Heat dissipation system and control method thereof

Abstract

The application discloses a heat dissipation system and a control method thereof, and belongs to the technical field of liquid cooling heat dissipation. The heat dissipation system comprises a liquid cooling radiator, which is used for being coupled with a power device and performing liquid cooling heat exchange; a flow regulating unit, which is used for delivering a first flow of cooling liquid when the power device is in a first running state and delivering a second flow of cooling liquid when the power device is in a second running state; and a controller, which is used for acquiring a running parameter of the power device, determining a running state based on the running parameter, and controlling the flow regulating unit to deliver the second flow of cooling liquid when it is determined that the power device is in the second running state. According to the embodiment of the application, the controller actively identifies the running state of the power device based on the running parameter, and controls the flow regulating unit to deliver the cooling liquid in different modes according to different running states, so that an active heat dissipation strategy of on-demand adjustment is realized, and the transient heat exchange capacity of the liquid cooling radiator is enhanced.

Description

Technical Field

[0001] This application belongs to the field of liquid cooling technology, and particularly relates to heat dissipation systems and their control methods. Background Technology

[0002] Existing liquid cooling systems are typically designed with a constant coolant flow rate based on the rated operating conditions of power devices, and cannot dynamically adjust the coolant flow rate according to changes in the operating status of the power devices. When power devices are under conditions such as short-term overload, the constant flow rate is difficult to match the sudden increase in heat dissipation demand, resulting in a higher peak junction temperature of the devices. If high flow rate operation is maintained for a long time to ensure overload capacity, it will lead to increased pump consumption and aggravated flow channel erosion.

[0003] Therefore, how to adaptively adjust the heat dissipation strategy according to the operating status of power devices has become an urgent technical problem to be solved. Summary of the Invention

[0004] This application provides a heat dissipation system and its control method, which realizes an adaptive adjustment strategy of the heat dissipation system based on the operating status of power devices, so as to save energy under rated operating conditions and enhance heat dissipation capacity in a timely manner under overload conditions.

[0005] On one hand, embodiments of this application provide a heat dissipation system, including: Liquid-cooled heat sinks are used for thermal coupling with power devices and for liquid-cooled heat exchange of power devices. The flow regulation unit is used to deliver a first flow rate of coolant to the liquid cooler when the power device is in a first operating state, and to output at least a second flow rate of coolant to the liquid cooler when the power device is in a second operating state. The controller is used to acquire the operating parameters of the power devices, determine the operating status of the power devices based on the operating parameters, and... When the power device is determined to be in the second operating state, the flow regulation unit controls the flow rate regulation unit to output at least a second flow rate of coolant to the liquid cooler, and the second flow rate is a pulse flow rate.

[0006] In one embodiment, the flow regulation unit includes: The rated flow subunit is located between the coolant reservoir and the liquid-cooled radiator, and is used to deliver a first flow rate of coolant to the liquid-cooled radiator when the power device is in the first operating state. The pulse current boosting subunit is located between the coolant reservoir and the liquid-cooled radiator. The control terminal of the pulse current boosting subunit is connected to the controller and is used to pulse the coolant from the coolant reservoir to form a second flow rate of coolant, which is then output to the liquid-cooled radiator.

[0007] In one implementation, the pulse current booster subunit includes an auxiliary pump and a fast valve; The auxiliary pump's inlet is connected to the coolant reservoir's outlet, the auxiliary pump's outlet is connected to the quick valve's inlet, and the quick valve's outlet is connected to the liquid-cooled radiator. The auxiliary pump is used to draw coolant from the coolant reservoir and pressurize the coolant to form a second flow rate of coolant. A quick-opening valve is used to control the flow of a second stream of coolant into the liquid-cooled radiator in a pulsed manner.

[0008] In one embodiment, the pulse booster subunit further includes a liquid storage assembly disposed between the auxiliary pump and the fast valve; A coolant storage assembly is used to store coolant supplied from a coolant reservoir via an auxiliary pump when the power device is in a first operating state, and to pre-pressurize the coolant to form a second flow rate of coolant; and, When the power device is in the second operating state, a second flow rate of coolant is output to the liquid-cooled radiator through a fast valve.

[0009] In one embodiment, the liquid storage assembly includes a one-way valve and an accumulator; The inlet of the check valve is connected to the outlet of the auxiliary pump, and the outlet of the check valve is connected to the inlet of the accumulator, which is used to deliver coolant to the accumulator. The accumulator's output port is connected to the input port of a quick-acting valve. The accumulator stores coolant and pre-pressurizes the coolant to create a second flow rate. When the power device is in the second operating state, coolant is pulsedly output to the liquid-cooled radiator at a second flow rate through a fast valve.

[0010] In one embodiment, the heat dissipation system further includes a status detection component for collecting operating parameters of the power devices and status parameters of the accumulator. The controller is used to: receive operating parameters transmitted by the status detection component, and determine the operating status based on the operating parameters; When the power device is determined to be in the first operating state, the auxiliary pump is controlled to deliver a first flow rate of coolant to the accumulator based on the state parameters of the accumulator. When the power device is determined to be in the second operating state, the control valve outputs a second flow of coolant from the accumulator to the liquid-cooled radiator.

[0011] In one implementation, the rated flow subunit includes a main circulation pump; The main circulation pump is used to draw coolant from the coolant reservoir and, when the power device is in its first operating state, output a first flow rate of coolant to the liquid-cooled radiator.

[0012] In one implementation, the rated flow subunit reuses the pulse flow booster subunit, and the main circulation pump is a variable speed driven main circulation pump. The main circulation pump is also used to generate a second flow of coolant in response to the controller's control when the power device is in a second operating state, and to output the second flow of coolant to the liquid-cooled radiator.

[0013] In one embodiment, the heat dissipation system further includes a coolant reservoir and an external radiator; The coolant reservoir's outlet is connected to the flow regulating unit's inlet for storing and supplying coolant; An external radiator is installed between the liquid-cooled radiator and the coolant reservoir to cool the coolant from the coolant reservoir and deliver it to the coolant reservoir.

[0014] On the other hand, embodiments of this application provide a control method based on the above-described heat dissipation system, including the following steps: Includes the following steps: Obtain the operating parameters of the power devices; Based on operating parameters, determine the operating status of power devices; When the operating state is determined to be the second operating state, the flow control unit outputs at least a second flow rate of coolant to the liquid-cooled radiator; the second flow rate is a pulsed flow rate.

[0015] In one implementation, determining the operating state of the power device based on operating parameters includes: Input the operating parameters into at least one of the preset device loss calculation model, thermal network model, or junction temperature estimation model to obtain the operating results. The operating results include at least one of the power device's current, current change rate, junction temperature, and loss. If the operating results meet the preset conditions, the operating state of the power device is determined to be the second operating state.

[0016] Secondly, embodiments of this application provide an electronic device, the device comprising: Processor and memory storing programs or instructions; The above control methods can be implemented when executing programs or instructions in the initial stage.

[0017] Fourthly, embodiments of this application provide a computer storage medium on which a program or instructions are stored, and when the program or instructions are executed by a processor, the above-described control method is implemented.

[0018] Fifthly, embodiments of this application provide a computer program product in which instructions are executed by the processor of an electronic device, causing the electronic device to perform the aforementioned control method.

[0019] This application discloses a heat dissipation system and its control method. The system obtains the operating parameters of power devices through a controller and determines their operating states accordingly. Since the operating parameters directly and quickly reflect the real-time heat load changes of the power devices, compared to existing technologies that rely on slow variables such as cold plate temperature or coolant inlet / outlet temperature difference for adjustment, the system's response delay to overload conditions is significantly shortened. Based on this, the flow regulation unit outputs a first flow rate in a first operating state and at least a second flow rate in a second operating state, according to the operating state determined by the controller. This achieves on-demand adjustment of the heat dissipation strategy. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a heat dissipation system provided in one embodiment of this application; Figure 2 This is a schematic diagram of the structure of a flow regulation unit provided in one embodiment of this application; Figure 3 This is a schematic diagram of the structure of a pulse current booster subunit provided in one embodiment of this application; Figure 4 This is a schematic diagram of another heat dissipation system provided in one embodiment of this application; Figure 5 This is a schematic diagram of the structure of a liquid storage assembly provided in one embodiment of this application; Figure 6 This is a schematic diagram of the cooling system of the main circulating pump provided by a rated flow subunit according to an embodiment of this application; Figure 7 This is a schematic diagram of the structure of a cooling system for a variable speed driven main circulation pump, provided in one embodiment of this application; Figure 8 This is a schematic diagram of another heat dissipation system provided in one embodiment of this application; Figure 9 This is a flowchart illustrating a control method based on the heat dissipation system provided in another embodiment of this application. Figure 10 This is a schematic diagram of the structure of a control device provided in another embodiment of this application.

[0022] Explanation of reference numerals in the attached figures: 1000. Heat dissipation system; 100. Liquid-cooled radiator; 200. Flow regulation unit; 210. Rated flow subunit; 211. Main circulation pump; 222. Variable speed drive main circulation pump; 220. Pulse current booster subunit; 221. Auxiliary pump; 222. Quick valve; 223. Liquid storage assembly; 2231. Accumulator; 2232. Check valve; 300, Controller; 400, Power Device; 500, Coolant Tank; 600, External Heatsink. Detailed Implementation

[0023] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0024] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0025] It should be noted that the acquisition, storage, use, and processing of data in this application embodiment all comply with the relevant provisions of national laws and regulations.

[0026] It should be noted that in the embodiments of this application, certain software, components, models and other existing solutions in the industry may be mentioned. These should be regarded as exemplary and are only intended to illustrate the feasibility of implementing the technical solution of this application. However, it does not mean that the applicant has used or necessarily used the solution.

[0027] In the field of thermal management of power electronic devices, power devices face complex and variable operating conditions during operation. In particular, when the devices are under short-term overload or thermal shock, their conduction losses and switching losses increase rapidly, and the junction temperature rises rapidly, which puts forward high requirements for the transient response capability of the heat dissipation system.

[0028] However, existing liquid cooling systems are typically designed with a constant coolant flow rate under rated operating conditions, making it impossible to dynamically adjust the heat dissipation capacity based on the actual operating status of power devices. When devices experience sudden changes in thermal load, the constant flow rate struggles to keep up with the increased heat dissipation demands, leading to higher peak junction temperatures. Conversely, maintaining a high flow rate for extended periods to meet extreme heat dissipation requirements results in increased pump consumption, higher system noise, and exacerbated flow channel erosion. Existing solutions lack a heat dissipation control mechanism that combines operating status identification with dynamic adjustment of coolant flow rate.

[0029] Based on the above issues, such as Figure 1 The present application provides a heat dissipation system 1000, including: a liquid-cooled radiator 100 for thermal coupling with a power device 400 and liquid-cooled heat exchange; a flow regulation unit 200 for supplying a first flow rate of coolant to the liquid-cooled radiator 100 when the power device 400 is in a first operating state, and outputting a second flow rate of coolant in a second operating state; and a controller 300 for acquiring operating parameters of the power device 400 and determining the operating state based on the operating parameters, and controlling the flow regulation unit 200 to output at least a second flow rate of coolant when the power device 400 is determined to be in the second operating state, wherein the second flow rate is a pulsed flow rate.

[0030] Through the technical solution provided in this application embodiment, the controller 300 actively identifies the operating state of the power device 400 based on operating parameters, realizing on-demand switching of the heat dissipation strategy. In the first operating state, the first flow rate is maintained to avoid increased pump consumption and flow channel erosion caused by the need for long-term high flow rate operation to ensure the overload capacity of the heat dissipation system 1000; in the second operating state, the heat dissipation system 1000 outputs the second flow rate in a timely manner to enhance transient heat transfer capability and suppress the rapid rise of the junction temperature peak of the power device, thereby balancing system energy efficiency and short-term overload reliability of the power device 400.

[0031] It should be noted that the specific application scenarios corresponding to the above-mentioned heat dissipation system 1000 are not limited in the embodiments provided in this application. The technical solutions provided in the embodiments of this application can be flexibly applied to various power electronic equipment scenarios with short-term overload or thermal shock heat dissipation requirements according to actual needs.

[0032] For example, in a practical application scenario where a liquid cooling system 1000 is deployed for a grid-type converter, the technical solution provided in this application embodiment can first obtain the operating parameters of the power device 400 in the converter, such as current, voltage, and other electrothermal signals, as input data for the controller 300. Then, the controller 300 determines the operating state of the power device 400 based on the operating parameters. When the power device 400 is in the first operating state of rated operation, the controller 300 controls the flow regulation unit 200 to maintain a first flow rate of coolant output; when the power device 400 enters the second operating state of overload or thermal shock, the controller 300 controls the flow regulation unit 200 to output at least a second flow rate of coolant to the liquid coolant radiator 100, wherein the second flow rate is a pulsed flow rate, and the transient heat dissipation capability is enhanced by outputting the second flow rate of coolant in a pulsed manner. The technical solutions provided in this application embodiment can achieve precise and on-demand control of the heat dissipation strategy of the grid converter heat dissipation system 1000, reduce system energy consumption under rated operating conditions, effectively suppress junction temperature peak under overload conditions, and improve the short-term overload carrying capacity and operational reliability of the device.

[0033] It should be noted that the application scenarios described in the above embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. Those skilled in the art will understand that with the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems. The heat dissipation system 1000 provided in the embodiments of this application can be applied to various scenarios requiring dynamic heat dissipation management of the power device 400.

[0034] The heat dissipation system 1000 provided in the embodiments of this application will now be described in detail. Please continue reading... Figure 1 , Figure 1 A schematic diagram of the structure of a heat dissipation system 1000 provided in one embodiment of this application is shown. Figure 1 As shown, the heat dissipation system 1000 may specifically include a liquid-cooled radiator 100, a flow regulation unit 200, and a controller 300.

[0035] The aforementioned liquid-cooled heat sink 100 is used for thermal coupling with the power device 400 and for liquid-cooled heat exchange of the power device 400. In actual deployment, the liquid-cooled heat sink 100 can be flexibly selected according to the packaging form and heat dissipation requirements of the power device 400.

[0036] For example, when the power device 400 is a single-sided heat dissipation package, the liquid cooling heat sink 100 can be in the form of a water-cooled plate, a microchannel cold plate, a pin-fin cold plate, or a jet-impact cold plate, and is mounted on the heat dissipation substrate surface of the power device 400; when the power device 400 is a double-sided press-fit package, such as a press-fit insulated gate bipolar transistor or an integrated gate commutated thyristor, the liquid cooling heat sink 100 can adopt a double-sided liquid cooling structure to exchange heat from both sides of the device simultaneously, further improving heat dissipation efficiency.

[0037] The liquid-cooled radiator 100 may have a main heat exchange channel inside, through which the coolant carries away the heat generated by the device via convection.

[0038] The specific type of coolant can be selected based on factors such as thermal conductivity, insulation requirements, and operating temperature range. Deionized water, water-glycol mixture, fluorinated liquid, or other media suitable for power electronics cooling systems can be chosen.

[0039] The flow regulation unit 200 is used to supply a first flow rate of coolant to the liquid cooler 100 when the power device 400 is in a first operating state, and to output a second flow rate of coolant to the liquid cooler 100 when the power device 400 is in a second operating state.

[0040] When the flow regulating unit 200 outputs a first flow rate of coolant to the liquid cooler 100, it can be controlled by the controller 300 to achieve the output, or it can be achieved by other control components or devices.

[0041] The first operating state can be the normal operating state or the rated operating state of the power device 400, in which the current, loss and junction temperature of the device are within the conventional design range.

[0042] The second operating state can be that the power device 400 is in an overload operation, thermal shock, or thermal risk state, such as when the device current exceeds a preset multiple of the rated current, the current change rate exceeds a preset threshold, the estimated junction temperature exceeds the safe temperature threshold, or the converter enters a grid-type support or fault ride-through state.

[0043] The specific conditions for determining the second operating state can also be customized according to the actual application scenario of the heat-dissipated device. For example, for a new energy grid-connected converter, the second operating state can be triggered when the current exceeds 1.2 times the rated value and the duration exceeds the set window; for an energy storage converter, the second operating state can be triggered when the estimated junction temperature exceeds the first temperature threshold. No specific limitations are made here.

[0044] The first flow rate corresponds to the coolant flow rate under normal heat dissipation requirements, while the second flow rate is a pulsed flow rate used to meet the instantaneous demand for enhanced heat dissipation under overload conditions. The specific flow rate value of the second flow rate can be flexibly set by the controller 300 according to the thermal parameters of the power device 400, the degree of overload, and the characteristics of the heat sink. For example, the specific flow rate value of the second flow rate can be 0.5 times, 1 times, 2 times, or other appropriate multiples of the first flow rate.

[0045] The controller 300 is the decision-making core of the system. It is used to acquire the operating parameters of the power device 400, determine the operating state of the power device 400 based on these operating parameters, and control the flow regulation unit 200 to output a second flow rate of coolant to the liquid cooler 100 when it is determined that the power device 400 is in a second operating state.

[0046] The operating parameters acquired by the controller 300 can characterize the thermoelectric state of the power device 400 from multiple dimensions.

[0047] For example, a current sensor can be used to collect the conduction current of the power device, a voltage sensor can be used to collect the bus voltage or the terminal voltage of the power device, and a temperature sensor can be used to collect the inlet temperature, outlet temperature of the coolant, or the case temperature of the power device.

[0048] The controller 300 may also have at least one of the following built-in models: power device loss calculation model, thermal network model, or junction temperature estimation model, to estimate the real-time loss, junction temperature, or heat load of the power device online.

[0049] For example, a power device loss calculation model can calculate the conduction loss and switching loss of a power device based on parameters such as current, voltage, switching frequency, and duty cycle; a thermal network model can deduce the real-time trend of junction temperature of a power device based on power loss and coolant temperature.

[0050] Therefore, the controller 300 can not only determine the operating status based on direct electrical parameters, but also make decisions based on thermal state estimation results, thereby covering more types of thermal risk scenarios.

[0051] In this embodiment, when the power device 400 is in the first operating state, the controller 300 confirms that the power device is operating normally based on the acquired operating parameters. At this time, no additional intervention is required for the heat dissipation system 1000. The flow regulation unit 200 can supply the liquid-cooled radiator 100 with a first flow rate of coolant to meet the heat dissipation requirements. Since the first flow rate is a reasonable flow rate designed according to the rated operating conditions, rather than a high flow rate maintained for a long time to meet the heat dissipation capacity under overload conditions, the power consumption of the pump is low, the pipe flow resistance loss is small, and the erosion rate of the inner wall of the flow channel is also at a normal level. The system can operate stably in a highly efficient and energy-saving state.

[0052] When power device 400 enters its second operating state due to grid disturbances, short-term overload commands, or fault ride-through, the current in the power device rises rapidly, losses increase accordingly, and the junction temperature begins to climb quickly. At this time, controller 300 can quickly identify this state transition by continuously monitoring operating parameters, such as detecting that the device current exceeds 1.2 times the rated current threshold within tens to hundreds of milliseconds, or estimating through a thermal network model that the junction temperature will exceed the safe temperature limit within a short period. After confirming that the device has entered the second operating state, controller 300 immediately controls the flow regulation unit 200 to output at least a second flow rate of coolant to the liquid-cooled radiator, where the second flow rate is a pulsed flow.

[0053] This control mechanism, based on feedforward identification of operating parameters, differs from existing technologies that rely on slow variables such as cold plate temperature or the temperature difference between the inlet and outlet of the coolant for feedback regulation. The operating parameters directly reflect the causes of power device loss changes, and their signal transmission delay is extremely short, allowing for the prediction of junction temperature rise trends without waiting for a temperature sensor to detect a significant temperature increase before a passive response. Therefore, the controller 300 can trigger flow regulation before the power device junction temperature rises significantly, ensuring an effective time match between the pulsed coolant output and the rising heat load of the device. After the pulsed flow of coolant enters the liquid-cooled radiator 100, it enhances the convective heat transfer coefficient within the flow channel, accelerating the heat removal rate and effectively suppressing the rapid rise of the device junction temperature peak, preventing the junction temperature from approaching or exceeding the safe operating boundary.

[0054] Meanwhile, since the flow regulation unit 200 only outputs the second flow rate in a pulsed manner in the second operating state, and maintains the first flow rate for most of the system's operating time, it will not significantly increase the overall energy consumption and flow channel erosion burden of the system.

[0055] In summary, the heat dissipation system 1000 provided in this application embodiment, through the acquisition and analysis of operating parameters by the controller 300, achieves active identification of the operating status of the power device 400, and accordingly controls the flow regulation unit 200 to output coolant in different forms of flow rates in the first and second operating states. Using operating parameters as sensing input, the controller 300 as the judgment center, and the flow regulation unit 200 as the execution terminal, the heat dissipation system can switch between different heat dissipation modes as needed, thereby operating at the rated flow rate under rated conditions and enhancing heat dissipation by outputting at least pulsed flow rates under overload conditions, thus balancing the long-term economic efficiency of the system with the reliability of short-term overload operation.

[0056] In the embodiments of this application, Figure 2 Another structural schematic diagram of the heat dissipation system 1000 according to an embodiment of this application is shown.

[0057] like Figure 2 As shown, the flow regulation unit 200 includes a rated flow subunit 210 and a pulse flow boosting subunit 220.

[0058] The rated flow subunit 210 is located between the coolant reservoir 500 and the liquid cooler 100. Its inlet is connected to the coolant reservoir 500, which is used to store and supply coolant, and its outlet is connected to the inlet of the liquid cooler 100.

[0059] When the power device 400 is in the first operating state, the rated flow subunit 210 is used to draw coolant from the coolant reservoir 500 and deliver a first flow rate of coolant to the liquid-cooled radiator 100.

[0060] The pulse current boosting subunit 220 is disposed between the coolant reservoir 500 and the liquid-cooled radiator 100, and the control terminal of the pulse current boosting subunit 220 is connected to the controller 300. When the power device 400 enters the second operating state, the pulse current boosting subunit outputs at least a second flow rate of coolant to the liquid-cooled radiator 100.

[0061] The pulse booster subunit 220 is electrically connected to the controller 300 and receives instructions from the controller 300. It is specifically responsible for extracting coolant from the coolant reservoir 500 under overload conditions, pressurizing it to form a second flow rate of coolant, and then outputting the second flow rate of coolant to the liquid cooler 100 in a pulsed manner to achieve transient enhanced heat dissipation.

[0062] In this embodiment, when the power device 400 is in the first operating state, the system only needs the rated flow subunit 210 to work independently to meet the heat dissipation requirements. The rated flow subunit 210 operates stably according to the flow rate designed for rated operating conditions. At this time, the pulse current boosting subunit 220 is in standby or low-speed preparation state and does not generate additional high flow output to the main circulation path.

[0063] Since the initial flow rate is sufficient to meet the rated heat dissipation requirements, pump consumption remains at a low level, and system energy consumption and operating noise are within a reasonable range.

[0064] In this embodiment of the application, when the controller 300 determines that the power device 400 has entered the second operating state based on the operating parameters, the pulse current boosting subunit 220 is immediately activated.

[0065] The pulse booster subunit 220 draws coolant from the coolant reservoir 500 and can pressurize the coolant in a very short time through an internal pressurization or energy storage release mechanism to form a second flow of coolant, and injects the second flow of coolant into the liquid-cooled radiator 100 in a pulse manner.

[0066] Taking the actual operating conditions of a grid-connected converter during grid fault ride as an example, when the grid voltage drops suddenly, triggering the converter to output 1.5 times the rated current within hundreds of milliseconds to support the grid, the power device losses of 400 almost instantly more than double, and the junction temperature rises at a steep slope.

[0067] At this point, if only the ordinary circulating pump in the rated flow subunit 210 is used for variable frequency speed regulation to increase the flow, from the time the controller 300 issues the command to the time the pump speed reaches the target value and the flow in the pipeline is actually established, multiple inertial stages such as motor acceleration, impeller speed-up, and fluid acceleration need to be experienced. The entire response process may take several seconds, which is far behind the rate of increase in junction temperature. However, the pulse flow boosting subunit 220, due to the use of low-inertia actuators such as the fast valve 222 or the accumulator 2231, can complete the valve opening action within tens of milliseconds after receiving the command from the controller 300, injecting the pre-stored pressurized coolant into the radiator in a pulsed manner. This enhances the convective heat transfer coefficient in the radiator during the critical window period of junction temperature rise, thereby effectively reducing the peak and suppressing further increases in the junction temperature peak.

[0068] When the power device 400 returns to the first operating state from the second operating state, the controller 300 shuts down the pulse current boosting subunit 220, and the system returns to the economical operating mode where the first flow rate is maintained only by the rated flow rate subunit 210. This normal energy-saving and transient current boosting mode makes the overall average power consumption of the system much lower than that of the scheme that maintains high flow rate operation for a long time, while ensuring that the heat dissipation capacity is not compromised under overload conditions.

[0069] It should be noted that although this embodiment describes the flow regulation unit 200 as two sub-units, this division is more of a functional logic definition, and in terms of physical implementation, it does not require that the two be two completely independent hardware entities. For example, in some embodiments, the rated flow sub-unit 210 and the pulse flow boosting sub-unit 220 can share the same pump body, and the output of the first flow and the second flow can be achieved respectively by controlling the speed or working mode of the pump body under different operating conditions.

[0070] In other implementations, the two can also be physically independent branches, with the flow path reconfigured by switching valves.

[0071] like Figure 3 As shown in the embodiments of this application, the specific configuration of the pulse current booster subunit 220 is further refined.

[0072] See Figure 3 In this embodiment, the pulse flow boosting subunit 220 may include an auxiliary pump 221 and a fast valve 222. The two work together under the unified scheduling of the controller 300 to form an auxiliary flow boosting branch independent of the main circulation path.

[0073] The inlet of the auxiliary pump 221 is connected to the outlet of the coolant reservoir 500, and the outlet of the auxiliary pump 221 is connected to the inlet of the quick valve 222. The outlet of the quick valve 222 leads to the inlet or inlet manifold of the liquid-cooled radiator 100.

[0074] The connecting pipeline between the auxiliary pump 221 and the quick valve 222 can be any of the following: rigid metal pipe, flexible hose, or integrated flow channel plate. The specific selection can be determined based on the system installation space, vibration requirements, and ease of maintenance.

[0075] The type of auxiliary pump 221 is not particularly limited. For example, it can be a small centrifugal pump, gear pump, plunger pump or diaphragm pump, as long as it can effectively pressurize the incoming coolant.

[0076] The auxiliary pump 221 is responsible for drawing coolant from the output side of the coolant reservoir 500 and pressurizing it to form a second flow rate.

[0077] The quick valve 222 acts as a switch for pulse output. On the one hand, it controls the coolant of the second flow rate to flow into the liquid-cooled radiator 100 in a pulse manner. On the other hand, it is used to adjust the state parameters of the coolant of the second flow rate, such as the peak flow rate, pulse duration, and pulse frequency.

[0078] In this embodiment, when the power device 400 is in the first operating state, the controller 300 keeps the fast valve 222 closed. The auxiliary pump 221 can be in low-speed standby or intermittent operation mode, or it can be completely stopped. At this time, the entire auxiliary flow booster branch is physically isolated from the main circulation path by the fast valve 222. All the first flow coolant output from the rated flow subunit 210 enters the liquid-cooled radiator 100, and the system operates stably under rated conditions. The existence of the auxiliary branch will not interfere with the main circulation path or cause additional pressure loss, ensuring the economy of normal operation.

[0079] When the controller 300 determines that the power device 400 has entered the second operating state based on the operating parameters, the auxiliary pump 221 and the fast valve 222 operate according to the preset timing sequence under the command of the controller 300.

[0080] For example, a typical action sequence is as follows: the controller 300 first starts the auxiliary pump 221, which draws coolant from the output port of the rated flow subunit 210 and rapidly pressurizes it in the pump chamber. This process can usually be completed within tens of milliseconds. When the pressure on the output side of the auxiliary pump 221 reaches the target value, the controller 300 immediately opens the fast valve 222, and the pressurized coolant is injected into the inlet of the liquid-cooled radiator 100 in a pulse form through the fast valve 222.

[0081] Taking the actual thermal response of an insulated-gate bipolar transistor (IGBT) module under short-circuit current-limiting conditions as an example, the power loss of the device under current-limiting conditions may jump from hundreds of watts to thousands of watts within milliseconds, and the junction temperature will rise at a rate of tens of degrees Celsius per second. If the response is only initiated after the junction temperature detection value has significantly increased, the heat accumulation of the device has already occurred, and the peak temperature will inevitably surge. However, in this embodiment, the controller 300 can trigger an electrical signal the instant the current over-limit is detected, the auxiliary pump 221 completes pressurization within tens of milliseconds, and the fast valve 222 completes opening within milliseconds. The total delay of the entire response chain, from overload detection to the pulsed injection of the second flow coolant into the radiator inlet, can be controlled within hundreds of milliseconds. At this time, the pulsed coolant can be delivered into the radiator channel before the junction temperature rises significantly, the convective heat transfer coefficient is enhanced in advance, and heat is carried away from the device substrate surface at a higher rate, thereby effectively suppressing the rise slope of the junction temperature and reducing the peak junction temperature in the early stage of thermal shock.

[0082] In this embodiment, the controller 300 can control the opening and closing duty cycle of the fast valve 222 through pulse width modulation according to the different overload levels, thereby adjusting the volume of coolant injected into the liquid-cooled radiator per unit time. When the overload is mild and the junction temperature rises at a gentle rate, the duty cycle can be appropriately reduced to reduce unnecessary flow consumption; when the overload is severe and the junction temperature rises sharply, the duty cycle can be increased or the valve can be kept open to enhance heat dissipation with maximum flow.

[0083] Similarly, the peak value of the pulse flow can be controlled by adjusting the valve opening amplitude, and the pulse period can be controlled by adjusting the valve opening and closing frequency. This parameter adjustability allows the auxiliary flow booster branch to adaptively match the heat dissipation intensity according to the severity of the actual heat load.

[0084] In addition, the quick valve 222 can also work with a pressure sensor or flow sensor installed on the auxiliary flow booster branch to feed back the real-time pressure or flow signal to the controller 300, forming a closed-loop regulation of the pulse parameters.

[0085] For example, when the flow sensor detects that the actual pulse flow is lower than the target value, the controller 300 can increase the valve opening or increase the speed of the auxiliary pump 221 to compensate; conversely, when the pulse flow exceeds the target range, the valve opening is appropriately reduced to ensure that the coolant of the second flow enters the liquid-cooled radiator 100 in a stable and controllable state.

[0086] The pulse current booster subunit 220 in this embodiment further incorporates a liquid storage component 223 to optimize the response speed and energy utilization efficiency of the pulse current booster subunit 220 under overload conditions.

[0087] See Figure 4 In this embodiment, the pulse current boosting subunit 220 further includes a liquid storage component 223. The inlet of the liquid storage component 223 is connected to the outlet of the coolant storage tank 500, and the outlet of the liquid storage component 223 is connected to the inlet of the fast valve 222, thereby forming an intermediate link with energy storage and buffering function in the pulse current boosting subunit 220.

[0088] When the power device 400 is in the first operating state, the liquid storage component 223 uses this normal operating time window to continuously receive and store the coolant delivered by the coolant storage tank 500. At the same time, the coolant is pre-pressurized so that it is stored in the liquid storage component 223 at a state higher than the normal pressure of the pipeline, forming the second flow of coolant.

[0089] The degree of pre-pressurization of the coolant by the liquid storage component and the capacity of the stored coolant can be determined based on the most demanding operating conditions that the power device 400 in the heat dissipation system 1000 needs to face. The capacity of the coolant stored in the accumulator and the degree of pressurization required for the coolant can be determined based on the magnitude and duration of the current of the power device 400 under the most demanding operating conditions.

[0090] When the power device 400 enters the second operating state, the liquid storage component 223, under the control of the controller 300, releases the pre-accumulated pressurized coolant through the fast valve 222, and outputs the second flow rate of coolant to the liquid-cooled radiator 100 in a pulse manner.

[0091] In this embodiment, although the pulse current boosting subunit 220 significantly shortens the current boosting response time through the cooperation of the auxiliary pump 221 and the fast valve 222, the process of the auxiliary pump 221 accelerating from a stationary or low-speed state to the target speed and raising the pump outlet pressure to a level that can form a second flow rate still requires a certain response time, on the order of hundreds of milliseconds, during its execution. This pressure-building process, although much faster than the frequency conversion speed regulation of the main circulation pump 211, still consumes a certain amount of response time. For some extreme thermal shock scenarios, such as the instantaneous surge current of the power device 400 in the critical state of short-circuit protection causing the junction temperature to surge at a rate exceeding one hundred degrees Celsius per second, a delay of hundreds of milliseconds may still allow excessive heat to accumulate at the junction temperature.

[0092] To compensate for the slow response of the auxiliary pump, this embodiment introduces a liquid storage component 223. During the first operating state, the heat load of the power device 400 is low, the heat exchange task of the heat dissipation system 1000 is light, and the time margin is large. The liquid storage component 223 draws a portion of the first flow rate of coolant from the output side of the rated flow subunit 210 and pre-pressurizes it.

[0093] When the controller 300 detects that the power device 400 has entered the second operating state, the coolant reservoir 223 has already stored a second flow rate of coolant. At this time, the controller 300 only needs to issue a command to open the fast valve 222 in the pulse current boosting subunit 220. Driven by the pressure difference, the second flow rate of coolant stored in the reservoir 223 quickly flows from the branch where the pulse current boosting subunit 220 is located to the liquid-cooled radiator 100, forming a pulsed injection of the second flow rate of coolant.

[0094] The embodiments of this application further specify the liquid storage component 223.

[0095] like Figure 5 As shown in the embodiment of this application, the liquid storage assembly 223 consists of an accumulator 2231, a one-way valve 2232, and an auxiliary pump 221.

[0096] The inlet of the auxiliary pump 221 is connected to the outlet of the rated flow subunit 210, and the outlet of the auxiliary pump 221 is connected to the inlet of the check valve 2232.

[0097] The output port of the one-way valve 2232 is connected to the input port of the accumulator 2231, and the output port of the accumulator 2231 is connected to the input port of the quick valve 222. The output port of the quick valve 222 finally leads to the liquid cooling radiator 100.

[0098] Accumulator 2231 can be a bladder-type accumulator 2231, which has a flexible bladder inside, pre-filled with nitrogen gas at a certain pressure, and the outside of the bladder is a coolant chamber; when high-pressure coolant enters the coolant chamber, the bladder is compressed, the nitrogen gas pressure increases, and the pressure energy of the coolant is stored as the compressive potential energy of the gas.

[0099] The accumulator 2231 can also be a piston-type accumulator 2231, which stores energy by compressing a spring with a piston; or a diaphragm-type accumulator 2231, which stores energy by elastic deformation of a metal or rubber diaphragm.

[0100] The selection of different types of accumulators 2231 depends on the system's operating pressure range, temperature conditions, response speed requirements, and expected service life, and this application embodiment does not impose specific limitations on these.

[0101] A one-way valve 2232 is installed between the auxiliary pump 221 and the accumulator 2231. Its conduction direction is from the auxiliary pump 221 to the accumulator 2231, and it is cut off in the opposite direction.

[0102] The one-way valve 2232 allows coolant to flow into the accumulator 2231 in only one direction and prevents it from flowing out in the opposite direction. This ensures that the coolant can only enter the accumulator 2231 and cannot flow back, thereby locking the pressure firmly inside the accumulator 2231 and ensuring the long-term effectiveness of the reservoir.

[0103] The auxiliary pump 221 performs the function of filling and pressurizing in the liquid storage assembly 223. During the first operating state of the power device 400, the controller 300 drives the auxiliary pump 221 to operate at a lower power to draw coolant from the output side of the coolant reservoir 500, pressurize it, and then inject it into the accumulator 2231 through the one-way valve 2232.

[0104] In this embodiment of the application, when the power device 400 is in the first operating state, the controller 300 first obtains the state parameters of the accumulator 2231 through the state detection component, such as the pressure value, liquid level or filling amount in the accumulator 2231, in order to determine the current energy storage state of the accumulator 2231.

[0105] If the pressure of the accumulator 2231 has not reached the preset target pre-charge pressure, or the coolant level in the accumulator 2231 is lower than the preset level, it indicates that energy storage needs to be replenished, and the controller 300 will then start the auxiliary pump 221.

[0106] The target pre-charge pressure and preset liquid level can be determined based on the most severe operating conditions that the power device 400 in the heat dissipation system 1000 needs to face. The capacity of the coolant stored in the accumulator and the degree of pressurization required for the coolant can be determined based on the magnitude and duration of the current of the power device 400 under the most severe operating conditions.

[0107] The auxiliary pump 221 draws coolant from the output port of the coolant reservoir 500 and injects it into the accumulator 2231 through the check valve 2232 for pre-pressurization. The coolant continues to enter until the target pre-pressurization pressure value is reached. The controller 300 closes the auxiliary pump 221 and the check valve, and the pre-pressurization process is completed.

[0108] When the controller 300 determines that the power device 400 has entered the second operating state based on operating parameters, such as detecting through a current sensor that the device current jumps to 1.3 times the rated current within a short time window, or calculating through a junction temperature estimation model that the device junction temperature will reach a preset first temperature threshold in hundreds of milliseconds, the controller 300 sends an opening command to the fast valve 222. Since the accumulator 2231 already has sufficient coolant at a second flow rate, the fast valve 222 opens, and the coolant at the second flow rate in the accumulator is output to the liquid-cooled radiator 100 in a pulsed manner through the fast valve.

[0109] During the pulse boosting process, the pressure inside the accumulator 2231 gradually decreases as the coolant is released. The controller 300 can monitor the pressure change of the accumulator 2231 in real time and, in conjunction with the dynamic changes in the device operating parameters, dynamically adjust the duty cycle or opening amplitude of the fast valve 222.

[0110] For example, when the pressure in accumulator 2231 is high at the beginning of the pulse release, the valve opening is appropriately reduced to avoid excessive hydraulic impact on the radiator flow channel due to excessive flow. When the pressure in accumulator 2231 decreases in the later stage of the release, the valve opening is appropriately increased to compensate for the pressure drop and maintain a stable output of the second flow. This closed-loop regulation strategy based on the state parameters of accumulator 2231 ensures that the quality of the pulse boost remains stable and controllable within a single release cycle.

[0111] When the controller 300 determines that the power device 400 has exited the second operating state and returned to the first operating state, the fast valve 222 closes, the auxiliary pump 221 restarts, and the accumulator 2231 is pre-charged again to store coolant for the next possible overload event.

[0112] The embodiments of this application further define the rated flow subunit 210.

[0113] like Figure 6 As shown, the rated flow subunit 210 includes a main circulation pump 211, which is used to draw coolant from the coolant reservoir 500 and deliver coolant to the liquid-cooled radiator.

[0114] The inlet of the main circulation pump 211 is connected to the outlet of the coolant reservoir 500, and the outlet of the main circulation pump 211 is connected to the inlet of the liquid coolant radiator 100.

[0115] The coolant reservoir 500 is used to store and supply coolant. Its capacity is designed according to the total circulation flow and heat dissipation power of the system. It is usually also equipped with auxiliary components such as a level gauge, vent valve and replenishment interface to ensure the sufficiency and quality of coolant during long-term stable operation of the system.

[0116] The type of main circulation pump 211 can be flexibly selected according to system operating conditions. In applications with high flow rate and low head, a centrifugal pump can be used for the main circulation pump 211; in applications requiring higher outlet pressure, a multi-stage centrifugal pump or vortex pump can be selected; in indoor deployment environments with strict requirements for noise and vibration, a magnetic drive pump or a canned pump can also be used to eliminate the risk of leakage caused by mechanical seals.

[0117] Regardless of the specific pump type used, the core function of the main circulation pump 211 remains consistent: when the power device 400 is in the first operating state, it draws coolant from the coolant reservoir 500 and delivers a first flow rate of coolant to the liquid-cooled radiator 100 to remove the heat generated by the device.

[0118] In this embodiment, when the power device 400 is in the first operating state, the heat load is at a normal level, and the first flow of coolant flowing through the liquid cooler 100 can effectively remove the steady-state heat of the device.

[0119] In the embodiments of this application, such as Figure 7 As shown, the main circulation pump 211 can be a variable speed driven main circulation pump.

[0120] When the main circulation pump 211 is a variable speed driven main circulation pump, the controller 300 can output a first flow rate of coolant or a second flow rate of coolant to the liquid-cooled radiator 100 by driving the main circulation pump 211 according to the operating status of the power device 400. At this time, the variable speed driven main circulation pump 211 can achieve pulse output even when there is no side current boosting branch of the pulse current boosting subunit.

[0121] In this embodiment, when the power device 400 is in the first operating state, the variable speed drive main circulation pump operates at a reference speed that matches the rated heat dissipation requirements, and outputs a first flow rate of coolant to the liquid-cooled radiator 100.

[0122] When the power device 400 enters the second operating state, the controller 300 can generate a second flow rate of coolant simply by issuing an acceleration command to the variable speed drive main circulation pump, and output the second flow rate of coolant to the liquid-cooled radiator 100. At this time, the heat dissipation system 1000 no longer relies on the pulse current boosting subunit 220 to provide the second flow rate of coolant. Instead, it issues an adjustment command to the variable speed drive main circulation pump to adjust the speed of the main circulation pump 211, thereby directly generating a second flow rate of coolant in the main circulation path, and outputting the second flow rate of coolant to the liquid-cooled radiator 100 in the form of pulses.

[0123] The heat dissipation system 1000 in this embodiment of the application also includes a status detection component to improve the controller 300's ability to sense the system's operating status and to construct a closed-loop control loop for the pre-charging process of the accumulator 2231.

[0124] In this embodiment, the heat dissipation system 1000 further includes a status detection component for collecting two types of key status parameters: one is the operating parameters of the power device 400, and the other is the status parameters of the accumulator 2231. The controller 300 then makes decisions based on these two types of parameters at the levels of operating status judgment and pre-charge control.

[0125] The specific configuration of the condition monitoring component can be flexibly configured according to actual engineering needs. For the acquisition of operating parameters of power devices 400, the condition monitoring component may include one or more of the following: current sensor, voltage sensor, and temperature sensor.

[0126] For example, Hall effect current sensors or Rogowski coils can be used to collect the device's on-current, resistive voltage dividers or isolated voltage sensors can be used to collect the bus voltage or device terminal voltage, and thermocouples or thermistors can be used to collect the coolant inlet temperature, outlet temperature, or device case temperature. Furthermore, flow sensors and pressure sensors can be installed in the coolant piping to obtain real-time coolant flow and pressure information. These parameters can serve as auxiliary criteria for judging the device's operating status and can also be used to monitor the system's own operational health.

[0127] For the acquisition of the status parameters of the accumulator 2231, the status detection component may include one or more of the following: pressure sensor, liquid level sensor, displacement sensor, and temperature sensor.

[0128] Taking the air-filled accumulator 2231 as an example, a pressure sensor can be installed in the coolant chamber of the accumulator 2231 to monitor the internal pressure value in real time; a temperature sensor can be installed on the housing of the accumulator 2231 to monitor its operating temperature; for the piston-type accumulator 2231, a linear displacement sensor or proximity switch can also be installed to determine the coolant charge level in the accumulator 2231 by detecting the piston position. These sensor signals are collected by the controller 300, enabling the controller 300 to fully grasp the real-time energy storage status of the accumulator 2231.

[0129] In the embodiments of this application, such as Figure 8 As shown, the heat dissipation system 1000 also includes a coolant reservoir 500 and an external radiator 600, which together with the aforementioned liquid-cooled radiator 100 and flow regulating unit 200 form a complete closed-loop coolant circulation loop.

[0130] The outlet of the coolant reservoir 500 is connected to the input of the flow regulating unit 200, and is used to store and continuously supply coolant to the system.

[0131] An external radiator 600 is positioned between the liquid-cooled radiator 100 and the coolant reservoir 500. Its inlet is connected to the outlet of the liquid-cooled radiator 100, and its outlet is connected to the return port of the coolant reservoir 500.

[0132] The external radiator 600 is used to dissipate the heat absorbed by the coolant from the power device 400 to the external environment. After flowing through the liquid-cooled radiator 100, the coolant absorbs the heat generated by the power device 400 and its temperature rises, becoming a high-temperature coolant. This high-temperature coolant then enters the external radiator 600, where it exchanges heat with an external cooling medium, which can be air or cooling water. After releasing heat, its temperature decreases, and it returns to the coolant reservoir 500 at a low temperature, waiting to enter the next cycle.

[0133] Based on the same inventive concept, correspondingly, embodiments of this application also provide a control method based on the above-described heat dissipation system 1000, such as... Figure 9 As shown, the control method includes: S700: Obtain the operating parameters of the power device.

[0134] These operating parameters are used to characterize the operating status of power devices.

[0135] The acquisition of operating parameters can be divided into two main categories: electrical parameters and thermal parameters.

[0136] In terms of electrical parameters, the on-current or phase current of the power device 400 can be collected by the current sensor, the bus voltage or device terminal voltage can be collected by the voltage sensor, and the operating command parameters such as switching frequency, duty cycle, and modulation ratio can also be obtained from the converter control system.

[0137] In terms of thermal parameters, the inlet temperature of the coolant, the outlet temperature of the coolant, the device case temperature or the heat sink substrate temperature can be collected by temperature sensors, the real-time flow rate of the coolant can be collected by flow sensors, and the pressure of the coolant pipeline can be collected by pressure sensors.

[0138] The sampling frequency of these parameters can be set according to actual needs. For example, the sampling frequency of electrical parameters can be set higher to capture rapid changes in current; the sampling frequency of temperature parameters can be set relatively lower because temperature, as a quantity of heat capacity, changes relatively slowly.

[0139] S800 determines the operating status of power devices based on operating parameters.

[0140] The first operating state typically corresponds to the normal or rated operating state of the power device 400.

[0141] The second operating state corresponds to the power device 400 being in an overload operation, thermal shock, or thermal risk state.

[0142] S900. When the operating state is determined to be the second operating state, the flow regulation unit is controlled to output at least a second flow rate of coolant to the liquid-cooled radiator; the second flow rate is a pulse flow rate.

[0143] Step S900 is executed under the control of the aforementioned controller 300.

[0144] The controller 300 can also control the flow regulation unit to output a first flow rate of coolant to the liquid cooler when it determines that the operating state is the first operating state.

[0145] While outputting the flow boosting command, the controller 300 can also dynamically set and adjust the status parameters of the second flow rate according to the severity of the overload.

[0146] For example, parameters such as the target peak flow rate, pulse duration, pulse frequency, or duty cycle of the second flow rate can be determined based on the multiple of the overload current or the rate of rise of the estimated junction temperature. The more severe the overload, the larger the target peak flow rate and the higher the pulse duty cycle, in order to match the higher heat dissipation requirements.

[0147] In this embodiment of the application, S800, determining the operating state of the power device based on operating parameters, includes: Input the operating parameters into at least one of the preset device loss calculation model, thermal network model, or junction temperature estimation model to obtain the operating results. The operating results shall include at least one of the following: current, current change rate, junction temperature, and loss of the power device 400. If the operating results meet the preset conditions, the power device 400 is determined to be in the second operating state.

[0148] The preset conditions can be at least one of the following: Determination based on current amplitude: When the device current is detected to exceed a preset multiple of the rated current, which can be 1.2 times or 1.5 times, the device is determined to enter the second operating state.

[0149] Judgment based on the rate of change of current: When the rate of change of the current of the power device 400 is detected to exceed the preset threshold within the preset time window, even if the current amplitude has not yet reached the overload multiple, it can be determined that the device is about to or has already entered the thermal shock state.

[0150] Judgment based on junction temperature or loss estimation results: The controller 300 can have at least one of the following built-in models: device loss calculation model, thermal network model, or junction temperature estimation model. The collected operating parameters are input into these models to obtain the real-time power loss or junction temperature estimation value of the device. When the estimated power loss value exceeds a preset first power threshold, or the estimated junction temperature value exceeds a preset first temperature threshold, the device is determined to enter a second operating state.

[0151] Based on the determination of the converter's operating mode: When the controller 300 receives external status signals such as the converter entering the grid-type support mode, fault ride-through mode, current-limiting operation mode, or short-term overload command, it can directly determine that the device has entered the second operating state.

[0152] In this embodiment of the application, the control method further includes: During the pulse current boosting process, the operating parameters are continuously monitored, and the control strategy is adaptively adjusted according to the parameter changes; In this embodiment of the application, during the second operating state, the controller 300 does not issue a flow increase command once and then stop intervening, but continuously monitors the operating parameters of the device and the state parameters of the coolant to form a dynamic closed-loop regulation.

[0153] For example, if the device current continues to rise or the estimated junction temperature is still rising rapidly, it indicates that the current second flow rate is still insufficient to effectively suppress the temperature rise. The controller 300 can further increase the pulse duty cycle or increase the valve opening. Conversely, if the device current has begun to fall or the estimated junction temperature has leveled off, the controller 300 can appropriately reduce the pulse intensity to avoid unnecessary flow waste.

[0154] In addition, for systems equipped with accumulator 2231, controller 300 can also monitor the pressure changes in accumulator 2231 in real time. When the pressure drops to a level insufficient to maintain the target flow rate due to pulse release, auxiliary pump 221 can be started in time to release and replenish pressure simultaneously, or the opening of quick valve 222 can be adjusted to compensate for the flow rate drop caused by pressure decay.

[0155] In this embodiment of the application, the control method further includes: when the power device 400 exits the second operating state, resuming the first flow operation.

[0156] The controller 300 continuously determines whether the power device 400 has exited the second operating state. Exit conditions may include: the device current falling below a preset multiple of the rated current for a certain period of time; the estimated junction temperature falling below a preset second temperature threshold; the converter exiting special operating modes such as grid support or fault ride-through and resuming normal operation.

[0157] Figure 10 A schematic diagram of the hardware structure of the control method provided in an embodiment of this application is shown.

[0158] The control method device may include a processor 301 and a memory 302 storing computer program instructions.

[0159] Specifically, the processor 301 may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of this application.

[0160] Memory 302 may include mass storage for data or instructions. For example, and not limitingly, memory 302 may include a hard disk drive (HDD), floppy disk drive, flash memory, optical disk, magneto-optical disk, magnetic tape, or Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 302 may include removable or non-removable (or fixed) media. Where appropriate, memory 302 may be internal or external to the integrated gateway disaster recovery device. In a particular embodiment, memory 302 is non-volatile solid-state memory.

[0161] Memory may include read-only memory (ROM), random access memory (RAM), disk storage media devices, optical storage media devices, flash memory devices, and electrical, optical, or other physical / tangible memory storage devices. Therefore, typically, memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the methods according to one aspect of this disclosure.

[0162] The processor 301 implements any of the control methods described in the above embodiments by reading and executing computer program instructions stored in the memory 302.

[0163] In one example, the control device for the heat dissipation system may further include a communication interface 303 and a bus 310. For example, Figure 10 As shown, the processor 301, memory 302, and communication interface 303 are connected through bus 310 and complete communication with each other.

[0164] The communication interface 303 is mainly used to realize communication between various modules, devices, units and / or equipment in the embodiments of this application.

[0165] Bus 310 includes hardware, software, or both, that couples components of an online data traffic metering device together. For example, and not limitingly, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, bus 310 may include one or more buses. Although specific buses are described and illustrated in embodiments of this application, any suitable bus or interconnect is contemplated herein.

[0166] The control device of this heat dissipation system can execute the online data traffic billing method in this application embodiment based on currently blocked spam SMS messages and SMS messages reported by users, thereby achieving a combination of... Figure 10 The control method of the heat dissipation system is described.

[0167] Furthermore, in conjunction with the heat dissipation system control method in the above embodiments, this application embodiment can provide a computer storage medium for implementation. This computer storage medium stores computer program instructions; when these computer program instructions are executed by a processor, they implement any of the heat dissipation system control methods in the above embodiments.

[0168] This application also provides a computer program product, including a computer program, which, when executed, implements any of the heat dissipation system control methods described in the above embodiments.

[0169] It should be clarified that this application is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of this application is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of this application.

[0170] The functional blocks shown in the above block diagram can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, they can be, for example, electronic circuits, application-specific integrated circuits (ASICs), appropriate firmware, plug-ins, function cards, etc. When implemented in software, the elements of this application are programs or code segments used to perform the required tasks. Programs or code segments can be stored on a machine-readable medium or transmitted over a transmission medium or communication link via data signals carried on a carrier wave. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.

[0171] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0172] The aspects of this disclosure have been described above with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this disclosure. It should be understood that each block in the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that these instructions, executable via the processor of the computer or other programmable data processing apparatus, enable the implementation of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field-programmable logic circuit. It is also understood that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can also be implemented by special-purpose hardware performing the specified functions or actions, or can be implemented by a combination of special-purpose hardware and computer instructions.

[0173] The above are merely specific embodiments of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

Claims

1. A heat dissipation system, characterized in that, include: A liquid-cooled heat sink is used for thermal coupling with power devices and for liquid-cooled heat exchange of the power devices; A flow regulation unit is used to deliver a first flow rate of coolant to the liquid cooler when the power device is in a first operating state, and to output at least a second flow rate of coolant to the liquid cooler when the power device is in a second operating state. The controller is configured to acquire the operating parameters of the power device, determine the operating state of the power device based on the operating parameters, and, When the power device is determined to be in the second operating state, the flow regulation unit is controlled to output at least a second flow rate of coolant to the liquid cooler, wherein the second flow rate is a pulsed flow rate.

2. The heat dissipation system according to claim 1, characterized in that, The flow regulation unit includes: A rated flow subunit is provided between the coolant reservoir and the liquid-cooled radiator, and is used to deliver the first flow rate of coolant to the liquid-cooled radiator when the power device is in the first operating state. A pulse current boosting subunit is disposed between the coolant reservoir and the liquid-cooled radiator. The control terminal of the pulse current boosting subunit is connected to the controller and is used to pulse boost the coolant from the coolant reservoir to form the second flow rate of coolant and output it to the liquid-cooled radiator.

3. The heat dissipation system according to claim 2, characterized in that, The pulse current booster subunit includes an auxiliary pump and a fast valve; The input port of the auxiliary pump is connected to the output port of the coolant reservoir, the output port of the auxiliary pump is connected to the input port of the quick valve, and the output port of the quick valve is connected to the liquid-cooled radiator. The auxiliary pump is used to draw coolant from the coolant reservoir and pressurize the coolant to form the second flow rate of coolant. The quick-switching valve is used to control the coolant flow of the second flow rate into the liquid-cooled radiator in a pulsed manner.

4. The heat dissipation system according to claim 3, characterized in that, The pulse flow booster subunit also includes a liquid storage component, which is disposed between the auxiliary pump and the fast valve; The liquid storage assembly is used to store the coolant provided by the coolant reservoir through the auxiliary pump when the power device is in the first operating state, and to pre-pressurize the coolant to form the second flow rate of coolant; as well as, When the power device is in the second operating state, the coolant of the second flow rate is output to the liquid-cooled radiator through the fast valve.

5. The heat dissipation system according to claim 4, characterized in that, The liquid storage assembly includes a one-way valve and an accumulator; The inlet of the one-way valve is connected to the outlet of the auxiliary pump, and the outlet of the one-way valve is connected to the inlet of the accumulator, for conveying the coolant to the accumulator; The accumulator's output port is connected to the fast valve's input port. The accumulator is used to store the coolant and pre-pressurize the coolant to form the second flow rate of coolant. as well as, When the power device is in the second operating state, the coolant is pulsedly output to the liquid-cooled radiator at the second flow rate through the fast valve.

6. The heat dissipation system according to claim 5, characterized in that, The heat dissipation system also includes a status detection component, which is used to collect the operating parameters of the power device and the status parameters of the accumulator. The controller is configured to: receive the operating parameters transmitted by the status detection component, and determine the operating status based on the operating parameters; When it is determined that the power device is in the first operating state, the auxiliary pump is controlled to deliver the first flow rate of coolant to the accumulator based on the state parameters of the accumulator; When it is determined that the power device is in the second operating state, the fast valve is controlled to output coolant from the second flow rate stored in the accumulator to the liquid-cooled radiator.

7. The heat dissipation system according to claim 2, characterized in that, The rated flow subunit includes a main circulation pump; The main circulation pump is used to extract coolant from the coolant reservoir and, when the power device is in the first operating state, output a first flow rate of coolant to the liquid-cooled radiator.

8. The heat dissipation system according to claim 7, characterized in that, The rated flow subunit reuses the pulse flow booster subunit, and the main circulation pump is a variable speed driven main circulation pump. The main circulation pump is also used to generate the second flow rate of coolant in response to the control of the controller when the power device is in the second operating state, and to output the second flow rate of coolant to the liquid-cooled radiator.

9. The heat dissipation system according to any one of claims 1-8, characterized in that, The heat dissipation system also includes a coolant reservoir and an external radiator; The outlet of the coolant reservoir is connected to the input of the flow regulating unit for storing and supplying coolant. The external radiator is positioned between the liquid-cooled radiator and the coolant reservoir to cool the coolant from the coolant reservoir and deliver it to the coolant reservoir.

10. A control method for a heat dissipation system, characterized in that, The heat dissipation system is the heat dissipation system as described in any one of claims 1-9, comprising the following steps: Obtain the operating parameters of the power devices; Based on the operating parameters, the operating status of the power device is determined; When the operating state is determined to be the second operating state, the flow regulation unit is controlled to output at least the second flow rate of coolant to the liquid-cooled radiator; The second flow rate is a pulsed flow rate.

11. The control method for the heat dissipation system according to claim 10, characterized in that, Determining the operating status of the power device based on the operating parameters includes: The operating parameters are input into at least one of a preset device loss calculation model, thermal network model, or junction temperature estimation model to obtain the operating results. The operating results include at least one of the power device's current, current change rate, junction temperature, and loss. If the operating results meet the preset conditions, the operating state of the power device is determined to be the second operating state.

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