Misalignment chamfer on wafer in connector system

Abstract

A circuit board is provided for insertion into a circuit board receiving slot of a mating electrical connector. The circuit board includes a first side surface and a second side surface opposite to the first side surface. A mating end extends between the first and second side surfaces. The mating end is configured to be inserted into the circuit board receiving slot of the mating electrical connector. An offset chamfered edge is provided on the mating end. The offset chamfered edge has a peak, a first angled surface, and a second angled surface, wherein the peak is offset from the longitudinal axis of the circuit board.

Description

Technical Field

[0001] This invention generally relates to substrates or wafers having offset chamfers on their front or mating ends. In particular, the invention relates to substrates or wafers with offset chamfers that reduce mating forces and help prevent impacts when the substrate or wafer mates with a mating connector. Background Technology

[0002] Electrical connectors used to interconnect circuit board baseboards to daughterboards typically consist of two mating connector halves. One of the mating halves usually includes multiple chips or circuit boards, including signal-carrying traces and ground traces. These connectors have high contact density and require operation at relatively high electrical speeds. Due to the ongoing trends of miniaturization and improved electrical performance in the electronics industry, there are constantly emerging requirements for even greater contact density and higher electrical speeds. Therefore, as density increases, the alignment of the connector halves becomes increasingly difficult. In particular, the contact between the chip and the contacts of the mating connector can be significant when the chip is inserted into the chip receiving slot of the mating connector. Furthermore, the mating force required to insert multiple chips into multiple chip receiving slots can be problematic.

[0003] Therefore, it would be beneficial to provide a connector system in which mating forces and impacts between mating connectors are minimized. In particular, it would be beneficial to provide a substrate or wafer with a mating edge having an offset chamfer, which allows for reduced insertion force and less impact during mating. Summary of the Invention

[0004] The following provides an overview of some illustrative embodiments of the invention. This invention is not a broad overview and is not intended to identify key or essential aspects or elements of the invention or to describe its scope.

[0005] One embodiment relates to a circuit board for insertion into a circuit board receiving slot of a mating electrical connector. The circuit board includes a first side surface and a second side surface opposite to the first side surface. A mating end extends between the first and second side surfaces. The mating end is configured to be inserted into the circuit board receiving slot of the mating electrical connector. An offset chamfered edge is provided on the mating end. The offset chamfered edge has a peak, a first angled surface, and a second angled surface, wherein the peak is offset from the longitudinal axis of the circuit board.

[0006] One embodiment relates to a circuit board for insertion into a circuit board receiving slot of a mating electrical connector. The circuit board includes a mating end and an opposing tail end. The mating end is configured to be inserted into a circuit board receiving slot in the mating electrical connector. A first side surface extends from the mating end to the tail end. A second side surface is opposite to the first side surface and extends from the mating end to the tail end. An offset chamfered edge is provided on the mating end. The offset chamfered edge has a peak, a first angled surface, and a second angled surface. The peak is offset from the longitudinal axis of the circuit board. The first angled surface extends from the peak to the first side surface and is angled rearward toward the tail end of the circuit board. The second angled surface extends from the peak to the second side surface and is angled rearward toward the rear end of the wafer.

[0007] One embodiment relates to an electrical connector having a housing for holding a plurality of wafers. The wafers include a mating end and opposing tail ends. The mating end is configured to be inserted into a circuit board receiving slot in the mating electrical connector. A first side surface of the wafer extends from the mating end to the tail end. A second side surface is opposite to the first side surface. An offset chamfered edge is provided on the mating end. The offset chamfered edge has a peak, a first angled surface, and a second angled surface. The peak is offset from the longitudinal axis of the wafer. When the wafers are inserted into the circuit board receiving slot in the mating electrical connector, the offset chamfered edge prevents the wafers from bumping or knocking.

[0008] Additional features and aspects of the invention will become apparent to those skilled in the art after reading and understanding the following detailed description of exemplary embodiments. As will be understood by those skilled in the art, other embodiments of the invention are possible without departing from the scope and spirit of the invention. Therefore, the drawings and related descriptions should be considered illustrative in nature and not restrictive. Attached Figure Description

[0009] Figure 1 This is a perspective view of an illustrative connector assembly of the present invention, wherein the daughter card connector assembly and the base plate connector assembly are shown in an unfitted state.

[0010] Figure 2 This is a cross-sectional view of part of the daughter card connector assembly and part of the base plate connector assembly before mating.

[0011] Figure 3 It indicates that it is in the mating position. Figure 2 A cross-sectional view of a portion of the daughter card connector assembly and a portion of the base plate connector assembly.

[0012] Figure 4 It is by Figure 2 The dashed line 4 in the figure indicates an enlarged sectional view of the portion of the daughter card connector assembly and the portion of the base plate connector assembly.

[0013] The accompanying drawings, which are incorporated in and form a part of this specification, schematically illustrate one or more exemplary embodiments of the invention and, together with the general description given above and the detailed description given below, serve to explain the principles of the invention. Detailed Implementation

[0014] Figure 1 An illustrative electrical connector system 10 is shown, having a baseplate connector 12 and a daughterboard connector 14 for electrically connecting a baseplate circuit board (not shown) and a daughterboard circuit board (not shown). While the electrical connector system 10 is described herein with reference to baseplate connector 12 and daughterboard connector 14, it should be understood that the subject matter herein can be used with different types of electrical connectors other than baseplate connectors or daughterboard connectors. Baseplate connector 12 and daughterboard connector 14 are merely illustrative of the electrical connector system 10.

[0015] In the illustrative embodiment shown, the daughter card connector 14 is configured as a right-angle connector, wherein the mating interface 16 and the mounting interface 18 of the daughter card connector 14 are oriented perpendicularly to each other. The daughter card connector 14 is mounted to the daughter card circuit board at the mounting interface 18. In alternative embodiments, other orientations of interfaces 16, 18 are possible.

[0016] The daughter card connector 14 includes a housing 20 made of one or more components, which holds multiple substrates or wafers 22, such as, but not limited to, circuit boards therein. The wafers 22 have mating ends 24. The wafers 22 can have different configurations, such as, but not limited to, microstrip (two layers) or stripline (four or more layers). In an illustrative embodiment, the wafer 22 has a signal path or trace (not shown) on one side 21 and a ground plane member (not shown) on the opposite side 23. The signal path or trace and the ground plane member extend to the mating end 24 near the wafer 22. The mating end 24 is positioned in a recess 26 of the housing 20, which extends from a mating interface 18 of the housing 20.

[0017] like Figure 4As shown, each wafer 22 has an offset chamfered edge 25 at its mating end 24. The offset chamfered edge 25 has a peak 27, a first tilted or angled surface 29, and a second tilted or angled surface 31. The peak 27 is offset from the longitudinal axis 33 of the wafer 22. The first angled surface 29 extends from the peak and is angled rearward toward the tail end of the wafer 22. The second angled surface 31 extends from the peak and is angled rearward toward the tail end of the wafer 22. In the illustrated embodiment, the distance D1 from the side 23 of the first angled surface 29 to the peak 27 is greater than the distance D2 from the side 21 of the second angled surface 31 to the peak 27. However, other configurations can be used, including but not limited to the first angled surface 29 being smaller than the second angled surface 31. Angles set between these can vary depending on the desired configuration: the first angled surface 29 and the side 23; the second angled surface 31 and the side 21; and the first angled surface 29 and the second angled surface 31. In the illustrated embodiment, the peak 27 has a circular outer surface 35. In the illustrated embodiment, the width of the mating end 24 of each wafer 22 is smaller than the width of the rest of the wafer 22.

[0018] In the illustrated embodiment, the baseplate connector 12 constitutes a plug connector mounted to the baseplate circuit board. However, other types of connectors may be used. When the baseplate connector 12 is mated to the daughter card connector 14, the daughter card circuit board is oriented substantially perpendicular to the baseplate circuit board. (See also...) Figure 1 and Figure 2 The base plate connector 12 includes mating ends 30 and mounting ends 32 that are generally oriented parallel to each other.

[0019] In the illustrative embodiment, the baseplate connector 12 includes a one-piece housing 34. Alternatively, the housing may include multiple separate housings or modules. The housing 34 has one or more substrate or wafer receiving slots 36 extending from the mating end 30 toward the mounting end 32.

[0020] The housing 34 holds at least one row of signal contacts 42 and at least one ground shield contact member 44. The at least one row of signal contacts 42 is positioned on one side of one or more wafer receiving slots 36. The at least one ground shield contact member 44 is positioned on the opposite side of one or more wafer receiving slots 36.

[0021] Signal contacts 42 extend between mating end 30 and mounting end 32. In an exemplary embodiment, signal contacts 42 are arranged in pairs to carry differential signals. However, in other configurations, signal contacts 42 may be arranged unpaired to carry differential signals, such as single-ended signals. Grounding shield contact member 44 extends between mating end 30 and mounting end 32.

[0022] Each signal contact 42 has a resilient contact arm 46, a retaining portion 48, and a circuit board mounting portion 50. In the illustrated embodiment, each resilient contact arm 46 has an introduction portion 52 and an engagement portion 54. The resilient contact arm 46 is configured to press against the signal conductive pad 24 of the signal trace of the chip 22 of the daughter card connector 14 when the daughter card connector 14 is inserted into the chip receiving slot 36 of the base board connector 12.

[0023] The retaining portion 48 has a retaining member 56, which may be, but is not limited to, a barb or protrusion extending from the surface of the retaining portion 48. The retaining member 56 mates with the housing 34 to retain the signal contact 42 in the base plate connector 12.

[0024] The circuit board mounting portion 50 has compliant portions 58, such as pin holes, but other configurations can be used. The circuit board mounting portion 50 mates with a base circuit board to hold the signal contact 42 to the base circuit board. The configuration of the signal contact 42 is intended to be illustrative, as other embodiments of the signal contact can be used.

[0025] In an illustrative embodiment, the grounding shield contact member 44 has a bent working spring portion 60. A grounding shield resilient contact beam or grounding shield contact spring finger 62 extends from a first end of the bent working spring portion 60. The grounding shield contact spring finger 62 is configured to press against the ground plane member of the substrate or wafer 22 when the daughter card connector engages with the baseboard connector 12. The specific configuration of each grounding shield contact beam 62 may vary or may be consistent.

[0026] Mounting member 70 extends from the second end of the bent working spring portion 60. In the illustrated embodiment, mounting member 70 is a pin-compliant member eyelet, but other types of mounting members 70 can be used.

[0027] When the baseplate connector 12 and the daughter card connector 14 are mated together, the mating end 24 of the wafer 22 of the housing 20 of the daughter card connector 14 moves through the mating end 30 of the housing 34 and into the wafer receiving slot 36. During insertion, the longitudinal axis 33 of the wafer 22 is positioned substantially aligned with the longitudinal axis 37 of the wafer receiving slot 36. Because the peak 27 of the offset chamfered edge 25 is offset from the longitudinal axis 33 of the wafer 22, the peak 27 of the offset chamfered edge 25 is also offset from the longitudinal axis 37 of the wafer receiving slot 36, as shown below. Figure 4 As shown.

[0028] As insertion continues, the second angled surface 31, offset from the chamfered edge 25, engages the lead-in portion 52 of the resilient contact arm 46 of the signal contact 42. Continued insertion causes the lead-in portion 52 to slide along the second angled surface 31, causing the resilient contact arm 46 to move to a stressed position where the engagement portion 54 moves away from the longitudinal axis 37 of the wafer receiving slot 36.

[0029] With the resilient contact arm 46 properly held in the stressed position, the wafer 22 continues to be inserted into the wafer receiving slot 36. As this occurs, the first angled surface 29, offset from the chamfered edge 25, engages the lead-in portion 66 of the resilient contact arm 64 of the grounding shield contact member 44. Continued insertion causes the lead-in portion 66 to slide along the first angled surface 29, thereby causing the resilient contact arm 64 to move to the stressed position, in which the engagement portion 68 moves away from the longitudinal axis 37 of the wafer receiving slot 36.

[0030] With the daughter card connector 14 and the baseplate connector 12 fully inserted, and the wafer 22 properly positioned in the wafer receiving slot 36, the engagement portion 54 of the signal contact 42 applies force to the signal trace on side 21, thereby ensuring that the engagement portion 54 of the signal contact 42 is positioned and maintains mechanical and electrical engagement with the signal trace. Additionally, the engagement portion 68 of the ground shield contact member 44 applies force to the ground plane member on side 23, thereby ensuring that the engagement portion 68 of the ground shield contact member 44 is positioned and maintains mechanical and electrical engagement with the ground plane member.

[0031] In the illustrated and described embodiments, the offset chamfered edge 25 initially makes physical contact with the signal contact 42 because the signal contact 42 is longer, and the lead-in portion 52 is positioned closer to the mating end 30 of the baseplate connector 12. However, in other embodiments where the ground shield contact member 44 is longer and the lead-in portion 66 is positioned closer to the mating end 30 of the baseplate connector 12, the offset chamfered edge 25 will initially make physical contact with the ground shield contact member 44.

[0032] When the baseplate connector 12 and daughter card connector 14 mate together, the use of offset chamfered edges 25 and staggered lengths of the signal contact 42 and ground shield contact member 44 allows for reduced mating forces. Additionally, the offset chamfered edges 25 help prevent the wafer 22z from bumping against the signal contact 42 and ground shield contact member 44. The offset chamfered edges 25 provide a more impact-resistant introduction on one side of the wafer 22 (in the illustrated embodiment, the first angled surface 29) relative to the opposite side (in the illustrated embodiment, the second angled surface 31). This offset is useful in applications where one side 23 of the wafer 22 mates with the ground shield contact member 44 and the other side 21 mates with the signal contact 42. Depending on the configuration of the baseplate connector 12, either the ground shield contact member 44 or the signal contact 42 is generally more susceptible to bumping than the other. The offset chamfered edges 25, having peaks 27 offset from the longitudinal axis 33 of the wafer 22, allow this problem to be overcome, thereby preventing bumping during insertion.

Claims

1. A circuit board for insertion into a circuit board receiving slot of a mating electrical connector, the circuit board comprising: First side surface; The second side surface opposite to the first side surface; A mating end, extending between a first side surface and a second side surface, is configured to be inserted into a circuit board receiving slot of a mating electrical connector; An offset chamfer edge is provided on the mating end. The offset chamfer edge has a peak, a first angled surface, and a second angled surface. The peak is offset from the longitudinal axis of the circuit board.

2. The circuit board of claim 1, wherein, The first angled surface extends from the first side surface to the peak.

3. The circuit board as described in claim 2, wherein, The first angled surface extends from the peak and angles backward toward the tail end of the circuit board, with the tail end opposite the mating end.

4. The circuit board as described in claim 2, wherein, The second angled surface extends from the second side surface to the peak.

5. The circuit board as described in claim 4, wherein, The second angled surface extends from the peak and is angled backward toward the rear end of the wafer.

6. The circuit board as claimed in claim 4, wherein, The length of the first angled surface is longer than the length of the second angled surface.

7. The circuit board as claimed in claim 1, wherein, The peak has a circular outer surface.

8. The circuit board as claimed in claim 4, wherein, The first side surface has a signal path disposed thereon, and the second side surface has a ground plane member disposed thereon.

9. The circuit board as claimed in claim 4, wherein, The second side surface has a signal path disposed thereon, and the first side surface has a ground plane member disposed thereon.

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