Image acquisition device and smart device

Abstract

This disclosure provides an image acquisition device and an intelligent device, relating to the technical fields of image processing. The image acquisition device includes: an image acquisition unit and a blind spot detection module, wherein the blind spot detection module has the ability to passively sense heat sources; the image acquisition unit includes at least: a support, an imaging module mounted on the support, and a drive mechanism for driving the support to rotate; the imaging module is used to track targets within its field of view during image acquisition; the blind spot detection module is used to detect the blind spot of the imaging module's field of view under the instruction of a trigger command; the drive mechanism is used to drive the support to rotate the imaging module towards the target located within the blind spot when the tracked target is lost.

Description

Technical Field

[0001] This disclosure relates to the field of image processing technology, and more particularly to an image acquisition device and a smart device. Background Technology

[0002] Existing image acquisition devices typically rely on cameras for target detection and recognition. When a target is directly in front of the camera's field of view, the image acquisition device can complete target detection, tracking, or triggering of an image through image recognition. However, when the target moves during the shooting process, it is easy for it to move out of the camera's field of view, and the camera will no longer be able to perceive and track the target, resulting in poor image quality. Summary of the Invention

[0003] This disclosure provides an image acquisition device and a smart device.

[0004] According to one aspect of this disclosure, an image acquisition device is provided, comprising:

[0005] An image acquisition unit and a blind spot detection module, wherein the blind spot detection module has the ability to passively sense heat sources; The image acquisition unit includes at least: a support, an imaging module mounted on the support, and a drive mechanism for driving the support to rotate; The imaging module is used to track targets within the field of view during image acquisition. The blind spot detection module is used to detect the blind spot of the imaging module under the instruction of a trigger command; The driving mechanism is used to drive the support part to rotate the imaging module in the direction of the target in the blind spot when the tracked target is lost.

[0006] According to one aspect of this disclosure, a smart device is provided, comprising: the image acquisition device described in the above-mentioned embodiment, wherein a blind spot detection module in the image acquisition device is disposed on the frame of the smart device.

[0007] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0008] The accompanying drawings are provided to better understand this solution and do not constitute a limitation of this disclosure. Wherein: Figure 1 This is a schematic diagram of the structure of an image acquisition device provided in an embodiment of the present disclosure; Figure 2 This is a schematic diagram of another image acquisition device provided in an embodiment of the present disclosure; Figure 3 This is a schematic diagram of another image acquisition device provided in an embodiment of the present disclosure; Figure 4 This is a schematic diagram of another image acquisition device provided in an embodiment of the present disclosure; Figure 5 This is a schematic diagram of another image acquisition device provided in an embodiment of the present disclosure; Figure 6 A schematic diagram of the detection area of ​​another image acquisition device provided in an embodiment of this disclosure; Figure 7 This is a schematic diagram of the structure of a smart device provided in an embodiment of the present disclosure; Figure 8 This is a schematic diagram of the structure of another smart device provided in an embodiment of the present disclosure; Figure 9 This is a schematic diagram of the structure of another smart device provided in an embodiment of the present disclosure; Figure 10 This is a schematic diagram of the structure of another smart device provided in an embodiment of this disclosure. Detailed Implementation

[0009] The exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments to aid understanding, and should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this disclosure. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0010] The image acquisition apparatus and smart device of the present disclosure are described below with reference to the accompanying drawings.

[0011] Artificial intelligence (AI) is the study of enabling computers to simulate certain human thought processes and intelligent behaviors (such as learning, reasoning, thinking, and planning). It involves both hardware and software technologies. AI hardware technologies generally include computer vision, speech recognition, natural language processing, and related technologies such as deep learning, big data processing, and knowledge graphs.

[0012] Image processing technology is the technique of using computers to analyze images to achieve desired results. It is also known as image processing. Image processing generally refers to digital image processing. A digital image is a large two-dimensional array obtained by capturing images using equipment such as industrial cameras, video cameras, and scanners. The elements of this array are called pixels, and their values ​​are called grayscale values. Image processing techniques generally include three parts: image compression, enhancement and restoration, and matching, description, and recognition.

[0013] Figure 1 This is a schematic diagram of the structure of an image acquisition device provided in an embodiment of this disclosure. Figure 1 As shown, the image acquisition device 1000 may include, but is not limited to, the following components: an image acquisition unit 110 and a blind spot detection module 120.

[0014] In some possible implementations, the image acquisition unit 110 includes a support 111, an imaging module 112 mounted on the support 110, and a drive mechanism 113 for driving the support 111 to rotate.

[0015] In some possible implementations, the imaging module 112 is used to track targets within the field of view during image acquisition.

[0016] In some possible implementations, the blind spot detection module 130 is used to detect targets in the blind spot of the imaging module 112 under the instruction of a trigger command.

[0017] In some possible implementations, a drive mechanism 113 is used to drive the support 111 to rotate, thereby causing the imaging module 112 to rotate in the direction of the target in the blind spot when the tracked target is lost.

[0018] In some possible implementations, the imaging module 112 can acquire images of the actual scene within its field of view under the user's command.

[0019] In some possible implementations, the image acquisition unit 110 may have the function of target detection on the image acquired by the imaging module 112, and determine that the imaging module 112 has lost the tracked target in response to the undetected target.

[0020] In some possible implementations, if it is determined that the imaging module 112 has lost the tracked target, in order to be able to re-determine the location of the target, a trigger command can be sent to the blind spot detection module 120 to instruct the blind spot detection module 120 to enter the detection mode.

[0021] In some possible implementations, the blind spot detection module 120 can be in standby or sleep mode when it does not receive a trigger command, in order to save energy consumption of smart devices.

[0022] In some possible implementations, the blind spot detection module 120 receives a trigger command, wakes up from standby mode or hibernation mode, and enters detection mode to detect targets in the blind spot of the imaging module 112.

[0023] In some possible implementations, the blind spot is the area not covered by the field of view of the imaging module 112. The blind spot changes with the changes in the field of view of the imaging module. For example, if the field of view of the imaging module 112 faces directly forward, the blind spot includes the left and right side areas; for example, if the field of view of the imaging module 112 faces left-front, the blind spot includes the right side area and the front area.

[0024] In some possible implementations, the imaging module 112 can be a visible light camera.

[0025] In some possible implementations, the blind spot detection module 120 has the ability to passively sense heat sources.

[0026] In some possible implementations, the blind spot detection module 120 may include multiple detection units, each with the ability to passively sense heat sources. Different detection units can be responsible for detecting different blind spots in the field of view of the imaging module 112.

[0027] In some possible implementations, the blind spot detection module 120 only performs passive detection and does not actively transmit detection signals. When the heat source target moves into the blind spot of the field of view, it will generate heat or energy due to the movement, and then radiate signals outward so that it can be detected by the blind spot detection module 120.

[0028] In some possible implementations, the blind zone detection module 120 extracts the signal strength and sends a detection signal to the processor of the image acquisition device 1000 based on the signal strength. Optionally, the detection signal can indicate whether the heat source target exists in the detection area of ​​the blind zone detection module 120.

[0029] In some possible implementations, the heat source target is determined to be within the blind zone only when the signal strength is greater than or equal to a set strength threshold, and then the processor sends a first detection signal. This first detection signal indicates that the heat source target exists within the detection area of ​​the blind zone detection module 120.

[0030] In some possible implementations, if the signal strength is less than a set strength threshold, it can be determined that the heat source target is not within the blind zone of the field of view, and a second detection signal is then sent to the processor. This second detection signal can indicate that the heat source target is not within the detection area of ​​the blind zone detection module 120.

[0031] In some possible implementations, the heat source target may include, but is not limited to, objects that can generate heat or energy during movement, such as human bodies and pets.

[0032] In this embodiment, during image acquisition or video capture, the collaborative imaging module and the blind spot detection module with the ability to passively sense heat sources perform target tracking, which can achieve panoramic perception of the monitoring area, facilitate accurate target tracking, and improve the quality of image acquisition or video capture.

[0033] Figure 2 This is a schematic diagram of the structure of a smart device provided in an embodiment of this application, such as... Figure 2 As shown, in some possible implementations, the blind spot detection module 120 includes a passive infrared (PIR) sensor array 121, which includes N PIR sensors, where N is an integer greater than or equal to 2.

[0034] In some possible implementations, N PIR sensors in the PIR sensor array 121 are spaced apart on the bezel of the smart device.

[0035] In some possible implementations, N PIR sensors are arranged around the imaging module 112. For example, the N PIR sensors can be arranged on both sides of the imaging module 112, the left and right sides, the top and bottom sides, etc.

[0036] In some possible implementations, depending on the camera structure, mounting location, and mechanical limiting requirements, the PIR sensor array 121 can achieve coverage of 180°, 240°, 270°, 290°, 300°, or 360° of the blind spot.

[0037] In this embodiment, multiple PIR sensors are deployed and arranged horizontally at intervals on the side frame of the image acquisition device. These multiple PIR sensors can perceive multiple areas such as the front, left front, left rear, right front, and right rear of the smart device, thereby reducing blind spots.

[0038] In some possible implementations, N PIR sensors are symmetrically arranged around the imaging module 112. For example, the N PIR sensors can be symmetrically arranged on both sides of the imaging module 112.

[0039] In some possible implementations, N PIR sensors are arranged at intervals around the imaging module 112. For example, two PIR sensors are arranged on the left side of the imaging module 112, with a set distance between them.

[0040] In some possible implementations, the N PIR sensors can be installed independently, meaning that the N PIR sensors are independent of each other.

[0041] In some possible implementations, N PIR sensors can be installed using an integrated array module. That is, N PIR sensors form a PIR sensor array. The integrated module method of the PIR sensor array can be determined according to the specifications and layout of the smart device.

[0042] In some possible implementations, each PIR sensor also includes a front-end optical assembly, which is an optical structure combination used to filter, focus, and divide the field of view of the infrared radiation of the target.

[0043] In some possible implementations, the front-end optical components may include, but are not limited to, at least one of the following elements: a focusing element, a filtering element, and a light-shielding element.

[0044] In some possible implementations, a focusing element is positioned outside the filtering element to receive and converge the infrared signal radiated by the heat source target. Optionally, the focusing element may include, but is not limited to, a Fresnel lens.

[0045] In some possible implementations, a filtering element is positioned between the focusing element and the PIR sensor to transmit only infrared signals within a preset wavelength range, thereby blocking light from non-target wavelengths. Optionally, the filtering element may include, but is not limited to, an infrared filter.

[0046] In some possible implementations, a light-shielding element is disposed on the periphery or inside the focusing element to block part of the focusing element's field of view, thereby defining the detection boundary of the PIR sensor and shielding non-target interference sources. Optionally, the light-shielding element may include, but is not limited to, a light-shielding partition.

[0047] In this embodiment, the focusing and partitioning effect of the light-concentrating element enables the PIR sensor to generate a differential detection signal with a phase difference, thereby effectively converting target movement into a identifiable electrical change, improving detection range and dynamic response sensitivity. The wavelength-selective transmission of the filter element filters out ambient light noise in non-target bands, reducing DC bias interference in strong light environments and enhancing signal stability. Furthermore, the physical shielding of non-target fields of view by the light-shielding element shields against radiation interference from fixed heat sources, reducing the probability of false identification.

[0048] Figure 3 This is a schematic diagram of the structure of a smart device provided in an embodiment of this application, such as... Figure 3 As shown, the PIR sensor array 121 includes a first PIR sensor group 1211 and a second PIR sensor group 1212, meaning that the N PIR sensors in the PIR sensor array 121 are divided into two sensor groups. The two sensor groups are arranged around the imaging module 112. Optionally, the first PIR sensor group 1211 and the second PIR sensor group 1212 are symmetrically arranged around the imaging module 112. In some possible implementations, the first PIR sensor group 1211 may include one or more PIR sensors, and the second PIR sensor group 1212 may include one or more PIR sensors.

[0049] In some possible implementations, the PIR sensor array 121 may include, but is not limited to, two PIR sensor groups, or three PIR sensor groups, or four, five, or more PIR sensor groups, to obtain higher azimuth resolution.

[0050] Figure 4 This is a schematic diagram of the structure of a smart device provided in an embodiment of this application, such as... Figure 4 As shown, the PIR sensor array 121' includes a first PIR sensor 1211', a second PIR sensor 1212', and a third PIR sensor 1213'. The first PIR sensor 1211' and the second PIR sensor 1212' are respectively arranged on the first side frame 130 and the second side frame 140 of the image acquisition device 1000. The first side frame 130 and the second side frame 140 are two opposite side frames, and both intersect with the top frame 150 where the imaging module 112 is located. The third PIR sensor 1213' is integrated with the imaging module 112 in the support part 111.

[0051] Figure 5 This is a schematic diagram of the structure of a smart device provided in an embodiment of this application, such as... Figure 5 As shown, the PIR sensor array 121' includes a first PIR sensor 1211' and a second PIR sensor 1212'. The first PIR sensor 1211' and the second PIR sensor 1212' are respectively arranged on the first side frame 130 and the second side frame 140 of the image acquisition device. The first side frame 130 and the second side frame 140 are two opposite side frames, and both intersect with the top frame 150 where the imaging module 112 is located.

[0052] In some possible implementations, PIR sensors are symmetrically arranged on the first side frame 130 and the second side frame 140.

[0053] In some possible implementations, the PIR sensors on the first side frame 130 and the second side frame 140 can also be arranged in an asymmetrical manner depending on the product installation scenario.

[0054] In this embodiment, the first PIR sensor 1211' and the second PIR sensor 1212' are arranged symmetrically with respect to the third PIR sensor 1213', which makes the overall structure and sensing area distribution more balanced, and further facilitates appearance design and mold implementation.

[0055] In some possible implementations, the third PIR sensor 1213' and the imaging module 112 are positioned in the middle area of ​​the top bezel, enabling detection and perception of the area directly in front of the smart device.

[0056] In some possible implementations, the field of view of the imaging module 112 is the area directly in front of the smart device. Since the third PIR sensor 1213' is integrated with the imaging module 112 in the middle area of ​​the top bezel, the detection direction of the third PIR sensor 1213' is basically consistent with the field of view of the imaging module 112. Therefore, the detection direction of the third PIR sensor 1213' is directly in front of the image acquisition device 1000 in the initial stage (that is, when the image acquisition unit 110 is in the reset position).

[0057] In some possible implementations, the detection directions of the first PIR sensor 1211' and the second PIR sensor 1212' are both directed towards the front of their respective side frames, and form a 90-degree angle with the detection direction of the third PIR sensor 1213', such as... Figure 6 As shown in the figure, 1211'' represents the detection area of ​​the first PIR sensor 1211', 1212'' represents the detection area of ​​the second PIR sensor 1212', and 1213'' represents the detection area of ​​the third PIR sensor 1213'.

[0058] In some possible implementations, the first PIR sensor 1211' located on the first side frame 130 (e.g., the left side frame) is positioned facing directly to the right front and forms a 90-degree angle with the third PIR sensor 1213'.

[0059] In some possible implementations, the second PIR sensor 1212' located on the second side frame 140 (e.g., the right side frame) is positioned facing directly to the left front and forms a 90-degree angle with the third PIR sensor 1213'.

[0060] In this embodiment, the third PIR sensor 1213' is disposed in the central region, and the first PIR sensor 1211' and the second PIR sensor 1212' are arranged on the two opposite side frames, thereby forming a three-segment orientation sensing structure around the imaging module 112. With the above arrangement, the third PIR sensor is mainly responsible for sensing the area in front of the device, and the left and right PIR sensors are respectively responsible for sensing the left front and right front areas. The combination of the three forms a fan-shaped coverage area, which can realize auxiliary perception of the blind spots of the imaging module 112, so as to track the target in all directions.

[0061] In some possible implementations, the detection axes of the first PIR sensor 1211' and the second PIR sensor 1212' are deflected by a preset 90-degree angle relative to the front normal of the smart device toward their respective side bezels.

[0062] In some possible implementations, the detection axis of the first PIR sensor 1211' located on the first side bezel 130 (e.g., the left side bezel) is deflected to the left by a preset angle of 90 degrees relative to the front normal of the smart screen.

[0063] In some possible implementations, the detection axis of the second PIR sensor 1212' located on the second side bezel 140 (e.g., the right side bezel) is deflected to the right by a preset angle of 90 degrees relative to the front normal of the smart screen.

[0064] In this embodiment of the disclosure, by setting a deflection angle for the two PIR sensors on the left and right, the detection areas of the two PIR sensors on the left and right can be expanded to both sides of the smart screen, thereby expanding the overall perception coverage and reducing the lateral blind spots.

[0065] In some possible implementations, the image acquisition device 1000 may also include an infrared transmission window for each PIR sensor (not shown in the figure).

[0066] In some possible implementations, a first infrared transmission window is provided at the placement position of the first PIR sensor 1211' on the first side frame 130; a second infrared transmission window is provided at the placement position of the second PIR sensor 1212' on the second side frame 140; and a third infrared transmission window is provided at the placement position of the third PIR sensor 1213' on the top frame 150.

[0067] In some possible implementations, each infrared transmission window may be located on a decorative cover, frame, or front housing.

[0068] In some possible implementations, each infrared transmission window is an independent window.

[0069] In some possible implementations, multiple infrared windows can be integrated into a single elongated window.

[0070] In some possible implementations, the infrared transmission window is made of a material that is transparent to the infrared band to ensure that the PIR sensor can detect changes in ambient thermal radiation.

[0071] In some possible implementations, the color of the translucent material and the appearance color of the smart device remain harmonious under visible light to make the overall appearance of the device aesthetically pleasing.

[0072] In some possible implementations, the permeable material maintains a certain transmittance in the infrared band to improve the PIR sensor's ability to detect changes in environmental thermal radiation.

[0073] In some possible implementations, the image acquisition device 1000 may also include a support for mounting the PIR sensor. Optionally, the support may take the form of, but is not limited to, a mounting bracket or a mounting position.

[0074] In some possible implementations, the support for mounting the PIR sensor is integrally formed with the main body of the smart device 2000.

[0075] In some possible implementations, each PIR sensor can be mounted on a support within the smart device 2000.

[0076] In some possible implementations, the bracket for mounting the PIR sensor includes the following: Mounting location for PIR sensor; An inclined positioning part used to define the installation direction of the PIR sensor; Positioning structure for fixing PIR sensors.

[0077] In some possible implementations, the positioning structure may include, but is not limited to, snap-fit, screw post, and welded part.

[0078] In some possible implementations, each PIR sensor can be installed in a different mounting position on the front shell or mid-frame of a smart device (such as a smart screen), and each PIR sensor can be fixed independently.

[0079] In this embodiment, the integrated support component ensures the stability of the relative position and angular relationship of each PIR sensor, thereby improving assembly consistency.

[0080] In some possible implementations, the image acquisition device also includes a Hall sensor for sensing the rotation angle of the support 111 during the driving of the drive mechanism 113.

[0081] In some possible implementations, control of the drive mechanism 113 is stopped in response to the actual rotation angle of the support 111 reaching the desired angle, that is, turning to the target position.

[0082] In some possible implementations, during the rotation of the support 111, the angle difference between two adjacent actual rotation angles of the support 111 is obtained, and in response to the angle difference being greater than a set angle threshold, at least one of the following operations is performed: Reduce the number of drive pulses in drive mechanism 113; Reduce the drive voltage and / or drive current of the drive mechanism 113.

[0083] When the angle difference is greater than the set angle threshold, the rotation speed can be reduced by decreasing the number of drive pulses of the drive mechanism 113 and / or reducing the drive voltage and / or drive current of the drive mechanism 113, thereby avoiding shooting shake and improving shooting quality.

[0084] In some possible implementations, the drive mechanism can employ a graded, gradual steering strategy to steer the imaging module and avoid jitter issues. For example, the graded, gradual steering strategy may include, but is not limited to, fixed threshold control, state machine control, rule-based control, or control methods based on statistical learning / predictive models, which are not limited here.

[0085] In this embodiment, a Hall sensor can be used for steering control, so that the image acquisition device can accurately turn to the location of the target. Furthermore, the angular velocity can be controlled during the rotation process to drive the image acquisition device to stably turn to the location of the target and avoid shaking during the rotation process.

[0086] Figure 7 This is a schematic diagram of the structure of a smart device provided in an embodiment of this application. Based on the above embodiments, as follows... Figure 7 As shown, in the above embodiment, each module of the image acquisition device 1000 is deployed on the smart device 2000, that is, the main body of the smart device 2000 is used to carry the image acquisition unit 110 and the blind spot detection module 120.

[0087] In some possible implementations, the smart device 2000 may also include a display module 210, a playback module 220, and a radio module 230.

[0088] In some possible implementations, the smart device 2000 may include a smart screen, a learning machine, a tablet computer, a smart camera, or a camera with a pan-tilt-zoom (PTZ) mechanism.

[0089] In some possible implementations, the blind spot detection module 120 is deployed on the bezel of the smart device 2000.

[0090] In some possible implementations, the first PIR sensor 1211' in the PIR sensor array 121 is located on the first side bezel 240 of the smart device 2000.

[0091] In some possible implementations, the first PIR sensors 1212' in the PIR sensor array 121 are spaced apart on the second side frame 250 of the smart device 2000. The first side frame 240 and the second side frame 250 are two opposing side frames, both intersecting with the top frame 260 where the imaging module 112 is located, such as... Figure 8 As shown.

[0092] In some possible implementations, the PIR sensor array 121 includes a first PIR sensor 1201, a second PIR sensor 1202, and a third PIR sensor 1203. The first PIR sensor 1201 and the second PIR sensor 1202 are positioned on the first side frame 240 and the second side frame 250 of the smart device 2000. The first side frame 240 and the second side frame 250 are two opposing side frames, both intersecting with the top frame 260 where the imaging module 112 is located. The third PIR sensor 123 is integrated with the imaging module 112 on the support portion 111. Figure 9 As shown.

[0093] In some possible implementations, both the first side frame 240 and the second side frame 250 include the sound output position of the playback module 220 (not shown in the figure). The PIR sensor is positioned on the side frame at a set distance from the sound output position on the same side. In other words, the PIR sensor on the side frame is located near the sound output position.

[0094] In some possible implementations, the placement position of the first PIR sensor 1211' on the first side frame 240 is separated from the sound emission position on the first side frame by a set distance.

[0095] In some possible implementations, the placement of the second PIR sensor 1212' on the second side frame 250 is separated from the sound emission position on the second side frame by a set distance.

[0096] In some possible implementations, the playback module is a speaker, and the speaker's sound outlet, i.e., the sound outlet position, can be provided on the first side frame 240 and the second side frame 250. The first PIR sensor 1211' is positioned at a predetermined distance from the speaker's sound outlet on the first side frame 240. The second PIR sensor 1212' is positioned at a predetermined distance from the speaker's sound outlet on the second side frame 250.

[0097] In this embodiment of the application, a PIR sensor is placed near the sound output location, which can avoid the need for additional openings on the smart device. This allows the human body sensing function to be realized without compromising the appearance design, making the smart device more intelligent and also facilitating appearance design and mold implementation.

[0098] In this embodiment, the PIR sensor array structure is simple and uses mature components. It achieves reliable blind zone perception and pre-following functions without relying on high-cost LiDAR or multiple high-resolution visual sensors. It features low cost, extremely low power consumption, easy integration into the hardware architecture of a gimbal camera, and a mature manufacturing process, making it suitable for mass production. Based on these advantages, this embodiment is particularly suitable for product scenarios such as home smart security cameras, commercial conference tracking cameras, and live streaming gimbals, significantly improving product tracking performance within a limited cost budget.

[0099] Figure 10 A schematic block diagram of an example smart device 1000 that can be used to implement embodiments of the present disclosure is shown.

[0100] like Figure 10 As shown, device 1000 includes a computing unit 1001, which can perform various appropriate actions and processes according to computer programs / instructions stored in read-only memory (ROM) 1002 or loaded from storage unit 10010 into random access memory (RAM) 1003. The RAM 1003 may also store various programs and data required for the operation of device 1000. The computing unit 1001, ROM 1002, and RAM 1003 are interconnected via bus 1004. Input / output (I / O) interface 1005 is also connected to bus 1004.

[0101] Multiple components in device 1000 are connected to I / O interface 1005, including: input units 10010 such as keyboard, mouse, etc.; output units 1007 such as various types of displays, speakers, etc.; storage units 10010 such as disks, optical disks, etc.; and communication units 10010 such as network cards, modems, wireless transceivers, etc. The communication unit 10010 allows device 1000 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0102] The computing unit 1001 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 1001 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 1001 performs the various methods and processes described above, such as the annotation method for teaching materials. For example, in some embodiments, the annotation method for teaching materials can be implemented as a computer software program that is tangibly contained in a machine-readable medium, such as storage unit 10010. In some embodiments, part or all of the computer program / instructions can be loaded and / or installed on device 1000 via ROM 1002 and / or communication unit 10010. When the computer program / instructions are loaded into RAM 1003 and executed by the computing unit 1001, one or more steps of the annotation method for teaching materials described above can be performed. Alternatively, in other embodiments, the computing unit 1001 may be configured to perform a video capture method by any other suitable means (e.g., by means of firmware).

[0103] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations may include: implementations in one or more computer programs / instructions that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transferring data and instructions to the storage system, the at least one input device, and the at least one output device.

[0104] The program code used to implement the methods of this disclosure may be written in any combination of one or more programming languages. This program code may be provided to a processor or controller of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus, such that when executed by the processor or controller, the program code causes the functions / operations specified in the flowcharts and / or block diagrams to be implemented. The program code may be executed entirely on a machine, partially on a machine, as a standalone software package partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0105] In the context of this disclosure, a machine-readable medium can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0106] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the computer. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0107] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), the Internet, and blockchain networks.

[0108] Computer systems can include clients and servers. Clients and servers are generally located far apart and typically interact via communication networks. The client-server relationship is created by computer programs / instructions running on the respective computers and having a client-server relationship with each other. Servers can be cloud servers, servers in distributed systems, or servers incorporating blockchain technology.

[0109] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in the disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this disclosure can be achieved, and this document does not impose any restrictions.

[0110] The specific embodiments described above do not constitute a limitation on the scope of protection of this disclosure. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. An image acquisition device, wherein, include: An image acquisition unit and a blind spot detection module, wherein the blind spot detection module has the ability to passively sense heat source targets; The image acquisition unit includes at least: a support, an imaging module mounted on the support, and a drive mechanism for driving the support to rotate; The imaging module is used to track targets within the field of view during image acquisition. The blind spot detection module is used to detect the blind spot of the imaging module under the instruction of a trigger command; The driving mechanism is used to drive the support part to rotate the imaging module in the direction of the target located in the blind spot of the field of view when the tracked target is lost.

2. The image acquisition device according to claim 1, wherein, The blind zone detection module includes a passive infrared PIR sensor array, which is arranged around the imaging module.

3. The image acquisition device according to claim 1, wherein, The PIR sensor array includes a first PIR sensor group and a second PIR sensor group, which are symmetrically arranged around the imaging module.

4. The image acquisition device according to claim 2, wherein, The PIR sensor array includes a first PIR sensor, a second PIR sensor, and a third PIR sensor. The first PIR sensor and the second PIR sensor are respectively arranged on the first side frame and the second side frame of the image acquisition device. The first side frame and the second side frame are two opposite side frames and both intersect with the top frame where the imaging module is located. The third PIR sensor is integrated with the imaging module in the support.

5. The image acquisition device according to claim 2, wherein, The PIR sensor array includes a first PIR sensor and a second PIR sensor, which are respectively arranged on the first side frame and the second side frame of the image acquisition device. The first side frame and the second side frame are two opposite side frames, and both intersect with the top frame where the imaging module is located.

6. The image acquisition device according to claim 4 or 5, wherein, The detection direction of the third PIR sensor in the PIR sensor array is initially oriented towards the front of the device to which the image acquisition device belongs. The detection direction of both the first PIR sensor and the second PIR sensor is directly in front of the side frame where they are located.

7. The image acquisition device according to claim 4 or 5, wherein, The detection axes of the first PIR sensor and the second PIR sensor are deflected by a preset 90° angle relative to the front normal of the image acquisition device in their respective directions. The detection axis of the third PIR sensor in the PIR sensor array is perpendicular to the front of the device to which the image acquisition device belongs.

8. The image acquisition device according to claim 2, wherein, The PIR sensor also includes a front-end optical assembly, which includes at least one of a focusing element, a filtering element, and a light-shielding element.

9. The image acquisition device according to any one of claims 1-5, wherein, Also includes: A Hall sensor is used to sense the rotation angle of the support during the driving process of the drive mechanism.

10. The image acquisition device according to any one of claims 1-5, wherein, The frame of the image acquisition device includes infrared transmission windows corresponding to each PIR sensor, used to receive signals radiated by the heat source target.

11. The image acquisition device according to any one of claims 1-5, wherein, Also includes: A mounting structure for installing a PIR sensor, the mounting structure satisfying the following conditions: Sensor mounting position; An inclined positioning part used to define the installation direction of the sensor; Positioning structure for fixing sensors.

12. A smart device, wherein, include: The image acquisition device as described in any one of claims 1-11, wherein the blind spot detection module in the image acquisition device is disposed on the frame of the smart device.

13. The intelligent device according to claim 11, wherein, Also includes: Display module; Playback module; Radio module.

14. The smart device according to claim 4 or 5, wherein, The side frame of the smart device includes a sound-emitting position, and the PIR sensor is positioned at a set distance from the sound-emitting position on the same side.

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