A multi-protocol interface adapter plate and interface configuration method suitable for SOC decoupling type IVI adapter layer
By designing a reserved area for selective mounting modules and a unified slave interface socket on the IVI adapter board, combined with board-level protection circuitry, the problems of existing adapter boards being unable to flexibly adapt to multiple vehicle models, consuming computing power, and optimizing EMI are solved, achieving low-cost and efficient interface configuration and signal transmission.
CN123055809APending Publication Date: 2026-11-06SUZHOU TUXIN DIANKE INFORMATION TECH CO LTD
View PDF -1 Cites 0 Cited by
Patent Information
- Application Number
- CN202611192689.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-08-07
- Publication Date
- 2026-11-06
Smart Images

Figure CN123055809A_ABST
Abstract
This invention relates to the field of in-vehicle infotainment technology, specifically to a multi-protocol interface adapter board and interface configuration method adapted to a decoupled IVI (Interactive Visual Interface) layer of a System-on-Chip (SOC). The system includes a SOC main control module, an IVI communication integration module, a multi-protocol interface module, and a multi-element isolated power supply and physical interface integration module. The IVI communication integration module communicates with the SOC main control module through a unified slave interface, and uses a configuration mapping table to adapt the interface configurations of each module based on the access device identifier. The multi-protocol interface module selectively integrates multiple physical layer interfaces, terminating peripheral protocols at the physical layer and achieving signal transmission through signal routing mapping. The multi-element isolated power supply and physical interface integration module provides hierarchical isolated power domains to suppress electromagnetic interference and achieves multi-protocol signal pin multiplexing mapping through multiplexed physical plug-in components. This invention offloads multi-protocol parsing, isolation, and plug-in mapping from the SOC to an independent adapter layer, solving the problems of high sunk costs in SOC iteration, difficulty in interface expansion, and limited panel interfaces.
Need to check novelty before this filing date? Find Prior Art
