Impedance matching system for a gallium arsenide epitaxial inductive power supply
By employing a new impedance matching system in gallium arsenide epitaxial processes to replace traditional inductors, efficient impedance matching and load adaptation are achieved, improving the efficiency and reliability of gallium arsenide epitaxial processes.
Patent Information
- Application Number
- CN202511551387.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-28
- Publication Date
- 2026-11-06
AI Technical Summary
In existing gallium arsenide epitaxial processes, traditional impedance matching schemes rely on large-size inductors, resulting in high parasitic resistance losses, low efficiency, and an inability to track load changes in real time, which affects the uniformity of epitaxial layer thickness and electrical performance.
It employs an uncontrolled rectifier module, a high-frequency chopper module, a full-bridge inverter circuit, and an impedance matching module, combined with an impedance matching transformer, matching capacitor, and feedback module. Real-time impedance matching is achieved through a phase detector and a phase-locked loop, replacing traditional inductor components. The full-bridge inverter frequency is dynamically adjusted to ensure the stability of impedance matching.
It reduces the size of the device, eliminates inductive heat loss, improves power output efficiency, ensures rapid response and impedance matching stability under load changes, and improves the uniformity of epitaxial layer thickness and crystal quality.
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Figure CN123054871A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of power supply technology, and in particular to an impedance system for a gallium arsenide epitaxial inductive power supply. Background Technology
[0002] Gallium arsenide (GaAs) epitaxy, a key technology in the semiconductor field, enables the precise growth of GaAs single-crystal thin films on substrates to construct core optoelectronic products such as high-performance radio frequency devices, laser diodes, and high-efficiency solar cells. This process heavily relies on advanced technologies such as molecular beam epitaxy (MBE), metal-organic chemical vapor deposition (MOCVD), and liquid phase epitaxy. These technologies all require a high-frequency inductive power supply to heat the reaction chamber to a high-temperature environment of 600-1200°C to activate atomic migration and achieve atomic-level stacking of the epitaxial layers. During this process, the energy control precision of the high-frequency inductive power supply directly determines the uniformity, crystal defect density, and electrical performance parameters of the epitaxial layers.
[0003] However, practical applications face significant impedance matching challenges. The equivalent impedance of the induction coil varies significantly depending on the size of the gallium arsenide wafer, and traditional impedance matching schemes often use series inductors for compensation. This approach suffers from three major drawbacks: First, the matching range is narrow, covering only a specific impedance interval; the matching effect deteriorates drastically when wafer size changes or load parameters shift. Second, the inductor is bulky, difficult to integrate in compact epitaxial devices, and the heat loss generated when large currents flow through the inductor severely reduces energy efficiency. Third, the response is hysteretic, unable to track load changes in real time, leading to fluctuations in power transmission efficiency and affecting the uniformity of the epitaxial layer thickness. Summary of the Invention
[0004] The technical problem to be solved by this invention is to address the issue that existing impedance matching relies on large-size inductors, which results in high parasitic resistance losses and low efficiency of the induced power supply.
[0005] To address the aforementioned technical problems, this invention provides an impedance matching system for a gallium arsenide epitaxial inductive power supply. The system comprises: an uncontrolled rectifier module, a high-frequency chopper module, a full-bridge inverter circuit, and an impedance matching module connected in sequence. The impedance matching module includes an impedance matching transformer and a matching capacitor. The uncontrolled rectifier module converts an external AC power supply to a DC power supply. The high-frequency chopper module transforms the DC power supply to obtain a controllable DC source. The full-bridge inverter circuit inverts the controllable DC source into AC voltage and current. The output terminal of the impedance matching module is connected to the input terminal of the load. The impedance matching module is used to perform impedance matching on the AC voltage and current to obtain an impedance-matched AC voltage and current, which is then input to the load. The primary side of the impedance matching transformer is connected to the output terminal of the full-bridge inverter circuit, and the secondary side is connected to the load for primary-secondary impedance transformation. The matching capacitor includes a first matching capacitor connected in parallel on the primary side of the impedance matching transformer and a second matching capacitor connected in parallel on the secondary side and the load terminal. The matching capacitor is used to ensure that the voltage and current output to the load are in phase.
[0006] The feedback module includes a phase detector and a phase-locked loop (PLL). The input of the phase detector is connected to the load, and the output of the phase detector is connected to the input of the PLL. The output of the PLL is connected to the full-bridge inverter circuit. The phase detector is used to obtain the phase angle of the AC voltage and current of the input load and determine whether the impedance needs to be readjusted based on the phase angle. If so, the PLL adjusts the frequency of the full-bridge inverter circuit according to the phase angle and then re-inputs the impedance-matched AC voltage and current to the impedance matching module for re-matching. If not, the output is sent to the load. The PLL is used to adjust the frequency of the full-bridge inverter circuit according to the phase angle.
[0007] Furthermore, the high-frequency chopper module comprises a power transistor, a diode, and an inductor forming a Buck chopper circuit, used to convert DC voltage into a controllable DC source;
[0008] In this configuration, the collector of the power transistor is connected to the positive terminal of the uncontrolled rectifier, the emitter is connected to the cathode of the diode, the anode of the diode is connected to the negative terminal of the uncontrolled rectifier module, the cathode is connected to one end of the inductor, and the other end of the inductor is connected to the input terminal of the full-bridge inverter circuit.
[0009] Furthermore, the full-bridge inverter circuit comprises a first power transistor S1, a second power transistor S2, a third power transistor S3, and a fourth power transistor S4 forming a full-bridge structure, used to invert controllable DC into AC voltage and current.
[0010] In this configuration, the drain (D) of the first power transistor S1 and the source (S) of the first power transistor S2 are connected to the positive terminal of the primary side of the transformer. The drain (D) of the third power transistor S3 and the source (S) of the fourth power transistor S4 are connected to the negative terminal of the primary side of the transformer. The collectors of the first power transistor S1 and the third power transistor S3 are connected to an inductor. The emitters of the second power transistor S2 and the fourth power transistor S4 are connected to the anode of a diode.
[0011] Furthermore, the feedback module also includes a sampling unit and a digital signal processor; the sampling unit includes a voltage transformer and a current transformer, which are connected in series across the load and the second matching capacitor branch, respectively, for real-time acquisition of analog signals of load voltage and current; the input of the digital signal processor is connected to a phase detector, and the output controls the switching frequency of the full-bridge inverter circuit through a phase-locked loop.
[0012] Furthermore, the primary-to-secondary turns ratio of the impedance matching transformer is N1:N2 = 1:3.
[0013] Furthermore, determining whether impedance adjustment is needed based on the phase angle specifically involves:
[0014] The phase difference θ = φU - φI between the load voltage U and the current I is measured in real time using a phase detector.
[0015] Set the phase angle allowable threshold θthreshold = ±δ, where δ is the system's preset phase tolerance range;
[0016] If |θ|>θthreshold, then adjustment is required; if |θ|≤θthreshold, then adjustment is not required.
[0017] Furthermore, the system also includes an overvoltage protection module and an overcurrent protection module; the overvoltage protection module adopts a dual comparator architecture, which triggers the IGBT shutdown circuit when the DC bus voltage exceeds a preset threshold; the overcurrent protection module monitors the inverter output current in real time through a Rogowski coil, and activates hardware-level latching protection when the current mutation rate exceeds a safety threshold.
[0018] Furthermore, the impedance matching module includes an adjustable inductor matrix, which is composed of multiple tapped inductors and a relay array. The inductance is discretely adjusted by controlling the relays to switch on and off via a DSP.
[0019] Furthermore, the power transistors of the full-bridge inverter circuit are silicon carbide MOSFETs.
[0020] Furthermore, the system supports a multi-load parallel operation mode, with each load channel independently configured with an impedance matching transformer and a matching capacitor, and the power distribution of each channel is coordinated by a digital signal processor.
[0021] Compared with existing technologies, the impedance matching system for gallium arsenide epitaxial inductive power supplies of this invention has the following advantages:
[0022] The uncontrolled rectifier module of this invention converts AC power to DC power, followed by a first-stage controllable DC voltage conversion via a high-frequency chopper module. Subsequently, a full-bridge inverter circuit inverts the controllable DC source back into AC voltage and current. The impedance matching module, through an impedance matching transformer, achieves precise load impedance matching through a composite resonance between the first matching capacitor connected in parallel on the primary side and the second matching capacitor connected in parallel on the secondary side and at the load end. Compared to traditional impedance matching schemes that rely on large inductors, this system replaces inductors with impedance matching modules, reducing equipment size and eliminating heat loss caused by the equivalent parasitic resistance when large currents flow through inductors, thus improving power output efficiency. The phase detector in the feedback module monitors the phase difference between the load voltage and current in real time, and the full-bridge inverter frequency is dynamically adjusted via a phase-locked loop to ensure continuous and stable impedance matching. This fundamentally solves the problems of large size and high losses in traditional inductor matching schemes, thereby improving power output efficiency. Attached Figure Description
[0023] Figure 1 This is a schematic block diagram of the impedance matching system for gallium arsenide epitaxial inductive power supply provided in an embodiment of the present invention.
[0024] Figure 2 This is a schematic block diagram of the impedance matching system for a gallium arsenide epitaxial inductive power supply provided in another embodiment of the present invention;
[0025] Figure 3 This is a circuit diagram of the impedance matching system for a gallium arsenide epitaxial inductive power supply provided in an embodiment of the present invention;
[0026] Figure 4 This is another circuit diagram of the impedance matching system for the gallium arsenide epitaxial induction power supply provided in this embodiment of the invention;
[0027] Figure 5 This is an operation flowchart of the impedance matching system for gallium arsenide epitaxial induction power supply provided in an embodiment of the present invention. Detailed Implementation
[0028] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of the present invention, including various details to aid understanding. These details should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope of the invention. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.
[0029] like Figure 1-5As shown, in an optional embodiment of the present invention, the impedance matching system of the gallium arsenide epitaxial induced power supply includes:
[0030] The system comprises an uncontrolled rectifier module, a high-frequency chopper module, a full-bridge inverter circuit, and an impedance matching module connected in sequence. The impedance matching module includes an impedance matching transformer and a matching capacitor. The uncontrolled rectifier module converts an external AC power supply into a DC power supply. The high-frequency chopper module transforms the DC power supply to obtain a controllable DC source. The full-bridge inverter circuit inverts the controllable DC source into AC voltage and current. The output terminal of the impedance matching module is connected to the input terminal of the load. The impedance matching module is used to perform impedance matching on the AC voltage and current to obtain an impedance-matched AC voltage and current, which is then input to the load. The primary side of the impedance matching transformer is connected to the output terminal of the full-bridge inverter circuit, and the secondary side is connected to the load for impedance transformation between the primary and secondary sides. The matching capacitor includes a first matching capacitor connected in parallel on the primary side of the impedance matching transformer and a second matching capacitor connected in parallel on the secondary side and the load terminal. The matching capacitor is used to ensure that the voltage and current output to the load are in phase.
[0031] The feedback module includes a phase detector and a phase-locked loop (PLL). The input of the phase detector is connected to the load, and the output of the phase detector is connected to the input of the PLL. The output of the PLL is connected to the full-bridge inverter circuit. The phase detector is used to obtain the phase angle of the AC voltage and current of the input load and determine whether the impedance needs to be readjusted based on the phase angle. If so, the PLL adjusts the frequency of the full-bridge inverter circuit according to the phase angle and then re-inputs the impedance-matched AC voltage and current to the impedance matching module for re-matching. If not, the output is sent to the load. The PLL is used to adjust the frequency of the full-bridge inverter circuit according to the phase angle.
[0032] Controlled rectifier module: Composed of a diode bridge circuit, it converts AC power into pulsating DC, which, after capacitor filtering, provides a stable DC bus voltage as the energy input source for subsequent circuits. High-frequency chopper module: Employs a Buck topology to reduce the DC bus voltage to a controllable DC source, achieving precise voltage control and energy buffering.
[0033] Specifically, the AC power supply first enters the uncontrolled rectifier module, where it is converted into pulsating DC through diode bridge rectification and capacitor filtering, serving as a stable DC bus voltage source. The DC bus voltage then enters the high-frequency chopper module (Buck topology), where power transistor S0, driven by the DSP, performs modulation, reducing the bus voltage to a controllable DC source, achieving precise voltage control and energy buffering. During this process, inductor L0 stores and releases energy, and diode D0 provides a freewheeling path, ensuring current continuity. The controllable DC source is then input to the full-bridge inverter circuit, where four power transistors S1-S4 alternately conduct, inverting the DC into a high-frequency AC square wave. The output, after capacitor filtering, is connected to the primary side of the impedance matching transformer. The impedance matching transformer performs impedance transformation: the high-frequency AC on the primary side is stepped up / dropped by the transformer, mapping the load impedance to the equivalent impedance on the primary side, adapting to the power supply's internal resistance. The first matching capacitor C1 and the transformer's primary inductance form an LC resonance, eliminating reactive components; the second matching capacitor C2 further compensates for secondary leakage inductance, forming a dual-capacitor resonant structure. The two components work together to enable the system to operate at the resonant frequency, achieving zero-voltage / zero-current switching, reducing switching losses, and improving output efficiency. In the feedback module, the phase detector collects the phase difference θ between the load voltage U and the current I in real time and outputs it to the digital signal processor. After processing the phase difference signal, the full-bridge inverter frequency is adjusted through a phase-locked loop to stabilize θ within a tolerance range of ±1°. If |θ|>θthreshold (e.g., ±5°), frequency adjustment is triggered to re-optimize impedance matching; if it is within the tolerance, the current state is maintained, ensuring that the response time during load changes is <1ms, the phase difference fluctuation is ≤0.5°, and guaranteeing the uniformity of the epitaxial layer thickness (<2%) and crystal quality.
[0034] Specifically, a concrete embodiment will be used to further illustrate this with reference to a circuit diagram:
[0035] Please see Figure 3 The uncontrolled rectifier module is connected to a 380V AC power supply. The high-frequency chopper module has one power transistor S0, one diode D0, and one inductor L0 connected to form a Buck chopper circuit. The collector (C) of S0 is connected to the positive terminal of the uncontrolled rectifier, the emitter (E) of S0 is connected to the cathode of D0, the cathode of D0 is connected to L0, and the anode of D0 is connected to the negative terminal of the uncontrolled rectifier. The anodes of L0 and D0 are connected to the input terminals of the full-bridge inverter, namely the collector (C) of S1 and the emitter (E) of S2. The high-frequency inverter module has four power transistors S1, S2, S3, and S4 connected to form a full-bridge inverter circuit. The drain (D) of S1 and the source (S) of S2 are connected to the positive terminal of the primary side of the high-frequency transformer T0. The drain (D) of S3 and the source (S) of S4 are connected to the negative terminal of the primary side of the high-frequency transformer T0. The collectors of S1 and S3 are connected to L0. The emitters of S2 and S4 are connected to the anode of D0. A first matching capacitor C1 is connected in parallel to the primary side of the high-frequency transformer T0, and a second matching capacitor C2 is connected in parallel to the secondary side. This second matching capacitor C2 is then connected in parallel with the load. (See also...) Figure 3When an impedance matching transformer and its primary and secondary matching capacitors are not used, and the power supply output is directly connected to the load, the rated output and required voltage and current waveforms of the equipment cannot be achieved due to impedance mismatch. The impedance matching and control method, in hardware, compensates for the leakage inductance of the impedance transformer by connecting a capacitor in parallel on the primary side, matches the secondary capacitor with the load impedance, and the matching transformer achieves impedance matching between the primary and secondary sides through its turns ratio. In software, it acquires the voltage and current waveforms output from the secondary side, obtains the phase difference between the two through a phase detector as feedback, and uses a phase-locked loop to control the full-bridge inverter frequency to track the set phase angle, thereby ensuring that the power supply and load operate under the set conditions, preventing them from operating in the inductive range, and ultimately achieving impedance matching operation and control.
[0036] The uncontrolled rectifier module of this invention converts AC power to DC power, followed by a first-stage controllable DC voltage conversion via a high-frequency chopper module. Subsequently, a full-bridge inverter circuit inverts the controllable DC source back into AC voltage and current. The impedance matching module achieves precise load impedance matching through a composite resonant connection between the impedance matching transformer and the matching capacitor C1 connected in parallel on the primary side, and the matching capacitor C2 connected in parallel on the secondary side and at the load end. Compared to traditional impedance matching schemes that rely on large inductors, this system replaces inductors with impedance matching modules, reducing equipment size and eliminating heat loss caused by the equivalent parasitic resistance when large currents flow through inductors, thus improving power output efficiency. The phase detector in the feedback module monitors the phase difference between the load voltage and current in real time, and the full-bridge inverter frequency is dynamically adjusted via a phase-locked loop to ensure continuous and stable impedance matching. This fundamentally solves the problems of large size and high losses in traditional inductor matching schemes, thereby improving power output efficiency.
[0037] like Figure 1-5 As shown, the specific operation process of an impedance matching system for a gallium arsenide epitaxial inductive power supply is as follows:
[0038] S10 converts AC power to DC power through an uncontrolled rectifier module;
[0039] S20, the DC power supply is converted into a controllable DC power source by using a high-frequency chopper module;
[0040] S30 converts a controllable DC source into AC voltage and current through a full-bridge inverter circuit;
[0041] S40, the primary and secondary impedances are transformed by the impedance matching transformer in the impedance matching module, and the impedances of the primary and secondary sides and the load are matched by the first matching capacitor C1 and the second matching capacitor C2.
[0042] In S50, the phase angle of the load current and voltage is obtained through the phase detector in the feedback module. Based on the phase angle, it is determined whether the impedance needs to be adjusted. If so, the frequency of the full-bridge inverter circuit is adjusted by the phase-locked loop according to the phase angle, and then S40-S50 are executed again. If not, the output is sent to the load.
[0043] Step S10, AC-DC conversion: Provides a basic DC energy source for the system, eliminating the impact of grid voltage fluctuations on subsequent circuits. Step S20, DC voltage controllable conversion: Achieves precise voltage regulation to adapt to different process requirements; inductor L0 stores and releases energy, and diode D0 provides a freewheeling path to ensure current continuity. It replaces traditional large-size inductors, reducing size, eliminating inductor parasitic resistance losses, and improving system efficiency. Step S30, DC-high-frequency AC inversion: The full-bridge inverter circuit (four power transistors S1-S4 forming an H-bridge) under complementary PWM drive converts controllable DC into a high-frequency AC square wave, which is then filtered by a capacitor and input to the primary side of the impedance matching transformer. This quantity form conversion provides high-frequency AC input to the impedance matching module. Step S40, impedance matching and resonant compensation: The impedance matching transformer performs impedance transformation, mapping the load impedance to the primary side equivalent impedance, adapting to the power supply internal resistance. The first matching capacitor C1 and the transformer primary inductance form an LC resonant network, eliminating reactive components; the second matching capacitor C2 compensates for secondary leakage inductance, forming a dual-capacitor resonant structure. Achieving conjugate matching between the load and power supply at the resonant frequency maximizes power transmission efficiency. This replaces traditional inductor matching, eliminating parasitic resistance losses and improving efficiency; resonant compensation ensures stable system operation over a wide load range. Step S50: Closed-loop feedback and adjustment: The phase detector acquires the phase difference θ between the load voltage U and current I in real time. The digital signal processor processes the θ signal and dynamically adjusts the full-bridge inverter frequency through a phase-locked loop, stabilizing θ within a ±1° tolerance range. If |θ|>θthreshold (e.g., ±5°), frequency adjustment is triggered and S40-S50 is re-executed; if within the tolerance, the current state is maintained, and the output is sent to the load. Real-time monitoring of load changes (e.g., wafer size switching, process parameter drift) dynamically optimizes impedance matching, ensuring power transmission stability. Response time <1ms and phase difference fluctuation ≤0.5° during load abrupt changes ensure epitaxial layer thickness uniformity and crystal quality; closed-loop control solves the response hysteresis problem of traditional inductor matching.
[0044] The uncontrolled rectifier module of this invention converts AC power to DC power, followed by a first-stage controllable DC voltage conversion via a high-frequency chopper module. Subsequently, a full-bridge inverter circuit inverts the controllable DC source into AC voltage and current. The impedance matching module achieves precise load impedance matching through a composite resonant connection between the impedance matching transformer, a first matching capacitor C1 connected in parallel on the primary side, and a second matching capacitor C2 connected in parallel on the secondary side and at the load end. Compared to traditional impedance matching schemes that rely on large inductors, this system replaces inductors with impedance matching modules, reducing equipment size and eliminating heat loss caused by the equivalent parasitic resistance when large currents flow through inductors, thus improving power output efficiency. The phase detector in the feedback module monitors the phase difference between the load voltage and current in real time, and the full-bridge inverter frequency is dynamically adjusted via a phase-locked loop to ensure continuous and stable impedance matching. This fundamentally solves the problems of large size and high losses in traditional inductor matching schemes, thereby improving power output efficiency.
[0045] In an optional embodiment of the present invention, determining whether impedance adjustment is needed based on the phase angle specifically involves:
[0046] The phase difference θ = φU - φI between the load voltage U and the current I is measured in real time using a phase detector.
[0047] Set the phase angle allowable threshold θthreshold = ±δ, where δ is the system's preset phase tolerance range;
[0048] If |θ|>θthreshold, then adjustment is required; if |θ|≤θthreshold, then adjustment is not required.
[0049] Specifically, a dedicated phase detector chip or DSP digital algorithm is used to calculate the phase difference θ = φU - φI by synchronously sampling the waveforms of the load voltage U and current I. For example, when the load is purely resistive, θ = 0°; for an inductive load, θ > 0° (voltage leads current); and for a capacitive load, θ < 0° (current leads voltage). The phase detector needs to capture transient phase changes at a high-frequency sampling rate (e.g., 10MHz) to ensure a fast response during sudden load changes (such as wafer size switching).
[0050] When |θ| > θthreshold, the DSP controller adjusts the switching frequency f_sw of the full-bridge inverter circuit through a phase-locked loop (PLL). For example, if θ > 5°, it indicates that the load is inductive, and f_sw needs to be reduced to compensate for the inductor phase lag; if θ < -5°, f_sw is increased to counteract the capacitor phase lead.
[0051] In this embodiment of the invention, the phase difference threshold judgment mechanism achieves wide-range, high-precision impedance matching by real-time monitoring of the phase difference between load voltage and current, combined with dynamic frequency adjustment. Compared with traditional inductor matching schemes, it not only eliminates the size and loss problems of large-size inductors, but also ensures rapid response and stable operation of the system under load changes through closed-loop control, fundamentally improving the efficiency and reliability of gallium arsenide epitaxial processes.
[0052] It should be understood that the various forms of processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this invention can be achieved, and this is not limited herein.
[0053] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the principles of this invention should be included within the scope of protection of this invention.
Claims
1. An impedance matching system for a gallium arsenide epitaxial inductive power supply, characterized in that, The system includes: an uncontrolled rectifier module, a high-frequency chopper module, a full-bridge inverter circuit, and an impedance matching module connected in sequence. The impedance matching module includes an impedance matching transformer and a matching capacitor. The uncontrolled rectifier module converts an external AC power supply into a DC power supply. The high-frequency chopper module transforms the DC power supply to obtain a controllable DC source. The full-bridge inverter circuit inverts the controllable DC source into AC voltage and current. The output terminal of the impedance matching module is connected to the input terminal of the load. The impedance matching module is used to perform impedance matching on the AC voltage and current to obtain an impedance-matched AC voltage and current, which is then input to the load. The primary side of the impedance matching transformer is connected to the output terminal of the full-bridge inverter circuit, and the secondary side is connected to the load for primary-secondary impedance transformation. The matching capacitor includes a first matching capacitor connected in parallel on the primary side of the impedance matching transformer and a second matching capacitor connected in parallel on the secondary side and the load terminal. The matching capacitor is used to ensure that the voltage and current output to the load are in phase. The feedback module includes a phase detector and a phase-locked loop (PLL). The input of the phase detector is connected to the load, and the output of the phase detector is connected to the input of the PLL. The output of the PLL is connected to the full-bridge inverter circuit. The phase detector is used to obtain the phase angle of the AC voltage and current of the input load and determine whether the impedance needs to be readjusted based on the phase angle. If so, the PLL adjusts the frequency of the full-bridge inverter circuit according to the phase angle and then re-inputs the impedance-matched AC voltage and current to the impedance matching module for re-matching. If not, the output is sent to the load. The PLL is used to adjust the frequency of the full-bridge inverter circuit according to the phase angle.
2. The impedance matching system for a gallium arsenide epitaxial inductive power supply according to claim 1, characterized in that, The high-frequency chopper module comprises a power transistor, a diode, and an inductor forming a Buck chopper circuit, used to convert DC voltage into a controllable DC source. In this configuration, the collector of the power transistor is connected to the positive terminal of the uncontrolled rectifier, the emitter is connected to the cathode of the diode, the anode of the diode is connected to the negative terminal of the uncontrolled rectifier module, the cathode is connected to one end of the inductor, and the other end of the inductor is connected to the input terminal of the full-bridge inverter circuit.
3. The impedance matching system for a gallium arsenide epitaxial inductive power supply according to claim 2, characterized in that, The full-bridge inverter circuit comprises a first power transistor S1, a second power transistor S2, a third power transistor S3, and a fourth power transistor S4 forming a full-bridge structure, used to invert controllable DC into AC voltage and current. In this configuration, the drain (D) of the first power transistor S1 and the source (S) of the first power transistor S2 are connected to the positive terminal of the primary side of the transformer. The drain (D) of the third power transistor S3 and the source (S) of the fourth power transistor S4 are connected to the negative terminal of the primary side of the transformer. The collectors of the first power transistor S1 and the third power transistor S3 are connected to an inductor. The emitters of the second power transistor S2 and the fourth power transistor S4 are connected to the anode of a diode.
4. The impedance matching system for a gallium arsenide epitaxial inductive power supply according to claim 1, characterized in that, The feedback module further includes a sampling unit and a digital signal processor; the sampling unit includes a voltage transformer and a current transformer, which are connected in series across the load and the second matching capacitor branch, respectively, for real-time acquisition of analog signals of load voltage and current; the input of the digital signal processor is connected to a phase detector, and the output controls the switching frequency of the full-bridge inverter circuit through a phase-locked loop.
5. The impedance matching system for a gallium arsenide epitaxial inductive power supply according to claim 1, characterized in that, The primary-to-secondary turns ratio of the impedance matching transformer is N1:N2=1:
3.
6. The impedance matching system for a gallium arsenide epitaxial inductive power supply according to claim 6, characterized in that, Determining whether impedance adjustment is needed based on the phase angle is as follows: The phase difference θ = φU - φI between the load voltage U and the current I is measured in real time using a phase detector. Set the phase angle allowable threshold θthreshold=±δ, where δ is the system's preset phase tolerance range; If |θ|>θthreshold, then adjustment is required; if |θ|≤θthreshold, then adjustment is not required.
7. The impedance matching system for a gallium arsenide epitaxial inductive power supply according to claim 1, characterized in that, The system also includes an overvoltage protection module and an overcurrent protection module; the overvoltage protection module adopts a dual comparator architecture, which triggers the IGBT shutdown circuit when the DC bus voltage exceeds a preset threshold; the overcurrent protection module monitors the inverter output current in real time through a Rogowski coil, and activates hardware-level latching protection when the current mutation rate exceeds a safety threshold.
8. The impedance matching system for a gallium arsenide epitaxial inductive power supply according to claim 1, characterized in that, The impedance matching module includes an adjustable inductor matrix, which consists of multiple tapped inductors and a relay array. The inductance is discretely adjusted by controlling the relays to switch on and off via a DSP.
9. The impedance matching system for a gallium arsenide epitaxial inductive power supply according to claim 1, characterized in that, The power transistors of the full-bridge inverter circuit are silicon carbide MOSFETs.
10. The impedance matching system for a gallium arsenide epitaxial inductive power supply according to claim 1, characterized in that, The system supports multi-load parallel operation mode, with each load channel independently configured with an impedance matching transformer and matching capacitor, and the power distribution of each channel is coordinated by a digital signal processor.
