A high-efficiency die bonding device and process for LED lamp beads

Abstract

This invention relates to the field of LED chip die bonding, and more particularly to a high-efficiency LED chip die bonding processing device and process, comprising: a base, a mounting frame fixedly connected to the top of the base, a mounting shell fixedly connected to the bottom of the mounting frame, a mounting plate disposed at the bottom of the mounting shell, four mounting rods fixedly connected in a circular array on the outer side of the mounting plate, each mounting rod having a suction nozzle fixedly connected to its end, and a rotary lifting mechanism disposed on the mounting frame, the rotary lifting mechanism being used to drive the mounting plate to rotate and lift. This invention, by setting up a rotary lifting mechanism, a mounting plate, and four suction nozzles, enables the four suction nozzles to sequentially complete material picking, adhesive application, die bonding, and adjustment actions every 90 degrees of rotation under drive, realizing multi-station parallel continuous operation and improving die bonding efficiency.

Description

Technical Field

[0001] This invention relates to the field of LED chip die bonding technology, and in particular to an efficient LED chip die bonding processing device and process. Background Technology

[0002] LED die bonders are key equipment used in LED product packaging. They mainly pick up LED chips from wafers and precisely place them onto substrates, then achieve electrical and mechanical connections using conductive adhesive or solder. For example, invention patent application number CN202411018296.X discloses a fully automatic LED die bonder and its die bonding method, including a base. The base is surrounded by a die ring feed line, a die ring discharge line, a negative pressure balancing frame, and a support frame, with the die ring feed line and die ring discharge line arranged opposite to each other.

[0003] The above case has the following shortcomings: For example, existing LED chip die bonding devices typically involve dispensing adhesive onto the substrate. After dispensing, the adhesive droplets exhibit a non-uniform shape, thicker in the center and thinner at the edges. When the chip is pressed down, the adhesive spreads outwards under pressure. However, due to the irregular droplet shape, adhesive in some areas may reach the edges first and become trapped, causing air in other areas to be trapped under the chip and unable to escape in time, easily forming bubbles in the chip's center or edges. Therefore, this invention proposes a high-efficiency LED chip die bonding device and process to solve the above problems. Summary of the Invention

[0004] Firstly, to achieve the above objectives, the technical solution adopted by the present invention is as follows: an efficient die bonding processing device for LED lamp beads, comprising: a base, a mounting frame fixedly connected to the top of the base, a mounting shell fixedly connected to the bottom of the mounting frame, a mounting plate provided at the bottom of the mounting shell, four mounting rods fixedly connected in a circular array on the outer side of the mounting plate, a suction nozzle fixedly connected to the end of each mounting rod, and a rotary lifting mechanism provided on the mounting frame, the rotary lifting mechanism being used to drive the mounting plate to rotate and lift. The base is circumferentially arranged with a chip feeding mechanism, a chip bottom coating mechanism, a die bonding mechanism, and a nozzle adjustment mechanism. The chip bottom coating mechanism includes: A glue-coated shell is fixedly connected to the top of the base, and a guide groove is provided on the side wall of the glue-coated shell; A glue spraying cylinder, wherein a flat-shaped spray nozzle is fixedly connected to the glue discharge pipe at the top of the glue spraying cylinder, and a sliding pin is fixedly connected to the side wall of the spray nozzle, and the sliding pin is slidably connected in the guide groove. The pushing component is used to push the glue spraying cylinder along the guide groove trajectory as the nozzle enters the glue coating shell downwards, and to apply glue to the bottom surface of the chip.

[0005] Preferably, the chip bottom coating mechanism further includes: A piston plate is slidably and sealed inside a glue spraying cylinder. A connecting frame is fixedly connected to the bottom end of the piston plate. The connecting frame is slidably connected inside a glue coating shell. A first spring is fixedly connected between the connecting frame and the glue spraying cylinder. The glue spraying tube is fixedly connected to the side wall of the glue supply tube, and a first one-way valve is installed in the glue discharge tube and a second one-way valve is installed in the glue supply tube. The actuation assembly includes an actuation frame, which is fixedly connected to the side wall of the nozzle; A drive wheel is rotatably connected to the outer wall of the suction nozzle.

[0006] Preferably, the suction nozzle is provided with a chip anti-rebound component, the chip anti-rebound component comprising: A sliding rod is slidably and sealed inside the suction nozzle. A second spring is fixedly connected between the sliding rod and the suction nozzle. A positioning piece is fixedly connected to the bottom end of the sliding rod. A slot is provided on the side wall near the top of the sliding rod. A sliding frame is slidably connected to the top of a mounting rod. A third spring is fixedly connected between the sliding frame and the mounting rod. A locking block that matches the locking slot is slidably connected to the end of the sliding frame. A fourth spring is fixedly connected between the locking block and the sliding frame. A pushing mechanism is used to move the sliding frame to release the pressure of the second spring.

[0007] Preferably, the actuating mechanism includes: Mounting base, the mounting base is fixedly connected to the side wall of the sliding frame, and the mounting base is rotatably connected with ball bearings; A groove adapted to the ball bearing is formed on the outer wall of the mounting housing, corresponding to the position of the die bonding mechanism.

[0008] Preferred options also include: A branch tube is fixedly connected to the side wall of the suction nozzle, and a piston block is slidably connected inside the branch tube. The piston block and the branch tube are fixedly connected by a fifth spring. A limiting plate, one end of which is fixedly connected to the side wall of the piston block, and the other end extends close to the slide rod. A limiting ring is fixedly connected to the side wall of the slide rod above the limiting plate.

[0009] Preferably, the rotary lifting mechanism includes a drive motor, which is fixedly connected inside the mounting housing. The output shaft of the drive motor is slidably inserted into the shaft of the mounting plate. Two cylinders are symmetrically fixedly connected to the mounting housing. The bottom ends of the telescopic rods of the two cylinders are fixedly connected to mounting rings, which are rotatably connected to the top of the mounting plate.

[0010] Preferably, the chip feeding mechanism includes a second moving stage, which is located on the right side of the mounting frame and disposed at the top of the base. A mounting platform is movably disposed at the top of the second moving stage along the Y direction. A wafer carrier is rotatably connected to the top of the mounting platform. The wafer carrier is used to carry the wafer film. A stepper motor is fixedly connected to the bottom of the mounting platform. The top of the output shaft of the stepper motor is fixedly connected to the wafer carrier.

[0011] Preferably, the die bonding mechanism includes a first movable stage, which is located on the left side of the mounting frame and disposed at the top of the base. A conveyor frame is movably disposed at the top of the first movable stage along the X and Y directions. A conveyor belt is disposed inside the conveyor frame, and a positioning grid is disposed at the top of the conveyor frame for positioning the assembly substrate.

[0012] Preferably, the nozzle adjustment mechanism includes an adjustment shell, which is fixedly connected to the base, and a pin is fixedly connected inside the adjustment shell.

[0013] Secondly, the present invention also proposes a high-efficiency die bonding process for LED chips, comprising the following steps: Step 1: Using the rotating lifting mechanism, move one of the nozzles to the chip feeding mechanism position, so that the nozzle contacts and picks up a chip, and moves the chip directly above the chip bottom coating mechanism through the nozzle; Step 2: The nozzle pulls the chip into the adhesive coating shell. When the nozzle descends to the set height, it pushes the component to make the adhesive spraying tube scan along the bottom surface of the chip, so that the adhesive is evenly applied to the entire bottom surface of the chip to form a thin adhesive layer of uniform thickness. Step 3: Move the coated chip to the die bonding mechanism. Once the chip is placed on the substrate, release the suction from the nozzle. Step 4: After die bonding is completed, the nozzle is rotated to the nozzle adjustment mechanism position. The nozzle is reset and adjusted through the nozzle adjustment mechanism to prepare for picking up the next chip.

[0014] Step 5: After die bonding of all chips on the entire substrate is completed, the substrate is sent out through the die bonding mechanism to enter the next baking and curing process.

[0015] Compared with the prior art, the present invention has the following beneficial effects: This invention, by setting up a rotary lifting mechanism, a mounting plate, and four suction nozzles, enables the four suction nozzles to sequentially complete the actions of picking up materials, applying adhesive, die bonding, and adjustment every 90 degrees under drive, realizing multi-station parallel continuous operation and improving die bonding efficiency.

[0016] This invention, by setting up a coating shell, a spraying tube, a flat nozzle, a push wheel, and a push frame, allows the spraying tube to move vertically and horizontally simultaneously along a guide groove when the nozzle drives the chip down. In the vertical direction, the piston plate squeezes the glue out, and in the horizontal direction, the flat nozzle scans and coats the bottom surface of the chip, forming a thin glue layer of uniform thickness, which helps to reduce the problem of air bubbles.

[0017] This invention uses a slide bar, a positioning plate, a locking block, a sliding frame, and a ball bearing. When the chip is not in the die-bonding position, the ball bearing contacts the outer wall of the mounting housing, causing the locking block to lock the slide bar. When the chip is in the die-bonding position, the ball bearing falls into the groove to release the slide bar. The positioning plate extends under the action of a second spring and continuously presses the back of the chip, ensuring that the chip is fully attached to the substrate and preventing the chip from springing back or shifting after the suction is released from the nozzle. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 This is a schematic diagram showing the connection between the mounting bracket, mounting plate, and suction nozzle of the present invention; Figure 4 This is a schematic diagram showing the connection of the drive motor, mounting ring, and mounting plate in this invention; Figure 5 for Figure 4 Enlarged view at point B in the middle; Figure 6 This is a schematic diagram showing the connection between the nozzle, branch tube, and slide bar in this invention; Figure 7 This is a schematic diagram showing the connection between the glue spraying cylinder, piston plate, and spray head in this invention; Figure 8 This is a schematic diagram showing the connection between the adjusting shell and the ejector pin in this invention; Figure 9 This is a schematic diagram showing the connection between the conveyor frame and the first moving platform in this invention; Figure 10 This is a schematic diagram showing the connection between the second moving stage and the wafer stage in this invention; Figure 11 This is a flowchart of the die bonding process in this invention.

[0019] In the diagram: 1. Base; 2. First moving stage; 3. Conveyor frame; 4. Mounting frame; 5. Conveyor belt; 6. Positioning grid; 7. Second moving stage; 8. Mounting platform; 9. Wafer stage; 10. Stepper motor; 11. Mounting housing; 12. Groove; 13. Drive motor; 14. Cylinder; 15. Mounting ring; 16. Mounting rod; 17. Nozzle; 18. Glue coating housing; 19. Guide sloping groove; 20. Glue spraying cylinder; 2001. Spray head; 21. Sliding pin; 22. Piston plate; 23. Connecting frame; 24. First spring; 25. Glue filling tube; 26. Push frame; 27. Push wheel; 28. Sliding rod; 29. ​​Second spring; 30. Positioning piece; 31. Slot; 32. Sliding frame; 33. Third spring; 34. Locking block; 35. Fourth spring; 36. Mounting seat; 37. Ball bearing; 38. Branch pipe; 39. Piston block; 40. Fifth spring; 41. Limiting plate; 42. Limiting ring; 43. Adjusting housing; 44. Ejector pin; 45. Mounting plate. Detailed Implementation

[0020] The following description is intended to disclose the invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art.

[0021] Firstly, such as Figures 1 to 10 As shown, this embodiment proposes a high-efficiency die bonding processing device for LED lamp beads, including: The base 1 has a mounting frame 4 fixedly connected to its top end, a mounting shell 11 fixedly connected to its bottom end, a mounting plate 45 provided at the bottom end of the mounting shell 11, and four mounting rods 16 fixedly connected in a ring array on the outer side of the mounting plate 45. Each mounting rod 16 is fixedly connected to a suction nozzle 17 at its end. The mounting frame 4 is equipped with a rotary lifting mechanism, which is used to drive the mounting plate 45 to rotate and lift. The rotary lifting mechanism includes a drive motor 13, which is fixedly connected inside the mounting housing 11. The output shaft of the drive motor 13 is slidably inserted into the shaft of the mounting plate 45. Two cylinders 14 are symmetrically fixedly connected to the mounting housing 11. The bottom end of the telescopic rod of the two cylinders 14 is fixedly connected to a mounting ring 15, which is rotatably connected to the top of the mounting plate 45. The top of the base 1 is annularly arranged with a chip feeding mechanism, a chip bottom surface adhesive coating mechanism, a die bonding mechanism, and a nozzle adjustment mechanism. The chip bottom surface adhesive coating mechanism includes: The adhesive shell 18 is fixedly connected to the top of the base 1, and a guide groove 19 is provided on the side wall of the adhesive shell 18. The glue spraying tube 20 has a glue discharge pipe at the top of the glue spraying tube 20 with a flat nozzle 2001 fixedly connected to it. The side wall of the nozzle 2001 is fixedly connected with a sliding pin 21, which is slidably connected in the guide groove 19. As the nozzle 17 descends into the adhesive coating housing 18, the pushing component is used to push the adhesive spraying cylinder 20 along the trajectory of the guide groove 19 and apply adhesive to the bottom surface of the chip. The chip bottom coating mechanism also includes: Piston plate 22 is slidably connected to the glue spraying cylinder 20. A connecting frame 23 is fixedly connected to the bottom end of piston plate 22. The connecting frame 23 is slidably connected to the glue coating shell 18. A first spring 24 is fixedly connected between the connecting frame 23 and the glue spraying cylinder 20. The glue spraying tube 20 is fixedly connected to the side wall of the glue supply tube 25. A first check valve is installed in the glue discharge tube and a second check valve is installed in the glue supply tube 25. The actuation assembly includes an actuation frame 26, which is fixedly connected to the side wall of the nozzle 2001; The push wheel 27 is rotatably connected to the outer wall of the suction nozzle 17; Existing LED chip bonding devices typically involve dispensing adhesive onto a substrate. After dispensing, the adhesive droplets often exhibit a non-uniform shape, thicker in the center and thinner at the edges. When the chip is pressed down, the adhesive spreads outwards under pressure. However, due to the irregular shape of the droplets, some areas may reach the edges first and become sealed, causing air in other areas to be trapped under the chip and unable to be expelled in time. This can easily lead to the formation of air bubbles in the center or edges of the chip. This technical solution can solve the above problems. The specific operation is as follows: First, the substrate and wafer film to be assembled are placed on the die bonding mechanism and the chip feeding mechanism respectively (by manual means or by a robotic arm). Then, the drive motor 13 is started, which drives the mounting plate 45 to rotate, so that one of the suction nozzles 17 moves above the wafer film. Then, the telescopic rods of the two cylinders 14 extend synchronously, pushing the mounting ring 15 and the mounting plate 45 to descend, so that the suction nozzle 17 contacts and picks up a chip. Then, the telescopic rods of the cylinders 14 retract, so that the suction nozzle 17 carries the chip to a safe height. Next, the drive motor 13 rotates the mounting plate 45, turning the nozzle 17 with the chip to the top of the chip bottom coating mechanism. Then, the cylinder 14 drives the mounting plate 45 to descend, causing the nozzle 17 to carry the chip into the coating shell 18. When the nozzle 17 descends to the set height, there is a small gap between the bottom of the chip and the nozzle 2001. At the same time, the push wheel 27 on the outer wall of the nozzle 17 contacts and presses down the push frame 26 on the side wall of the nozzle 2001, so that the push frame 26 drives the entire glue spraying cylinder 20 to move along the guide groove 19 on the side wall of the coating shell 18. Driven by the guide chute 19, the movement of the glue spraying cylinder 20 can be divided into horizontal and vertical movements: During the vertical movement of the glue spraying cylinder 20, the connecting frame 23 inside the glue spraying cylinder 20 moves relative to the glue spraying cylinder 20 in the vertical direction, causing the glue spraying cylinder 20 and the piston plate 22 to move relative to each other. The piston plate 22 squeezes the glue, the first one-way valve opens (the second one-way valve closes), and the glue flows out evenly from the flat nozzle 2001, and the first spring 24 is compressed. During the horizontal movement of the glue spraying cylinder 20, the flat nozzle 2001 scans and moves the bottom surface of the chip, which helps to evenly coat the entire bottom surface of the chip with glue and form a thin glue layer of uniform thickness. After the glue application is completed, the cylinder 14 retracts, and the suction nozzle 17 lifts the chip with the uniform glue layer already applied to its bottom surface. The push wheel 27 disengages from the push frame 26, the first spring 24 rebounds, and drives the glue spraying cylinder 20 to move in the opposite direction and reset along the guide groove 19. This causes the piston plate 22 to move in the opposite direction relative to the glue spraying cylinder 20, creating a negative pressure inside the glue spraying cylinder 20. The second one-way valve opens (the first one-way valve closes), and new glue is drawn in through the glue replenishment tube 25 to prepare for the next glue application. Then, the drive motor 13 rotates the chip coated with glue to the top of the die bonding mechanism, the cylinder 14 extends, and the suction nozzle 17 descends to press the chip onto the substrate. Since there is already a uniform glue layer on the bottom surface of the chip, the glue directly adheres to the substrate during pressing, which helps to reduce the formation of closed air bubbles due to irregular glue droplet shape. After the chip installation is completed, the drive motor 13 moves the nozzle 17 to the nozzle adjustment mechanism to reset and adjust the nozzle 17. After the adjustment is completed, the nozzle 17 enters the next feeding cycle. Because the four nozzles 17 are driven by the rotary lifting mechanism, they can complete the placement of a chip every 90 degrees. Compared with the traditional swing arm placement, the swing amplitude is smaller, which helps to improve placement efficiency.

[0022] As a further embodiment of the present invention, a chip anti-rebound component is provided inside the suction nozzle 17, the chip anti-rebound component comprising: The slide rod 28 is slidably connected to the suction nozzle 17. A second spring 29 is fixedly connected between the slide rod 28 and the suction nozzle 17. A positioning piece 30 is fixedly connected to the bottom end of the slide rod 28. A slot 31 is opened on the side wall of the slide rod 28 near the top end. The sliding frame 32 is slidably connected to the top of the mounting rod 16. A third spring 33 is fixedly connected between the sliding frame 32 and the mounting rod 16. A locking block 34 that matches the locking groove 31 is slidably connected to the end of the sliding frame 32. A fourth spring 35 is fixedly connected between the locking block 34 and the sliding frame 32. A pushing mechanism is used to move the sliding frame 32 to release the pressure of the second spring 29; The driving organizations include: Mounting base 36 is fixedly connected to the side wall of sliding frame 32, and ball bearings 37 are rolled inside the mounting base 36. A groove 12 adapted to the ball 37 is provided on the outer wall of the mounting shell 11, corresponding to the position of the die bonding mechanism. Specifically, in the non-die-bonded position, the ball bearing 37 is always in contact with the outer wall of the mounting housing 11. Therefore, the retaining block 34 is always inserted into the retaining groove 31 of the slide bar 28, and the slide bar 28 is locked in the retracted state. The positioning piece 30 is close to the inner top of the nozzle 17 and does not contact the back of the chip. When the suction nozzle 17 rotates the chip to the die-bonding position, the cylinder 14 drives the suction nozzle 17 to descend with the chip. When the suction nozzle 17 descends close to the substrate, the ball bearing 37 leaves the outer wall of the mounting housing 11 and enters the groove 12. At this time, the sliding frame 32 moves under the action of the third spring 33, causing the locking block 34 to disengage from the locking slot 31, thus releasing the limit on the sliding rod 28. After the sliding rod 28 is released, it moves downward under the action of the second spring 29, and the positioning piece 30 extends from the suction nozzle 17, pressing down on the back of the chip. When the suction force of the suction nozzle 17 is released, the chip is... The positioning piece 30 is pressed onto the substrate. Since the positioning piece 30 always applies a downward pressure to the chip through the second spring 29, this helps to ensure that the chip is in full contact with the substrate, ensuring that the adhesive layer fully wets the substrate surface for die bonding. On the other hand, as the nozzle 17 moves upward, the second spring 29 continues to release pressure, allowing the positioning piece 30 to continuously press the chip for a period of time until the nozzle 17 is completely away from the chip surface. This avoids the chip from rebounding due to the residual suction in the nozzle 17, which could lead to air entry or even chip displacement.

[0023] As a further embodiment of the present invention, the nozzle adjustment mechanism includes an adjustment shell 43, which is fixedly connected to the base 1. A pin 44 is fixedly connected inside the adjustment shell 43. Specifically, after the chip is installed, the cylinder 14 drives the mounting plate 45 to move upward, so that the ball 37 re-contacts the side wall of the mounting shell 11 from the groove 12. The sliding frame 32 moves, so that the locking block 34 contacts the side wall of the slide rod 28 and is squeezed, causing the locking block 34 to retract into the sliding frame 32. After the mounting plate 45 moves the nozzle 17 above the adjustment shell 43, the cylinder 14 drives the mounting plate 45 and the nozzle 17 to move downward, so that the pin 44 contacts and squeezes the positioning piece 30, causing the slide rod 28 to move upward. The second spring 29 is compressed until the slot 31 moves to the position of the locking block 34. Under the action of the fourth spring 35, the locking block 34 extends and re-engages with the slot 31, completing the adjustment of the nozzle 17.

[0024] As a further embodiment of the present invention, it also includes: Branch tube 38 is fixedly connected to the side wall of suction nozzle 17. A piston block 39 is slidably connected inside the branch tube 38. A fifth spring 40 is fixedly connected between the piston block 39 and the branch tube 38. Limiting plate 41, one end of which is fixedly connected to the side wall of piston block 39, and the other end extends close to slide rod 28. Limiting ring 42 is fixedly connected above limiting plate 41 on the circumferential surface of slide rod 28. Specifically, by setting the piston block 39 and the limiting plate 41, when the suction nozzle 17 is activated, a negative pressure is generated inside the suction nozzle 17, causing the chip to be sucked up. At this time, under the action of the negative pressure, the piston block 39 moves along the branch tube 38, and the fifth spring 40 generates elastic force. During the process of the piston block 39 moving along the branch tube 38, the limiting plate 41 moves synchronously, so that the limiting plate 41 moves directly below the limiting ring 42. When the ball 37 moves to the groove 12 and releases the limiting of the slide rod 28, the slide rod 28 cannot move downward under the restriction of the limiting plate 41 until the suction nozzle 17 completely places the chip on the substrate and cancels the suction. At this time, the negative pressure inside the suction nozzle 17 disappears, and the piston block 39 moves back to its original position under the action of the fifth spring 40, so that the limiting plate 41 moves away from the limiting ring 42. At this time, the slide rod 28 moves downward, so that the positioning piece 30 presses the chip, ensuring the stability of the chip position.

[0025] As a further embodiment of the present invention, the chip feeding mechanism includes a second moving stage 7, which is located on the right side of the mounting frame 4 and is set at the top of the base 1. A mounting stage 8 is movably set at the top of the second moving stage 7 along the Y direction. A wafer carrier 9 is rotatably connected to the top of the mounting stage 8. The wafer carrier 9 is used to carry the wafer film. A stepper motor 10 is fixedly connected to the bottom of the mounting stage 8. The top of the output shaft of the stepper motor 10 is fixedly connected to the wafer carrier 9. Specifically, by setting up the wafer stage 9, during the process of picking up the chip by the nozzle 17, the chip to be picked up is moved directly below the nozzle 17 in real time by the action of the second moving stage 7 and the stepper motor 10.

[0026] As a further embodiment of the present invention, the die bonding mechanism includes a first movable stage 2, which is located on the left side of the mounting frame 4 and is set at the top of the base 1. A conveyor frame 3 is movably arranged at the top of the first movable stage 2 along the X and Y directions. A conveyor belt 5 is arranged inside the conveyor frame 3, and a positioning grid 6 is arranged at the top of the conveyor frame 3 for positioning the assembly substrate. Specifically, by setting up a conveyor table, during the chip assembly process, the position of the conveyor frame 3 is adjusted by the first moving table 2, so that the position to be assembled is adjusted to be directly below the nozzle 17 in a timely manner.

[0027] It should be noted that the first moving stage 2 and the second moving stage 7 are coordinated by guide rails, lead screws, and servo motors to adjust the position of the conveyor frame 3 and the mounting platform 8.

[0028] like Figure 11 As shown, this embodiment also proposes a high-efficiency die bonding process for LED chips, including the following steps: Step 1: Using the rotating lifting mechanism, move one of the nozzles 17 to the chip feeding mechanism position, so that the nozzle 17 contacts and picks up a chip, and moves the chip directly above the chip bottom coating mechanism through the nozzle 17. Step 2: The suction nozzle 17 drives the chip into the adhesive coating shell 18. When the suction nozzle 17 descends to the set height, the adhesive spraying tube 20 is pushed to scan along the bottom surface of the chip, so that the adhesive is evenly applied to the entire bottom surface of the chip to form a thin adhesive layer of uniform thickness. Step 3: Move the coated chip to the die bonding mechanism. Once the chip is placed on the substrate, release the suction of nozzle 17. Step 4: After die bonding is completed, the nozzle 17 is rotated to the nozzle adjustment mechanism position. The nozzle 17 is reset and adjusted by the nozzle adjustment mechanism to prepare for picking up the next chip. Step 5: After die bonding of all chips on the entire substrate is completed, the substrate is sent out through the die bonding mechanism to enter the next baking and curing process.

[0029] The working principle of this invention is as follows: Start the drive motor 13 to drive the mounting plate 45 to rotate, so that one of the suction nozzles 17 moves to the top of the wafer stage 9 in the chip feeding mechanism. The telescopic rods of the two cylinders 14 extend synchronously, pushing the mounting ring 15 and the mounting plate 45 to descend, so that the suction nozzle 17 contacts and picks up a chip. Then the cylinders 14 retract, so that the suction nozzle 17 carries the chip to a safe height. The drive motor 13 rotates the mounting plate 45 again, so that the suction nozzle 17 is rotated to the top of the chip bottom coating mechanism. Cylinder 14 drives mounting plate 45 to descend, and nozzle 17 pulls the chip into the coating shell 18. When nozzle 17 descends to the set height, a small gap remains between the bottom surface of the chip and the flat nozzle 2001. At the same time, push wheel 27 on the outer wall of nozzle 17 contacts and presses down push frame 26 on the side wall of nozzle 2001. Push frame 26 drives the entire glue spraying cylinder 20 to move along guide groove 19 on the side wall of coating shell 18. Driven by guide groove 19, glue spraying cylinder 20 moves both vertically and horizontally: during vertical movement, glue spraying cylinder 20 and piston plate 22 are relative to each other. As the chip moves horizontally, the piston plate 22 squeezes the glue, the first one-way valve opens, and the glue flows out evenly from the flat nozzle 2001. During horizontal movement, the flat nozzle 2001 scans the bottom surface of the chip, evenly coating the entire bottom surface of the chip with glue to form a thin glue layer of uniform thickness. After the glue coating is completed, the cylinder 14 retracts, the suction nozzle 17 drives the chip to rise, the push wheel 27 disengages from the push frame 26, the first spring 24 rebounds, the glue spraying cylinder 20 resets in the reverse direction, the piston plate 22 moves in the opposite direction to generate negative pressure inside the glue spraying cylinder 20, the second one-way valve opens, and new glue is sucked in through the glue replenishment tube 25, completing one glue coating cycle. The drive motor 13 rotates the glued chip to the top of the die bonding mechanism. The cylinder 14 extends, and the suction nozzle 17 descends to press the chip onto the substrate. During the pressing process, the chip anti-rebound component works: when not in the die bonding position, the ball bearing 37 contacts the outer wall of the mounting shell 11, the locking block 34 inserts into the slot 31 of the slide bar 28, the slide bar 28 is locked, and the positioning piece 30 retracts. When the suction nozzle 17 rotates to the die bonding position and descends close to the substrate, the ball bearing 37 enters the groove 12, the sliding frame 32 moves under the action of the third spring 33, the locking block 34 disengages from the slot 31, and after the suction of the suction nozzle 17 is released, the slide bar 28 is released and moves downward under the action of the second spring 29. The positioning piece 30 extends out from the suction nozzle 17 and presses the back of the chip, pressing the chip to ensure that the glue layer is fully adhered and the chip does not shift. When the suction nozzle 17 rises, the second spring 29 continues to release, keeping the positioning piece 30 pressed until the suction nozzle 17 moves away, preventing the chip from rebounding. After die bonding is completed, the drive motor 13 rotates the nozzle 17 above the nozzle adjustment mechanism. The cylinder 14 drives the nozzle 17 to descend. The ejector pin 44 in the adjustment housing 43 contacts and presses against the positioning plate 30, pushing the slide bar 28 to move upward. The second spring 29 is compressed until the slot 31 moves to the position of the block 34. The block 34 is re-engaged into the slot 31 under the action of the fourth spring 35, completing the reset and adjustment of the slide bar 28 in the nozzle 17. Then the nozzle 17 enters the next round of material picking cycle. Driven by the rotation and lifting mechanism, the four nozzles 17 can complete the complete placement of one chip every ninety degrees of rotation, achieving efficient and continuous operation.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A high-efficiency die bonding processing device for LED lamp beads, characterized in that, include: A base (1) is fixedly connected to a mounting frame (4) at its top end. A mounting shell (11) is fixedly connected to the bottom end of the mounting frame (4). A mounting plate (45) is provided at the bottom end of the mounting shell (11). Four mounting rods (16) are fixedly connected to the outer side of the mounting plate (45) in a circular array. A suction nozzle (17) is fixedly connected to the end of each mounting rod (16). A rotating lifting mechanism is provided on the mounting frame (4). The rotating lifting mechanism is used to drive the mounting plate (45) to rotate and lift. The base (1) is provided with a chip feeding mechanism, a chip bottom coating mechanism, a die bonding mechanism, and a nozzle adjustment mechanism along a ring at its top. The chip bottom coating mechanism includes: The adhesive shell (18) is fixedly connected to the top of the base (1), and a guide groove (19) is provided on the side wall of the adhesive shell (18). The glue spraying cylinder (20) has a glue discharge pipe at the top of the glue spraying cylinder (20) with a flat nozzle (2001) fixedly connected to it. The nozzle (2001) has a sliding pin (21) fixedly connected to its side wall. The sliding pin (21) is slidably connected in the guide groove (19). As the nozzle (17) moves downward into the adhesive coating shell (18), the pushing component is used to push the adhesive spraying tube (20) along the trajectory of the guide groove (19) and apply adhesive to the bottom surface of the chip.

2. The high-efficiency die bonding processing device for LED lamp beads according to claim 1, characterized in that, The chip bottom surface adhesive coating mechanism also includes: Piston plate (22), the piston plate (22) is slidably connected in the glue spraying cylinder (20), the bottom end of the piston plate (22) is fixedly connected to a connecting frame (23), the connecting frame (23) is slidably connected in the glue coating shell (18), and a first spring (24) is fixedly connected between the connecting frame (23) and the glue spraying cylinder (20). The glue spraying tube (20) is fixedly connected to the side wall of the glue supply tube (25), and a first one-way valve is provided in the glue discharge tube and a second one-way valve is provided in the glue supply tube (25). The pushing assembly includes a pushing frame (26), which is fixedly connected to the side wall of the nozzle (2001); A drive wheel (27) is rotatably connected to the outer wall of the suction nozzle (17).

3. The high-efficiency die bonding processing device for LED lamp beads according to claim 2, characterized in that, The suction nozzle (17) is provided with a chip anti-rebound component, which includes: The slide rod (28) is sealed and slidably connected inside the suction nozzle (17). A second spring (29) is fixedly connected between the slide rod (28) and the suction nozzle (17). A positioning piece (30) is fixedly connected to the bottom end of the slide rod (28). A slot (31) is provided on the side wall near the top of the slide rod (28). A sliding frame (32) is slidably connected to the top of the mounting rod (16). A third spring (33) is fixedly connected between the sliding frame (32) and the mounting rod (16). A locking block (34) that matches the locking slot (31) is slidably connected to the end of the sliding frame (32). A fourth spring (35) is fixedly connected between the locking block (34) and the sliding frame (32). A pushing mechanism is used to move the sliding frame (32) to release the pressure of the second spring (29).

4. The high-efficiency die bonding processing device for LED lamp beads according to claim 3, characterized in that, The propulsion mechanism includes: Mounting base (36), which is fixedly connected to the side wall of sliding frame (32), and a ball bearing (37) is rotatably connected inside the mounting base (36). A groove (12) adapted to the ball (37) is provided on the outer wall of the mounting shell (11) corresponding to the die bonding mechanism position.

5. The high-efficiency die bonding processing device for LED lamp beads according to claim 4, characterized in that, Also includes: Branch pipe (38), the branch pipe (38) is fixedly connected to the side wall of the suction nozzle (17), a piston block (39) is sealed and slidably connected inside the branch pipe (38), and a fifth spring (40) is fixedly connected between the piston block (39) and the branch pipe (38). A limiting plate (41) is fixedly connected at one end to the side wall of the piston block (39), and at the other end extends close to the slide rod (28). A limiting ring (42) is fixedly connected above the limiting plate (41) to the side wall of the slide rod (28).

6. The high-efficiency die bonding processing device for LED lamp beads according to claim 4, characterized in that, The rotary lifting mechanism includes a drive motor (13), which is fixedly connected inside the mounting housing (11). The output shaft of the drive motor (13) is slidably inserted into the shaft of the mounting plate (45). Two cylinders (14) are symmetrically fixedly connected on the mounting housing (11). The bottom ends of the telescopic rods of the two cylinders (14) are fixedly connected to mounting rings (15), which are rotatably connected to the top of the mounting plate (45).

7. The high-efficiency die bonding processing device for LED lamp beads according to claim 1, characterized in that, The chip feeding mechanism includes a second moving stage (7), which is located on the right side of the mounting frame (4) and set at the top of the base (1). A mounting stage (8) is movably set at the top of the second moving stage (7) along the Y direction. A wafer carrier (9) is rotatably connected to the top of the mounting stage (8). The wafer carrier (9) is used to carry the wafer film. A stepper motor (10) is fixedly connected to the bottom of the mounting stage (8). The top of the output shaft of the stepper motor (10) is fixedly connected to the wafer carrier (9).

8. The high-efficiency die bonding processing device for LED lamp beads according to claim 1, characterized in that, The die bonding mechanism includes a first moving stage (2), which is located on the left side of the mounting frame (4) and set at the top of the base (1). A conveyor frame (3) is movably arranged at the top of the first moving stage (2) along the X and Y directions. A conveyor belt (5) is arranged inside the conveyor frame (3). A positioning grid (6) is arranged at the top of the conveyor frame (3) for positioning and assembling the substrate.

9. The high-efficiency die bonding processing device for LED lamp beads according to claim 4, characterized in that, The nozzle adjustment mechanism includes an adjustment shell (43), which is fixedly connected to the base (1), and a pin (44) is fixedly connected inside the adjustment shell (43).

10. A high-efficiency die bonding process for LED chips, applicable to the high-efficiency die bonding processing apparatus for LED chips as described in any one of claims 1-9, characterized in that, Includes the following steps: Step 1: Move one of the suction nozzles (17) to the chip feeding mechanism position by rotating the lifting mechanism, so that the suction nozzle (17) contacts and picks up a chip, and moves the chip to the top of the chip bottom coating mechanism through the suction nozzle (17); Step 2: The suction nozzle (17) drives the chip into the adhesive shell (18). When the suction nozzle (17) descends to the set height, the adhesive spraying tube (20) is pushed to scan along the bottom surface of the chip, so that the adhesive is evenly applied to the entire bottom surface of the chip to form a thin adhesive layer of uniform thickness. Step 3: Move the coated chip to the die bonding mechanism. Once the chip is placed on the substrate, cancel the suction of the nozzle (17). Step 4: After die bonding is completed, the nozzle (17) is rotated to the nozzle adjustment mechanism position. The nozzle (17) is reset and adjusted by the nozzle adjustment mechanism to prepare for picking up the next chip. Step 5: After die bonding of all chips on the entire substrate is completed, the substrate is sent out through the die bonding mechanism to enter the next baking and curing process.

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