Electrical connector housing with windows to facilitate seating of press-fit contacts

Abstract

An electrical connector assembly has a housing with multiple wafer receiving cavities extending from a mating end of the housing to a mounting end of the housing. A top surface of the housing is substantially parallel to and opposite to the mating end of the housing. A window is disposed in the top surface of the housing, extending through the top surface and into the wafer receiving cavity. Multiple wafers are positioned in the wafer receiving cavity. Each wafer has a mating end and a mounting end, with its top surface substantially parallel to and opposite to the mounting end of the wafer. The top surface of the wafer extends into the window of the housing. Force is applied directly to the top surface of the wafer to properly position the wafer with a mating substrate.

Description

Technical Field

[0001] This invention relates to an electrical connector housing having a window to expose the top side of a printed circuit board wafer positioned within the housing. The window allows forces to be applied directly to the top side of the printed circuit board wafer, thereby allowing the printed circuit board wafer to properly seat when mated with a daughter card. Background Technology

[0002] Interconnect systems, or connectors, are used to route signals from one electronic component to another. Due to the complexity of the devices, interconnect systems typically need to carry large amounts of data. Furthermore, this data is usually transmitted at high data rates. Simultaneously, the system needs to be as small as possible. Therefore, interconnect systems capable of carrying many high-speed signals within a relatively small space are required.

[0003] To meet density and signal integrity requirements, connectors utilize stacked printed circuit board (PCB) chips, completely enclosed within a housing or connector housing. The chips have compliant pins at their mounting ends, which position themselves within through-holes in the daughter card when the connector mates with it. To fully engage the connector with the daughter card, a significant force is applied to the housing, which is then transferred to the floating PCB chips to ensure all compliant pins are fully seated in the through-holes. However, because the PCB chips must be able to move within the housing to compensate for variations in fit with the mating connector, applying force to the housing does not always result in all compliant pins being fully engaged in the through-holes, potentially leading to electrical and mechanical problems.

[0004] Therefore, it would be beneficial to provide a connector housing that allows insertion force to be applied directly to the surface of the floating printed circuit board wafer to ensure that the compliant pin is correctly and completely positioned in the through hole of the mating daughter card. Summary of the Invention

[0005] This embodiment relates to an electrical connector assembly having a housing with a plurality of wafer receiving cavities extending from a mating end of the housing to a mounting end of the housing. A top surface of the housing is substantially parallel to and opposite to the mating end of the housing. A window is disposed in the top surface of the housing and extends through the top surface of the housing into the wafer receiving cavity. A plurality of wafers are positioned in the wafer receiving cavity. The wafer has a mating end and a mounting end, with its top surface substantially parallel to and opposite to the mounting end of the wafer. The top surface of the wafer extends into the window of the housing. Force is applied directly to the top surface of the wafer to properly position the wafer with a mating substrate.

[0006] This embodiment relates to an electrical connector assembly having a housing with a plurality of wafer receiving cavities extending from a mating end of the housing to a mounting end of the housing. The wafer receiving cavities extend in planes substantially parallel to and spaced apart from adjacent wafer receiving cavities. The planes of the wafer receiving cavities extend in planes substantially perpendicular to the planes of the mounting ends. A top surface of the housing is substantially parallel to and opposite to the mating ends. A window is disposed in the top surface of the housing and extends through the top surface of the housing into the wafer receiving cavity. A plurality of wafers are positioned in the wafer receiving cavities. Each wafer has a mating end and a mounting end, with its top surface substantially parallel to and opposite to the mounting end of the wafer. The top surface of the wafer extends into the window of the housing. Mounting contacts are located at the mounting ends of the wafers. The mounting contacts have compliant mounting portions extending from the mounting ends of the wafers. A force is applied directly to the top surface of the wafers such that the mounting ends of the mounting contacts are inserted into through-holes in the mating substrate.

[0007] The embodiments relate to a method for mating an electrical connector assembly having a wafer positioned in a wafer receiving cavity with a substrate. The method includes: positioning a compliant mounting portion of a mounting contact of the connector assembly to align with a corresponding through-hole of the substrate; positioning an insert rod in a window of the housing of the connector assembly; moving the insert rod to directly engage with the top surface of the wafer; and continuing to move the insert rod to apply force to the wafer, causing the wafer to move toward the substrate such that the compliant mounting portion of the mounting contact moves into and is fully seated in the corresponding through-hole. Attached Figure Description

[0008] Figure 1 This is a perspective view of an illustrative embodiment of a connector having a printed circuit board chip positioned within a housing.

[0009] Figure 2 It is along Figure 1 The cross-sectional view of the connector taken from line 2-2 is... Figure 1 A perspective view of the connector before it mates with the instruction sub-card.

[0010] Figure 3 yes Figure 1 A perspective view of the connector before it mates with the instruction sub-card.

[0011] Figure 4 It works in conjunction with the daughter card. Figure 1 A perspective view of the connector, with the force applicator positioned in a window in the connector housing, the force applicator mechanically engaging with the top surface of the connector's printed circuit board wafer.

[0012] Figure 5 It is along Figure 4 The cross-sectional view taken from line 5-5.

[0013] Figure 6 It is along Figure 4 The cross-sectional view taken from line 6-6.

[0014] Figure 7 It works in conjunction with the daughter card. Figure 4 A perspective view of the connector, in which the force applicator has been removed. Detailed Implementation

[0015] Figure 1 An electrical connector assembly 10 formed according to an illustrative embodiment is shown. In the illustrative embodiment, the electrical connector assembly 10 is a daughter card connector that can mate with a mating backplane connector (not shown) to electrically connect a backplane circuit board (not shown) and a daughter card circuit board (not shown). Although the electrical connector assembly 10 is described herein with reference to a daughter card connector, it should be understood that the subject matter herein can be used with different types of electrical connectors other than daughter card connectors. The daughter card connector assembly 10 is merely an illustrative embodiment of the type of electrical connector assembly 10 that mates with a mating connector.

[0016] In the illustrative embodiment shown, connector assembly 10 forms a right-angle connector, wherein the mating end 16 and mounting end 18 of connector assembly 10 are oriented perpendicularly to each other. Connector assembly 10 is mounted to daughter card circuit board 19 at mounting end 18. Connector assembly 10 is mounted to mating connector (not shown) at mating end 16. In alternative embodiments, other orientations of ends 16, 18 are possible.

[0017] The connector assembly 10 includes a housing 20 having a plurality of wafer receiving cavities or slots 21 extending from a mating end 16 to a mounting end 18. The wafer receiving cavities 21 extend in planes parallel to and spaced apart from adjacent wafer receiving cavities 21. The planes of the wafer receiving cavities 21 extend in planes substantially perpendicular to the plane of the mounting end 18.

[0018] The housing 20 has a top surface 17, which is substantially parallel to and opposite to the mounting end 18. A window or recess 25 is provided in the top surface 17. The window 25 extends through the top surface 17 and into the wafer receiving cavity 21. The longitudinal axis 27 of the window 25 extends along the entire length of the housing 20.

[0019] Multiple wafers, substrates, or circuit boards 22 are held within the housing 20. The wafers, substrates, or circuit boards 22 are positioned within wafer receiving cavities 21 and extend from mating end 16 through the housing 20 to mounting end 18. In the illustrated embodiment, the connector assembly 10 has fourteen wafer receiving cavities 21 and wafers 22, but other numbers of wafer receiving cavities 21 and wafers 22 may be provided. The wafers 22 extend in planes parallel to and spaced apart from adjacent wafers 22.

[0020] Each chip 22 has a mating end 24 configured to mate with a mating connector (not shown) and a mounting end 26 configured to be mounted to a daughter card circuit board 19. The mating end 24 extends from the mating end 16 of the connector assembly 10, and the mounting end 26 extends from the mounting end 18 of the connector assembly 10.

[0021] like Figure 3 As shown, the wafer 22 has a top surface 23 that is substantially parallel to and opposite to the mounting end 26. The top surface 23 extends into the window 25 of the housing 20.

[0022] Each chip 22 has a mounting contact 30 positioned at a mounting end 26. For example... Figure 6 As shown, the mounting contact 30 has a circuit board engagement resilient arm 31, a retaining section 33, and a compliant mounting portion 35. The circuit board engagement resilient arm 31 applies a normal force to an electronic (signal / ground) path (not shown) located on the side of the wafer 22 to mechanically and electrically connect the circuit board engagement resilient arm 31 to the electronic path. This type of interference fit between the circuit board engagement resilient arm 31 and the path of the wafer 22 allows the wafer 22 to move or float relative to the mounting contact 30 while still maintaining the electrical connection between them. In the illustrated embodiment, the compliant mounting portion 35 has a pinhole construction, but other types of compliant mounting portions 35 can be used.

[0023] With the wafer 22 properly positioned within the wafer receiving cavity 21 of the housing, the mounting contacts 30 are positioned in a straight line with the window 25 of the housing 20. The width of the window 25 is sufficient to ensure that all mounting contacts 30 are positioned in a straight line with the window 25.

[0024] In use, the fully assembled connector assembly 10 is moved close to the daughter card circuit board 19, such that the conformal mounting portion 35 of the mounting contact 30 is positioned to align with the corresponding through hole 47 of the daughter card circuit board 19, as... Figure 2 As shown. In this position, the insertion rod 50 moves to a position close to the window 25 of the housing 20 and aligned with the window 25, as shown. Figures 3 to 5 As shown.

[0025] The compliant mounting portion 35 of the mounting contact 30 is partially inserted into the corresponding through-hole 47 of the daughter card circuit board 19. The insertion rod 50 moves toward the daughter card circuit board 19. When the insertion rod 50 is positioned aligned with the window 25, the continued movement of the insertion rod 50 causes the guide surface 52 of the insertion rod 50 to enter the window 25 and engage the top surface 23 of the chip 22.

[0026] As the insertion rod 50 moves toward the daughter card circuit board 19, the force F applied by the insertion rod 50 causes the floating wafer 22 to move downwards until the mounting end 26 engages with the pushing surface 39 of the fixing section 33 of the mounting contact 30. With the mounting end 26 of the wafer 22 engaged with the pushing surface 39 of the fixing section 33, continued movement of the insertion rod 50 causes the compliant mounting portion 35 to move into and fully position itself in the corresponding through hole 47. Because the insertion rod 50 and the compliant mounting portion 35 are directly aligned, the force applied to the top surface 23 by the insertion rod 50 is directly transferred to the compliant mounting portion 35.

[0027] With the compliant mounting portion 35 of the mounting contact 30 correctly in place, the insertion rod 50 moves away from the daughter card circuit board 19 and out of the window 25, as... Figure 7 As shown. When the force is removed from the insertion rod 50, the compliant mounting portion 35 remains fully inserted. However, with the removal of the force, the wafer 22 is allowed to move slightly in its longitudinal direction, thereby allowing the wafer 22 to float relative to the housing 20 to compensate for any misalignment between the connector assembly 10 and the mating backplate connector.

[0028] Applying force directly to the top surface 23 of the chip 22 allows for the use of a smaller compliant mounting portion 35 on the module contacts 30, which improves signal integrity for signal transmission flowing between the chip 22 and the daughter card circuit board 19. Additionally, the configuration of the electrical connector assembly 10 allows a direct force F to be applied to the top surface 23 of the chip 22, thereby temporarily eliminating chip 22 float during the application process, while allowing chip 22 to float once the connector assembly 10 is fully in place on the daughter card circuit board 19.

Claims

1. An electrical connector assembly, comprising: A housing having multiple wafer receiving cavities extending from the mating end of the housing to the mounting end of the housing; The top surface of the housing is substantially parallel to and opposite to the mating end of the housing, and a window disposed in the top surface of the housing extends through the top surface of the housing and enters the wafer receiving cavity; Multiple wafers are positioned in the wafer receiving cavity, each wafer having a mating end and a mounting end, the top surface of the wafer being substantially parallel to and opposite to the mounting end of the wafer, and the top surface of the wafer extending into a window of the housing; This applies force directly to the top surface of the wafer to properly position the wafer in relation to the mating substrate.

2. The electrical connector assembly of claim 1, wherein the longitudinal axis of the window extends across the entire length of the housing.

3. The electrical connector assembly of claim 1, wherein the wafer has a mounting contact positioned at a mounting end of the wafer.

4. The electrical connector assembly of claim 3, wherein the mounting contact has a circuit board engagement resilient arm, a retaining section, and a compliant mounting portion.

5. The electrical connector assembly of claim 4, wherein the circuit board engagement resilient arm applies a normal force to an electronic path positioned on the side of the wafer to position the circuit board engagement resilient arm for mechanical and electrical connection with the electronic path.

6. The electrical connector assembly of claim 5, wherein an interference fit is provided between the circuit board engagement resilient arm and the path of the wafer, wherein the wafer is movable or floatable relative to the mounting contacts while still maintaining the electrical connection between them.

7. The electrical connector assembly of claim 4, wherein the compliant mounting portion has a pinhole configuration.

8. The electrical connector assembly of claim 4, wherein the retaining segment has a pushing surface that engages the wafer when the wafer is pushed toward the mounting end of the housing.

9. The electrical connector assembly of claim 3, wherein the mounting contact is positioned in a straight line with a window of the housing.

10. The electrical connector assembly of claim 1, wherein the connector assembly is a right-angle connector, wherein the mating end and the mounting end of the connector assembly are oriented perpendicularly to each other.

11. A method for mating an electrical connector assembly having a wafer positioned in a wafer receiving cavity with a substrate, the method comprising: Position the compliant mounting portion of the mounting contacts of the connector assembly to align with the corresponding through-holes of the substrate. Position the insertion rod in the window of the housing of the connector assembly; Move the insertion rod to directly engage with the top surface of the wafer; Continue moving the insertion rod to apply force to the wafer, causing the wafer to move toward the substrate, so that the compliant mounting portion of the mounting contact moves into the corresponding through hole and is fully positioned in the corresponding through hole.

12. The method of claim 11, wherein the mounting contact is positioned in a straight line with the window of the housing.

13. The method of claim 11, wherein as the wafer moves toward the substrate, the wafer engages the pushing surface of the fixed segment of the mounting contact.

14. The method of claim 11, further comprising: Remove the insertion rod from the window, where the compliant mounting portion remains fully inserted and allows the wafer to move slightly in its longitudinal direction to allow the wafer to float relative to the housing, thereby compensating for any misalignment between the connector assembly and the mating connector.

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