Perovskite solar cell module with single edge lead-out and preparation method thereof

Abstract

This invention belongs to the field of perovskite solar cell technology and relates to a single-sided perovskite solar cell module and its fabrication method. By concentrating the positive and negative leads on the same side of a transparent substrate, external bridging wires, busbars, and conductive tapes are eliminated. This avoids the need for wires to cross the cell edge and bend and converge within the space, maximizing the utilization of the effective area and correspondingly reducing the dead area. Simultaneously, it eliminates the potential risks of solder joint fatigue failure and stress concentration in corner areas found in traditional double-sided lead schemes, significantly reducing poor contact. It can directly adapt to standard single-sided FPCs and centralized connectors, fitting the single-sided wiring design of consumer electronics motherboards and is more suitable for integrated installation in compact spaces. This invention eliminates the need for additional wires, insulating tape, and manual soldering processes, reducing the types of materials and assembly steps, effectively lowering production material costs, labor assembly costs, and subsequent maintenance costs.

Description

Technical Field

[0001] This invention belongs to the field of perovskite solar cell technology, specifically relating to a single-sided perovskite solar cell module and its fabrication method. Background Technology

[0002] Perovskite solar cells have gained widespread attention in recent years for their outstanding advantages, such as excellent photoelectric conversion efficiency in low-light indoor environments, low manufacturing cost, and ability to be fabricated on flexible substrates. They are gradually being applied to built-in power solutions in consumer products such as remote controls, wireless sensors, and electronic price tags.

[0003] Currently, in conventional perovskite solar cell modules, the transparent bottom electrode and the metal top electrode are located on opposite sides of the cell, with the positive and negative leads distributed on the top and bottom surfaces or opposite edges of the module. Even with internal series connection technology to achieve dual-sided leads on the same surface, the positive and negative electrodes can only be arranged at the left and right ends of the same surface of the module. In practical applications of consumer electronics, the mainboard typically uses a single-sided wiring design with a centralized connector. Therefore, during electrical assembly of the aforementioned cell modules, the positive and negative electrodes at both ends must first be led out separately by soldering wires, and then converged to a single connector on the same side of the mainboard after spatial bending.

[0004] This electrode lead-out method has three significant drawbacks: First, it has high wiring complexity and occupies a large space. After the positive and negative wires are led out from both ends of the component, they need to cross the edge of the battery and bend and converge in the narrow internal space of the device, which not only increases the design difficulty of the cable layout, but also squeezes the precious internal space of the electronic product. Second, the electrical connection reliability is insufficient. The internal space of consumer electronics products is compact, and the connecting wires inevitably suffer repeated bending during assembly and maintenance. The solder joints at the convergence of the wires and the wire body are prone to poor contact or even open circuit failure due to mechanical fatigue, which directly leads to the failure of the battery component. Third, the material and assembly costs are high. The double-sided lead structure is incompatible with the single-sided FPC and centralized connector assembly process commonly used in consumer electronics modules. It requires additional wires, insulating fixing tape and manual welding processes, which increases the material costs and assembly and maintenance costs.

[0005] To address these issues, existing technologies often employ the method of attaching conductive tape, guiding one electrode along the cell surface to the same end as the opposite electrode, allowing the positive and negative electrodes to converge on the same side before being led out together. However, this approach still has significant technical limitations: it essentially only replaces traditional jumper wires with planar conductors attached to the cell surface, and the end of the conductive tape still needs to be transferred to the connector via welding or crimping; furthermore, the conductive tape exhibits significant stress concentration in the bend areas, making it prone to fatigue fracture or delamination after long-term service, resulting in poor mechanical durability. Therefore, this approach does not fundamentally shorten the electrical connection path, nor does it truly simplify the wiring structure, and it cannot effectively overcome the inherent defects of existing perovskite solar cell module electrode lead-out structures. There is still considerable room for optimization in this technology.

[0006] In view of this, the present invention is hereby proposed. Summary of the Invention

[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a single-sided perovskite solar cell module and its fabrication method. This addresses the problems of complex wiring, large space occupation, poor connection reliability (prone to fatigue fracture), and high material and assembly costs associated with existing perovskite solar cell modules in practical applications (especially consumer electronics) due to the separate placement of positive and negative electrodes on both sides of the module. Structurally, it completely eliminates the need for external jumper wires, busbars, and conductive tape, avoiding wire bending across the cell edge and space constraints. This significantly reduces wiring difficulty, eliminates fatigue fracture, poor contact, or solder joint failure caused by repeated bending and stress concentration of wires in existing technologies, and improves the mechanical durability of the module in a compact space.

[0008] To achieve the above objectives, the present invention provides the following technical solution: In a first aspect, the present invention provides a method for fabricating a single-sided perovskite solar cell module, comprising the following steps: S1. Provide a transparent substrate, and deposit a transparent conductive layer on the surface of the transparent substrate; S2. The transparent conductive layer is patterned by the first laser scribing to form multiple first etching grooves, which divide the transparent conductive layer into an effective area and a non-effective area located around the effective area. The non-effective area is provided with a first electrode area and a second electrode area that are mutually insulated from each other on the same side edge. S3. Fabricate battery functional modules on the patterned transparent conductive layer; S4. Perform a second laser scribing on the battery functional module to form multiple second etched grooves, wherein the second etched grooves are arranged adjacent to at least a portion of the first etched grooves. S5. A top electrode layer is prepared on the surface of the battery functional module, and a third laser scribing is performed on the top electrode layer to form multiple third etching grooves. The third etching grooves are arranged adjacent to at least a portion of the second etching grooves to form multiple sub-cells connected in series. The first electrode lead-out end corresponding to the top electrode is connected to the first electrode region, and the second electrode lead-out end corresponding to the transparent conductive layer located in the effective region is connected to the second electrode region. S6. Encapsulation is performed on the effective area and at least part of the non-effective area. After encapsulation, the first electrode area and the second electrode area are exposed, and finally a perovskite solar cell module with one side led out is obtained.

[0009] Preferably, in step S2, the first etched groove divides the transparent conductive layer of the non-effective area into a first region, a second region, and a third region that are mutually insulated. The first region is located on one side of the effective area, and the third region is located on the side adjacent to the first region and is connected to the effective area and the second electrode region. In step S5, the top electrode of the sub-cell that is far from the first electrode region is connected to the first electrode region through the second region.

[0010] Preferably, in step S2, the first etched groove divides the transparent conductive layer of the non-effective area into a first region, a second region, a third region, a fourth region, and a fifth region that are mutually insulated. The first region is located on one side of the effective area, and the fifth region is located on the side adjacent to the first region and is connected to the effective area and the second electrode area. The first region and the third region are arranged on opposite sides, and the fourth region and the fifth region are arranged on the same side. The fourth region is connected to the first electrode area, and the second region and the fourth region are arranged on opposite sides. In step S5, after the top electrode layer is prepared, the top electrode of the sub-cell near the second region is connected to the second region; after the third laser scribing is performed on the top electrode layer, an insulating layer is prepared on the top electrode layer. A conductive paste layer is prepared on the insulating layer, with one end of the conductive paste layer overlapping the second region and the other end overlapping the first electrode region.

[0011] Preferably, in step S2, the effective area includes a first effective area and a second effective area, wherein the first effective area and the second effective area are arranged side by side with their ends in opposite directions; In step S4, a second etched groove is prepared by using a second laser scribing to span the first effective region and the second effective region. The second etched groove penetrates the battery functional module and exposes the bottom transparent conductive layer, so that the transparent conductive layer of the sub-battery in the first effective region away from the first electrode region and the top electrode layer of the sub-battery in the second effective region away from the second electrode region are connected in series. In step S5, a third laser scribing is used to prepare a third etched groove, which, in addition to ensuring the effective connection at the series overlap of the first effective region and the second effective region, is used to isolate the first effective region and the second effective region. The top electrode of the sub-cell in the first effective region near the first electrode region is connected to the first electrode region, and the transparent conductive layer of the sub-cell in the second effective region near the second electrode region is connected to the second electrode region.

[0012] Specifically, after step S5 is completed and before step S6 is executed, a fourth laser scribing semi-cleaning step is also included: using a laser to remove the battery functional module and top electrode layer in the non-effective area, exposing the transparent conductive layer in the area.

[0013] Specifically, the packaging process in step S6 includes: UV-curable adhesive is evenly applied to the encapsulation area, covered with a transparent cover plate, and irradiated with UV light for 5-10 minutes to allow the UV-curable adhesive to fully cure. The projected area of ​​the transparent cover plate on the horizontal plane is smaller than the projected area of ​​the transparent substrate on the horizontal plane, so as to expose the first electrode area and the second electrode area.

[0014] Specifically, after packaging, solder pads are prepared on the first and second electrode areas using screen printing, scraping, or dot coating processes for external circuit connection.

[0015] Secondly, the present invention provides a perovskite solar cell module, which is prepared by the preparation method described above.

[0016] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects: 1. This invention achieves this through the coordinated design of the first, second, and third laser scribing patterns. This design allows the positive and negative leads to be located on the same side of the transparent substrate, requiring only an electrode area on the same edge of the substrate. This eliminates the need for external bridging wires, busbars, and conductive tape, avoiding the need for wires to cross battery edges and bend and converge within the space. Simultaneously, the effective area is maximized, and the dead area is correspondingly reduced. This fundamentally eliminates the risks of repeated wire bending and fatigue failure at solder joints at cross-surface convergence points, as seen in traditional dual-sided lead designs, significantly reducing poor contact. It also avoids the stress concentration, fatigue fracture, or adhesive layer delamination issues at corners found in conductive tape solutions, greatly simplifying cable routing within consumer electronics products. It is directly compatible with standard single-sided FPCs and centralized connectors, fitting the single-sided wiring design characteristics of consumer electronics motherboards and making it ideal for integrated installations in compact spaces.

[0017] 2. This invention eliminates the need for additional wiring, insulating tape, and manual welding, reducing the types of materials and assembly steps. The single-sided lead-out structure is compatible with the assembly process of standard consumer electronics modules, allowing for direct connector insertion or reflow soldering, effectively reducing production material costs, labor assembly costs, and subsequent maintenance costs. Furthermore, the specific method for implementing the single-sided lead-out provided by this invention is flexible and can be selected according to the different requirements of the component's size, shape, number of sub-cells, and application scenarios. In addition, only the scribing path and parameters of existing laser scribing equipment need to be adjusted; no new equipment types are required, resulting in low industrialization costs and easy implementation on existing production lines. Attached Figure Description

[0018] The accompanying drawings are incorporated in and form part of this specification, and together with the description serve to explain the principles of the invention.

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a flowchart of the preparation method of the present invention; Figure 2 A graphical schematic diagram of the transparent conductive layer in Example 1; Figure 3 This is a schematic diagram of the P1 etching scheme in Example 1; Figure 4 for Figure 3 Sectional view along AA′; Figure 5 This is a schematic diagram of the P2 etching scheme in Example 1; Figure 6 for Figure 5 Sectional view along AA′; Figure 7 This is a schematic diagram of the P3 etching scheme in Example 1; Figure 8 for Figure 7 Sectional view along AA′; Figure 9 This is a schematic diagram of the fourth laser scribing semi-edge cleaning process in Example 1; Figure 10 for Figure 9 Sectional view along AA′; Figure 11 This is a three-dimensional schematic diagram of the perovskite solar cell module of Example 1; Figure 12This is a graphical schematic diagram of the transparent conductive layer in Example 2; Figure 13 This is a schematic diagram of the P1, P2, and P3 etching scheme in Example 2; Figure 14 This is a schematic diagram of the fourth laser scribing semi-edge cleaning process in Example 2; Figure 15 This is a schematic diagram of the insulating layer in Example 2; Figure 16 This is a schematic diagram of the conductive paste layer in Example 2; Figure 17 This is a schematic diagram of the encapsulation glass cover plate in Example 2; Figure 18 A graphical schematic diagram of the transparent conductive layer in Example 3; Figure 19 This is a schematic diagram of the P1 etching scheme in Example 3; Figure 20 for Figure 19 Sectional view along AA′; Figure 21 for Figure 19 BB′ sectional view; Figure 22 This is a schematic diagram of the P2 etching scheme in Example 3; Figure 23 for Figure 22 Sectional view along AA′; Figure 24 for Figure 22 BB′ sectional view; Figure 25 This is a schematic diagram of the P3 etching scheme in Example 3; Figure 26 for Figure 25 Sectional view along AA′; Figure 27 for Figure 25 BB′ sectional view; Figure 28 for Figure 25 A cross-sectional view along the CC' direction; Figure 29 This is a schematic diagram of the fourth laser scribing semi-edge cleaning process in Example 3; Figure 30 for Figure 29 Sectional view along AA′; Figure 31 for Figure 29 BB′ sectional view; Figure 32 for Figure 29 A cross-sectional view along the CC' direction; Figure 33 This is a schematic diagram of the encapsulation glass cover plate in Example 3. Detailed Implementation

[0021] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples consistent with some aspects of the invention as detailed in the appended claims.

[0022] To enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0023] See Figure 1 As shown, the present invention provides a method for fabricating a single-sided perovskite solar cell module, comprising the following steps: S1. Provide a transparent substrate and deposit a transparent conductive layer on the surface of the transparent substrate; S2. The transparent conductive layer is patterned by the first laser scribing to form multiple first etching grooves, which divide the transparent conductive layer into an effective area and an ineffective area located around the effective area. The same side edge of the ineffective area is provided with a first electrode area and a second electrode area that are mutually insulated. In this application, a desired bottom electrode pattern is predefined on the transparent conductive layer, and the location of a pre-defined electrode area with one side leading out is simultaneously marked. A first etched groove penetrates the transparent conductive layer, dividing the originally continuous transparent conductive layer into multiple independent regions that are electrically insulated from each other.

[0024] The effective region, located within the module after fabrication, is the area responsible for photoelectric conversion. The transparent conductive layer within the effective region can be divided into multiple sub-electrode regions by several first etched grooves. These sub-electrode regions will serve as the bottom electrodes of their respective series-connected sub-cells in subsequent steps. The sub-electrode regions are electrically insulated from each other by the first etched grooves to ensure the formation of the series structure within the effective region.

[0025] The non-active region can be located circumferentially to the active region, that is, the area surrounding the active region. The non-active region can provide an exit channel for the transparent conductive layer within the active region, and a first electrode region and a second electrode region that are mutually insulated can be provided on the same side edge of the non-active region.

[0026] It should be noted that the first electrode region and the second electrode region can be two mutually insulated exposed areas on the transparent conductive layer, divided by the first etched groove. Here, "exposed" means that in subsequent steps, the battery functional module and the top electrode layer above the first electrode region and the second electrode region are removed, thereby directly exposing the transparent conductive layer for connection with external circuitry.

[0027] It should also be noted that the pattern design of the first etched groove in this step not only needs to consider the series arrangement of the sub-cells in the effective area, but also needs to be coordinated with the layout of the subsequent second and third etched grooves to achieve single-sided lead-out.

[0028] S3. Fabricate battery functional modules on the patterned transparent conductive layer; In this application, the battery functional module may include a hole transport layer, a perovskite layer, an electron transport layer, etc., stacked sequentially, and the specific materials and thicknesses are subject to what those skilled in the art can achieve.

[0029] S4. Perform a second laser scribing on the battery functional module to form multiple second etched grooves, wherein the second etched grooves are arranged adjacent to at least a portion of the first etched grooves. In this application, the second etched groove can penetrate the battery functional module. The second etched groove is arranged adjacent to the first etched groove, but not every first etched groove corresponds to a second etched groove. The extension direction or positional distribution of the second etched groove depends on the series connection direction or series connection method of the sub-cells.

[0030] S5. A top electrode layer is prepared on the surface of the battery functional module, and a third laser scribing is performed on the top electrode layer to form multiple third grooves. The third grooves are arranged adjacent to at least a portion of the second grooves to form multiple sub-cells connected in series. Among them, the first electrode lead-out end corresponding to the top electrode is connected to the first electrode region, and the second electrode lead-out end corresponding to the transparent conductive layer located in the effective region is connected to the second electrode region. In this application, the top electrode layer can cover the surface of the battery functional module, and the specific materials and thickness are subject to what those skilled in the art can achieve.

[0031] The third laser scribing line penetrates the top electrode layer and the battery functional module, dividing the top electrode layer into multiple independent regions corresponding to sub-cells. The third etched groove is positioned adjacent to the second etched groove, and together with the first etched groove, they form multiple series-connected sub-cells within the effective area. The third etched groove does not necessarily correspond one-to-one with each of the second etched grooves; its extension range or position can be selectively set according to the lead-out requirements.

[0032] S6. Encapsulation is performed on the effective area and at least part of the non-effective area. After encapsulation, the first electrode area and the second electrode area are exposed, and finally a perovskite solar cell module with one side led out is obtained.

[0033] In this embodiment, depending on the component design and scribe layout, there are three ways to connect the first electrode lead-out corresponding to the top electrode to the first electrode region, and the second electrode lead-out corresponding to the transparent conductive layer in the effective region to the second electrode region, as detailed below: Example 1 Please refer to Figures 2-11 As shown, this embodiment provides a method for fabricating a single-sided perovskite solar cell module, and the specific steps are as follows: S1. Provide a rigid transparent substrate, and deposit a transparent conductive layer on the substrate; Specifically, the transparent substrate is a glass substrate. The transparent conductive layer is an indium tin oxide (ITO) thin film, which is deposited on one side of the glass substrate using magnetron sputtering with a thickness of 150 nm.

[0034] S2, see also Figure 3 and 4 As shown, the transparent conductive layer is scribing with a first laser to divide the non-effective area into three mutually insulated regions: a first region F1, a second region F2, and a third region F3. Specifically, a laser with a wavelength of 1064nm is used to pattern the transparent conductive layer through a first laser scribing process (denoted as P1) to form multiple first etched grooves.

[0035] like Figure 3 As shown, the transparent conductive layer is rectangular. The direction of the long side is defined as the first direction, and the direction of the short side is defined as the second direction. The first direction is perpendicular to the second direction. For ease of description, based on the directions shown in the figures, the orientation within the plane of the transparent substrate is uniformly defined as follows: the direction of the long side of the transparent substrate is defined as the first direction, i.e., the horizontal or left-right direction; the direction of the short side of the transparent substrate is defined as the second direction, i.e., the vertical or up-down direction.

[0036] The first etched groove specifically includes: The first lower transverse P1 groove extends along the first direction from one edge of the transparent conductive layer to the opposite edge, and is located near the lower edge of the transparent conductive layer. The first lower transverse P1 groove is the lower boundary line between the effective area and the lower ineffective area. Multiple longitudinal P1 grooves extend upwards from the lower transverse grooves to the boundary of the effective area along the second direction, and the multiple longitudinal P1 grooves are arranged at equal intervals along the first direction. In this embodiment, there are four longitudinal P1 grooves, which divide the transparent conductive layer in the effective area into multiple sub-electrode regions; The first upper transverse P1 groove extends along the first direction from one side edge of the effective area to the boundary of the non-effective area, but does not penetrate to the opposite side edge of the transparent conductive layer. The second transverse P1 groove is located in the non-effective area and extends along the first direction. The second transverse P1 groove is parallel to the first upper transverse P1 groove and the first lower transverse P1 groove, and the ends of the second transverse P1 groove and the first upper transverse P1 groove are connected by a longitudinal P1 groove.

[0037] like Figure 3 As shown, through the above-mentioned groove pattern, the transparent conductive layer in the non-effective area is divided into three mutually insulated areas: a first area F1, a second area F2, and a third area F3. The first area F1 is located on one side of the effective area, and the third area F3 is located on the side adjacent to the first area F1 and is connected to the effective area and the second electrode area.

[0038] S3. Fabricate battery functional modules on the patterned transparent conductive layer; Specifically, a hole transport layer, a perovskite layer, and an electron transport layer can be fabricated sequentially, with the hole transport layer located near the transparent conductive layer. The specific materials and thicknesses are determined by those skilled in the art and will not be elaborated upon here.

[0039] S4, see also Figure 5 and 6 As shown, a second laser scribing is performed on the battery functional module to form multiple second etched grooves; Specifically, a second laser etching process (denoted as P2) is performed using a 532nm laser to form multiple second-etched P2 grooves.

[0040] The second etched P2 groove is at least partially adjacent to the first etched P1 groove. Specifically, a second etched P2 groove is formed on the left side of each longitudinal P1 groove (i.e., the side away from the first electrode region / second electrode region), and the second etched P2 groove is parallel to the corresponding longitudinal P1 groove and spaced 10-20 μm apart. It should be noted that the second etched P2 groove only extends to the upper and lower boundaries of the effective region and is not located in the non-effective region.

[0041] It should also be noted that the P2 groove runs through the electron transport layer, the perovskite layer, and the hole transport layer, exposing the underlying transparent conductive layer.

[0042] S5, see also Figure 7 and 8 As shown, the top electrode layer is prepared and a third laser scribing is performed; Ag or Cu with a thickness of 50-100 nm can be deposited on the electron transport layer using vapor deposition or PVD processes as the top electrode.

[0043] Specifically, a third laser scribing is performed on the top electrode layer to form multiple third etching grooves. The third etching grooves are arranged adjacent to the second etching grooves between adjacent sub-cells to form multiple sub-cells connected in series. The top electrode of the sub-cell far from the first electrode region is connected to the first electrode region through the second region F2 to achieve the same-side arrangement of the first electrode region and the second electrode region. Furthermore, after completing the third laser scribing process (P3), a fourth laser scribing semi-edge cleaning process is performed using a 532nm laser and a high-precision galvanometer module; the edge cleaning range coverage is detailed in [reference needed]. Figure 9 and 10 As shown: the 2mm area to the left of the first vertical P2 groove on the left, the 4mm area to the right of the first vertical P1 groove on the right, and the 2mm areas outside the first upper horizontal P1 groove and the first lower horizontal P1 groove, remove the functional layers and top electrode layer in the above areas, and retain the transparent conductive layer; the above areas include the positions where the first laser scribing was previously applied, and the substrate is exposed by laser cleaning.

[0044] S6, see also Figure 11 As shown, encapsulation is performed on the non-active and active regions, and the first electrode region and the second electrode region must be exposed during encapsulation. Specifically, the encapsulation process involves double-glass dispensing encapsulation, uniformly applying UV-curable adhesive to the encapsulation area of ​​the module. The width of the glass cover is the same as the width of the transparent substrate, and the length of the glass cover is smaller than that of the transparent substrate, which is used to expose the first electrode area (negative electrode -) and the second electrode area (positive electrode +). After the transparent substrate and the glass cover are pressed together, they are irradiated with a 320-395nm UV lamp for 5-10 minutes until fully cured, thus forming a single-sided perovskite solar cell module.

[0045] Specifically, the first and second electrode areas on the right side can be prepared with pads using methods such as screen printing, scraping, or dot coating for external lead soldering.

[0046] Through the above process, the top electrode (usually the negative electrode) in the inverted structure is guided through the bottom transparent conductive layer to the same side of the substrate as the bottom electrode (positive electrode).

[0047] Example 2 Please refer to Figures 12-17 This embodiment provides a method for fabricating a single-sided perovskite solar cell module, the specific steps of which are as follows: S1. Provide a rigid transparent substrate, and deposit a transparent conductive layer on the substrate; Specifically, the transparent substrate is a glass substrate. The transparent conductive layer is an indium tin oxide (ITO) thin film, which is deposited on one side of the glass substrate using magnetron sputtering with a thickness of 150 nm.

[0048] S2, see also Figure 12 As shown, the transparent conductive layer is scribing with a first laser to divide the non-effective area into a first region H1, a second region H2, a third region H3, a fourth region H4, and a fifth region H5 that are mutually insulated. Specifically, a laser with a wavelength of 1064nm is used to pattern the transparent conductive layer through a first laser scribing process (denoted as P1) to form multiple first etched grooves.

[0049] like Figure 12 As shown, the transparent conductive layer is rectangular, with the long side extending in the direction of the first direction and the short side extending in the direction of the second direction. The first direction and the second direction are perpendicular. The first etched groove specifically includes: The first lower transverse P1 groove extends along the first direction from one edge of the transparent conductive layer to the opposite edge, and is located near the lower edge of the transparent conductive layer. The first lower transverse P1 groove is the boundary line between the effective area and the lower ineffective area. Multiple longitudinal P1 grooves extend upwards from the lower transverse grooves to the boundary of the effective area along the second direction, and the multiple longitudinal P1 grooves are arranged at equal intervals along the first direction. In this embodiment, there are four longitudinal P1 grooves, which divide the transparent conductive layer in the effective area into multiple sub-electrode regions; The first upper transverse P1 groove extends from one side edge of the transparent conductive layer to the opposite side edge along the first direction; The second transverse P1 groove extends along the first direction within the non-effective region. The second transverse P1 groove is parallel to the first upper transverse P1 groove and the first lower transverse P1 groove, and the second transverse P1 groove is connected to a longitudinal P1 groove, which is connected to the first upper transverse P1 groove. The smallest area enclosed by the second transverse P1 groove, the longitudinal P1 groove, and the first upper transverse P1 groove is the first electrode region.

[0050] like Figure 12 As shown, through the above-mentioned groove pattern, the transparent conductive layer in the non-effective area is divided into five mutually insulated areas: the first area H1, the second area H2, the third area H3, the fourth area H4, and the fifth area H5. The first region H1 is located on one side of the effective region, the fifth region H5 is located on the side adjacent to the first region H1 and is connected to the effective region and the second electrode region. The first region H1 and the third region H3 are located on opposite sides, the fourth region H4 and the fifth region H5 are located on the same side, and the fourth region H4 is connected to the first electrode region. The second region H2 and the fourth region H4 are located on opposite sides.

[0051] S3. Fabricate battery functional modules on the patterned transparent conductive layer; Specifically, a hole transport layer, a perovskite layer, and an electron transport layer can be fabricated sequentially, with the hole transport layer located near the transparent conductive layer. The specific materials and thicknesses are determined by those skilled in the art and will not be elaborated upon here.

[0052] S4, see also Figure 13 As shown, a second laser scribing is performed on the battery functional module to form multiple second etched grooves; Specifically, a second laser scribing (denoted as P2) is performed using a 532nm laser to form multiple second etched P2 grooves.

[0053] The second etched P2 groove is at least partially adjacent to the first etched P1 groove. Specifically, a second etched P2 groove is formed on the left side of each longitudinal P1 groove (i.e., the side away from the first electrode region / second electrode region), and the second etched P2 groove is parallel to the corresponding longitudinal P1 groove and spaced 10-20 μm apart. It should be noted that the second etched P2 groove only extends to the upper and lower boundaries of the effective region and is not located in the non-effective region.

[0054] It should also be noted that the P2 groove runs through the electron transport layer, the perovskite layer, and the hole transport layer, exposing the underlying transparent conductive layer.

[0055] S5, see also Figure 13 As shown, the top electrode layer is prepared and a third laser scribing is performed, which is the same as in Example 1; See Figure 14 As shown, after the third laser scribing is completed, a 532nm laser is used in conjunction with a high-precision galvanometer module to perform a fourth laser scribing semi-edge cleaning process, the specific process of which is the same as in Example 1; Further, see Figure 15 As shown, after the fourth laser scribing half-edge cleaning is completed, an insulating layer is prepared on the top electrode layer. The insulating layer can be prepared by screen printing epoxy resin, or by using ALD or PVD processes to prepare a 50-100nm Al2O3 insulating layer. Further, see Figure 16 As shown, after the insulating layer is prepared, a 10-30 μm silver or copper conductive paste layer is screen-printed on it. One end of the conductive paste layer overlaps with the second region H2, and the other end overlaps with the first electrode region. The conductive paste on the left and right sides can occupy 30%-50% of the area of ​​the first region H1 and the first electrode region. The width of the conductive paste layer spanning the middle region is 5-10 mm, and the overlap width between the left and right sides of the first region and the first electrode region is 1-2 mm.

[0056] In a specific implementation, the conductive paste overlaps with the exposed transparent conductive layer (negative electrode) of the second region on the left side and overlaps with the first electrode region on the right side. S6, see also Figure 17As shown, the non-effective area and the effective area are encapsulated. During encapsulation, the first electrode area and the second electrode area must be exposed. The specific process is the same as in Example 1. However, it should be noted that the glass cover plate must completely cover the screen-printed conductive paste layer. The conductive paste layer and the effective area are encapsulated together in the glass cover plate to ensure the long-term reliability of the conductive paste layer. At the same time, the screen printing process does not affect the encapsulation effect.

[0057] Example 3 Please refer to Figures 18-33 This embodiment provides a method for fabricating a single-sided perovskite solar cell module, the specific steps of which are as follows: S1. Provide a rigid transparent substrate, and deposit a transparent conductive layer on the substrate; Specifically, the transparent substrate is a glass substrate. The transparent conductive layer is an indium tin oxide (ITO) thin film, which is deposited on one side of the glass substrate using magnetron sputtering with a thickness of 150 nm.

[0058] S2, see also Figure 18 As shown, the transparent conductive layer is scribed with a first laser to form multiple first etched grooves, which divide the transparent conductive layer into an effective area and an ineffective area. The effective area includes a first effective area and a second effective area, which are arranged side by side with their ends in opposite directions. Specifically, a laser with a wavelength of 1064nm is used to pattern the transparent conductive layer through a first laser scribing process (denoted as P1) to form multiple first etched grooves.

[0059] like Figure 19-21 As shown, the transparent conductive layer is rectangular, with the long side extending in the direction of the first direction and the short side extending in the direction of the second direction. The first direction and the second direction are perpendicular. The first etched groove specifically includes: Multiple first transverse P1 grooves extend from one edge of the transparent conductive layer to the opposite edge along a first direction. In this embodiment, there are three first transverse P1 grooves: a lower transverse P1 groove, a middle transverse P1 groove, and an upper transverse P1 groove. The middle transverse P1 groove is located between the lower and upper transverse P1 grooves, effectively dividing the area into a first effective area and a second effective area arranged along a second direction. The first effective area is located above the middle transverse P1 groove, and the second effective area is located below the middle transverse P1 groove. The lower and upper transverse P1 grooves serve as the boundaries between the effective area and the lower and upper non-effective areas, respectively. The first longitudinal P1 groove extends from the lower edge to the upper edge of the transparent conductive layer along the second direction. The first longitudinal P1 groove intersects with the three grooves in the first direction, further dividing the effective area into left and right parts along the first direction. Multiple second longitudinal P1 grooves; in this embodiment, there are two second longitudinal P1 grooves, one of which extends from the middle transverse P1 groove to the upper edge of the opposite side along the second direction (hereinafter referred to as the upper right local P1 groove), and is located on the side of the first longitudinal P1 groove near the first electrode area. The other end of one of them extends from the middle transverse P1 groove along the second direction to the lower edge of the opposite side (hereinafter referred to as the lower left local P1 groove), and is located on the side of the first longitudinal P1 groove away from the second electrode area. like Figure 19 As shown, the transparent conductive layer is divided into effective and ineffective regions by the aforementioned groove pattern. The effective region is further divided into multiple sub-electrode regions.

[0060] S3. Fabricate battery functional modules on the patterned transparent conductive layer; Specifically, a hole transport layer, a perovskite layer, and an electron transport layer can be fabricated sequentially, with the hole transport layer located near the transparent conductive layer. The specific materials and thicknesses are determined by those skilled in the art and will not be elaborated upon here.

[0061] S4, see also Figure 22-24 As shown, a second laser scribing is performed on the battery functional module to form multiple second etched grooves, and the second etched grooves are arranged adjacent to at least a portion of the first etched grooves. Specifically, a second laser etching process (denoted as P2) is performed using a 532nm laser to form multiple second etched P2 grooves. In this embodiment, the arrangement of the second etched P2 grooves is as follows: Within the first effective region, a second etched P2 trench is formed to the right of the first longitudinal P1 trench. This second etched P2 trench is located within the first effective region and serves as the P2 trench for the series connection of sub-cells within the first effective region. Similarly, a second etched P2 trench is formed to the right of the upper right local P1 trench. It should be noted that the function of this second etched P2 trench is to fill the top electrode layer during subsequent deposition steps, ensuring electrical connection between the top electrode layer of the sub-cell closest to the first electrode region (the rightmost side in the figure) and the transparent conductive layer region located in the non-effective region. This provides a path for the top electrode current to be drawn from the effective region to the first electrode region.

[0062] Within the second effective region, a second etched P2 groove is formed on the left side of the first longitudinal P1 groove. This second etched P2 groove is located within the second effective region and serves as the P2 groove for the series connection of sub-cells within the second effective region. In this application, a second etched P2 groove is provided on the side of the effective region furthest from the first electrode region (i.e., the leftmost side), which is the second etched P2 groove to the left of the lower left local P1 groove. This second etched P2 groove extends along a second direction, spanning both the first and second effective regions. It is located within the effective region, extending from the upper boundary of the first effective region to the lower boundary of the second effective region. In this configuration, the transparent conductive layer of the sub-cell in the first effective region furthest from the first electrode region is electrically connected to the top electrode layer of the sub-cell in the second effective region furthest from the second electrode region.

[0063] S5, see also Figure 25-28 As shown, a top electrode layer is prepared on the surface of the battery functional module, and a third laser scribing is performed on the top electrode layer to form multiple third grooves. Ag or Cu with a thickness of 50-100 nm can be deposited on the electron transport layer using vapor deposition or PVD processes as the top electrode.

[0064] A third laser scribing (denoted as P3) is performed using a 532nm laser to form multiple third etched P3 grooves. Specifically, the third etched P3 groove is arranged at least partially adjacent to one of the second etched P2 grooves. In this embodiment, the arrangement of the third etched P3 groove is as follows: Within the first effective region, a third etched P3 groove is provided on the side of the second etched P2 groove that is furthest from the first electrode region (i.e., the leftmost side) and closest to the first electrode region (i.e., the right side). The third etched P3 groove extends from the upper boundary of the first effective region along the second direction to the middle transverse P1 groove. The third etched P3 groove is used to isolate the top electrode layer of the leftmost sub-cell in the first effective region from the top electrode layer of its adjacent sub-cell on its right side, so as to ensure the series path.

[0065] The third etched P3 groove is located on the side of the first longitudinal P1 groove that extends upward along the second direction to the boundary of the first effective region, and is adjacent to the corresponding second etched P2 groove. This third etched P3 groove is used to cooperate with the second etched P2 groove in the first effective region to realize the series connection of sub-cells in the first effective region; The third etched P3 groove is located extending downwards from the transverse P1 groove along the second direction to the boundary of the second effective region, situated on the side of the first longitudinal P1 groove away from the second electrode region, and adjacent to the corresponding second etched P2 groove. This third etched P3 groove is used in conjunction with the second etched P2 groove within the second effective region to achieve series connection of sub-cells within the second effective region.

[0066] Based on the above-described layout, the sub-cells within the first effective area are connected in series from right to left along the first direction. That is, the sub-cell closest to the first electrode region is the starting point of the series path in the first effective area, and the sub-cell furthest from the first electrode region is the ending point of the series path. The series connection is achieved through the corresponding P1 / P2 / P3 etched grooves for each sub-cell: the bottom electrode (transparent conductive layer) of each sub-cell is electrically connected to the top electrode layer of its adjacent sub-cell through the P2 groove, while the P3 groove isolates the top electrode layer of that sub-cell from the top electrode layers of its adjacent sub-cells, ensuring that the current flows along the series direction.

[0067] The transparent conductive layer of the leftmost sub-cell in the first effective region is electrically connected to the top electrode layer of the leftmost sub-cell in the second effective region through the leftmost second etched P2 groove. The leftmost second etched P2 groove runs through the battery functional module. After the top electrode layer is deposited, it fills the groove, so that the corresponding electrodes of the upper and lower effective regions form a conductive path at the groove, thereby realizing the end-to-end electrical connection between the first and second effective regions.

[0068] Within the second effective region, each sub-cell is connected in series from left to right along the first direction. That is, the sub-cell furthest from the second electrode region (leftmost) is the starting point of the series connection path in the second effective region, and the sub-cell closest to the second electrode region (rightmost) is the ending point. The series connection method is similar to that in the first effective region, achieved through the cooperation of three sets of etched grooves (P1 / P2 / P3), but the connection direction is opposite to that in the first effective region.

[0069] The sub-cell closest to the first electrode region (i.e., the rightmost side) in the first effective region has no third etched P3 groove next to the second etched P2 groove on the right side of the local P1 groove in the upper right. Therefore, the top electrode of the sub-cell closest to the first electrode region in the first effective region is connected to the first electrode region.

[0070] The transparent conductive layer of the sub-cell closest to the second electrode region (i.e., the rightmost side) within the second effective region is connected to the second electrode region. Thus, the transparent conductive layer of the sub-cell closest to the second electrode region within the second effective region is connected to the second electrode region.

[0071] Further, see Figure 29-32 As shown, after completing the third laser scribing process, a fourth laser scribing semi-edge cleaning process is performed using a 532nm laser and a high-precision galvanometer module. The semi-edge cleaning range of the fourth laser scribing covers the area shown in the figure. Figure 29 As shown: the area to the left of the first vertical P1 scribe line on the left, the area to the right of the first vertical P1 scribe line on the right, and the area outside the upper horizontal P1 groove and the lower horizontal P1 groove, remove the functional layers and top electrode layer in the above areas.

[0072] S6, see also Figure 33As shown, the non-effective and effective areas are encapsulated, exposing the first and second electrode areas during encapsulation. UV-curable adhesive is uniformly applied to the encapsulation area; the glass cover is the same width as the substrate but shorter in length to expose the first and second electrode areas; after lamination, it is fully cured by irradiation with a 320-395nm UV lamp for 10 minutes, resulting in a perovskite solar cell module with a single-sided lead interface.

[0073] In summary, all three embodiments described above achieve a top electrode that converges with the bottom transparent conductive layer, screen-printed conductive paste, or a series overlap structure, ultimately settling on the same edge of the module. The functional layer structure and film layer process of the core power generation area remain unchanged, and the module's photoelectric conversion efficiency is essentially the same as that of a conventional double-sided lead structure. The single-sided electrode pad design allows the module to be directly inserted into a single-sided FPC connector in consumer electronics or to undergo a single reflow soldering process, completely eliminating the risk of open circuits caused by external wire bending across surfaces. This significantly improves wiring reliability and assembly efficiency, while reducing labor, material, and maintenance costs.

[0074] It should be noted that the effective area of ​​both Embodiment 1 and Embodiment 2 consists of four sub-cells connected in series, while the first and second effective areas of Embodiment 3 each include two sub-cells connected in series. The non-effective area in the accompanying drawings of this invention includes the packaging area, the first electrode area, the second electrode area, and the etched grooves located in the non-effective area.

[0075] In this embodiment of the application, after the encapsulation is completed, pads are prepared on the first electrode area and the second electrode area by screen printing, scraping or dot coating processes for external circuit connection.

[0076] The pad material can be conductive paste such as silver paste, copper paste, or nickel paste, or a low-temperature solder alloy. The pad preparation process can be screen printing, scraping, or dot coating, applying the conductive paste to the exposed transparent conductive layer surface of the first and second electrode areas, and then curing at a low temperature (e.g., baking at 80–150°C for 10–30 minutes) to form a firm conductive pad.

[0077] The area and thickness of the pads can be designed according to the specifications of the external connector. The pads cover at least a portion of the first and second electrode areas and form good ohmic contact with the transparent conductive layer.

[0078] The pads can be rectangular, circular, or strip-shaped. An insulating gap is maintained between the pads on the first electrode region and the pads on the second electrode region. This gap can be naturally formed by the first etched groove, or it can be cut again by laser after packaging to ensure its insulation.

[0079] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention.

[0080] It should be understood that the present invention is not limited to the content already described above, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A method for fabricating a single-sided perovskite solar cell module, characterized in that, Includes the following steps: S1. Provide a transparent substrate, and deposit a transparent conductive layer on the surface of the transparent substrate; S2. The transparent conductive layer is patterned by the first laser scribing to form multiple first etching grooves, which divide the transparent conductive layer into an effective area and a non-effective area located around the effective area. The non-effective area is provided with a first electrode area and a second electrode area that are mutually insulated from each other on the same side edge. S3. Fabricate battery functional modules on the patterned transparent conductive layer; S4. Perform a second laser scribing on the battery functional module to form multiple second etched grooves, wherein the second etched grooves are arranged adjacent to at least a portion of the first etched grooves. S5. A top electrode layer is prepared on the surface of the battery functional module, and a third laser scribing is performed on the top electrode layer to form multiple third etching grooves. The third etching grooves are arranged adjacent to at least a portion of the second etching grooves to form multiple sub-cells connected in series. The first electrode lead-out corresponding to the top electrode is connected to the first electrode region, and the second electrode lead-out corresponding to the transparent conductive layer located in the effective region is connected to the second electrode region. S6. Encapsulation is performed on the effective area and at least part of the non-effective area. After encapsulation, the first electrode area and the second electrode area are exposed, and finally a perovskite solar cell module with one side led out is obtained.

2. The preparation method according to claim 1, characterized in that, In step S2, the first etched groove divides the transparent conductive layer of the non-effective area into a first region, a second region, and a third region that are mutually insulated. The first region is located on one side of the effective area, and the third region is located on the side adjacent to the first region and is connected to the effective area and the second electrode area. In step S5, the top electrode of the sub-cell that is far from the first electrode region is connected to the first electrode region through the second region.

3. The preparation method according to claim 1, characterized in that, In step S2, the first etched groove divides the transparent conductive layer of the non-effective area into a first region, a second region, a third region, a fourth region, and a fifth region that are mutually insulated. The first region is located on one side of the effective area, and the fifth region is located on the side adjacent to the first region and is connected to the effective area and the second electrode area. The first region and the third region are arranged on opposite sides, and the fourth region and the fifth region are arranged on the same side. The fourth region is connected to the first electrode area, and the second region and the fourth region are arranged on opposite sides. In step S5, after the top electrode layer is prepared, the top electrode of the sub-cell near the second region is connected to the second region; after the third laser scribing is performed on the top electrode layer, an insulating layer is prepared on the top electrode layer. A conductive paste layer is prepared on the insulating layer, with one end of the conductive paste layer overlapping the second region and the other end overlapping the first electrode region.

4. The preparation method according to claim 1, characterized in that, In step S2, the effective area includes a first effective area and a second effective area, and the first effective area and the second effective area are arranged side by side with their ends facing opposite directions; In step S4, a second etched groove is prepared by using a second laser scribing to span the first effective region and the second effective region. The second etched groove penetrates the battery functional module and exposes the bottom transparent conductive layer, so that the transparent conductive layer of the sub-battery in the first effective region away from the first electrode region and the top electrode layer of the sub-battery in the second effective region away from the second electrode region are connected in series. In step S5, a third laser scribing is used to prepare a third etched groove, which, in addition to ensuring the effective connection at the series overlap of the first effective region and the second effective region, is used to isolate the first effective region and the second effective region. The top electrode of the sub-cell in the first effective region near the first electrode region is connected to the first electrode region, and the transparent conductive layer of the sub-cell in the second effective region near the second electrode region is connected to the second electrode region.

5. The preparation method according to claim 1, characterized in that, After step S5 is completed and before step S6 is executed, a fourth laser scribing semi-cleaning step is also included: using a laser to remove the battery functional module and top electrode layer in the non-effective area, exposing the transparent conductive layer in the area.

6. The preparation method according to claim 1, characterized in that, The packaging process in step S6 specifically includes: UV-curable adhesive is evenly applied to the encapsulation area, covered with a transparent cover plate, and irradiated with UV light for 5-10 minutes to allow the UV-curable adhesive to fully cure. The projected area of ​​the transparent cover plate on the horizontal plane is smaller than the projected area of ​​the transparent substrate on the horizontal plane, so as to expose the first electrode area and the second electrode area.

7. The preparation method according to claim 1, characterized in that, After packaging, solder pads are prepared on the first and second electrode areas using screen printing, scraping, or dot coating processes for external circuit connection.

8. A perovskite solar cell module, prepared by any one of the preparation methods described in claims 1-7.

Images