Display module and display device

Abstract

This application discloses a display module and a display device. The display module includes a display panel and a circuit board. The display panel includes a display area and a non-display area, with the non-display area at least partially surrounding the display area. The non-display area includes a pad area, which includes a plurality of first panel pads, and the circuit board includes a plurality of first circuit board pads. The display module also includes conductive connection structures that electrically connect the first panel pads and the first circuit board pads. In this application, signal transmission between the first panel pads and the first circuit board pads is achieved through conductive connection structures, ensuring a simple electrical connection method between the first panel pads and the first circuit board pads.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the continuous development of display technology, display modules are increasingly widely used in portable electronic products such as smartphones and smart wearable devices. In these electronic devices, the display panel in the display module usually needs to establish a signal connection with the circuit board to realize the transmission of display signals. In the existing technology, the electrical connection between the circuit board and the display panel in the display module is relatively complex and requires high process precision. Summary of the Invention

[0003] This application provides a display module and a display device that ensures a simple electrical connection between the panel pads in the display panel and the circuit board pads in the circuit board.

[0004] According to one aspect of this application, a display module is provided, including a display panel and a circuit board; The display panel includes a display area and a non-display area, wherein the non-display area at least partially surrounds the display area; The non-display area includes a pad area, the pad area includes a plurality of first panel pads, and the circuit board includes a plurality of first circuit board pads; The display module further includes a conductive connection structure, which electrically connects the first panel pad and the first circuit board pad respectively.

[0005] According to another aspect of this application, a display device is provided, including the above-described display module.

[0006] In summary, the display module provided in this application includes a display panel and a circuit board. The display panel includes a display area and a non-display area, with the non-display area surrounding at least a portion of the display area. The pad area of ​​the non-display area includes multiple first panel pads, and the circuit board includes multiple first circuit board pads. Unlike the method of bonding and electrically connecting panel pads and circuit board pads in related technologies, in this application embodiment, the first circuit board pads and the first panel pads are electrically connected through a conductive connection structure. Thus, when implementing the electrical connection between the first panel pads and the first circuit board pads, it is not necessary to align the first panel pads and the first circuit board pads in the thickness direction of the display module. Instead, the first panel pads and the first circuit board pads are electrically connected through a conductive connection structure, ensuring a simple electrical connection method. Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of this application; Figure 2 This is a schematic diagram of another display module provided in an embodiment of this application; Figure 3 This is a schematic diagram of a non-display area provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of another display module provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of another display module provided in the embodiments of this application; Figure 6 yes Figure 5 An enlarged schematic diagram of region A in the middle; Figure 7 yes Figure 5 A schematic diagram of a cross-section along the B-B' direction; Figure 8 yes Figure 5 Another cross-sectional diagram along the B-B' direction; Figure 9 yes Figure 2 A schematic diagram of a cross-section along the C-C' direction; Figure 10 This is a schematic diagram of the structure of another display module provided in the embodiments of this application; Figure 11 yes Figure 10 An enlarged schematic diagram of region C in the middle; Figure 12 yes Figure 10 A schematic diagram of a cross-section along the D-D' direction; Figure 13 yes Figure 10 Another cross-sectional diagram along the D-D' direction; Figure 14 This is a schematic diagram illustrating the connection between a first panel pad and a first circuit board pad, provided in an embodiment of this application. Figure 15 This is another schematic diagram showing the connection between the first panel pad and the first circuit board pad provided in an embodiment of this application; Figure 16 This is a schematic diagram of the structure of another display module provided in the embodiments of this application; Figure 17 This is a schematic diagram of the structure of another display module provided in the embodiments of this application; Figure 18 yes Figure 17 An enlarged schematic diagram of region E in the middle; Figure 19 yes Figure 17 An enlarged schematic diagram of region F in the middle; Figure 20 yes Figure 5 Another enlarged schematic diagram of region A in the middle; Figure 21 yes Figure 5 Another cross-sectional diagram along the B-B' direction; Figure 22 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0009] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0010] Furthermore, the terms "first," "second," and similar words used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, terms such as "an," "one," or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. Terms such as "including" or "comprising" mean that the element or object preceding the word encompasses the element or object listed after the word and its equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly. In addition, the descriptions of "same" and "equal" involved in the embodiments of this application do not mean that two objects are completely equal in size or shape; they are allowed to be approximately the same or approximately equal within a certain error range. It should be noted that the implementation methods provided in the embodiments of this application can be combined with each other without contradiction.

[0011] Figure 1This is a schematic diagram of the structure of a display module provided in an embodiment of this application, specifically a schematic diagram of the display area and non-display area in an unfolded state. Figure 2 This is a schematic diagram of another display module provided in the embodiments of this application, specifically a schematic diagram of a non-display area bent to the non-light-emitting side of the display panel. Figure 3 This is a schematic diagram of a non-display area provided in an embodiment of this application. For example... Figures 1-3 As shown, the display module includes a display panel 10 and a circuit board 20. The display panel 10 includes a display area AA and a non-display area BB, with the non-display area BB at least partially surrounding the display area AA. The non-display area BB includes a pad area CC, which includes a plurality of first panel pads 110. The circuit board 20 includes a plurality of first circuit board pads 210. The display module also includes a conductive connection structure 30, which electrically connects the first panel pads 110 and the first circuit board pads 210, respectively.

[0012] Specifically, such as Figure 1 As shown, the display module includes a display area AA and a non-display area BB, with the non-display area BB at least partially surrounding the display area AA. The display area AA may include multiple sub-pixels and multiple display signal lines; each sub-pixel may include an electrically connected light-emitting element and pixel circuitry. Furthermore, the light-emitting element may include light-emitting elements of different colors, such as at least one of red, green, blue, or white light-emitting elements, to achieve a color display effect on the display panel. Moreover, the light-emitting element may be an organic light-emitting diode (OLED), a micro-OLED, or a micro-LED. Taking an OLED as an example, the light-emitting element may include a first electrode, a second electrode, and an organic compound layer located between the first and second electrodes. The organic compound layer may include a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, an electron transport layer, a hole blocking layer, and an electron injection layer, but is not limited thereto. Alternatively, the organic compound layer may also include a charge-generating layer, such as a P-type charge-generating layer and an N-type charge-generating layer. When a voltage is applied to the first and second electrodes of an organic light-emitting diode (OLED), holes passing through the hole transport layer and electrons passing through the electron transport layer move to the light-emitting layer to form excitons, causing visible light to be emitted from the light-emitting layer. The pixel circuit may include a driving transistor supplying current to the light-emitting element, one or more switching transistors switching the current path between the driving transistor and the light-emitting element, and a capacitor maintaining the voltage between the gate and source of the driving transistor. The pixel circuit may, for example, be a "2T1C", "7T1C", or "8T1C" structure, where "T" represents a transistor and "C" represents a capacitor. The display signal lines may include, for example, at least one of scan signal lines and data signal lines.

[0013] The non-display area BB surrounds a portion of the display area AA, and this portion of the non-display area BB can be bent to the non-light-emitting side of the display panel 10. Thus, when viewed from the light-emitting side of the display panel, at least a portion of the non-display area BB is not visible, and the vast majority or all of the display panel is the display area AA. This increases the screen-to-body ratio of the display panel. For example, as... Figure 1 and Figure 2 The display module shown has its non-display area BB located to the left and below the display area AA, which can be bent to the non-light-emitting side of the display panel 10, ensuring a good screen-to-body ratio. It should be noted that... Figure 1 and Figure 2 This description uses the example of bending the non-display area BB located on the left and bottom sides of the display area AA to the non-light-emitting side of the display panel 10, but it is not a limitation. In other embodiments, the non-display area BB located on the right and bottom sides of the display area AA can also be bent to the non-light-emitting side of the display panel 10, or the non-display areas BB located on the left, right, and bottom sides of the display area AA can be bent to the non-light-emitting side of the display panel 10, or all the non-display areas BB located on the left, right, top, and bottom sides of the display area AA can be bent to the non-light-emitting side of the display panel 10. This application does not impose any limitations on this, and those skilled in the art can make the desired configuration.

[0014] In addition, see also Figure 2 The non-display area BB includes a pad area CC, which includes multiple first panel pads 110. The circuit board 20 includes multiple first circuit board pads 210. Both the first panel pads 110 and the first circuit board pads 210 are connection pads used to realize signal transmission. For example, the first panel pads 110 can be electrically connected to some display signal lines located in the display area AA and / or in the non-display area BB; the circuit board 20 is electrically connected to the first panel pads 110 through the multiple first circuit board pads 210, realizing signal interaction between the display panel 10 and the circuit board 20. In related technologies, multiple circuit board pads in the circuit board and multiple panel pads in the display panel are usually overlapped, and the circuit board pads and panel pads are arranged face-to-face, and the bonding electrical connection between the circuit board pads and panel pads is realized by anisotropic conductive adhesive between the circuit board pads and panel pads. In the above connection methods, it is usually necessary to align the circuit board pads and the panel pads in the thickness direction of the display module to ensure the electrical connection between them. However, aligning the first circuit board pads and the first panel pads in the thickness direction of the display module is quite difficult, which increases the difficulty of electrical connection.

[0015] Therefore, the solution in this application embodiment adjusts the arrangement and connection method of the first panel pad 110 and the first circuit board pad 210 to reduce the difficulty of electrical connection between the first panel pad 110 and the first circuit board pad 210. For example, as... Figure 3 As shown, the display panel 10 also includes a panel substrate 40, which includes a pad area panel substrate 410 located in the pad area CC. A first panel pad 110 is disposed on the pad area panel substrate 410. The circuit board 20 includes a circuit board substrate 50, and a first circuit board pad 210 is disposed on the circuit board substrate 50. When the non-display area BB is not bent, both the first panel pad 110 and the first circuit board pad 210 are located on the light-emitting side surface of the display panel, so that both the first panel pad 110 and the first circuit board pad 210 are exposed at least partially at the connection position. When the non-display area BB is bent to the non-light-emitting side of the display panel 10, the first panel pad 110 is located on the side of the pad area panel substrate 410 away from the light-emitting side, and the first circuit board pad 210 is located on the side of the pad area panel substrate 50 away from the light-emitting side, and both the first panel pad 110 and the first circuit board pad 210 are exposed on the non-light-emitting side of the display panel. Based on this, in the technical solution of this application embodiment, the first panel pad 110 and the first circuit board pad 210 are electrically connected by the conductive connection structure 30, without the need to align the first panel pad 110 and the first circuit board pad 210 in the thickness direction of the display panel, thus ensuring that the electrical connection method of the first panel pad 110 and the first circuit board pad 210 is simple.

[0016] In summary, in this embodiment, when the non-display area is in a flat state, both the first panel pad and the first circuit board pad are located on the light-emitting side of the display panel. When the non-display area is bent to the non-light-emitting side of the display panel, the first panel pad is located on the side of the panel substrate in the pad area away from the light-emitting side, and the first circuit board pad is located on the side of the panel substrate in the pad area away from the light-emitting side, and both the first panel pad and the first circuit board pad are exposed on the non-light-emitting side of the display panel. The first panel pad and the first circuit board pad are electrically connected through a conductive connection structure, which means that it is not necessary to align the first panel pad and the first circuit board pad in the thickness direction of the display panel, ensuring a simple electrical connection method for the first panel pad and the first circuit board pad.

[0017] Optional, see below Figure 3 Along the thickness direction of the display module, the first panel pad 110 and the first circuit board pad 210 do not overlap.

[0018] Specifically, such as Figure 3As shown, along the thickness direction of the display module, the first panel pad 110 and the first circuit board pad 210 do not overlap, thus both the first panel pad 110 and the first circuit board pad 210 have a large exposed area. The conductive connection structure 30 at least partially overlaps with the first panel pad 110 and the first circuit board pad 210, thereby enabling signal transmission between the first panel pad 110 and the first circuit board pad 210 through the conductive connection structure 30. Furthermore, by setting the overlap area between the conductive connection structure 30 and the first panel pad 110 and the first circuit board pad 210 to be large along the thickness direction of the display module, the stability of the electrical connection between the first panel pad 110 and the conductive connection structure 30, as well as the stability of the electrical connection between the first circuit board pad 210 and the conductive connection structure 30, can be improved, and it is also beneficial to achieve low-impedance conduction between the first panel pad 110 and the first circuit board pad 210.

[0019] Optional, Figure 4 This is a schematic diagram of another display module provided in the embodiments of this application, specifically a schematic diagram of a structure in which both the display area and the non-display area are in an unfolded state. Figure 5 This is a schematic diagram of another display module provided in the embodiments of this application, specifically a schematic diagram of a non-display area bent to the non-light-emitting side of the display panel. Figure 6 yes Figure 5 An enlarged schematic diagram of region A in the middle. See also... Figures 4-6 The non-display area BB also includes a bending area DD, and a portion of the pad area CC is bent through the bending area DD to the non-light-emitting side of the display panel 10. The first panel pad 110 is disposed in the bending area DD and is electrically connected to the first circuit board pad 210 on the non-light-emitting side of the display panel 10.

[0020] Specifically, such as Figures 4-6 In the illustrated embodiment, the non-display area BB includes the non-display area BB located to the left of the display area AA, the non-display area BB located to the right of the display panel AA, and the non-display area BB located below the display area AA. Figure 4As shown, in the unbent state of the non-display area BB, that is, in its flat state, the bending area DD is located on the side of the pad area CC closest to the display area AA. Since the bending area DD is a bendable region, the pad area CC is bent to the non-light-emitting side of the display panel 10 via the bending area DD. Especially for the non-display areas BB located on the left and right sides of the display area AA, when viewed from the light-emitting side of the display panel 10, because a portion of the non-display areas BB on the left and right sides of the display area AA is bent to the non-light-emitting side of the display panel 10, the bezel area of ​​the display panel 10 can be reduced, which is beneficial for achieving a narrow bezel design of the display panel 10 and increasing the area ratio of the display area AA. It can be understood that the pad area CC can be bent around the bending axis of the bending area DD, so the portion of the bending area DD located near the bending axis of the pad area CC, as well as the pad area CC, is bent to the non-light-emitting side of the display panel 10.

[0021] In addition, such as Figure 5 and Figure 6 As shown, on the non-light-emitting side of the display panel 10, the first panel pad 110 in the pad area CC located on the left and right sides of the circuit board 20 can be directly electrically connected to the first circuit board pad 210 in the circuit board 20 through the conductive connection structure 30. This allows the first circuit board pad 210 of the circuit board 20 to directly provide signals to the first panel pad 110 located in the non-display area BB on the left and right sides of the display panel 10, thus eliminating the need for a separate circuit board for the first panel pad 110 in the non-display area BB on the left and right sides of the display panel 10. In related technologies, a separate circuit board is required for the first panel pad 110 in the non-display area BB on the left and right sides of the display panel 10. This circuit board needs to be electrically connected to the circuit board located in the non-display area below the display panel 10 via a connector. However, connectors typically have a certain volume, occupy a large space, and increase the overall stacking height of the display module. In the technical solution of this application, by setting the first panel pad 110 to be electrically connected to the first circuit board pad 210 in the circuit board 20 located in the non-display area on the lower side of the display panel 10 through the conductive connection structure 30, it is not necessary to set a separate circuit board for the first panel pad 110 located in the non-display area BB on the left and right sides of the display panel 10. This can reduce the stacking thickness of the first panel pad 110 and the first circuit board pad 210 at the electrical connection position, which is beneficial to realizing the thin and light design of the display module.

[0022] Optional, see below Figures 4-6The display panel 10 also includes multiple data signal lines 101 located in the display area AA. The data signal lines 101 extend along a first direction (X direction as shown in the figure, and will be described using the first direction X as an example below), and the multiple data signal lines 101 are arranged along a second direction (Y direction as shown in the figure, and will be described using the second direction Y as an example below). The first direction X and the second direction Y intersect. The bending area DD includes a first bending area DD1, and the pad area CC includes a first pad area CC1. In the flat state of the display panel 10, along the second direction Y, the first bending area DD1 is located on one side of the display area AA, and the first pad area CC1 is located on the side of the first bending area DD1 away from the display area AA.

[0023] For example, such as Figure 4 As shown, the display area AA also includes multiple data signal lines 101, which are used to provide data signals to sub-pixels in the same column. Based on this, let the extension direction of the data signal lines 101 be the first direction X, and the arrangement direction of the multiple data signal lines 101 be the second direction Y. The bending area DD includes a first bending area DD1. In the flat state of the display panel 10, along the second direction Y, the first bending area DD1 is located on one side of the display area AA, that is, the first bending area DD1 is located on the left or right side of the display area AA. The pad area CC includes a first pad area CC1. The first pad area CC1 is located on the side of the first bending area DD away from the display area AA. Therefore, after the non-display area BB bends to the non-light-emitting side of the display panel 10, the first pad area CC1 is located on the left or right side of the circuit board 20. At this time, the first panel pads 110 of the first pad area CC1 located on the left and right sides of the circuit board 20 can be electrically connected to the first circuit board pads 210 in the circuit board 20 through the conductive connection structure 30, so as to provide signals to the first panel pads 110 in the first pad area CC1 through the first circuit board pads 210 at the corresponding positions of the circuit board 20. In this way, there is no need to set up a separate circuit board for the first panel pads 110 in the first pad area CC1, and there is no need to connect different circuit boards through connectors, thereby reducing the stacking thickness of the first panel pads 110 in the first pad area CC1 and the first circuit board pads 210 in the circuit board 20 at the electrical connection position, which is beneficial to realizing the thin and light design of the display module.

[0024] It should be noted that, Figure 4 and Figure 5The embodiments shown are merely illustrative examples of the non-display areas located to the left of the display area AA, the non-display areas located to the right of the display area AA, and the non-display areas located below the display area AA being bent to the non-light-emitting side of the display panel 10. However, this is not a limitation. In other embodiments, the non-display areas located to the left of the display area AA, the right of the display area AA, the lower side of the display area AA, and the upper side of the display area AA may all be bent to the non-light-emitting side of the display panel 10.

[0025] Optionally, based on the above, Figure 7 yes Figure 5 A schematic diagram of a cross-section along the B-B' direction. See also... Figure 5 , Figure 6 and Figure 7 The display panel 10 also includes a panel substrate 40, which includes a display area panel substrate 420 and a first pad area panel substrate 411. The display area panel substrate 420 is located in the display area AA, and the first pad area panel substrate 411 is located in the first pad area CC1. In the bent state of the display panel 10, a plurality of first panel pads 110 are disposed on the side of the first pad area panel substrate 411 away from the display area panel substrate 420. The circuit board 20 also includes a circuit board substrate 50, with a plurality of first circuit board pads 210 disposed on the side of the circuit board substrate 50 away from the display area panel substrate 420. Along the thickness direction Z of the display module, the first pad area panel substrate 411 overlaps with the circuit board substrate 50.

[0026] Specifically, such as Figure 7As shown, the display panel 10 also includes a panel substrate 40, which serves as the substrate for the display panel 10 and provides support for the circuits in the display area AA and non-display area BB. The panel substrate 40 includes a display area panel substrate 420 and a pad area panel substrate 410. In the bent state of the display panel, the display area panel substrate 420 is located on the light-emitting side of the display panel 10 relative to the pad area panel substrate 410. Multiple sub-pixels arranged in an array can be disposed on the display area panel substrate 420. Each sub-pixel can include an electrically connected light-emitting element and a pixel circuit. The pixel circuit provides various driving signals to the light-emitting element, thereby enabling the display of the display panel 10 in the display area AA. The pad area panel substrate 410 is located in the pad area CC and provides support for multiple first panel pads 110 in the pad area CC. The pad area CC includes a first pad area CC1, which is located along the second direction Y on the side of the first bending area DD1 away from the display area AA. The pad area panel substrate 410 includes a first pad area panel substrate 411, which is located in the first pad area CC1, thereby providing support for the first panel pads 110 of the first pad area CC1. It is understood that since the first pad area CC1 is bent to the non-light-emitting side of the display panel 10 through the first bending area DD1, in the bent state of the display panel 10, the display area panel substrate 420 is located on the light-emitting side of the display panel 10, and the first pad area panel substrate 411 is located on the non-light-emitting side of the display panel 10.

[0027] See also Figure 7 The circuit board 20 also includes a circuit board substrate 50, which is located on the non-light-emitting side of the display panel 10 when the display panel 10 is bent. Furthermore, when the display panel 10 is bent, a plurality of first panel pads 110 are disposed on the side of the first pad area panel substrate 411 away from the display area panel substrate 420, and a plurality of first circuit board pads 210 are disposed on the side of the circuit board substrate 50 away from the display area panel substrate 420, thereby exposing at least a portion of the first panel pads 110 and the first circuit board pads 210 on the same side. Thus, by simply aligning the first panel pads 110 and the first circuit board pads 210 in the direction of the plane of the display panel 10 and electrically connecting them through the conductive connection structure 30, the electrical connection method of the first panel pads 110 and the first circuit board pads 210 is kept simple.

[0028] Furthermore, along the thickness direction Z of the display module, the first pad area panel substrate 411 overlaps with the circuit board substrate 50, thereby forming an overlapping area between the first pad area panel substrate 411 and the circuit board substrate 50. The overlapping area can provide stable support, thereby improving the reliability of the electrical connection between the first panel pad 110 and the first circuit board pad 210.

[0029] It is understandable that, such as Figure 7 In the embodiments shown, the example is that the first pad area panel substrate 411 overlaps with the circuit board substrate 50, but this is not a limitation. In other embodiments, the first pad area panel substrate 411 may not overlap with the circuit board substrate 50, and this application does not limit this.

[0030] It should be noted that, Figure 6 Only the panel substrate and circuit board are shown as examples, omitting other structures. It is understood that the display module also includes support structures (not shown in the figures) located between the pad area panel substrate and the display area panel substrate, and between the circuit board and the display area panel substrate. These support structures may include at least one of an inorganic layer support structure, foam, and a metal support structure to ensure the structural and performance stability of the display module. Furthermore, in subsequent figures, support structures are also provided between the pad area panel substrate and the display area panel substrate, and between the circuit board and the display area panel substrate; these will not be described further.

[0031] Optional, Figure 8 yes Figure 5 Another schematic diagram of a cross-section along the B-B' direction. See also... Figure 8 The display module also includes a first adhesion structure 610. Along the thickness direction of the display module, the first adhesion structure 610 is located between the first pad area panel substrate 411 and the circuit board substrate 50, and the first adhesion structure 610 adheres to and connects the first pad area panel substrate 411 and the circuit board substrate 50. Along the thickness direction Z of the display module, the first pad area panel substrate 411 and the circuit board substrate 50 overlap and have an overlap portion 401. The orthographic projection of the first adhesion structure 610 on the plane where the display area panel substrate 420 is located covers the orthographic projection of the overlap portion 401 on the plane where the display area panel substrate 420 is located.

[0032] Specifically, such as Figure 8As shown, a first adhesion structure 610 is also provided in the overlapping area of ​​the first pad area panel substrate 411 and the circuit board substrate 50. Along the thickness direction Z of the display module, the first adhesion structure 610 is located between the first pad area panel substrate 411 and the circuit board substrate 50, thereby adhering and fixing the first pad area panel substrate 411 and the circuit board substrate 50 through the first adhesion structure 610, avoiding relative displacement between the first pad area panel substrate 411 and the circuit board substrate 50, and ensuring the reliability of the electrical connection between the first panel pad 110 and the first circuit board pad 210.

[0033] Furthermore, along the thickness direction Z of the display module, the first pad area panel substrate 411 overlaps with the circuit board substrate 50 and has an overlap portion 401, with the first adhesion structure 610 disposed in the area of ​​the overlap portion 401. Based on this, if the first adhesion structure 610 is recessed relative to the overlap portion 401, i.e., the overlap portion 401 covers the first adhesion structure 610, then the first adhesion structure 610 will form an undercut opening with the circuit board substrate 50 on the side near the first panel pad 110. In this case, when connecting the first panel pad 110 and the first circuit board pad 210, the conductive connection structure 30 may break at the undercut opening, causing the electrical connection between the first panel pad 110 and the first circuit board pad 210 to be disconnected, affecting the reliability of the electrical connection. Therefore, in this embodiment, the orthographic projection of the first adhesion structure 610 onto the plane of the display area panel substrate 420 covers the orthographic projection of the overlapping portion 401 onto the plane of the display area panel substrate 420. Furthermore, the area of ​​the first adhesion structure 610 can be larger than the area of ​​the overlapping portion 401, so that the first adhesion structure 610 extends beyond the circuit board substrate 50 on the side near the first panel pad 110, forming a stepped structure with the circuit board substrate 50 at the position near the first panel pad 110. When the conductive connection structure 30 electrically connects the first panel pad 110 and the first circuit board pad 210, it can provide good wiring in the stepped structure without breaking the wire due to the inner bottom cut-out, thereby improving the reliability of the electrical connection between the first panel pad 110 and the first circuit board pad 210 and avoiding the occurrence of wire breakage.

[0034] It should be noted that the above embodiments are only illustrative examples of the first pad area panel substrate 411 being located on the side of the circuit board substrate 50 near the display area panel substrate 420 when the display panel is bent, but this is not a limitation. In other embodiments, when the display panel is bent, the circuit board substrate 50 may also be located on the side of the first pad area panel substrate 411 near the display area panel substrate 420. In this case, when the orthographic projection of the first adhesion structure 610 on the plane where the display area panel substrate 420 is located covers the orthographic projection of the overlapping portion 401 on the plane where the display area panel substrate 420 is located, the first adhesion structure 610 can extend beyond the first pad area panel substrate 411 on the side near the first circuit board pad 210, thereby forming a stepped structure with the first pad area panel substrate 411 at the position near the first circuit board pad 210, improving the reliability of the electrical connection between the first panel pad 110 and the first circuit board pad 210, and avoiding wire breakage.

[0035] Optional, see below Figure 8 Along the thickness direction Z of the display module, at least a portion of the circuit board substrate 50 is located on the side of the first pad area panel substrate 411 away from the display area panel substrate 420. The first circuit board pad 210 is located on the side of the circuit board substrate 50 away from the display area panel substrate 420.

[0036] For example, such as Figure 8 In the illustrated embodiment, the circuit board substrate 50 overlapping the first pad area panel substrate 411 is used as an example. Along the thickness direction Z of the display module, the circuit board substrate 50 partially overlaps the first pad area panel substrate 411, and a portion of the circuit board substrate 50 is located on the side of the first pad area panel substrate 411 away from the display area panel substrate 420, so that a portion of the circuit board substrate 50 overlaps the first pad area panel substrate 411, ensuring that the conductive connection structure 30 can connect the first panel pad 110 and the first circuit board pad 210 through the overlapping portion. It can be understood that the overlapping portion of the circuit board substrate 50 and the first pad area panel substrate 411 is the overlapping portion 401 of the circuit board substrate 50 and the first pad area panel substrate 411. In addition, the first circuit board pad 210 is located on the side of the circuit board substrate 50 away from the display area panel substrate 420, and the first panel pad 110 is located on the side of the first pad area panel substrate 411 away from the display area panel substrate 420, so that the first circuit board pad 210 and the first panel pad 110 are exposed on the same side, ensuring that the connection method of the first circuit board pad 210 and the first panel pad 110 is simple.

[0037] Optionally, in yet another embodiment, Figure 9 yes Figure 2 A schematic diagram of a cross-section along the C-C' direction. See also... Figure 9Along the thickness direction of the display module, at least a portion of the first pad area panel substrate 411 is located on the side of the circuit board substrate 50 away from the display area panel substrate 420. The first panel pad 110 is located on the side of the first pad area panel substrate 411 away from the display area panel substrate 420.

[0038] For example, such as Figure 9 In the illustrated embodiment, the example of the first pad area panel substrate 411 overlapping the circuit board substrate 50 is described. Along the thickness direction of the display module, the circuit board substrate 50 and the first pad area panel substrate 411 partially overlap, and a portion of the first pad area panel substrate 411 is located on the side of the circuit board substrate 50 away from the display area panel substrate 420, such that a portion of the first pad area panel substrate 411 overlaps the circuit board substrate 50, ensuring that the conductive connection structure 30 can connect the first panel pad 110 and the first circuit board pad 210 through the overlapping portion. It can be understood that the overlapping portion of the circuit board substrate 50 and the first pad area panel substrate 411 is the overlapping portion 401 of the circuit board substrate 50 and the first pad area panel substrate 411. In addition, the first circuit board pad 210 is located on the side of the circuit board substrate 50 near the display area panel substrate 420, and the first panel pad 110 is located on the side of the first pad area panel substrate 411 near the display area panel substrate 420, so that the first circuit board pad 210 and the first panel pad 110 are exposed on the same side, ensuring that the electrical connection method of the first circuit board pad 210 and the first panel pad 110 is simple.

[0039] Optionally, in one embodiment, Figure 10 This is a schematic diagram of another display module provided in the embodiments of this application, specifically a schematic diagram of a non-display area bent to the non-light-emitting side. Figure 11 yes Figure 10 An enlarged schematic diagram of region C in the middle. Figure 12 yes Figure 10 A schematic diagram of a cross-section along the D-D' direction. See also... Figures 10-12 The display panel 10 also includes a panel substrate 40, which includes a display area panel substrate 420 and a first pad area panel substrate 411. The display area panel substrate 420 is located in the display area AA, and the first pad area panel substrate 411 is located in the first pad area CC1. In the bent state of the display panel 10, a plurality of first panel pads 110 are disposed on the side of the first pad area panel substrate 411 away from the display area panel substrate 420. The circuit board 20 also includes a circuit board substrate 50, with a plurality of first circuit board pads 210 disposed on the side of the circuit board substrate 50 away from the display area panel substrate 420. Along the thickness direction of the display module, the first pad area panel substrate 411 and the circuit board substrate 50 do not overlap.

[0040] Specifically, such as Figures 10-12As shown, the display panel 10 also includes a panel substrate 40. The panel substrate 40 includes a display area panel substrate 420 and a pad area panel substrate 410. In the bent state of the display panel, the display area panel substrate 420 is located on the light-emitting side of the display panel 10 relative to the pad area panel substrate 410. The pad area CC includes a first pad area CC1, which is bent around a first bending area DD1 to the non-light-emitting side of the display panel. The pad area panel substrate 410 includes a first pad area panel substrate 411, which is located in the first pad area CC1, thereby providing support for the first panel pad 110 of the first pad area CC1. It is understood that since the first pad area CC1 is bent to the non-light-emitting side of the display panel 10 through the first bending area DD1, in the bent state of the display panel 10, the display area panel substrate 420 is located on the light-emitting side of the display panel 10, and the first pad area panel substrate 411 is located on the non-light-emitting side of the display panel 10.

[0041] See also Figure 12 The circuit board 20 also includes a circuit board substrate 50, which is located on the non-light-emitting side of the display panel 10 when the display panel 10 is bent. Furthermore, when the display panel 10 is bent, a plurality of first panel pads 110 are disposed on the side of the first pad area panel substrate 411 away from the display area panel substrate 420, and a plurality of first circuit board pads 210 are disposed on the side of the circuit board substrate 50 away from the display area panel substrate 420, thereby exposing at least a portion of the first panel pads 110 and the first circuit board pads 210 on the same side. Thus, by simply aligning the first panel pads 110 and the first circuit board pads 210 in the direction of the plane of the display panel 10 and electrically connecting them through the conductive connection structure 30, the electrical connection method of the first panel pads 110 and the first circuit board pads 210 is kept simple.

[0042] Furthermore, along the thickness direction Z of the display module, the first pad area panel substrate 411 and the circuit board substrate 50 do not overlap; that is, the first pad area panel substrate 411 and the circuit board substrate 50 are staggered in the thickness direction of the display module, so that there is no overlapping area between the first pad area panel substrate 411 and the circuit board substrate 50. In this way, the first pad area panel substrate 411 and the circuit board substrate 50 can be set at the same height, reducing the stacking height at the connection point of the first panel pad 110 and the first circuit board pad 210, thereby facilitating the thinner and lighter design of the display module.

[0043] Optional, Figure 13 yes Figure 10 Another schematic diagram of a cross-section along the D-D' direction. See also... Figure 13The display module also includes a second adhesion structure 620. Along the second direction Y, the second adhesion structure 620 is located between the first pad area panel substrate 411 and the circuit board substrate 50, and the second adhesion structure 620 adhesively connects the first pad area panel substrate 411 and the circuit board substrate 50. Along the thickness direction of the display module, the thickness of the second adhesion structure 620 is greater than or equal to the thickness of the first pad area panel substrate 411, or the thickness of the second adhesion structure 620 is greater than or equal to the thickness of the circuit board substrate 50. The conductive connection structure 30 is located on the side of the second adhesion structure 620 away from the display area panel substrate 420.

[0044] Specifically, in yet another embodiment, such as Figure 13 As shown, along the thickness direction Z of the display module, the first pad area panel substrate 411 and the circuit board substrate 50 are staggered, meaning there is a gap between them. Based on this, along the second direction Y, a second adhesion structure 620 is provided between the first pad area panel substrate 411 and the circuit board substrate 50. The second adhesion structure 620 is located within the gap, thereby adhering and fixing the first pad area panel substrate 411 and the circuit board substrate 50, preventing relative displacement between them and ensuring the reliability of the electrical connection between the first panel pad 110 and the first circuit board pad 210. Furthermore, along the thickness direction of the display panel, the thickness of the second adhesion structure 620 is greater than or equal to the thickness of the first pad area panel substrate 411, or the thickness of the second adhesion structure 620 is greater than or equal to the thickness of the circuit board substrate 50, so that the second adhesion structure 620 completely fills the gap between the first pad area panel substrate 411 and the circuit board substrate 50. Thus, when the conductive connection structure 30 is fabricated on the side of the second adhesion structure 620 away from the display area panel substrate 420, grooves or gaps are avoided between the first pad area panel substrate 411 and the circuit board substrate 50, which would cause capillary adsorption phenomenon in the conductive connection structure 30. This avoids short circuits between adjacent conductive connection structures 30 and improves the reliability of the electrical connection between the first panel pad 110 and the first circuit board pad 210.

[0045] It should be noted that since the first pad area panel substrate 411 and the circuit board substrate 50 do not overlap, when the first pad area panel substrate 411 and the circuit board substrate 50 are adhered and fixed by the second adhesion structure 620, there may still be unstable adhesion between the first pad area panel substrate 411 and the circuit board substrate 50. Therefore, in this embodiment, a first adhesion structure 610 is provided on the side of the first pad area panel substrate 411 and the circuit board substrate 50 near the display area panel substrate 420. Along the thickness direction of the display module, the first adhesion structure 610 at least partially overlaps with the first pad area panel substrate 411 and the circuit board substrate 50, and the first adhesion structure 610 covers the gap between the first pad area panel substrate 411 and the circuit board substrate 50, thereby further improving the stability of the adhesion between the first pad area panel substrate 411 and the circuit board substrate 50.

[0046] Optional, see below Figure 13 The thickness of the first pad area panel substrate 411 is d1, and the thickness of the circuit board substrate 50 is d2, wherein |d1-d2| / d1≤20%.

[0047] Specifically, by setting the thickness d1 of the first pad area panel substrate 411 and the thickness d2 of the circuit board substrate 50 to satisfy |d1-d2| / d1≤20%, the thickness of the first pad area panel substrate 411 is approximately equal to the thickness of the circuit board substrate 50. Thus, when both the first pad area panel substrate 411 and the circuit board substrate 50 are adhered to the first adhesion structure 610, the surface of the first pad area panel substrate 411 away from the first adhesion structure 610 is approximately flush with the surface of the circuit board substrate 50 away from the first adhesion structure 610. This ensures a simple electrical connection method for the conductive connection structure 30 and guarantees the stability of the electrical connection between the first panel pad 110 and the first circuit board pad 210. For example, the thickness of the first pad area panel substrate 411 can be 0.10mm, 0.11mm, or 0.12mm, and the thickness of the circuit board substrate 50 can be 0.10mm, 0.11mm, or 0.12mm.

[0048] In an alternative embodiment, see also... Figure 6 The display panel 10 further includes at least one first panel pad group 100, which includes a plurality of first panel pads 110 arranged along a first direction X. The circuit board 20 further includes at least one first circuit board pad group 200, which includes a plurality of first circuit board pads 210 arranged along the first direction X. The plurality of first panel pads 110 in the first panel pad group 100 are electrically connected to the plurality of first circuit board pads 210 in the first circuit board pad group 200.

[0049] For example, such as Figure 6 In the illustrated embodiment, the first pad area CC1 includes a first panel pad group 100 as an example. Correspondingly, a first circuit board pad group 200 is included at a corresponding position on the circuit board 20. Along the second direction Y, the area where the first panel pad group 100 is located at least partially overlaps with the area where the first circuit board pad group 200 is located, thereby facilitating the corresponding electrical connection between the first panel pads 110 in the first panel pad group 100 and the first circuit board pads 210 in the first circuit board pad group 200. Specifically, the first panel pad group 100 includes a plurality of first panel pads 110, which extend along the second direction Y, and the plurality of first panel pads 110 are arranged along the first direction X in the first panel pad group 100. The first circuit board pad group 200 includes a plurality of first circuit board pads 210, which extend along the second direction Y, and the plurality of first circuit board pads 210 are arranged along the first direction X in the first circuit board pad group 200. When electrically connecting the first panel pad 110 to the first circuit board pad 210, the corresponding first panel pad 110 and first circuit board pad 210 must first be aligned in the second direction Y. This ensures that the orthographic projection of each first panel pad 110 on the first pad area panel substrate 411 in the second direction Y at least partially overlaps with the orthographic projection of the corresponding first circuit board pad 210 on the first pad area panel substrate 411. The aligned first panel pad 110 and first circuit board pad 210 are then electrically connected through the corresponding conductive connection structure 30, thus ensuring a simple electrical connection method. Furthermore, the multiple first panel pads 110 in the first panel pad group 100 and the multiple first circuit board pads 210 in the first circuit board pad group 200 are electrically connected accordingly. That is, different first panel pads 110 and different first circuit board pads 210 are insulated from each other, ensuring normal transmission of different signals.

[0050] In another alternative embodiment, Figure 14 This is a schematic diagram illustrating the connection between a first panel pad and a first circuit board pad, as provided in an embodiment of this application. See also... Figure 14The display panel 10 includes at least two first panel pad groups 100, which include an i-th first panel pad group 100i and a j-th first panel pad group 100j. The i-th first panel pad group 100i and the j-th first panel pad group 100j are arranged along a second direction Y, and along the second direction Y, the gaps between the first panel pads 110 in the i-th first panel pad group 100i and the gaps between two adjacent first panel pads 110 in the j-th first panel pad group 100j overlap; i and j are both positive integers. The circuit board 20 includes at least two first circuit board pad groups 200, each including a p-th first circuit board pad group 200p and a q-th first circuit board pad group 200q. The p-th and q-th first circuit board pad groups 200p and 200q are arranged along a second direction Y. Along the second direction Y, the gaps between adjacent first circuit board pads 210 in the p-th first circuit board pad group 200p and adjacent first circuit board pads 210 in the q-th first circuit board pad group 200q overlap. p and q are both positive integers. A plurality of first panel pads 110 in the i-th first panel pad group 100i are electrically connected to a plurality of first circuit board pads 210 in the p-th first circuit board pad group 200p. A plurality of first panel pads 110 in the j-th first panel pad group 100j are electrically connected to a plurality of first circuit board pads 210 in the q-th first circuit board pad group 200q.

[0051] For example, such as Figure 14In the illustrated embodiment, the first pad area CC1 includes two first panel pad groups 100 as an example, that is, the first pad area CC1 includes the i-th first panel pad group 100i and the j-th first panel pad group 100j. Correspondingly, the circuit board 20 includes the p-th first circuit board pad group 200p and the q-th first circuit board pad group 200q at the corresponding positions. The first panel pad group 100i and the first panel pad group 100j are arranged along the second direction Y. Along the second direction Y, the gaps between the first panel pads 110 in the first panel pad group 100i and the first panel pads 110 in the first panel pad group 100j overlap. That is, along the second direction Y, the first panel pads 110 in the first panel pad group 100i and the first panel pads 110 in the first panel pad group 100j are staggered to leave connection space for the first panel pads 110 in the first panel pad group 100i between the two adjacent first panel pads 110 in the first panel pad group 100j, thereby facilitating the electrical connection between the first panel pads in the first panel pad group 100i and the first circuit board pads 210 in the first circuit board pad group 200p. Similarly, along the second direction Y, the gaps between the first circuit board pad 210 in the p-th group of first circuit board pads 200p and the gaps between two adjacent first circuit board pads 210 in the q-th group of first circuit board pads 200q overlap. That is, along the second direction Y, the first circuit board pad 210 in the p-th group of first circuit board pads 200p and the first circuit board pad 210 in the q-th group of first circuit board pads 200q are staggered, thereby facilitating the electrical connection between the first circuit board pad 210 in the q-th group of first circuit board pads 200q and the first panel pad 110 in the j-th group of first panel pads 100j.

[0052] Furthermore, when electrically connecting the first panel pad in the first panel pad group 100i of the i-th group to the first circuit board pad 210 in the first circuit board pad group 200p of the p-th group, the first panel pad 110 in the first panel pad group 100i and the first circuit board pad 210 in the first circuit board pad group 200p of the p-th group must first be aligned in the second direction Y. This ensures that the orthographic projection of each first panel pad 110 in the first panel pad group 100i on the plane where the first pad area panel substrate 411 is located overlaps with the orthographic projection of the corresponding first circuit board pad 210 in the first circuit board pad group 200p on the plane where the first pad area panel substrate 411 is located in the p-th group of the first circuit board pad group 200p. The aligned first panel pad 110 and the first circuit board pad 210 are then electrically connected through the corresponding conductive connection structure 30, thus ensuring a simple electrical connection method. Similarly, when electrically connecting the first circuit board pad 210 in the first circuit board pad group 200q of the qth group with the first panel pad 110 in the first panel pad group 100j of the jth group, the first circuit board pad 210 in the first circuit board pad group 200q and the first panel pad 110 in the first panel pad group 100j of the jth group must first be aligned in the second direction Y. This ensures that the orthographic projection of each first circuit board pad 210 in the first circuit board pad group 200q on the plane where the first pad area panel substrate 411 is located overlaps with the orthographic projection of the corresponding first panel pad 110 in the first panel pad group 100j on the plane where the first pad area panel substrate 411 is located in the jth group. The aligned first panel pad 110 and the first circuit board pad 210 are then electrically connected through the corresponding conductive connection structure 30, thus ensuring a simple electrical connection method. In addition, multiple first panel pads 110 are electrically connected to multiple first circuit board pads 210, meaning that different first panel pads 110 and different first circuit board pads are insulated from each other to ensure normal transmission of different signals.

[0053] In yet another alternative embodiment, Figure 15 This is another schematic diagram illustrating the connection between the first panel pad and the first circuit board pad provided in an embodiment of this application. See also... Figure 15 The display panel 10 further includes at least one second panel pad group 300, which includes a plurality of first panel pads 110 arranged along a second direction Y. The circuit board 20 further includes at least one second circuit board pad group 400, which includes a plurality of first circuit board pads 210 arranged along a second direction Y. The plurality of first panel pads 110 in the second panel pad group 300 are electrically connected to the plurality of first circuit board pads 210 in the second circuit board pad group 400.

[0054] For example, such as Figure 15As shown, the first pad area CC1 includes a first panel pad group 100 and a second panel pad group 300 as an example for explanation. Correspondingly, the circuit board 20 includes a first circuit board pad group 200 and a second circuit board pad group 400. In the first pad area CC1, the arrangement direction of the plurality of first panel pads 110 in the first panel pad group 100 intersects with the arrangement direction of the plurality of first panel pads 110 in the second panel pad group 300. In the circuit board 20, the arrangement direction of the plurality of first circuit board pads 210 in the first circuit board pad group 200 intersects with the arrangement direction of the plurality of first circuit board pads 110 in the second circuit board pad group 400. When electrically connecting the first panel pad 110 and the first circuit board pad 210, the first panel pad 110 and the first circuit board pad 210 in the arrangement direction can be electrically connected. That is, the first panel pad 110 in the first panel pad group 100 can be electrically connected to the first circuit board pad 210 in the first circuit board pad group 200, and the first panel pad 110 in the second panel pad group 300 can be electrically connected to the first circuit board pad 210 in the second circuit board pad group 400. In this way, it can be ensured that when connecting the first panel pad 110 and the second circuit board pad 210 through the conductive connection structure 30, the trace of the conductive connection structure 30 is short, ensuring a simple connection method.

[0055] It should be noted that, please continue to refer to Figure 15 Since the first panel pads 110 in the first panel pad group 100 are arranged along the first direction X and extend along the second direction Y, and correspondingly, the first circuit board pads 210 in the first circuit board pad group 200 are arranged along the first direction X and extend along the second direction Y, an electrical connection between the first panel pads 110 in the first panel pad group 100 and the first circuit board pads 210 in the first circuit board pad group 200 can be achieved through a linear conductive connection structure 30 extending along the second direction Y. The first panel pads 110 in the second panel pad group 300 and the first circuit board pads 210 in the second circuit board pad group 400 both extend along the first direction X, and their arrangement direction is the second direction Y. Therefore, an electrical connection between the first panel pads 110 in the second panel pad group 300 and the first circuit board pads 210 in the second circuit board pad group 400 can be achieved through a zigzag conductive connection structure 30.

[0056] It should also be noted that, along the thickness direction of the display module, the first pad area panel substrate 411 of the first pad area CC1 at least partially overlaps with the circuit board substrate 50 of the circuit board 20. Based on this, when the first panel pad 110 in the second panel pad group 300 and the first circuit board pad 210 in the second circuit board pad group 400 are electrically connected via the conductive connection structure 30, compared to the scheme where the first pad area panel substrate 411 and the circuit board substrate 50 do not overlap, there is no need for wiring at the overlap position of the first pad area panel substrate 411 and the circuit board substrate 50. This reduces the trace length of the conductive connection structure 30, which is beneficial for reducing connection impedance.

[0057] Optionally, in yet another embodiment, Figure 16 This is a structural schematic diagram of another display module provided in the embodiments of this application, specifically a structural schematic diagram of the display panel in an unfolded state. Figure 17 This is a schematic diagram of another display module provided in this application embodiment, specifically a schematic diagram of a structure in which the non-display area is bent to the non-light-emitting side of the display panel. Figure 18 yes Figure 17 An enlarged schematic diagram of region E in the middle. See also... Figures 16-18 The bending area DD also includes a second bending area DD2. In the flat state of the display panel 10, along the second direction Y, the second bending area DD2 is located on one side of the display area AA, and the second bending area DD2 and the first bending area DD1 are located on opposite sides of the display area AA. The first panel pad 110 is disposed in the second bending area DD2.

[0058] Specifically, such as Figure 16 As shown, the non-display area BB also includes a second bending area DD2. In the flat state of the display panel 10, along the second direction Y, the second bending area DD2 can be located on opposite sides of the display area AA; that is, the second bending area DD2 can also be the left bending area and / or right bending area of ​​the display panel. See also... Figure 17 and Figure 18 The first panel pad 11 in the second bending area DD2 located on the left and right sides of the circuit board 20 is directly electrically connected to the first circuit board pad 210 in the circuit board 20 through the conductive connection structure 30. Therefore, it is not necessary to set up a separate circuit board 20 for the first panel pad 110 in the second bending area DD2 located on the left and right sides of the display panel 10. This can reduce the stacking height of the first panel pad 110 in the second bending area DD2 and the first circuit board pad 210 in the main circuit board 201 at the connection position, which is conducive to realizing the thin and light design of the display module.

[0059] Optional, Figure 19 yes Figure 17 A magnified schematic diagram of region F in the middle, see [link / reference]. Figure 16 , Figure 17 and Figure 19 The bending area DD also includes a third bending area DD3. In the flat state of the display panel 10, the third bending area DD3 is located on one side of the display area AA along the first direction X. The display panel 10 also includes a plurality of second panel pads 120, and the circuit board 20 also includes a plurality of second circuit board pads 220. Along the thickness direction of the display module, the second panel pads 120 and the second circuit board pads 220 overlap and are electrically connected. The second panel pads 120 are located in the third bending area DD3.

[0060] Specifically, such as Figure 16 , Figure 17 and Figure 19 As shown, the bending area D also includes a third bending area DD3. In the flat state of the display panel 10, along the first direction X, the third bending area DD3 is located on one side of the display area AA, that is, the third bending area DD3 can be the lower bending area of ​​the display panel 10. The third bending area DD3 is provided with a plurality of second panel pads 120, which can extend along the first direction X and be arranged along the second direction Y. It can be understood that the third bending area DD3 bends around the bending axis of the third bending area DD3, thereby bending the area of ​​the third bending area DD3 located on the side away from the display area AA from the bending axis to the non-light-emitting side of the display panel 10. The plurality of second panel pads 120 are located in the area of ​​the third bending area DD3 bent to the non-light-emitting side of the display panel 10, thereby facilitating the electrical connection between the second panel pads 120 and the second circuit board pads 220 in the circuit board 20. It should be noted that the number of traces in the lower bending area of ​​the display panel 10 is greater than that in the left and right bending areas. Specifically, the number of second panel pads 120 in the third bending area DD3 is significantly greater than the number of first panel pads 110 in the second bending area DD2, or the number of first panel pads 110 in the first pad area CC1. Therefore, in the third bending area DD3, the second panel pads 120 and the second circuit board pads 220 are electrically connected by bonding. That is, along the thickness direction of the display module, the second panel pads 120 and the second circuit board pads 220 are positioned opposite each other and overlap, thereby ensuring the stability of signal transmission in the third bending area DD3.

[0061] Optional, see below Figure 16The distribution density of the first panel pads 110 is less than that of the second panel pads 120. Specifically, since the number of second panel pads 120 in the third bending region DD3 is much greater than the number of first panel pads 110 in the second bending region DD2, or the number of first panel pads 110 in the first pad region CC1, the distribution density of the first panel pads 110 can be set to be less than that of the second panel pads 120. For example, the size of the first panel pads 110 can be set to be larger than the size of the second panel pads 120, or the spacing between two adjacent first panel pads 110 can be set to be greater than the spacing between two adjacent second panel pads 120. Furthermore, when the first panel pads 110 are electrically connected to the first circuit board pads 210 through the conductive connection structure 30, the width of the conductive connection structure 30 can be set to be larger, thereby improving the stability of the electrical connection between the first panel pads 110 and the first circuit board pads 210, and at the same time reducing the connection impedance, thus improving the stability of signal transmission between the first panel pads 110 and the first circuit board pads 210.

[0062] Specifically, referring to 16, a plurality of first panel pads 110 are arranged along a first direction X, and a plurality of second panel pads 120 are arranged along a second direction Y. The width of the first panel pads 110 in the first direction X is greater than the width of the second panel pads 120 in the second direction Y; and / or, the spacing between two adjacent first panel pads 110 in the first direction X is greater than the spacing between two adjacent second panel pads 120 in the second direction Y.

[0063] Specifically, such as Figure 16 As shown, multiple first panel pads 110 are arranged along a first direction X and extend along a second direction Y, and multiple second panel pads 120 are arranged along the second direction Y and extend along the first direction X. Based on this, by setting the width of the first panel pads 110 in the first direction X to be greater than the width of the second panel pads 120 in the second direction Y, when the first panel pads 110 are electrically connected to the first circuit board pads 210 via the conductive connection structure 30, the width of the conductive connection structure 30 can be set to be larger, increasing the overlap width between the conductive connection structure 30 and the first panel pads 110 in the first direction X. This improves the stability of the electrical connection between the first panel pads 110 and the first circuit board pads 210, while also reducing the connection impedance. And / or, the spacing between two adjacent first panel pads 110 in the first direction X is set to be greater than the spacing between two adjacent second panel pads 120 in the second direction Y. If the spacing between two adjacent first panel pads 110 in the first direction X is larger, the width of the conductive connection structure 30 in the area between the first panel pad 110 and the first circuit board pad 210 can be set to be larger, thereby reducing the connection impedance between the first panel pad 110 and the first circuit board pad 210 and improving the stability of signal transmission between the first panel pad 110 and the first circuit board pad 210.

[0064] Optional, see below Figure 4 The display panel 10 also includes a panel substrate 40, which includes a first pad area panel substrate 411 located in a first pad area CC1. The extension length of the first pad area CC1 in the first direction X is equal to the maximum extension length of the first pad area panel substrate 411 in the first direction X.

[0065] For details, please refer to [link / reference]. Figure 4 The first pad area panel substrate 411 is located in the first pad area CC1, and provides support for the multiple first panel pads 110 in the first pad area CC1. In the first pad area CC1, the multiple first panel pads 110 are arranged in the first direction X. By setting the extension length of the first pad area CC1 in the first direction X to be equal to the maximum extension length of the first pad area panel substrate 411 in the first direction X, the extension length of the first pad area CC1 in the first direction X is ensured to be large enough, providing design space for setting the first panel pads 110 with large width and large spacing, and improving the stability of the electrical connection and signal transmission between the first panel pads 110 and the first circuit board pads 210.

[0066] Optional, Figure 20 yes Figure 5 Another enlarged schematic diagram of region A in the middle. Figure 21 yes Figure 5 Another schematic diagram of a cross-section along the B-B' direction. See also... Figure 20 and Figure 21 The display module also includes an insulating protective adhesive 70, which covers the conductive connection structure 30. Specifically, by covering the conductive connection structure 30 with the insulating protective adhesive 70, the conductive connection structure 30 is prevented from being corroded by water and oxygen, thereby improving the reliability of the connection of the conductive connection structure 30. In addition, the insulating protective adhesive 70 can also cover the first panel pad 110 and the first circuit board pad 210, thereby ensuring the reliability of the electrical connection between the first panel pad 110 and the first circuit board pad 210.

[0067] It should be noted that the material of the insulating protective adhesive 70 may include UV-curable types, such as UV-curable epoxy resin or UV-curable acrylate insulating adhesive, etc. It may also include thermosetting types of the insulating protective adhesive 70, such as polyurethane or silicone. This application does not limit the specific material of the insulating protective adhesive 70; those skilled in the art can set it as needed.

[0068] Optionally, the conductive connection structure 30 may include conductive ink. The conductive ink can be applied by coating and scribing or by etching. This application embodiment does not limit the specific application method of the conductive ink. In the preparation process of the conductive ink, the thickness of the conductive ink can be set to less than or equal to 10 micrometers, thereby reducing the stacking height of the first panel pad 110 and the first circuit board pad 210 at the connection position, which is beneficial to achieving a thinner and lighter design of the display module. In addition, the conductive ink material is preferably nano-silver ink. After the conductive ink is coated, it can be cured by laser or flash lamp sintering, thereby improving the stability of the conductive ink electrical connection.

[0069] Based on the same inventive concept, embodiments of this application also provide a display device, which includes the display module provided in embodiments of this application. Therefore, the display device possesses the technical features of the display module provided in embodiments of this application and can achieve the beneficial effects of the display module provided in embodiments of this application. Similarities can be referred to the above description of the display module provided in embodiments of this application, and will not be repeated here.

[0070] For example, Figure 22 This is a schematic diagram of the structure of a display device provided in an embodiment of this application, such as... Figure 22 As shown, the display device includes the display module 01 provided in this application embodiment. The display device provided in this application embodiment can be any electronic product with display function, including but not limited to the following categories: mobile phones, televisions, laptops, desktop monitors, tablets, digital cameras, smart bracelets, smart glasses, vehicle displays, medical devices, industrial control equipment, touch interactive terminals, etc., and this application embodiment does not make any special limitations on them.

[0071] It should be understood that the working processes of the various pixel circuits shown above can be used, with stages reordered, added, or deleted. For example, the stages in the working process of each pixel circuit described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this application can be achieved, and this is not limited herein. The above specific embodiments do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A display module, characterized by Including display panels and circuit boards; The display panel includes a display area and a non-display area, wherein the non-display area at least partially surrounds the display area; The non-display area includes a pad area, the pad area includes a plurality of first panel pads, and the circuit board includes a plurality of first circuit board pads; The display module further includes a conductive connection structure, which electrically connects the first panel pad and the first circuit board pad respectively.

2. The display module of claim 1, wherein, Along the thickness direction of the display module, the first panel pads and the first circuit board pads do not overlap.

3. The display module of claim 1, wherein, The non-display area also includes a bending area, through which the pad area is bent to the non-light-emitting side of the display panel; The first panel pad is electrically connected to the first circuit board pad on the non-light-emitting side of the display panel.

4. The display module of claim 3, wherein, The display panel also includes multiple data signal lines located in the display area. The data signal lines extend along a first direction, and the multiple data signal lines are arranged along a second direction, wherein the first direction and the second direction intersect. The bending area includes a first bending area, and the pad area includes a first pad area. In the flat state of the display panel, along the second direction, the first bending area is located on one side of the display area, and the first pad area is located on the side of the first bending area away from the display area.

5. The display module according to claim 4, characterized in that, The display panel further includes a panel substrate, which includes a display area panel substrate and a first pad area panel substrate, wherein the display area panel substrate is located in the display area and the first pad area panel substrate is located in the first pad area. In the bent state of the display panel, a plurality of first panel pads are disposed on the side of the first pad area panel substrate away from the display area panel substrate; the circuit board further includes a circuit board substrate, and a plurality of first circuit board pads are disposed on the side of the circuit board substrate away from the display area panel substrate; Along the thickness direction of the display module, the first pad area panel substrate overlaps with the circuit board substrate.

6. The display module according to claim 5, characterized in that, The display module further includes a first adhesion structure. Along the thickness direction of the display module, the first adhesion structure is located between the first pad area panel substrate and the circuit board substrate. The first adhesion structure adheres to and connects the first pad area panel substrate and the circuit board substrate. Along the thickness direction of the display module, the first pad area panel substrate overlaps with the circuit board substrate and has an overlapping portion; The orthographic projection of the first adhesive structure onto the plane where the display area panel substrate is located covers the orthographic projection of the overlapping portion onto the plane where the display area panel substrate is located.

7. The display module according to claim 5, characterized in that, Along the thickness direction of the display module, at least a portion of the first pad area panel substrate is located on the side of the circuit board substrate away from the display area panel substrate; The first panel pad is located on the side of the first pad area panel substrate away from the display area panel substrate.

8. The display module according to claim 5, characterized in that, Along the thickness direction of the display module, at least a portion of the first circuit board substrate is located on the side of the first pad area panel substrate away from the display area panel substrate; The first circuit board pad is located on the side of the circuit board substrate away from the display area panel substrate.

9. The display module according to claim 4, characterized in that, The display panel further includes a panel substrate, which includes a display area panel substrate and a first pad area panel substrate, wherein the display area panel substrate is located in the display area and the first pad area panel substrate is located in the first pad area. In the bent state of the display panel, a plurality of first panel pads are disposed on the side of the first pad area panel substrate away from the display area panel substrate; the circuit board further includes a circuit board substrate, and a plurality of first circuit board pads are disposed on the side of the circuit board substrate away from the display area panel substrate; Along the thickness direction of the display module, the first pad area panel substrate does not overlap with the circuit board substrate.

10. The display module according to claim 9, characterized in that, The display module further includes a second adhesion structure. Along the second direction, the second adhesion structure is located between the first pad area panel substrate and the circuit board substrate, and the second adhesion structure adheres to and connects the first pad area panel substrate and the circuit board substrate. Along the thickness direction of the display module, the thickness of the second adhesion structure is greater than or equal to the thickness of the first pad area panel substrate, or the thickness of the second adhesion structure is greater than or equal to the thickness of the circuit board substrate. The conductive connection structure is located on the side of the second adhesion structure away from the display panel substrate.

11. The display module according to claim 9, characterized in that, The thickness of the first pad area panel substrate is d1, and the thickness of the circuit board substrate is d2; Wherein, |d1- d2| / d1≤20%.

12. The display module according to claim 4, characterized in that, The display panel further includes at least one first panel pad group, the first panel pad group including a plurality of first panel pads arranged along the first direction; The circuit board further includes at least one first circuit board pad group, the first circuit board pad group including a plurality of first circuit board pads arranged along the first direction; The plurality of first panel pads in the first panel pad group are electrically connected to the plurality of first circuit board pads in the first circuit board pad group.

13. The display module according to claim 12, characterized in that, The display panel includes at least two first panel pad groups, each including an i-th first panel pad group and a j-th first panel pad group. The i-th and j-th first panel pad groups are arranged along a second direction, and along the second direction, the gaps between adjacent first panel pads in the i-th first panel pad group and adjacent first panel pads in the j-th first panel pad group overlap; i and j are both positive integers. The circuit board includes at least two first circuit board pad groups, which include a p-th first circuit board pad group and a q-th first circuit board pad group. The p-th first circuit board pad group and the q-th first circuit board pad group are arranged along the second direction, and along the second direction, the gaps between two adjacent first circuit board pads in the p-th first circuit board pad group and the gaps between two adjacent first circuit board pads in the q-th first circuit board pad group overlap; p and q are both positive integers. The plurality of first panel pads in the i-th group of first panel pads are electrically connected to the plurality of first circuit board pads in the p-th group of first circuit board pads. The plurality of first panel pads in the j-th group of first panel pads are electrically connected to the plurality of first circuit board pads in the q-th group of first circuit board pads.

14. The display module according to claim 12, characterized in that, The display panel further includes at least one second panel pad group, the second panel pad group including a plurality of first panel pads arranged along the second direction; The circuit board further includes at least one second circuit board pad group, the second circuit board pad group including a plurality of first circuit board pads arranged along the second direction; The plurality of first panel pads in the second panel pad group are electrically connected to the plurality of first circuit board pads in the second circuit board pad group.

15. The display module according to claim 4, characterized in that, The bending area further includes a second bending area. In the flat state of the display panel, along the second direction, the second bending area is located on one side of the display area, and the second bending area and the first bending area are located on opposite sides of the display area. The first panel pad is located in the second bending area.

16. The display module according to claim 4, characterized in that, The bending area also includes a third bending area, which is located on one side of the display area along the first direction when the display panel is in a flat state. The display panel further includes a plurality of second panel pads, and the circuit board further includes a plurality of second circuit board pads; Along the thickness direction of the display module, the second panel pads and the second circuit board pads overlap, and the second panel pads and the second circuit board pads are bonded and electrically connected. The second panel pad is located in the third bending area.

17. The display module according to claim 16, characterized in that, The distribution density of the first panel pads is less than that of the second panel pads.

18. The display module according to claim 17, characterized in that, A plurality of first panel pads are arranged along the first direction, and a plurality of second panel pads are arranged along the second direction; The width of the first panel pad in the first direction is greater than the width of the second panel pad in the second direction; and / or, the spacing between two adjacent first panel pads in the first direction is greater than the spacing between two adjacent second panel pads in the second direction.

19. The display module according to claim 4, characterized in that, The display panel further includes a panel substrate, the panel substrate including a first pad area panel substrate, the first pad area panel substrate being located in the first pad area; The extension length of the first pad area in the first direction is equal to the maximum extension length of the first pad area panel substrate in the first direction.

20. The display module according to claim 1, characterized in that, The display module also includes an insulating protective adhesive that covers the conductive connection structure.

21. The display module according to claim 1, characterized in that, The conductive connection structure includes conductive ink.

22. A display device, characterized in that, Includes the display module as described in any one of claims 1-21.

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