Radiator, core plate module and electronic device

Abstract

This application relates to the field of heat dissipation device technology, and discloses a heat sink, a core board module, and electronic equipment. The heat sink is applied to a core board and includes: a heat sink body, including a substrate and a heat-conducting component, the heat-conducting component being disposed on one side of the substrate; a bracket, on which a support platform is protruded, the support platform being used to abut against the back of the core board, the support platform including a first leg, a second leg, a third leg, and a fourth leg; the support platform can switch between a first state and a second state, in the first state being arranged in a first rectangular distribution, and in the second state being arranged in a second rectangular distribution; a groove is formed on the bracket, and the support platform includes a support frame, the support frame being liftable and height-adjustable in the groove; a first elastic element is connected between the support frame and the bottom wall of the groove; the support frame can be locked in a first position and a second position. Through the above method, this application can not only achieve efficient heat dissipation of the core board, but also ensure that the core board is not easily damaged by excessive deformation.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, specifically to a heat sink, a core board module, and electronic equipment. Background Technology

[0002] A core board, as a highly integrated miniature circuit board, primarily packages the core functions of an embedded system together. It integrates the most critical electronic components of the embedded device, such as the CPU, RAM, storage, and power management chips. The core board is typically mounted on a baseboard and used in conjunction with it. The baseboard provides the core board with the necessary power, external interface expansion, signal conditioning, and other functions.

[0003] In existing electronic devices, the core board is usually mounted on the base plate with its back facing the base plate. For heat dissipation of the core board, the heat sink substrate is attached and locked to the core board from the front, so that the heat sink can actively or passively dissipate heat from the components on the front of the core board.

[0004] To improve the thermal conductivity between the components on the core board and the heat sink substrate, the substrate usually needs to be pressed firmly onto the core board. This causes the core board to bend and deform. If the deformation is too large, it can easily damage the components on the core board. Summary of the Invention

[0005] In view of the above problems, the embodiments of this application provide a heat sink, a core board module and an electronic device, which can not only achieve efficient heat dissipation of the core board, but also provide reliable support for the core board, ensuring that the core board is not easily damaged by excessive deformation.

[0006] According to a first aspect of the embodiments of this application, a heat sink is provided for use on a core board. The heat sink includes: a heat sink body, including a substrate and a heat-conducting element, the heat-conducting element being disposed on one side of the substrate, and the other side of the substrate being used to attach to components on the front side of the core board; a bracket, on which a support platform is protruded, the support platform being used to abut against the back side of the core board and connected to fasteners that pass through the substrate and the core board in sequence; the support platform includes a first leg, a second leg, a third leg, and a fourth leg, at least three of the first leg, the second leg, the third leg, and the fourth leg being movably connected to the bracket; the support platform can be in a first state with Switching between two states: In the first state, the first, second, third, and fourth legs are arranged in a first rectangle; in the second state, the first, second, third, and fourth legs are arranged in a second rectangle, the area of ​​the second rectangle being smaller than the area of ​​the first rectangle; a groove is provided on the bracket, and the support platform includes a support frame, which is vertically and vertically mounted in the groove; a first elastic element is connected between the support frame and the bottom wall of the groove, the first elastic element being used to provide elastic force to the support frame to rise towards the outside of the groove; the support frame can be locked in a first position sunk into the groove and a second position at least partially protruding from the groove.

[0007] In one alternative embodiment, a first leg is fixedly mounted on one end of one side edge of the bracket, and a second leg is rotatably mounted on the other end. On the other side edge of the bracket, a third leg is retractably mounted on one end, and a fourth leg is detachably mounted on the other end. The second leg can rotate between the middle position and the corner position of one side edge of the bracket. The third leg can extend or retract in a direction toward or away from the first leg. The fourth leg can be detachably fixed at the corner of the other side edge of the bracket or on the inner area of ​​the side of the bracket that is in contact with the core plate. In a first state, the second leg rotates to one corner position of the bracket, the third leg extends to another corner position farther from the first leg, and the fourth leg is fixed to yet another corner position of the bracket. In a second state, the second leg rotates to the middle position of one side edge of the bracket, the third leg shortens to a position closer to the first leg, and the fourth leg is fixed to the inner area of ​​the side of the bracket that is in contact with the core plate.

[0008] In one alternative embodiment, a fixing block is disposed inside the groove, and a locking block is slidably disposed inside the groove along a first direction perpendicular to the lifting direction of the support frame; a second elastic element is connected between the locking block and the fixing block, the second elastic element being used to provide elastic force to the locking block to slide in a direction away from the fixing block; a clearance opening is provided on the support frame, and both the fixing block and the locking block are at least partially accommodated in the clearance opening, and a locking groove is provided on the side wall of the clearance opening opposite to the locking block, the locking groove including a first locking groove and a second locking groove arranged along the lifting direction, when the locking block is engaged in the first locking groove, the support frame is locked in a first position, and when the locking block is engaged in the second locking groove, the support frame is locked in a second position.

[0009] In one alternative embodiment, locking blocks are provided on both opposite sides of the fixing block, and a second elastic element is connected between each locking block and the fixing block. Locking grooves are provided on both side walls of the clearance opening facing each other.

[0010] In one alternative configuration, the locking grooves on both sides are triangularly distributed, and the locking blocks on both sides are also triangularly distributed, with the locking blocks on both sides engaging the locking grooves in three positions.

[0011] In one alternative embodiment, a hook is provided in the groove that can be raised and lowered. A third elastic element is connected between the hook and the bottom wall of the groove. The third elastic element is used to provide an elastic force to the hook to rise outward from the groove. A locking block is provided with a locking part. After the locking block slides toward the fixing block and the locking part is locked with the hook, the locking block separates from the locking groove. When the hook descends toward the bottom wall of the groove, the hook separates from the locking part, and the locking block slides away from the fixing block and locks into the locking groove.

[0012] In one alternative embodiment, at least two fixing blocks are spaced apart along a second direction, which is perpendicular to both the first and lifting directions. At least one second elastic element is connected between the locking block and each fixing block, and a hook is disposed between at least two fixing blocks.

[0013] In one optional embodiment, the heat-conducting component includes a first fin group and a second fin group. The first fin group includes a plurality of fins spaced apart along a direction perpendicular to the substrate. The second fin group is disposed at one end of the first fin group and includes a plurality of fins spaced apart along a direction parallel to the substrate. In the direction perpendicular to the substrate, the height of the first fin group is greater than the height of the second fin group, and at least one first heat-conducting pipe is connected between the first fin group and the substrate. A first airflow driving component is disposed on the substrate, located at the end of the first fin group opposite to the second fin group, and the first airflow driving component is used to drive… The airflow passes sequentially through the first fin group and the second fin group; or, the heat-conducting element includes a third fin group, which includes a plurality of fins spaced apart along a direction parallel to the substrate; or, the heat-conducting element includes a fourth fin group, which includes a plurality of fins spaced apart along a direction parallel to the substrate, and a plurality of second heat-conducting pipes are connected between the fourth fin group and the substrate; a plurality of second airflow driving elements are disposed on the substrate, the second airflow driving elements are located at one end of the fourth fin group, and the height of the fourth fin group in the direction perpendicular to the substrate is not lower than that of the second airflow driving elements, and the second airflow driving elements are used to drive the airflow through the fourth fin group.

[0014] According to a second aspect of the embodiments of this application, a core board module is provided, comprising: a core board and a heat sink as described in any of the above claims, wherein the core board is clamped between a bracket and a substrate.

[0015] According to a third aspect of the present application, an electronic device is provided, including a device body and the aforementioned core board module; a base plate is provided inside the device body, a first connector is provided on the base plate, a second connector is provided on the back of the core board module, an opening is provided on the bracket for the second connector to be exposed, the core board module is disposed on the base plate, and the second connector and the first connector are plugged into each other to form an electrical connection.

[0016] The heat sink provided in this embodiment is pressed and attached to the components on the front side of the core board by one side of the substrate, so that the heat generated by these components can be quickly transferred to the heat-conducting component on the other side of the substrate, achieving efficient heat dissipation for the core board. To prevent excessive bending deformation of the core board due to excessive pressure from the substrate, which could damage the components, a bracket is provided for the heat sink. A support platform protruding from the bracket abuts against the back of the base plate and the core board, providing reliable support for the core board from the back and preventing excessive deformation. In addition, fasteners pass through the substrate and the core board in sequence and are connected to the support platform, so that the pressure on the core board is mainly concentrated at the position opposite to the support platform, thereby preventing the core board from bending due to excessive pressure at positions far from the support platform. By assembling the first, second, third, and fourth legs in different ways on the bracket, they can be adjusted to be distributed in a smaller rectangular area (second rectangle) or a larger rectangular area (first rectangle), thereby adapting to the plate size of different core plates and achieving assembly with different core plates and reliable support for the core plates.

[0017] Meanwhile, to ensure compatibility with different core boards, and to provide support in the middle of the back of some core boards, the support bracket has a groove. The support bracket includes a support frame that can be raised and lowered within the groove, and a first elastic element connects the support frame to the bottom wall of the groove. When the support frame is locked in the first position recessed into the groove, the support frame is flush with the front of the bracket. At this time, the four legs (first leg, second leg, third leg, and fourth leg) are in the second state, supported by the four legs at the four corners of the back of the core board. When the support frame is locked in the second position, at least partially protruding from the groove, the support frame protrudes from the front of the bracket. At this time, the four legs are in the first state, supported by the four legs at the four corners of the back of the core board. Based on the upward elastic force of the first elastic element, the support frame can be stably supported on the back of the core board at the position corresponding to the CPU. Through the support of the four legs and the support frame for the corners and the middle area of ​​the back of the core board, the core board is not prone to excessive bending deformation under pressure, thus ensuring the structural stability of the core board.

[0018] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, specific embodiments of this application are given below. Attached Figure Description

[0019] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 and Figure 2 These are 3D views of the S920S core board from two different perspectives. Figure 3 and Figure 4 These are 3D views of the S920L core board from two different perspectives. Figure 5 and Figure 6 These are 3D images of the S920X core board from two different perspectives. Figure 7 and Figure 8 These are, respectively, a perspective view and an exploded view of the first core board module provided in the embodiments of this application; Figure 9 A perspective view of the back side of the substrate in the first core board module provided in the embodiments of this application; Figure 10 An exploded view of the heat sink in the first core board module provided in this application embodiment; Figure 11 and Figure 12 These are, respectively, a perspective view and an exploded view of the second core board module provided in the embodiments of this application; Figure 13 A perspective view of the back side of the substrate in the second core board module provided in an embodiment of this application; Figure 14 and Figure 15 These are, respectively, a perspective view and an exploded view of the third core board module provided in the embodiments of this application; Figure 16 A perspective view of the back side of the substrate in the third core board module provided in the embodiments of this application; Figure 17 A perspective view of the bracket in the first state of the heat sink provided in the embodiments of this application; Figure 18 A perspective view of the bracket when the support platform is in the second state and the support frame is in the first position in the radiator provided in the embodiment of this application; Figure 19An exploded view of the bracket in the radiator provided in the embodiments of this application; Figure 20 A perspective view of the bracket in the radiator provided in the embodiment of this application when the support frame is in the second position; Figure 21 A perspective view of the bracket in the heat sink provided in the embodiment of this application when the locking block and the locking groove are separated; Figure 22 for Figure 21 Enlarged view at point A.

[0020] The reference numerals in the detailed embodiments are as follows: 100. Radiator; 110. Heat sink body; 111. Base plate; 1111. First connecting hole; 112. Heat-conducting component; 1121. First fin group; 1122. Second fin group; 1123. Third fin group; 1124. Fourth fin group; 113. Boss; 1141. First airflow drive component; 11411. Fan; 11412. Fan bracket; 1142. Second airflow drive component; 1151. First heat pipe; 1152. Second heat pipe; 120. Bracket; 121. Support platform; 1211. First positioning post; 1212. Third connecting hole; 1212a. First group; 1212b. Second group; 1213. Second positioning post; 1214. Second fixing hole; 1221. First leg; 1222. Second leg; 1223. Third leg; 1224. Fourth leg; 123. Groove; 124. Support frame; 1241. Alternating opening; 1242. Locking groove; 1242a. First locking groove; 1242b. Second locking groove; 1251. First elastic element; 1252. Second elastic element; 1253. Third elastic element; 126. Fixing block; 127. Locking block; 1271. Snap-fit ​​part; 128. Hook; 129. Opening; 130. Fasteners; 210. First core board; 211. First CPU; 212. First memory; 213. First positioning hole; 214. Second connecting hole; 215. First fixing hole; 220. Second core board; 221. Second CPU; 222. Second memory; 223. Third positioning hole; 224. Fourth connecting hole; 225. Third fixing hole; 230. Third core board; 231. Third CPU; 232. Third memory; 233. Fourth positioning hole; 234. Fifth connecting hole; 235. Fourth fixing hole; 310. First core board module; 320. Second core board module; 330. Third core board module; 400. Second connector. Detailed Implementation

[0021] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0023] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0024] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0025] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0026] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0027] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0028] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0029] After the core board is installed on the base plate, since the base plate is also a circuit board structure, its strength is relatively low. When the core board is under pressure, the base plate not only cannot provide strong support for the core board, but is also easily affected by the pressure of the core board and will bend and deform.

[0030] To address this issue, and in order to achieve efficient heat dissipation for the core board by pressing the heat sink substrate firmly against the front of the core board, while ensuring that the core board is not subjected to excessive bending deformation due to excessive pressure, this application considers configuring a bracket for the heat sink. A raised support platform on the bracket abuts against the back of the core board. The bracket can be made of high-strength metal or plastic. During installation, the support platform supports the back of the core board between the back of the core board and the base plate, providing strong support for the core board and preventing excessive bending deformation, thus ensuring that components are not easily damaged. Simultaneously, the support platform is connected to fasteners that pass through the substrate and the core board sequentially, so that the pressure is mainly concentrated at the support platform, preventing the core board from bending due to excessive force at locations far from the support platform.

[0031] The back of the core board usually also generates heat. The core board is supported by a raised support platform, which allows the heat from the back of the core board to be dissipated through the bracket, thereby effectively improving the heat dissipation capacity of the core board.

[0032] In the specific implementation of this application, three types of core boards are mainly used as examples to introduce the assembly of heat sinks with them and the heat dissipation of them. The models of these three core boards are S920S, S920L and S920X, respectively. It should be noted that this does not constitute a limitation on the specific core board models that the heat sink can be adapted to. For other models of core boards, the size of the heat sink and the position of the connection structure can be adjusted adaptively based on the bracket support on the back to clamp and assemble the core board, so as to meet the installation requirements of the corresponding model of core board.

[0033] The three core boards are defined as the first core board, the second core board, and the third core board, respectively. The front structure of the S920S is as follows: Figure 1 As shown, the back structure is as follows Figure 2 As shown, it is the first core board 210, with a power consumption of 125W and a board size of 130*102mm. The size of the first CPU 211 on the first core board 210 is between the size of the second CPU 221 on the second core board 220 and the size of the third CPU 231 on the third core board 230. The first memory 212 on the first core board 210 is a BGA (Ball Grid Array) board.

[0034] The front structure of the S920L is as follows Figure 3 As shown, the back structure is as follows Figure 4 As shown, it is the second core board 220, with a power consumption of 80W and a board size of 165*135mm. The second CPU 221 on the second core board 220 is smaller in size, and the second memory 222 on it is vertical.

[0035] The front structure of the S920X is as follows Figure 5 As shown, the back structure is as follows Figure 6 As shown, it is the third core board 230, with a power consumption of 175W. The board size is the same as the second core board 220. The third CPU 231 of the third core board 230 is larger, and the third memory 232 on it is also a BGA board. The third memory 232 is also set on the back of the third core board 230.

[0036] According to a first aspect of the embodiments of this application, a heat sink is provided, as detailed in [reference needed]. Figure 7 and Figure 8The figures show the three-dimensional and exploded structures of the heat sink provided in this application embodiment when applied to the first core board 210. As shown in the figures, the heat sink 100 includes a heat sink body 110 and a bracket 120. The heat sink body 110 includes a substrate 111 and a heat-conducting element 112. The heat-conducting element 112 can be the fins shown in the figures. It can be integrally formed with the substrate 111 or assembled and fixed to the substrate 111 by means of welding, snap-fit, threaded fastener connection, etc. The heat-conducting element 112 is disposed on one side of the substrate 111. The other side of the substrate 111 is used to attach to the components on the front side of the core board, such as high-power devices such as CPU, memory, MOSFET, and network card, so that the heat generated by the core board during operation can be transferred to the heat-conducting element 112 through the substrate 111, thereby achieving efficient heat dissipation of the core board.

[0037] A boss can also be provided on the side of the substrate 111 facing away from the heat conductor 112. The boss is used to fit tightly onto high-power devices such as CPUs, so that the substrate 111 can quickly absorb the heat generated by the high-power devices. The gap between the substrate 111 and the front side of the core board can be filled with high thermal conductivity materials such as thermal pads, graphene, and phase change materials to fully improve the heat dissipation capacity of the core board.

[0038] like Figure 8 As shown, the bracket 120 is provided with a protruding support platform 121, which is used to abut against the back of the first core board 210 and is connected to a fastener 130 that passes through the substrate 111 and the first core board 210 in sequence, so that the first core board 210 is clamped in the middle by the substrate 111 and the bracket 120 to form an integral module. The bracket 120 may also have grooves or openings to avoid components on the back of the core board.

[0039] The above assembly method is also applicable to the first core board 210, the second core board 220, the third core board 230, and other core board models. Different forms of heat sink bodies 110 and brackets 120 can be designed to address the differences in power consumption, size, component types, and layouts of each core board.

[0040] First, regarding the first core board 210, please refer again for details. Figure 7 and further combine Figure 9 The heat sink body 110 shown in the figure has a three-dimensional structure from the back view. Multiple protrusions 113 can be provided on the back of the substrate 111. The protrusions 113 are respectively attached to the first CPU 211 and the first memory 212. Of course, they can also be attached to other components on the front of the first core board 210 to achieve efficient heat dissipation of the components.

[0041] Considering that the substrate 111 needs to be pressed tightly against the first CPU 211 and the first memory 212, the first core board 210 will bear considerable pressure at the locations of the first CPU 211 and the first memory 212. To prevent excessive deformation of the first core board 210, such as... Figure 8 As shown, the bracket 120 can be equipped with support platforms 121 at the center opposite to the first CPU 211 and at each of the four corners, providing strong support at the center and corners of the back of the first core board 210 to prevent excessive deformation and damage to the first core board 210. Simultaneously, heat from the back of the first core board 210, especially the heat at the position opposite the CPU, can be transferred to the bracket 120 through the support platforms 121, thus achieving heat dissipation from the back of the first core board 210 and ensuring efficient heat dissipation for the first core board 210.

[0042] like Figure 8 As shown, the heat-conducting component 112 may include a first fin group 1121 and a second fin group 1122. The first fin group 1121 includes a plurality of fins spaced apart along a direction perpendicular to the substrate 111 (in the direction indicated by the double arrow Z in the figure), and the second fin group 1122 includes a plurality of fins spaced apart along a direction parallel to the substrate 111 (in the direction indicated by the double arrow Y in the figure).

[0043] In the direction indicated by the double arrow Z, the height of the first fin group 1121 is higher than the height of the second fin group 1122. The purpose of this arrangement is because the first core board 210 has strong expandability. The first fin group 1121 and the second fin group 1122 are distributed in an L-shape, which can ensure heat dissipation of the entire substrate 111 while providing sufficient installation space for expansion devices by utilizing the area above the second fin group 1122.

[0044] To improve heat dissipation efficiency, please further combine... Figure 10 A first airflow drive component 1141 may also be provided on the substrate 111. The first airflow drive component 1141 can be a fan 11411 as shown in the figure. The fan 11411 is mounted and fixed on the substrate 111 by a fan bracket 11412. The first airflow drive component 1141 is located at the end of the first fin group 1121 opposite to the second fin group 1122. The first airflow drive component 1141 is used to drive the airflow to pass through the first fin group 1121 and the second fin group 1122 in sequence. Specifically, the first fin group 1121 is the main heat dissipation structure of the heat sink body 110. Most of the air outlet area of ​​the first airflow drive component 1141 is covered by the first fin group 1121. After the airflow passes through the first fin group 1121, it carries away the heat on it. The second fin group 1122 is the auxiliary heat dissipation area of ​​the heat sink body 110. The airflow passes through the first fin group 1121 first and then flows through the second fin group 1122 to further carry away the heat from the second fin group 1122.

[0045] Considering the relatively high power consumption of the first core board 210 (125W), in order to improve the heat dissipation capacity of the first fin group 1121, such as... Figure 10 As shown, at least one first heat pipe 1151 can be connected between the first fin group 1121 and the substrate 111. The first heat pipe 1151 can quickly transfer the heat of the substrate 111 to each fin in the first fin group 1121, so that the heat on the substrate 111 can be quickly discharged, thus ensuring the rapid transfer of heat from the components on the first core board 210 to the substrate 111.

[0046] To facilitate the assembly of the heatsink 100 with the first core board 210, such as Figure 8 As shown, the front of the support platform 121 and the back of the first core board 210 can be positioned by inserting the first positioning post 1211 and the first positioning hole 213. After the bracket 120 and the first core board 210 are positioned to each other, the heat sink body 110 is snapped onto the front of the first core board 210, and after the fasteners 130 (e.g., screws with springs) pass through the first connection holes 1111 at the four corners of the substrate 111 and the second connection holes 214 at the four corners of the first core board 210, they are locked to the third connection holes 1212 at the four corners of the support platform 121, so that the heat sink 100 and the first core board 210 are assembled to form the first core board module 310.

[0047] When the first core board module 310 is installed on the base plate, it can be positioned by inserting the second positioning post 1213 on the back of the bracket 120 into the second positioning hole on the base plate. After positioning, the fasteners pass through the first fixing holes 215 at the four corners of the first core board 210 and the second fixing holes 1214 at the four corners of the support platform 121 and are fastened to the base plate to assemble and fix the first core board module 310 on the base plate.

[0048] This structural design not only facilitates the assembly and connection of the first core board 210 and the heat sink 100, but also facilitates the assembly operation of the first core board 210 and the heat sink 100 as a whole on the base plate. In addition, the bracket 120 is supported on the back of the first core board 210 by the support platform 121, which can effectively ensure that the first core board 210 is not easily deformed by excessive pressure, thereby ensuring the stability of the first core board 210.

[0049] Secondly, for the second core board 220, please refer to... Figures 11 to 13 ,in Figure 11 and Figure 12 The three-dimensional structure and exploded structure of the heat sink 100 applied to the second core board 220 are shown respectively. Figure 13The three-dimensional structure of the back side of the substrate 111 is shown. As shown in the figure, since the main heat-generating element on the front side of the second core board 220 is the second CPU 221 in the central region, a boss 113 for attaching with the second CPU 221 is provided in the central region of the back side of the substrate 111 so that the heat of the second CPU 221 can be quickly transferred to the substrate 111.

[0050] Considering the low power consumption of the second core board 220 (80W), in order to meet the heat dissipation requirements of the second core board 220 while reducing the space occupied by the heat sink 100, the heat conduction component 112 may include a third fin group 1123. The third fin group 1123 includes fins arranged in a direction parallel to the substrate 111. Figure 11 and Figure 12 Several fins are arranged at intervals (in the direction indicated by the double arrow Y). No airflow driving components are provided on the substrate 111. The third fin group 1123 adopts passive heat dissipation to minimize the volume of the heat sink 100 while meeting the heat dissipation requirements of the low-power second core board 220.

[0051] Because the corners of the second core board 220 are obstructed by the vertical second memory 222, the space is relatively limited, and the pressure of the substrate 111 on the second core board 220 is mainly concentrated at the second CPU 221. Therefore, as Figure 11 and Figure 12 As shown, the width of the substrate 111 along the direction indicated by the double arrow Y is less than the distance between the two second memory modules 222. The substrate 111 is disposed between the two second memory modules 222. The support platform 121 is also disposed at the position opposite to the bracket 120 and the second CPU 221 and at the four corners, so as to provide strong support for the second core board 220 at the second CPU 221 and at the four corners, and prevent the second core board 220 from being damaged due to excessive deformation under force.

[0052] The assembly of the heat sink 100 and the second core board 220 is similar to the assembly of the first core board 210 described above, such as... Figure 12 As shown, a first positioning post 1211 is provided on the front of the support platform 121, and a third positioning hole 223 is provided on the second core plate 220. The first positioning post 1211 is inserted into the third positioning hole 223 to align and position the bracket 120 with the second core plate 220. After the bracket 120 and the second core plate 220 are positioned relative to each other, the fastener 130 passes through the first connecting hole 1111 on the edge of the substrate 111 and the fourth connecting hole 224 in the middle area of ​​the second core plate 220 in sequence, and is then fastened to the third connecting hole 1212 on the support platform 121, so that the heat sink body 110, the second core plate 220 and the bracket 120 are assembled into a whole second core plate module 320.

[0053] To ensure that the second core plate 220 is subjected to uniform stress and is not prone to deformation, such as Figure 12 As shown, multiple first connection holes 1111, multiple fourth connection holes 224, and multiple third connection holes 1212 are evenly distributed around the second CPU 221, so that the substrate 111 and the second CPU 221 are tightly attached. At the same time, the pressure of the substrate 111 and the supporting force of the support platform 121 on the second core board 220 at the second CPU 221 are evenly distributed around the second CPU 221, thereby ensuring that the second core board 220 is subjected to balanced forces and is not prone to large-scale deformation.

[0054] The assembly of the second core board module 320 on the base plate is similar to that of the first core board module 310, as follows: Figure 12 As shown, a second positioning post 1213 is provided on the back of the support platform 121. The second positioning post 1213 is inserted into the second positioning hole on the base plate to position the second core board module 320 on the base plate. After positioning, the fasteners pass through the third fixing holes 225 at the four corners of the second core board 220 and the second fixing holes 1214 at the four corners of the support platform 121 in sequence and are then locked onto the base plate to assemble and fix the second core board module 320 to the base plate.

[0055] Finally, for the third core board 230, please refer to... Figures 14 to 16 ,in Figure 14 and Figure 15 The three-dimensional and exploded structures of the heat sink 100 applied to the third core board 230 are shown respectively. Figure 16 The figure shows a three-dimensional structure of the substrate 111 from the rear view. As shown, since the third CPU 231 on the third core board 230 is relatively large and a large number of memory chips (third memory 232) are provided on the third core board 230, a number of large-area protrusions 113 can be provided on the back of the substrate 111. These protrusions 113 are attached to the third CPU 231 and the third memory 232 to improve the heat dissipation efficiency of the third core board 230.

[0056] The third core board 230 has a relatively high power consumption of 175W. Therefore, to meet its strong heat dissipation requirements, such as... Figure 14 and Figure 15As shown, the heat-conducting component 112 may include a fourth fin group 1124, which comprises fins spaced apart along a direction parallel to the substrate (indicated by the double arrow Y in the figure). A plurality of second heat pipes 1152 are also connected between the fourth fin group 1124 and the substrate 111. After the substrate 111 absorbs heat from the third core board 230, the plurality of second heat pipes 1152 can quickly conduct the heat from the substrate 111 to each fin in the fourth fin group 1124, thereby achieving efficient heat dissipation of the third core board 230 and meeting its high power consumption heat dissipation requirements.

[0057] The substrate 111 is also provided with a plurality of second airflow driving members 1142. The second airflow driving members 1142 are located at one end of the fourth fin group 1124. The second airflow driving members 1142 are used to drive airflow through the fourth fin group 1124 so that the heat on the fourth fin group 1124 can be dissipated quickly.

[0058] The height of the fourth fin group 1124 in the direction perpendicular to the substrate 111 (in the direction indicated by the double arrow Z in the figure) is not lower than that of the second airflow drive member 1142, so that the fourth fin group 1124 can have a large heat dissipation area while basically covering the airflow path blown by the second airflow drive member 1142, thereby achieving high-efficiency heat dissipation.

[0059] The third core board 230 has higher power consumption and is mainly used to provide powerful computing power. Its expansion performance is slightly worse. Therefore, the larger fourth fin group 1124 will not have a significant impact on the installation of expansion components. In addition, taking the multiple second airflow drive components 1142 as examples, multiple fans can meet the heat dissipation requirements while minimizing their speed, thereby reducing overall noise and extending the lifespan of the entire system.

[0060] The support platform 121 is set at the position opposite to the bracket 120 and the third CPU 231 and at the four corners of the bracket 120, so as to provide reliable support for the third core board 230 at the third CPU 231 and the corner positions, ensuring that the third core board 230 is not easily bent or deformed.

[0061] The assembly of the heatsink 100 and the third core board 230 is similar to that described above, such as... Figure 15 As shown, a first positioning post 1211 is provided on the front of the support platform 121, and a fourth positioning hole 233 is provided on the third core plate 230. The first positioning post 1211 is inserted into the fourth positioning hole 233 to position the third core plate 230 on the bracket 120. Please refer to further details. Figure 16After positioning, the fastener 130 passes through the first connecting hole 1111 on the substrate 111 and the fifth connecting hole 234 on the third core board 230 in sequence, and is then fastened to the third connecting hole 1212 on the front of the support platform 121, so that the heat sink body 110, the third core board 230 and the bracket 120 together form the third core board module 330.

[0062] Similar to the assembly of the second core board 220, multiple first connecting holes 1111, multiple fifth connecting holes 234, and multiple third connecting holes 1212 are evenly distributed around the third CPU 231 so that the substrate 111 and the third CPU 231 are tightly attached. At the same time, the pressure of the substrate 111 and the supporting force of the support platform 121 on the third core board 230 at the third CPU 231 are evenly distributed around the third CPU 231, thereby ensuring that the third core board 230 is subjected to balanced forces and is not prone to large-scale deformation.

[0063] like Figure 15 As shown, a second positioning post 1213 is provided on the back of the support platform 121. The second positioning post 1213 is inserted into the second positioning hole on the base plate to position the third core board module 330 on the base plate. After positioning, the fasteners pass through the fourth fixing holes 235 at the four corners of the third core board 230 and the second fixing holes 1214 at the four corners of the support platform 121 in sequence, and are then locked onto the base plate to assemble and fix the third core board module 330 to the base plate.

[0064] In summary, the heat sink 100 provided in this embodiment of the application is pressed and attached to the components on the front side of the core board by one side of the substrate 111, so that the heat generated by these components can be quickly transferred to the heat-conducting element 112 on the other side of the substrate 111, thereby achieving efficient heat dissipation of the core board. In order to avoid excessive bending deformation of the core board due to excessive pressure from the substrate 111, which could damage the components, a bracket 120 is also provided for the heat sink 100. A support platform 121 protruding from the bracket 120 abuts against the back of the base plate and the core board to provide reliable support for the core board from the back and prevent excessive deformation. In addition, after the fastener 130 passes through the substrate 111 and the core board in sequence, it is connected to the support platform 121, so that the pressure on the core board is mainly concentrated at the position opposite to the support platform 121, thereby preventing the core board from bending due to excessive pressure at a position far away from the support platform 121.

[0065] contrast Figure 8 , Figure 12 and Figure 15As can be seen, in the assembly methods of the heat sink 100 with the first core board 210, the second core board 220 and the third core board 230 mentioned above, due to the different sizes of the three core boards and the different sizes, types and layout positions of the components on the board, the shape and position of the support platform 121 on the bracket 120, as well as the positions of the third connecting hole 1212 and the second fixing hole 1214 on the support platform 121, are also different. In order to achieve the installation adaptation of a single bracket 120 with different core boards, this application has also improved the design of the structure of the bracket 120.

[0066] Please refer to the details. Figure 17 and Figure 18 The figures show the three-dimensional structure of the bracket 120 in two states according to the embodiments of this application. As shown in the figures, the support platform 121 includes a first leg 1221, a second leg 1222, a third leg 1223, and a fourth leg 1224. At least three of the first leg 1221, the second leg 1222, the third leg 1223, and the fourth leg 1224 are movably connected to the bracket 120 so that the support platform 121 can switch between the first state and the second state.

[0067] exist Figure 17 and Figure 18 In the specific embodiment shown, a first leg 1221 is fixedly provided at one end of one side edge of the bracket 120, and a second leg 1222 is rotatably provided at the other end. On the other side edge of the bracket 120, a third leg 1223 is retractably provided at one end, and a fourth leg 1224 is detachably provided at the other end. It is understood that in some other embodiments, at least three of the first leg 1221, the second leg 1222, the third leg 1223, and the fourth leg 1224 can also be detachably connected to the bracket 120 by pins or screws, so that at least three of the first leg 1221, the second leg 1222, the third leg 1223, and the fourth leg 1224 can be installed at different positions on the bracket 120.

[0068] Combination Figure 17 and Figure 18 As can be seen, the second leg 1222 can rotate between the middle position and the corner position of one side edge of the bracket 120 (the left side edge in the figure). Specifically, in the specific embodiment shown in the figure, the rotation axis of the second leg 1222 (shown by the dotted line in the figure) is parallel to the substrate 111. In some other embodiments, the rotation axis of the second leg 1222 can also be perpendicular to the substrate 111, as long as the rotation stroke of the second leg 1222 can reach the middle position and the corner position of one side edge.

[0069] The third leg 1223 can extend and retract in a direction toward or away from the first leg 1221 (as indicated by the double arrow X in the diagram). When extended, it resembles... Figure 17 As shown, when shortened as Figure 18 As shown. Specifically, the third leg 1223 can be telescopically connected to the bracket 120 by means of a slider and a groove, and the third leg 1223 can be locked in different telescopic distance states by means of a pin and a hole.

[0070] The fourth leg 1224 can be detachably fixed at the corner of the other side edge of the bracket 120 (e.g. Figure 17 (as shown) or disassembled and fixed on the inner area of ​​the bracket 120 that is in contact with the core plate (such as... Figure 18 As shown. Specifically, the fourth leg 1224 can be detachably inserted into different holes on the bracket 120 via a pin to achieve adjustment at different positions on the bracket 120, or it can be achieved by means of threaded connection, etc.

[0071] The above structural design allows the support platform 121 to switch between a first state and a second state. For example... Figure 17 As shown, in the first state, the second leg 1222 rotates to one of the corner positions of the bracket 120, the third leg 1223 extends to another corner position farther from the first leg 1221, and the fourth leg 1224 is fixed at another corner position of the bracket 120. The support platform 121 is distributed in a first rectangle, that is, the first leg 1221, the second leg 1222, the third leg 1223 and the fourth leg 1224 are connected in sequence to form the first rectangle.

[0072] like Figure 18 As shown, in the second state, the position of the first leg 1221 remains unchanged, the second leg 1222 rotates to the middle position of one edge of the bracket 120, the third leg 1223 shortens to a position closer to the first leg 1221, and the fourth leg 1224 is fixed to the inner area of ​​the bracket 120 that is in contact with the core plate. The support platform 121 is arranged in a second rectangle, that is, the first leg 1221, the second leg 1222, the third leg 1223, and the fourth leg 1224 are connected sequentially to form the second rectangle, and the area of ​​the second rectangle is smaller than the area of ​​the first rectangle.

[0073] When the bracket 120 is assembled with the first core board 210, because the first core board 210 has a relatively small size, the support platform 121 is adjusted to... Figure 18 In the second state shown, the first leg 1221, the second leg 1222, the third leg 1223, and the fourth leg 1224 can be supported at the four corners of the first core board 210 to provide support for the first core board 210 from the back. The specific connection and fixation method between the bracket 120 and its support platform 121 and the first core board 210 and the heat sink body 110 can be the same as mentioned above. Figures 7 to 10 The embodiments shown are the same, so they will not be described in detail here.

[0074] When the bracket 120 is assembled with the second core board 220 or the third core board 230, because their board size is relatively large, the support platform 121 is adjusted to... Figure 17 In the first state shown, the first leg 1221, the second leg 1222, the third leg 1223, and the fourth leg 1224 can be supported at the four corners of the second core board 220 or the third core board 230, respectively, to provide reliable support for the second core board 220 or the third core board 230 from the back. The specific connection and fixation method between the bracket 120 and its support platform 121 and the heat sink body 110 and the second core board 220 or the third core board 230 can be the same as mentioned above. Figures 11 to 16 The embodiments shown are the same, and will not be described in detail here.

[0075] In summary, by arranging the first support leg 1221, the second support leg 1222, the third support leg 1223, and the fourth support leg 1224 in different assembly forms on the bracket 120, they can be adjusted to be distributed in a smaller rectangular area (the second rectangle mentioned above) or in a larger rectangular area (the first rectangle mentioned above), thereby adapting to the plate size of different core plates and realizing assembly with different core plates and reliable support for the core plates.

[0076] Considering the large size of the second core board 220 and the third core board 230, if the support is only provided at the four corners, it is still relatively easy for the central area of ​​the board to be compressed and bend. Therefore, in order not to affect the compatibility with the first core board 210, and to ensure that the support platform 121 can also provide support at the middle position of the back of the second core board 220 or the third core board 230 when assembling with the second core board 220 or the third core board 230, this application also improves the design of the bracket 120.

[0077] For details, please continue reading Figure 17 and Figure 18 and further combine Figure 19 , Figure 19 The exploded structure of the bracket 120 is shown in the figure. As shown in the figure, the bracket 120 has a groove 123. The support platform 121 includes a support frame 124. The support frame 124 can be raised and lowered in the groove 123 along the direction indicated by the double arrow Z. The support frame 124 and the groove 123 can be guided to rise and slide by the cooperation of a slider and a groove or a hole and shaft.

[0078] A first elastic element 1251 connects the support frame 124 to the bottom wall of the groove 123. The first elastic element 1251 can be a compression spring, a sheet spring, or an elastic soft rubber block, etc. The first elastic element 1251 provides a spring force to the support frame 124 to rise outwards from the groove 123, so that the support frame 124 can automatically rise when no external force is applied. To ensure balanced force on the support frame 124, such as... Figure 19 As shown, multiple first elastic elements 1251 can be provided to provide upward elastic force to the support frame 124 at different positions.

[0079] The support frame 124 can be locked in the first position recessed into the groove 123 (e.g.) Figure 18 (as shown) and at least partially protruding from the groove 123 at a second position (as shown) Figure 20 As shown in the figure, the support frame 124 can be locked relative to the groove 123 through snap-fit, pin limit, and top screw tightening.

[0080] like Figure 18 As shown, when the support frame 124 is locked in the first position, the support frame 124 is flush with the front of the bracket 120. At this time, the four legs (first leg 1221, second leg 1222, third leg 1223, and fourth leg 1224) are in the second state, that is, they are distributed in a second rectangle, and all legs are at the same height. In this state, the first core plate 210 can be assembled onto the bracket 120 and supported by the four legs at the four corners of the back of the first core plate 210.

[0081] like Figure 20 As shown, when the support frame 124 is locked in the second position, the support frame 124 protrudes from the front of the bracket 120. At this time, the four legs are in the first state, that is, when they are distributed in the first rectangle, all the legs and the support frame 124 are the same height. In this state, after the second core board 220 or the third core board 230 is assembled onto the bracket 120, four legs support the four corners of the back of the second core board 220 or the third core board 230. Based on the upward elastic force of the first elastic element 1251 on the support frame 124, the support frame 124 can stably support the back of the second core board 220 or the third core board 230 at the position corresponding to the first CPU 211 or the second CPU 221. Through the support of the four legs and the support frame 124 on the end corners and the middle area of ​​the back of the second core board 220 or the third core board 230 respectively, the second core board 220 or the third core board 230 is not prone to excessive bending deformation when under pressure, which can well ensure the structural stability of the second core board 220 or the third core board 230.

[0082] For substrate 111 and support stage 121 Figure 12 or Figure 15As shown, the fastener 130 passes through the middle region of the substrate 111 and the core plate to connect to the third connecting hole 1212. Because the distribution positions of the fourth connecting holes 224 for the fastener 130 to pass through are different on the second core plate 220 and the third core plate 230, in order to ensure that the support frame 124 can connect to the fastener 130 when assembled with either the second core plate 220 or the third core plate 230, the shape of the support frame 124 needs to cover the locations of the fourth connecting holes 224 on both the second core plate 220 and the third core plate 230. Figure 19 As shown, the support frame 124 is provided with two sets of third connecting holes 1212. The first set 1212a is distributed in the same position as the fourth connecting hole 224 on the second core plate 220, and the second set 1212b is distributed in the same position as the fourth connecting hole 224 on the third core plate 230.

[0083] When the bracket 120 is assembled with the second core board 220, the fastener 130 is fastened to the first group 1212a. When the bracket 120 is assembled with the third core board 230, the fastener 130 is fastened to the second group 1212b.

[0084] To facilitate the lifting and adjusting of the support frame 124, this application also includes a corresponding design for the locking structure of the support frame 124. Please refer to the following for details. Figure 19 and Figure 20 A fixing block 126 is disposed inside the groove 123, and a locking block 127 is slidably disposed inside the groove 123 along a first direction (the direction shown by the double arrow X in the figure, which is perpendicular to the direction shown by the double arrow Z). A second elastic member 1252 is connected between the locking block 127 and the fixing block 126. The second elastic member 1252 is used to provide elastic force to the locking block 127 to slide in a direction away from the fixing block 126.

[0085] The support frame 124 has a recess 1241, and both the fixing block 126 and the locking block 127 are at least partially accommodated in the recess 1241. The side wall opposite to the locking block 127 of the recess 1241 has a locking groove 1242, which includes a first locking groove 1242a and a second locking groove 1242b arranged in the direction indicated by the double arrow Z.

[0086] When the locking block 127 slides in the direction indicated by the double arrow X, it can engage with the locking groove 1242 (as shown in the image). Figure 20 (as shown) or disengage from the locking groove 1242 (as shown) Figure 21As shown), this enables rapid adjustment of the support frame 124 between the first position and the second position. When the locking block 127 engages with the first locking groove 1242a, the support frame 124 is locked in the first position, and the support frame 124 sinks into the groove 123; when the locking block 127 engages with the second locking groove 1242b, the support frame 124 is locked in the second position, and the support frame 124 at least partially protrudes from the groove 123.

[0087] To ensure that the support frame 124 is reliably locked so that it can stably provide support to the second core plate 220 or the third core plate 230, such as Figures 19 to 21 As shown, locking blocks 127 are provided on both opposite sides of the fixing block 126, and a second elastic element 1252 is connected between each locking block 127 and the fixing block 126. Locking grooves 1242 are provided on both sides of the opposing side walls of the clearance opening 1241. By having the locking blocks 127 on both sides respectively engage with the corresponding locking grooves 1242, the support frame 124 is reliably locked in the first position or the second position.

[0088] like Figure 19 As shown, the locking grooves 1242 on both sides can be triangularly distributed, and the parts of the locking blocks 127 on both sides that are used to engage the locking grooves 1242 are also triangularly distributed accordingly. The locking blocks 127 lock the support frame 124 by engaging the locking grooves 1242 at various points on both sides, so as to fully ensure the structural strength and stability of the support frame 124.

[0089] To facilitate the adjustment of the support frame 124, such as Figures 19 to 21 As shown, a hook 128 can also be vertically mounted within the groove 123. A third elastic element 1253 connects the hook 128 to the bottom wall of the groove 123. The third elastic element 1253 provides a spring force to the hook 128 to rise outward from the groove 123. Figure 22 shown Figure 21 In the enlarged structure at point A, the locking block 127 is provided with a latching part 1271 (which can be a latching groove as shown in the figure, or a latching block, etc.).

[0090] When the locking block 127 slides toward the fixing block 126 and the locking part 1271 engages and is fixed with the hook 128, it forms Figure 20 and Figure 21 In the state shown, the locking block 127 is limited by the hook 128 and will not pop out toward the locking groove 1242, and the locking block 127 is separated from the locking groove 1242. Therefore, in this state, the support frame 124 can be easily adjusted to raise or lower it to the desired first or second position.

[0091] After the support frame 124 is adjusted to the correct position, press the hook 128 to make it descend toward the bottom wall of the groove 123. The hook 128 can then separate from the locking part 1271. The locking block 127 will pop out and lock into the locking groove 1242 under the elastic force of the second elastic element 1252, thereby limiting and fixing the support frame 124.

[0092] For a design where locking blocks 127 are provided on both sides of the fixing block 126, the hook 128 can be used as follows: Figure 21 As shown, it extends to both sides and engages with the latching parts 1271 on both sides respectively. When unlocking the support frame 124, the locking blocks 127 on both sides can be moved simultaneously by different fingers to make the locking blocks 127 on both sides slide towards each other and engage with the latches 128, which makes it easier to apply force to the locking blocks 127.

[0093] To prevent the locking block 127 from tilting under force when sliding, such as Figure 19 and Figure 20 As shown, at least two fixing blocks 126 can be arranged at intervals along the second direction (the direction shown by the double arrow Y in the figure, which is perpendicular to the directions shown by the double arrows X and Z). At least one second elastic element 1252 is connected between the locking block 127 and each fixing block 126. The multiple second elastic elements 1252 provide a reset elastic force to the locking block 127 at different positions to ensure that the locking block 127 is subjected to uniform force when sliding and resetting, and is not prone to skewing, so as to ensure that the locking block 127 can be accurately inserted into the locking groove 1242.

[0094] The hook 128 is disposed between at least two fixing blocks 126 to ensure that after the hook 128 is engaged with the engagement part 1271, the elastic force of the second elastic element 1252 on the locking block 127 is distributed on both sides of the engagement part 1271, the force distribution on the locking block 127 is uniform, and the locking block 127 is stable and not easily tilted.

[0095] According to a second aspect of the embodiments of this application, a core board module is provided, the core board module including a core board and a heat sink 100 in any of the above embodiments, the core board being held between a bracket 120 and a substrate 111.

[0096] Specifically, the core board module can be the first core board module 310 mentioned above (e.g., Figures 7 to 10 As shown), the second core board module 320 (as shown) Figures 11 to 13 (as shown) or the third core board module 330 (such as Figures 14 to 16 (as shown), and each core board module can adopt such as Figures 17 to 22 The bracket 120 shown.

[0097] According to a third aspect of the embodiments of this application, an electronic device is also provided, the electronic device including a device body and a core board module provided in the above embodiments. A base plate is disposed within the device body, a first connector is disposed on the base plate, and a second connector 400 (e.g., ...) is disposed on the back of the core board module. Figure 2 , Figure 4 and Figure 6 As shown in the figure), the bracket 120 has an opening 129 for exposing the second connector 400 (as shown in the figure). Figure 8 , Figure 12 , Figure 15 and Figure 17 (As shown in the diagram). The core board module is mounted on the base plate, and the second connector 400 is electrically connected to the first connector by mating.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way.

Claims

1. A radiator, characterized in that, The heat sink, applied to the core board, includes: The heat sink body includes a substrate and a heat-conducting component. The heat-conducting component is disposed on one side of the substrate, and the other side of the substrate is used to attach to the components on the front side of the core plate. A bracket has a protruding support platform that abuts against the back of the core plate and is connected to fasteners that pass sequentially through the substrate and the core plate. The support platform includes a first leg, a second leg, a third leg, and a fourth leg, at least three of which are movably connected to the bracket. The support platform can switch between a first state and a second state. In the first state, the first, second, third, and fourth legs are arranged in a first rectangle; in the second state, they are arranged in a second rectangle, the area of ​​which is smaller than the area of ​​the first rectangle. The bracket has a groove, and the support platform includes a support frame that is vertically and vertically positioned within the groove. A first elastic element connects the support frame to the bottom wall of the groove, providing a spring force that propels the support frame upwards towards the outside of the groove. The support frame can be locked in a first position recessed into the groove and in a second position at least partially protruding from the groove.

2. The radiator according to claim 1, characterized in that, On one side edge of the bracket, the first support leg is fixedly provided at one end and the second support leg is rotatably provided at the other end. On the other side edge of the bracket, the third support leg is telescopically provided at one end and the fourth support leg is detachably provided at the other end. The second leg can rotate between the middle position and the corner position of one side edge of the bracket, the third leg can extend and retract in the direction toward or away from the first leg, and the fourth leg can be detachably fixed at the corner of the other side edge of the bracket or on the inner area of ​​the bracket that is in contact with the core plate. In the first state, the second leg rotates to one of the corner positions of the bracket, the third leg extends to another corner position farther away from the first leg, and the fourth leg is fixed to yet another corner position of the bracket; In the second state, the second leg rotates to the middle position of one side edge of the bracket, the third leg shortens to a position closer to the first leg, and the fourth leg is fixed to the inner area of ​​the bracket and the core plate.

3. The radiator according to claim 1, characterized in that, A fixing block is provided inside the groove, and a locking block is also slidably provided inside the groove along a first direction, the first direction being perpendicular to the lifting direction of the support frame; A second elastic element is connected between the locking block and the fixing block. The second elastic element is used to provide the locking block with a spring force to slide in a direction away from the fixing block. The support frame has a recessed opening, and both the fixing block and the locking block are at least partially accommodated in the recessed opening. The side wall of the recessed opening opposite to the locking block has a locking groove. The locking groove includes a first locking groove and a second locking groove arranged along the lifting direction. When the locking block is engaged in the first locking groove, the support frame is locked in the first position. When the locking block is engaged in the second locking groove, the support frame is locked in the second position.

4. The radiator according to claim 3, characterized in that, The locking blocks are provided on both sides of the fixed block, and the second elastic element is connected between each locking block and the fixed block. The locking grooves are provided on both sides of the opposite side wall of the clearance opening.

5. The radiator according to claim 4, characterized in that, The locking grooves on both sides are triangularly distributed, and the locking blocks on both sides are also triangularly distributed. The locking blocks on both sides are engaged in the locking grooves at three positions.

6. The radiator according to claim 3, characterized in that, A hook is provided in the groove and can be raised and lowered. A third elastic element is connected between the hook and the bottom wall of the groove. The third elastic element is used to provide the hook with an elastic force to rise out of the groove. The locking block is provided with a snap-fit ​​part. After the locking block slides toward the fixing block and the snap-fit ​​part snaps into the hook, the locking block separates from the locking groove. When the hook descends toward the bottom wall of the groove, the hook separates from the locking part, and the locking block slides away from the fixing block and engages with the locking groove.

7. The radiator according to claim 6, characterized in that, At least two fixing blocks are spaced apart along a second direction, which is perpendicular to both the first direction and the lifting direction. At least one second elastic element is connected between the locking block and each fixing block. The hook is disposed between at least two fixing blocks.

8. The radiator according to any one of claims 1-7, characterized in that, The heat-conducting component includes a first fin group and a second fin group. The first fin group includes a plurality of fins spaced apart along a direction perpendicular to the substrate. The second fin group is disposed at one end of the first fin group and includes a plurality of fins spaced apart along a direction parallel to the substrate. In a direction perpendicular to the substrate, the height of the first fin group is higher than the height of the second fin group, and at least one first heat pipe is connected between the first fin group and the substrate. A first airflow driving component is provided on the substrate. The first airflow driving component is located at one end of the first fin group away from the second fin group. The first airflow driving component is used to drive the airflow to pass through the first fin group and the second fin group in sequence. or, The heat-conducting component includes a third fin group, which includes a plurality of fins spaced apart along a direction parallel to the substrate. or, The heat-conducting component includes a fourth fin group, which includes a plurality of fins spaced apart along a direction parallel to the substrate, and a plurality of second heat-conducting pipes are connected between the fourth fin group and the substrate. The substrate is provided with a plurality of second airflow driving elements, the second airflow driving elements are located at one end of the fourth fin group, the height of the fourth fin group in the direction perpendicular to the substrate is not lower than the second airflow driving element, and the second airflow driving element is used to drive airflow through the fourth fin group.

9. A core board module, characterized in that, include: The core plate and the heat sink as described in any one of claims 1-8, wherein the core plate is sandwiched between the bracket and the substrate.

10. An electronic device, characterized in that, Includes the main body of the equipment and the core board module as described in claim 9; The device body is provided with a base plate, a first connector is provided on the base plate, a second connector is provided on the back of the core board module, and an opening is provided on the bracket for the second connector to be exposed. The core board module is disposed on the base plate, and the second connector and the first connector are plugged into each other to form an electrical connection.

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