiently removes volatile residues and plasma reaction deposits from the top of the vacuum chamber, effectively ensuring the cleanliness of the chip cleaning and activation process and reducing processing defects. Furthermore, this physical residue removal method is compatible with vacuum operating environments, will not damage the equipment structure or chip substrate, and significantly improves the equipment's operational stability.

[0015] This invention features a linked, follow-up jet structure to achieve integrated, efficient, and thorough cleaning of the top of the vacuum chamber, significantly optimizing the chip cleaning process quality. During the wiping process, the top bar slides back and forth along the adjusting rod, while its bottom horizontal bar abuts against the pressure block. This compresses the pressure block's spring and causes it to move downwards within the mounting hole, unlocking the air passage. External nitrogen gas is then introduced into the air inlet chamber through the adjusting rod and mounting hole, and evenly ejected from multiple outlets on both sides of the top groove of the top bar. This achieves real-time synchronization between blowing and wiping, combined with the negative pressure suction of the vacuum pump, forming a triple cleaning mode that thoroughly eliminates cleaning dead zones, effectively improving the uniformity and efficiency of cleaning the vacuum chamber's interior, and ensuring the consistency and quality of batch chip cleaning processes. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall front view of the present invention; Figure 2 This is a schematic diagram of the rear view structure of the body of the present invention; Figure 3 This is a schematic diagram of the structure of the base, vacuum chamber, sliding frame, and mounting frame of the present invention; Figure 4 This is a schematic cross-sectional view of the left side of the vacuum chamber of the present invention; Figure 5 for Figure 4 Enlarged view of point A in the middle; Figure 6 This is a schematic cross-sectional view of the rear side of the vacuum chamber of the present invention; Figure 7 for Figure 6 Enlarged view of point B in the middle; Figure 8This is a bottom-view schematic diagram of the internal structure of the vacuum chamber of the present invention; Figure 9 This is a schematic diagram of the screw, adjusting rod, and cleaning assembly of the present invention; Figure 10 This is a cross-sectional view of the adjusting rod and a schematic diagram of the disassembled parts of the cleaning assembly of the present invention; Figure 11 for Figure 10 Enlarged view of point C in the middle; Figure 12 This is a schematic cross-sectional view of the top strip portion of the present invention.

[0017] In the diagram: 1. Machine body; 2. Base; 3. Vacuum chamber; 4. Sliding frame; 5. Mounting frame; 6. Drive cylinder; 7. Automatic feeding mechanism; 8. Automatic unloading mechanism; 9. Screw; 10. Motor; 11. Cleaning assembly; 111. Sliding frame; 112. Top bar; 113. Flexible scraper; 12. Air intake assembly; 121. Mounting hole; 122. Pressure block; 123. Air intake chamber; 13. Adjusting rod. Detailed Implementation

[0018] To further illustrate the technical means and effects adopted by the present invention in order to achieve the intended purpose, the following detailed description is provided in conjunction with the accompanying drawings and preferred embodiments, based on the specific implementation methods, structures, features and effects of the present invention. Example 1

[0019] Please see Figures 1 to 12 This invention provides a technical solution: a plasma cleaner based on chip packaging, comprising a body 1, a base 2 installed at the bottom of a cavity above the body 1, a vacuum chamber 3 connected to the base 2 via a sealing ring, the top of the inner cavity of the vacuum chamber 3 being designed with an arc-shaped structure, a centrally located elongated opening at the top of the inner cavity of the vacuum chamber 3 being connected to an external vacuum pump via pipes and hoses, a nozzle radio frequency electrode being installed in a circular groove at the top of the inner cavity of the vacuum chamber 3, sliding frames 4 being fixed on the left and right sides of the vacuum chamber 3, and mounting frames 5 being slidably connected to the sliding frames 4 via multiple columns at the top, the mounting frames 5 being fixed to the top of the cavity above the body 1, and a mounting frame 5 being fixed inside the mounting frame 5. Drive cylinder 6, the output end of drive cylinder 6 is connected to the top of sliding frame 4. Automatic feeding mechanism 7 and automatic unloading mechanism 8 are respectively set on the left and right sides of base 2. Screws 9 are rotatably connected to the grooves on the left and right sides of the inner cavity of vacuum box 3. Motor 10 is connected to the rear of left screw 9. Motor 10 is installed in the groove on the rear side of vacuum box 3 through bracket. The two screws 9 are connected by rear belt and pulley. Adjusting rods 13 are set below the two screws 9. The inner cavity of the two adjusting rods 13 is connected to the external air supply mechanism through rear tube and hose. The two adjusting rods 13 are respectively installed in the grooves on the left and right sides of the inner cavity of vacuum box 3. A cleaning assembly 11 and an air intake assembly 12 are provided between the screw 9 and the adjusting rod 13. The cleaning assembly 11 includes a slide 111. The left and right sides of the slide 111 are threadedly connected to the two screws 9 respectively. A top bar 112 is vertically slidably installed inside the slide 111. Both the slide 111 and the top bar 112 are designed with an arc-shaped structure. The arc-shaped structure of the slide 111 corresponds to the arc-shaped grooves on the front and rear walls of the inner cavity of the vacuum chamber 3. The arc-shaped grooves on the front and rear walls of the inner cavity of the vacuum chamber 3 are used for the initial storage of the slide 111. The top bar 112 is slidably connected to the top of the adjusting rod 13 through the bottom notches on the left and right sides. The top protrusion of the adjusting rod 13 is designed with inclined surfaces on the front and rear sides. The top protrusion of the adjusting rod 13 is used for adjusting the position of the top bar 112. A flexible scraper 113 is fixed in the groove at the top of the top bar 112. During the purging process when the external gas supply mechanism injects nitrogen into the vacuum chamber 3, the controller first turns on the motor 10 to drive the two screws 9 to rotate back and forth. This causes the slide 111 to drive the top bar 112 to slide back and forth on the screws 9. During the sliding process, the top bar 112 slides and contacts the adjusting rod 13 through the bottom notches on both sides. When the top bar 112 slides to the top protrusion of the adjusting rod 13, the top bar 112 moves upward in the slide 111 and drives the flexible scraper 113 to fit against the top of the cavity of the vacuum chamber 3. With the slide 111 sliding back and forth on the screws 9, the flexible scraper 113 wipes away the volatile and adhered residues on the top of the cavity of the vacuum chamber 3. Example 2

[0020] Based on Example 1, please refer to Figures 1 to 12 The present invention provides a technical solution: a cleaning assembly 11 and an air intake assembly 12 are provided between the screw 9 and the adjusting rod 13. The air intake assembly 12 includes a plurality of mounting holes 121, which are arranged on the protruding top of the adjusting rod 13. The mounting holes 121 communicate with the internal cavity of the adjusting rod 13. A pressure block 122 is vertically and slidably installed in each mounting hole 121 by means of a spring. The air intake assembly 12 also includes an air intake chamber 123 opened in the top bar 112 for air intake. The air inlets on the left and right sides of cavity 123 are located at the lower notches on the left and right sides of top bar 112. Multiple air outlets are arranged on both sides of the top groove of top bar 112. All the air outlets of top bar 112 are connected to air inlet cavity 123. The two protrusions on the top of pressure block 122 are designed with inclined structures on both sides. Pressure block 122 lifts the two inclined protrusions for sliding contact with the horizontal bar at the air inlet position of air inlet cavity 123. Pressure block 122 is used to open and close the air inlet cavity 123 and the internal cavity of adjusting rod 13. As the bottom notches on both sides of the top bar 112 reciprocate and slide against the top of the adjusting rod 13, the horizontal bar at the air inlet of the air inlet chamber 123 inside the top bar 112 abuts against the corresponding pressure block 122 in the sliding path at the top of the adjusting rod 13. This causes the pressure block 122 to compress the spring and move downward within the mounting hole 121. The downward movement of the pressure block 122 no longer blocks the mounting hole 121, allowing nitrogen gas from the external air supply mechanism to enter the air inlet chamber 123 through the mounting hole 121 and then be ejected from multiple air outlets on both sides of the groove at the top of the top bar 112. This ensures that the top of the inner cavity of the vacuum chamber 3 is thoroughly purged during the reciprocating sliding of the top bar 112. Combined with the flexible scraper 113 to wipe away volatile and adhered residues and the real-time suction of the vacuum pump, the cleaning is performed more evenly and efficiently.

[0021] Working principle: When using this plasma cleaner, the operator first presets the parameters of the plasma cleaner according to the chip specifications. Then, the automatic feeding mechanism 7 is started to move the tray containing the chip substrate into the base 2. Then, the drive cylinder 6 is started to drive the sliding frame 4 and the vacuum box 3 to move downward on the mounting frame 5, so that the bottom of the vacuum box 3 overlaps with the top of the base 2 and provides corresponding downward pressure. Then, the external vacuum pump is turned on to perform vacuum suction of the inner cavity of the vacuum box 3 through the long strip opening in the center of the top of the inner cavity of the vacuum box 3 according to the corresponding parameters. Then, the radio frequency electrode of the nozzle at the top of the inner cavity of the vacuum box 3 is turned on to perform plasma cleaning and activation treatment on the surface of the substrate in the tray. After the plasma cleaning treatment of the corresponding parameters and time is completed, the external gas supply mechanism is turned on to inject nitrogen into the vacuum box 3 for purging for the corresponding time. The vacuum pump is used to discharge the residual gas in the vacuum box 3 during the cleaning process. Then, the vacuum pump is turned off and the drive cylinder 6 is started to drive the sliding frame 4 and the vacuum box 3 to reset upward on the mounting frame 5. Then, the automatic unloading mechanism 8 is used to take out the tray containing the chip substrate from the base 2, completing the entire cleaning process. Based on the above, during the purging process when the external gas supply mechanism injects nitrogen into the vacuum chamber 3, the controller first turns on the motor 10 to drive the two screws 9 to rotate back and forth, so that the slide 111 drives the top bar 112 to slide back and forth on the screws 9. During the sliding process, the top bar 112 slides and contacts the adjusting rod 13 through the bottom notches on the left and right sides. During this process, when the top bar 112 slides to the top protrusion of the adjusting rod 13, the top bar 112 moves upward in the slide 111 and drives the flexible scraper 113 to fit and contact the top of the cavity of the vacuum chamber 3. With the slide 111 sliding back and forth on the screws 9, the flexible scraper 113 wipes away the volatile and adhered residues on the top of the cavity of the vacuum chamber 3. Based on the above, when the bottom notches on both sides of the top bar 112 reciprocate and slide against the top of the adjusting rod 13, the horizontal bar at the air inlet of the air inlet chamber 123 inside the top bar 112 abuts against the corresponding pressure block 122 in the sliding path at the top of the adjusting rod 13. This causes the pressure block 122 to squeeze the spring downward in the mounting hole 121. The downward movement of the pressure block 122 no longer blocks the mounting hole 121, allowing the nitrogen gas input from the external air supply mechanism into the adjusting rod 13 to enter the air inlet chamber 123 through the mounting hole 121, and then spray out from multiple air outlets on both sides of the groove at the top of the top bar 112. This allows the top of the inner cavity of the vacuum box 3 to be thoroughly purged during the reciprocating sliding of the top bar 112. Combined with the flexible scraper 113 to wipe away the volatile and adhered residues and the real-time suction of the vacuum pump, the cleaning effect is improved more evenly and efficiently. After the nitrogen purging cleaning stage of vacuum chamber 3 is completed, slide 111 is reset to its initial position, so that slide 111 is stored in the arc-shaped grooves on the front and rear walls of the inner cavity of vacuum chamber 3, so as to avoid affecting the subsequent plasma cleaning process.

[0022] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A plasma cleaner based on chip packaging, comprising a body (1), characterized in that: A base (2) is installed at the bottom of the cavity above the machine body (1). A vacuum box (3) is connected to the base (2) above it by a sealing ring with a concave-convex fit. Sliding frames (4) are fixed on the left and right sides of the vacuum box (3). The sliding frames (4) are slidably connected to mounting frames (5) through multiple columns at the top. The mounting frames (5) are fixed at the top of the cavity above the machine body (1). A drive cylinder (6) is fixed inside the mounting frame (5). The output end of the drive cylinder (6) is connected to the top of the sliding frame (4). An automatic feeding mechanism (7) and an automatic unloading mechanism (8) are respectively provided on the left and right sides of the base (2). The vacuum box (3) is located on the left and right sides of the cavity. Each groove is sealed and rotatably connected with a screw (9). A motor (10) is connected to the rear of the left screw (9). The motor (10) is installed in the groove on the rear side of the vacuum chamber (3) through a bracket. The two screws (9) are connected by a rear belt and a pulley. An adjusting rod (13) is provided below each of the two screws (9). The inner cavity of the two adjusting rods (13) is connected to the external gas supply mechanism through a rear pipe and a hose. The two adjusting rods (13) are respectively installed in the grooves on the left and right sides of the inner cavity of the vacuum chamber (3). A cleaning component (11) and an air intake component (12) are provided between the screw (9) and the adjusting rod (13).

2. The plasma cleaner based on chip packaging according to claim 1, characterized in that: The top of the inner cavity of the vacuum chamber (3) is designed with an arc-shaped structure. The long opening in the center of the top of the inner cavity of the vacuum chamber (3) is connected to the external vacuum pump body through pipes and hoses. The nozzle radio frequency electrode is provided in the circular groove at the top of the inner cavity of the vacuum chamber (3).

3. The plasma cleaner based on chip packaging according to claim 1, characterized in that: The cleaning component (11) includes a slide (111), which is threaded to two screws (9) on its left and right sides respectively. A top bar (112) is vertically slidably installed inside the slide (111), and a flexible scraper (113) is fixed in the groove at the top of the top bar (112).

4. A plasma cleaner based on chip packaging according to claim 3, characterized in that: The slide (111) and top bar (112) are both designed as arc-shaped structures. The arc-shaped structure of the slide (111) corresponds to the arc-shaped grooves on the front and rear walls of the vacuum chamber (3). The arc-shaped grooves on the front and rear walls of the vacuum chamber (3) are used for storing the slide (111) in its initial state.

5. A plasma cleaner based on chip packaging according to claim 3, characterized in that: The top bar (112) is connected to the top of the adjusting rod (13) in a sealed sliding connection through the bottom notches on the left and right sides. The top protrusion of the adjusting rod (13) is designed with inclined surfaces on the front and back sides. The top protrusion of the adjusting rod (13) is used for adjusting the position of the top bar (112).

6. A plasma cleaner based on chip packaging according to claim 1, characterized in that: The air intake assembly (12) includes multiple mounting holes (121), which are arranged on the top of the protrusion of the adjusting rod (13). The mounting holes (121) are connected to the internal cavity of the adjusting rod (13). Each mounting hole (121) is fitted with a pressure block (122) that is vertically slidably mounted by a spring.

7. A plasma cleaner based on chip packaging according to claim 3, characterized in that: The air intake assembly (12) also includes an air intake chamber (123) opened in the top bar (112). The air intake ports on the left and right sides of the air intake chamber (123) are opened at the lower notches on the left and right sides of the top bar (112). Multiple air outlets are arranged on both sides of the top groove of the top bar (112). The multiple air outlets of the top bar (112) are all connected to the air intake chamber (123).

8. A plasma cleaner based on chip packaging according to claim 6, characterized in that: The pressure block (122) has two protrusions on the top, both sides of which are designed as inclined structures. The pressure block (122) lifts the two inclined protrusions for sliding contact with the horizontal bar at the air inlet of the air inlet (123). The pressure block (122) is used to open and close the air inlet (123) and the internal cavity of the adjusting rod (13).

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