A multi-protocol interface adapter plate and interface configuration method suitable for SOC decoupling type IVI adapter layer

By designing a reserved area for selective mounting modules and a unified slave interface socket on the IVI adapter board, combined with board-level protection circuitry, the problems of existing adapter boards being unable to flexibly adapt to multiple vehicle models, consuming computing power, and optimizing EMI are solved, achieving low-cost and efficient interface configuration and signal transmission.

CN123055809APending Publication Date: 2026-11-06SUZHOU TUXIN DIANKE INFORMATION TECH CO LTD
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Patent Information

Application Number
CN202611192689.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-08-07
Publication Date
2026-11-06

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Abstract

This invention relates to the field of in-vehicle infotainment technology, specifically to a multi-protocol interface adapter board and interface configuration method adapted to a decoupled IVI (Interactive Visual Interface) layer of a System-on-Chip (SOC). The system includes a SOC main control module, an IVI communication integration module, a multi-protocol interface module, and a multi-element isolated power supply and physical interface integration module. The IVI communication integration module communicates with the SOC main control module through a unified slave interface, and uses a configuration mapping table to adapt the interface configurations of each module based on the access device identifier. The multi-protocol interface module selectively integrates multiple physical layer interfaces, terminating peripheral protocols at the physical layer and achieving signal transmission through signal routing mapping. The multi-element isolated power supply and physical interface integration module provides hierarchical isolated power domains to suppress electromagnetic interference and achieves multi-protocol signal pin multiplexing mapping through multiplexed physical plug-in components. This invention offloads multi-protocol parsing, isolation, and plug-in mapping from the SOC to an independent adapter layer, solving the problems of high sunk costs in SOC iteration, difficulty in interface expansion, and limited panel interfaces.
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