Resistor-capacitor, power module and PCB board

Abstract

The embodiment of the application provides a resistor-capacitor, a power module and a PCB (Printed Circuit Board). It relates to the field of power electronics. The resistor-capacitor comprises a resistor-capacitor body and a pad structure, wherein the pad structure is arranged on the resistor-capacitor body; the pad structure comprises two circular pads, wherein the center distance of the two circular pads is adapted to the pitch requirement of a BGA (Ball Grid Array) package for vertical power supply, and the diameter of the circular pad meets the capacitor welding pitch requirement for horizontal power supply. The application is used to reduce the power supply design time.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and in particular to a resistor-capacitor, power supply module and PCB board. Background Technology

[0002] In the field of switches, especially in high-performance network equipment, power supply design is one of the core aspects of printed circuit board (PCB) design. The layout and power supply method of the power supply directly affect the stability, heat dissipation efficiency, and production cost of the PCB.

[0003] In related technologies, power supply methods in high-density PCB design typically employ horizontal and vertical power supply approaches. In a horizontal power supply scheme, the chip and power module are integrated on the same PCB, requiring filter capacitors to be placed on the bottom of the chip to meet power performance requirements. In a vertical power supply scheme, the power module is vertically connected to the chip, necessitating a separate PCB design for the power module. Therefore, both approaches result in long power supply design times and high development costs. Summary of the Invention

[0004] This application provides resistors, capacitors, power modules, and PCB boards to reduce power supply design time.

[0005] In a first aspect, embodiments of this application provide a resistor-capacitor combination, including a resistor-capacitor body and a pad structure, wherein:

[0006] The pad structure is arranged on the resistor-capacitor body;

[0007] The pad structure includes two circular pads, wherein the center-to-center spacing of the two circular pads is adapted to the spacing requirements of a vertically powered ball grid array package (BGA), and the diameter of the circular pads meets the spacing requirements for horizontally powered capacitor soldering.

[0008] In one possible implementation, the center-to-center spacing ranges from 0.4 mm to 1.5 mm.

[0009] In one possible implementation, the diameter of the circular pad ranges from 0.5 mm to 0.6 mm.

[0010] Secondly, embodiments of this application provide a power module, including: a BGA substrate and a plurality of resistors and capacitors as described in the first aspect and / or any possible implementation of the first aspect, wherein: the pad structures of the plurality of resistors and capacitors are arranged at intervals in BGA pattern, and the plurality of resistors and capacitors are soldered to the BGA substrate; wherein, the power module is used to connect the power supply and the power consumption part.

[0011] In one possible implementation, the multiple resistor and capacitor pad structures are arranged at intervals according to the BGA pattern, including: the multiple resistor and capacitor pad structures are arranged at intervals corresponding to a preset angle of the BGA pattern.

[0012] In one possible implementation, the preset angle includes 120° and / or 240°.

[0013] In one possible implementation, the power module further includes a circular stencil and a circular solder pad, wherein: the circular stencil is disposed on the BGA substrate and is used to apply solder paste to the BGA substrate; the circular solder pad is stacked on the solder paste.

[0014] Thirdly, embodiments of this application provide a PCB board, including a chip, a PCB substrate, and a power module as described in the second aspect and / or any possible implementation of the second aspect, wherein: the chip is disposed on the PCB substrate; the power module is disposed in the vertical direction of the PCB substrate, and the power module provides vertical power to the chip.

[0015] Fourthly, embodiments of this application provide a PCB board, including a chip, a PCB substrate, a power module as described in the second aspect and / or any possible implementation of the second aspect, and resistors and capacitors as described in the first aspect and / or any possible implementation of the first aspect, wherein: the chip is disposed on the PCB substrate; the power module is disposed in the vertical direction of the PCB substrate, and the power module supplies power to the chip vertically; the pad structure of multiple resistors and capacitors is disposed in the horizontal direction of the PCB substrate, wherein the multiple resistors and capacitors are interconnected to form a power module, which supplies power to the chip horizontally by connecting an external power source and the chip.

[0016] Fifthly, embodiments of this application provide a switching device, which includes a PCB board as described in the third aspect and / or any possible implementation of the third aspect and / or a PCB board as described in the fourth aspect and / or any possible implementation of the fourth aspect.

[0017] This application provides resistor-capacitor (RC) modules, power supply modules, and PCB boards. The center-to-center spacing of the two circular pads on the RRC body is matched to the spacing requirements of the BGA package. Simultaneously, the diameter of the circular pads meets the soldering requirements of the RRC components under horizontal power supply. Furthermore, when vertical power supply is achieved through the RRC, the identical pad structure on the RRC body can serve as a spacing reference for BGA-related components, ensuring that the center position of the solder joints on the circular pads remains consistent with the BGA spacing, thereby reducing the need for re-layout due to package switching. The pad structure on the RRC body, through a unified circular geometry, simultaneously constrains the pad spacing and pad diameter, thus achieving a balance between soldering manufacturability, device layout compatibility, and process adaptability within a limited PCB space. This reduces the repetitive development costs between different power supply modes, shortens power supply design time, and improves soldering consistency, layout reuse efficiency, and the versatility of the overall board design. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] Figure 1 A schematic diagram of a resistor-capacitor structure provided in an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of the structure of a power module provided in an embodiment of this application.

[0021] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0022] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0023] In related technologies, power supply methods in high-density PCB design typically employ horizontal and vertical power supply approaches. In a horizontal power supply scheme, the chip and power module are integrated on the same PCB, requiring filter capacitors to be placed on the bottom of the chip to meet power performance requirements. In a vertical power supply scheme, the power module is vertically connected to the chip, necessitating a separate PCB design for the power module. Therefore, both approaches result in long power supply design times and high development costs.

[0024] The pad structure provided in this application matches the center-to-center spacing of the two circular pads on the resistor-capacitor (RC) body with the spacing requirements of the BGA package. Simultaneously, the diameter of the circular pads meets the soldering requirements of the resistor-capacitor components under horizontal power supply. Furthermore, when vertical power supply is achieved via the RC body, the identical pad structure on the RC body can serve as a spacing reference for BGA-related components, ensuring that the center position of the solder joints on the circular pads remains consistent with the BGA spacing, thereby reducing the need for re-layout due to package switching. The pad structure on the RC body, through a unified circular geometry, simultaneously constrains both the pad spacing and the pad diameter, thus achieving a balance between soldering manufacturability, device layout compatibility, and process adaptability within a limited PCB space. This reduces repetitive development costs between different power supply modes, shortens power supply design time, and improves soldering consistency, layout reuse efficiency, and the versatility of the overall board design.

[0025] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0026] Figure 1 This is a schematic diagram of a resistor-capacitor structure provided in an embodiment of this application, as shown below. Figure 1 As shown, the resistor-capacitor 10 includes a resistor-capacitor body and a pad structure 11, wherein: the pad structure 11 is disposed on the resistor-capacitor body 13; the pad structure 11 includes two circular pads 12, wherein: the center distance between the two circular pads 12 is adapted to the spacing requirements of the ball grid array package (BGA) for vertical power supply, and the diameter of the circular pads 12 meets the spacing requirements for the capacitor soldering of horizontal power supply.

[0027] The center-to-center spacing of the two circular pads 12 is adapted to the spacing requirements of the ball grid array package (BGA) for vertical power supply, while the diameter of the circular pads 12 meets the spacing requirements for capacitor soldering for horizontal power supply. This allows the same pad structure 11 to accommodate the mounting and soldering needs under different power supply modes. The circular pads 12 are used to carry the terminal electrodes of the resistors and capacitors 10 and form a solderable interface so that electrical connections can be achieved during reflow soldering through the melting, wetting, and solidification of solder paste.

[0028] Optionally, the circular pad 12 is typically located within a predetermined mounting area of ​​the printed circuit board (PCB), maintaining a cooperative relationship with adjacent traces, vias, solder mask boundaries, and device bodies according to the PCB's device layout. Furthermore, the pad structure 11 can serve as a soldering carrier for the resistor-capacitor 10 devices in horizontal power supply mode, and also as a soldering reference adapted to the BGA package spacing in vertical power supply mode. Optionally, the resistor-capacitor 10 devices include both resistors and capacitors.

[0029] By directly mounting the pad structure 11 onto the resistor-capacitor 10 body, the resistor-capacitor 10 can simultaneously meet the installation adaptation requirements for both horizontal and vertical power supply scenarios. Furthermore, because the center-to-center spacing of the two circular pads 12 within the pad structure 11 matches the BGA spacing requirements for vertical power supply, and the pad diameter meets the capacitor soldering spacing requirements for horizontal power supply, the resistor-capacitor 10 can adapt to the installation requirements of both horizontal and vertical power supply methods. This reduces PCB redevelopment and component selection adjustments caused by power supply mode switching, thus improving the reusability and compatibility of the resistor-capacitor 10. Optionally, the resistor-capacitor 10 includes both capacitors and resistors.

[0030] Optionally, resistor and capacitor 10 can be a 0402 packaged device, or a 0201, 0603 or equivalent miniature surface mount device.

[0031] In one possible implementation, the circular pad 12 can be a planar circular metal pad, a circular pad 12 with solder resist definition boundaries, or a miniature circular pad that is configured to match the opening of the stencil.

[0032] Optionally, the circular pad 12 can be made of various pad materials. For example, the circular pad 12 can be a conductive copper layer with nickel-gold plating, immersion gold plating, tin plating, or an organic protective layer covering the copper foil surface. It can also be an outer copper foil pad of a single-layer board, a through-hole pad that is connected to the inner layer, or a blind or buried via pad adapted for high-density board layout.

[0033] In one possible embodiment, the diameter of the circular pad 12 is smaller than the center-to-center distance between the two circular pads 12 to form the necessary electrical isolation and soldering margin, and to improve mounting consistency by matching the edge of the circular pad 12 with the solder mask opening.

[0034] The center-to-center spacing of the two circular pads 12 refers to the fixed arrangement distance between the geometric centers of adjacent pads. The center-to-center spacing of the two circular pads 12 should meet the spatial reference for the arrangement of BGA packages in a vertical power supply scenario, so that the pad array composed of the circular pads 12 forms a repeatable spacing rule on the printed circuit board. Specifically, the size of the center-to-center spacing is adapted to the ball pitch or solder joint array spacing of the BGA device, so that when replacing with vertical power supply related devices, the soldering alignment relationship can be maintained without completely reconstructing the motherboard pads.

[0035] Furthermore, the center-to-center distance between the two circular pads 12 is generally determined by the device package specifications, stencil opening size, solder paste collapse characteristics, and assembly tolerances.

[0036] The diameter of the circular pad 12 meets the requirements for soldering coverage and solder joint overlap of the resistor-capacitor (RC) devices in a horizontal power supply layout, ensuring that the terminal electrodes of the RC devices can stably fall within the effective soldering area of ​​the pad and form reliable solder joints. The diameter of the circular pad 12 must ensure that the solder paste has sufficient wetting area during reflow to improve solder joint strength and conductivity reliability, while avoiding an excessively large pad that would increase the board area or cause spacing conflicts with adjacent pads.

[0037] Optionally, the diameter of the circular pad 12 can be set in conjunction with the solder end size of the resistor-capacitor 10 device, the body width of the resistor-capacitor 10 device, and the opening size of the stencil. It can also be adapted to resistor-capacitor 10 devices of different capacity levels and package specifications, and can be optimized in combination with the width of the solder mask bridge.

[0038] The center-to-center spacing of the two circular pads 12 is mutually constrained by their diameters. This means that while ensuring the center-to-center spacing meets BGA pitch compatibility requirements, sufficient clearance must be maintained to prevent solder bridging and interference between the two pads. This ensures the soldering stability and manufacturability of the pad structure 11 in high-density packaging environments. Simultaneously, the mutual constraint between the diameters of the circular pads 12 and their center-to-center spacing allows the same pad structure 11 to maintain the necessary coverage for device soldering in horizontal power supply layouts, while retaining sufficient package pitch compatibility in vertical power supply layouts, thus enabling reuse across power supply modes.

[0039] The pad structure 11 provided in this embodiment matches the center-to-center distance between the two circular pads on the resistor-capacitor body with the spacing requirements of the BGA package. Simultaneously, the diameter of the circular pads meets the soldering requirements of the resistor-capacitor components under horizontal power supply. Furthermore, when vertical power supply is achieved via resistors and capacitors, the identical pad structure on the resistor-capacitor body can serve as a spacing reference for BGA-related devices, ensuring that the center position of the solder joints on the circular pads remains consistent with the BGA spacing, thereby reducing the need for re-layout due to package switching. The pad structure on the resistor-capacitor body, through a unified circular geometry, simultaneously constrains both the pad spacing and the pad diameter, thus achieving a balance between soldering manufacturability, device layout compatibility, and process adaptability within a limited PCB space. This reduces the repetitive development costs between different power supply modes, shortens power supply design time, and improves soldering consistency, layout reuse efficiency, and the versatility of the overall board design.

[0040] In one possible implementation, the center-to-center spacing ranges from 0.4 mm to 1.5 mm.

[0041] The center-to-center spacing ranges from 0.4 mm to 1.5 mm, limiting the distance between the geometric centers of the two circular pads 12 to within this range. By limiting the distance between the geometric centers of the two circular pads 12 to within this range, the density of the pad array composed of the circular pads 12 can be constrained. This allows the pad array to meet the requirements of fine-pitch array packaging for the positional accuracy of adjacent solder joints, while also accommodating the mounting space of resistors and capacitors 10 in horizontal power supply mode. Simultaneously, by controlling the range of the center-to-center spacing between the two circular pads 12, the versatility of the same pad structure 11 for different power supply methods can be improved. When the center-to-center spacing is 0.4 mm to 1.5 mm, a relatively stable proportional relationship is typically formed with the diameter of the circular pad 12, the net edge distance between the two circular pads 12, and the solder mask isolation strip. With a smaller center-to-center spacing, a compact arrangement can be achieved by reducing the pad diameter and using high-precision stencil printing. With a larger center-to-center spacing, more routing space can be reserved while maintaining soldering reliability.

[0042] Optionally, the center-to-center spacing can be any value between 0.4 mm and 1.5 mm. For example, the center-to-center spacing can be 0.4 mm; the center-to-center spacing can also be 0.889 mm; the center-to-center spacing can also be 1.5 mm.

[0043] By limiting the distance between the geometric centers of the two circular pads 12 to within the range of 0.4 mm to 1.5 mm, the circular pads 12 can be coordinated with the ball grid array package spacing in the vertical power supply scenario, and can provide sufficient soldering and assembly space for the resistor-capacitor 10 devices in the horizontal power supply scenario.

[0044] Since the distance between the geometric centers of the two circular pads 12 is limited to the range of 0.4 mm to 1.5 mm, the mounted resistors and capacitors 10 can obtain a clear coordinate reference when positioning, and the probability of solder bridging and misalignment can be reduced after soldering, so that the same pad structure 11 can be reused between different power supply schemes.

[0045] By limiting the center-to-center spacing range, the pad array achieves a balance between fine-pitch package compatibility, device mounting stability, and board-level space utilization, thereby reducing the cost of repeated PCB layout development for switch boards due to power supply mode differences, and improving soldering consistency and process adaptability.

[0046] In one possible implementation, the diameter of the circular pad 12 ranges from 0.5 mm to 0.6 mm.

[0047] The outer diameter of the circular pad 12 is limited to the range of 0.5 mm to 0.6 mm. This is to control the board area occupied by the circular pad 12 while meeting the device soldering area requirements. This ensures that the circular pad 12 provides sufficient soldering wetting area and solder adhesion area for the resistor-capacitor 10 devices in horizontal power supply scenarios, thereby guaranteeing a stable electrical connection after reflow soldering. At the same time, it avoids excessive compression of the spacing between the two circular pads 12 due to excessively large dimensions, thus maintaining compatibility with the BGA package spacing requirements in vertical power supply scenarios.

[0048] The diameter of the circular pad 12 can be any length from 0.5 mm to 0.6 mm. For example, the pad diameter can be 0.5 mm to suit higher density layouts; the pad diameter can also be 0.55 mm to balance soldering area and layout spacing; the pad diameter can also be 0.6 mm to suit situations where solder paste volume requirements are relatively high.

[0049] Optionally, the outer diameter of the circular pad 12 is generally not greater than the center distance between the two circular pads 12, so as to avoid the two circular pads 12 overlapping or interference from the solder mask opening.

[0050] Optionally, the circular pad 12 can also be replaced by a near-circular pad 12 with a partial rounded corner transition based on process requirements, or an equivalent circular pad 12 with solder mask optimization.

[0051] Figure 2 This is a schematic diagram of the structure of a power module provided in an embodiment of this application, as shown below. Figure 2 As shown, the power module includes: a BGA substrate 21 and resistors and capacitors 10 as described in the above embodiments and / or any possible implementation of the above embodiments, wherein: the pad structures 11 of the plurality of resistors and capacitors 10 are arranged at intervals in BGA pattern, and the plurality of resistors and capacitors 10 are soldered to the BGA substrate 21; wherein, the power module is used to connect the power supply and the power consumption part.

[0052] The BGA substrate 21 serves as the carrier and electrical connection platform for the power module. Specifically, the BGA substrate 21 provides mounting references for multiple resistors and capacitors 10 that meet array soldering requirements. Simultaneously, the BGA substrate 21 also provides conductive paths between the resistors and capacitors 10 and external power supplies and power-consuming components.

[0053] The BGA substrate 21 is located in the main body of the power module in the overall structure, and multiple resistors and capacitors 10 are arranged in the predetermined soldering area within the BGA substrate 21. The pad structure 11 on the resistors and capacitors 10 is interconnected with the corresponding pads, power networks and signal networks on the substrate, so that the power module can form a stable interface connection with the power supply terminal and the power consumption part through the substrate after assembly.

[0054] Optionally, the BGA substrate 21 can be any one of a rigid printed circuit board, a flexible printed circuit board, or a rigid-flex board.

[0055] Optionally, the BGA substrate 21 can be a multilayer wiring structure; it can also be a partially buried blind via structure; or it can be a composite carrier structure with a reinforcing layer. By selecting different structures of the BGA substrate 21, different current carrying capacity and assembly strength requirements can be met.

[0056] Multiple resistors and capacitors 10 are a collection of surface-mount electrical components disposed on the BGA substrate 21. Multiple resistors and capacitors 10 are used in the power supply module to realize decoupling, filtering, energy storage, impedance matching and / or current transient compensation functions to support the supply current and suppress voltage ripple and noise interference.

[0057] The plurality of resistors and capacitors 10 may structurally include capacitors, resistors, and / or a network of resistors and capacitors 10 formed by combinations of resistors and capacitors. The plurality of resistors and capacitors 10 are regularly and evenly distributed in the soldering area of ​​the BGA substrate 21 according to the BGA pattern spacing to form a regular array adapted to the BGA. The resistors and capacitors 10 are fixed and conductive to the BGA substrate 21 by soldering.

[0058] Optionally, when soldering resistors and capacitors 10 to BGA substrate 21, nickel-tin plating, tin-silver-copper solder ends, or other solderable metal end faces can be used to improve soldering wettability and connection reliability.

[0059] Multiple resistors and capacitors 10 correspond in size to the BGA pattern. The center-to-center spacing of the circular pads 12 within the pad structure 11 of the resistors and capacitors 10 should match the center-to-center spacing of the BGA solder ball array to avoid solder bridges, misalignment, or cold solder joints. Simultaneously, the diameter of the circular pads 12 within the pad structure 11 of the resistors and capacitors 10 should meet the process requirements of uniform solder distribution and device self-alignment during reflow soldering. In summary, the center-to-center spacing and diameter of the circular pads 12 within the outer pad structure 11 of the resistors and capacitors 10 need to be designed in coordination with the overall density of the BGA substrate 21.

[0060] By setting the center-to-center spacing of the circular pads 12 within the pad structure 11 of the resistor-capacitor 10 to correspond to the BGA pattern spacing, adjacent resistors and capacitors 10 are arranged in a regular array in space. This balances device layout, solder distribution, and manufacturability within the same soldering area of ​​the BGA substrate 21. Functionally, the pad structure 11 of the resistor-capacitor 10 serves both to meet the alignment requirements of small-pitch BGA packages in vertical power supply scenarios and, through the design of the pad diameter and soldering window, to meet the requirements of capacitor soldering spacing and solder joint strength in horizontal power supply scenarios. This allows the same pad structure 11 to be reused across different power supply architectures.

[0061] This application provides a power module that integrates module-level power supply, decoupling, and filtering functions by uniformly arranging multiple resistors and capacitors on a Ball Grid Array (BGA) substrate, arranging them according to the BGA pattern spacing rules, and soldering them using pad structures adapted to the BGA substrate. When the power module is connected to an external power source and to the power-consuming components, the current first enters the electrical circuit of each resistor and capacitor through the conductive network on the BGA substrate. Subsequently, each resistor and capacitor regulates the transient current under energized conditions and absorbs and bypasses high-frequency noise and ripple components, thereby maintaining the stability of the power supply voltage during load changes, switching, or transient chip operation. Simultaneously, because the multiple resistors and capacitors are arranged according to a rule matching the BGA pattern spacing, their solder joint positions, device spacing, and solder distribution can remain consistent during reflow soldering, thereby reducing the probability of assembly defects such as device misalignment, solder bridges, and cold solder joints. Furthermore, the resistor-capacitor pad structure takes into account both the small-pitch adaptability required for vertical power supply and the capacitor soldering tolerance required for horizontal power supply, so that the same power module basic structure can be switched between different power supply schemes without the need to repeatedly develop independent PCB layouts.

[0062] In one possible implementation, the pad structures 11 of the plurality of resistors and capacitors 10 are arranged at intervals in a BGA pattern, including: the pad structures 11 of the plurality of resistors and capacitors 10 are arranged at intervals at a preset angle corresponding to the BGA pattern.

[0063] The circular pads 12 of the resistors and capacitors 10 are arrayed at preset angles corresponding to the reference edge of the BGA substrate 21. This arrangement prevents the circular pads 12 from linearly expanding along a single horizontal or vertical direction, instead forming a BGA pattern with a preset angle of deflection around the ball position center of the BGA array. This method allows the circular pads 12 of the resistors and capacitors 10 to meet BGA pattern spacing requirements while avoiding BGA solder balls, trace channels, and surrounding device areas. It also ensures that the pad center spacing, solder paste opening direction, and mounting direction are coordinated with the reflow soldering process, thereby improving the adaptability and soldering consistency of the resistors and capacitors 10 in different power supply layouts.

[0064] Optionally, two circular pads 12 are arranged on the pad structure 11 of the resistor-capacitor 10, that is, a pair of circular pads 12 are arranged on the resistor-capacitor 10. Further, the pair of circular pads 12 corresponding to the resistor-capacitor 10 are set in the mounting area of ​​the resistor-capacitor 10 on the BGA substrate 21 according to the mapping relationship of the BGA pattern, so that the pad pair and the BGA array maintain a predetermined spatial correspondence, so as to realize that the pad structures 11 of multiple resistor-capacitor 10 are arranged at a preset angle interval corresponding to the BGA pattern.

[0065] In one possible implementation, the preset angle includes 120° and / or 240°.

[0066] The preset angles, including 120° and / or 240°, refer to the arrangement of multiple resistor-capacitor pad structures 11 in an array layout, with one or more preset angles between them. When multiple resistor-capacitor pad structures 11 are arranged at preset angle intervals corresponding to the BGA pattern, the preset angles can be 120°, 240°, or a subset of resistors 10 can be arranged at 120° and another subset at 240° to form a geometrically symmetrical pad array. When the preset angles include 120° and / or 240°, arranging multiple resistor-capacitor pad structures 11 at preset angle intervals corresponding to the BGA pattern allows for structural adaptation to the BGA pattern within the limited space of the BGA substrate 21. Specifically, the 120° and / or 240° angular arrangement enables the resistors 10 to form an equal or near-equal division relationship in the circumferential direction, facilitating decoupling and filtering around the chip periphery in a horizontal power supply scenario. Meanwhile, in vertical power supply scenarios, it coordinates with the BGA substrate 21 to reduce mechanical interference and electrical interference between adjacent components, and improve local layout density and soldering consistency.

[0067] If resistor 10 is a 0402 resistor 10, then the 120° and 240° angular positions can be rotated and mounted to match the long side and / or short side of the 0402 resistor 10 device to form a BGA pattern arrangement.

[0068] In one possible implementation, the power module further includes a circular stencil and a circular solder pad, wherein: the circular stencil is disposed on the BGA substrate 21 and is used to apply solder paste to the BGA substrate 21; the circular solder pad is stacked on the solder paste.

[0069] On the BGA substrate 21, the pad structures 11 of resistors and capacitors 10 are arranged at BGA pattern intervals. Then, solder paste is evenly applied to the corresponding positions of the pad structures 11 of resistors and capacitors 10 on the BGA substrate 21 using a stencil. Next, a circular solder pad is placed on the solder paste to mount multiple resistors and capacitors 10 to their corresponding positions within the BGA substrate 21 in the BGA pattern interval arrangement, ensuring a stable solder joint between the pad structures 11 of the resistors and capacitors and the boundaries of the solder paste-covered pads. This arrangement allows multiple resistors and capacitors 10 to be assembled more compactly and regularly on the same BGA substrate 21, while also being compatible with layout requirements under different power supply modes. This reduces the need for repeated PCB development due to power supply mode switching, improves the consistency of resistor and capacitor soldering, and enhances the efficiency of single-board layout reuse.

[0070] Those skilled in the art will understand that a circular stencil is a metal template used for solder paste printing on BGA substrate pad areas. The circular stencil defines the release location and amount of solder paste through circular openings within it, thereby forming a uniform, circular or near-circular solder deposit on the corresponding pad. Optionally, the diameter of the circular openings within the circular stencil can correspond to the diameter of the circular pad to facilitate a uniform solder paste deposition thickness, thereby improving solder joint consistency and reducing the probability of bridging, cold solder joints, and voids.

[0071] Optionally, the circular openings within the circular stencil correspond one-to-one or in an array to the circular pads 12 within the pad structure 11 of the resistor-capacitor 10, so that the squeegee can precisely transfer the solder paste to the corresponding position on the circular pad 12 during printing. Furthermore, the diameter of the circular openings within the circular stencil can be slightly smaller than or equal to the diameter of the circular pad 12 to control the amount of solder.

[0072] Optionally, the circular openings within the circular steel mesh can be standard circles, rounded circles, or near-circular shapes achieved through process compensation.

[0073] Optionally, the material of the circular steel mesh can be any of stainless steel sheet, nickel alloy sheet, or other wear-resistant and corrosion-resistant metal sheet.

[0074] Optionally, the round "Sold" can be tin-silver-copper lead-free solder paste, flux-containing composite solder paste, or other solder materials suitable for reflow soldering.

[0075] Optionally, the thickness of the stencil can be selected based on the amount of solder paste released.

[0076] This application provides a PCB board, which includes a chip, a PCB substrate, and a power module as described in the above embodiments and / or any possible implementation of the above embodiments, wherein: the chip is disposed on the PCB substrate; the power module is disposed in the vertical direction of the PCB substrate, and the power module provides vertical power to the chip.

[0077] When the chip is mounted on the PCB substrate, it can serve as the core processor or high-power device carrier in a switch board. After the power module is arranged vertically along the PCB substrate, it forms a close vertical power supply path with the chip, thereby shortening the power supply loop and current transmission path. This reduces the space occupied by power devices in the PCB substrate plane for wiring and installation, allowing more limited board space to be allocated to high-speed signal devices and other functional devices.

[0078] Meanwhile, since the power module directly supplies power to the chip vertically, the power supply organization in high-power power supply scenarios is more concentrated, which helps to improve voltage stability and reduce the difficulty of layout switching, and can better adapt to the design requirements of high density, small space and high power consumption of switch boards.

[0079] This application provides a PCB board. The PCB board includes a chip, a PCB substrate, a power module as described in the above embodiments and / or any possible implementation of the above embodiments, and a plurality of resistors and capacitors as described in the above embodiments and / or any possible implementation of the above embodiments, wherein: the chip is disposed on the PCB substrate; the power module is disposed in the vertical direction of the PCB substrate, and the power module supplies vertical power to the chip; the pad structure of the plurality of resistors and capacitors is disposed in the horizontal direction of the PCB substrate, wherein the plurality of resistors and capacitors are interconnected to form a power module, which supplies horizontal power to the chip by connecting an external power source and the chip.

[0080] When the chip is placed on the PCB substrate, it can form a compact electrical connection with multiple resistors and capacitors placed horizontally on the PCB substrate, and with the power supply module placed vertically on the PCB substrate. This allows the PCB board to use both horizontal and vertical power supply methods. After multiple resistors and capacitors are interconnected to form a power supply module, they can perform power supply support, filtering, and decoupling near the chip, thereby shortening the signal and power loop paths, reducing power supply voltage drop and parasitic effects, and making it easier to adapt to the high-density layout of switch boards. This improves power supply stability and board reusability within the limited PCB space, helps reduce the repeated development costs under different power supply schemes, and improves the overall board manufacturing consistency.

[0081] This application provides a PCB board. The PCB board includes a chip, a PCB substrate, and multiple resistors and capacitors as described in the above embodiments and / or any possible implementation of the above embodiments, wherein: the chip is disposed on the PCB substrate; the pads of the multiple resistors and capacitors are disposed in the horizontal direction of the PCB substrate, wherein the multiple resistors and capacitors are interconnected to form a power module, which provides horizontal power to the chip by connecting an external power supply and the chip.

[0082] This application provides a switching device, which includes at least one PCB board as described in the above embodiments and / or any possible implementation of the above embodiments.

[0083] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0084] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0085] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0086] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0087] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0088] Finally, it should be noted that other embodiments of this application will readily conceive of by those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and alterations may be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A resistor-capacitor pair, characterized in that, Includes resistor-capacitor bodies and pad structures, wherein: The pad structure is arranged on the resistor-capacitor body; The pad structure includes two circular pads, wherein the center-to-center distance between the two circular pads is adapted to the spacing requirements of a vertically powered ball grid array package (BGA), and the diameter of the circular pads meets the spacing requirements for horizontally powered capacitor soldering.

2. The resistor-capacitor according to claim 1, characterized in that, The center-to-center distance ranges from 0.4 mm to 1.5 mm.

3. The resistor-capacitor according to claim 1 or 2, characterized in that, The diameter of the circular pad ranges from 0.5 mm to 0.6 mm.

4. A power supply module, characterized in that, include: BGA substrate and a plurality of resistors and capacitors as described in any one of claims 1-3, wherein: Multiple resistor and capacitor pads are arranged in a BGA pattern and spaced apart, and multiple resistors and capacitors are soldered to a BGA substrate. The power module is used to connect the power supply and the power consumption part.

5. The power supply module according to claim 4, characterized in that, The plurality of resistor and capacitor pad structures are arranged at intervals in a BGA pattern, including: the plurality of resistor and capacitor pad structures are arranged at intervals at preset angles corresponding to the BGA pattern.

6. The power supply module according to claim 5, characterized in that, The preset angle includes 120° and / or 240°.

7. The power module according to any one of claims 4-6, characterized in that, The power module also includes a circular steel mesh and a circular Sold, wherein: The circular steel mesh is laid on the BGA substrate, and the circular steel mesh is used to apply solder paste on the BGA substrate; the circular solder is stacked on the solder paste.

8. A PCB board, characterized in that, Includes a chip, a PCB substrate, and a power module as described in any one of claims 4-7, wherein: The chip is disposed on the PCB substrate; The power module is arranged in the vertical direction of the PCB substrate, and the power module provides vertical power to the chip.

9. A PCB board, characterized in that, It includes a chip, a PCB substrate, multiple resistors and capacitors as described in any one of claims 1-3, and a power module as described in any one of claims 4-7, wherein: The chip is disposed on the PCB substrate; The power module is arranged in the vertical direction of the PCB substrate, and the power module provides vertical power to the chip. Multiple resistor-capacitor pads are arranged in the horizontal direction of the PCB substrate. The multiple resistors and capacitors are interconnected to form a power module, which provides horizontal power to the chip by connecting an external power source and the chip.

10. A switching device, characterized in that, The switching device includes the PCB board as described in claim 8 and / or the PCB board as described in claim 9.

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