Semiconductor refrigeration sheet encapsulation device and control method thereof

Abstract

This invention discloses a semiconductor refrigeration chip encapsulation device and its control method, relating to the field of semiconductor refrigeration chip packaging technology. The device includes a frame, and on the frame are a feeding assembly, an encapsulation operating table assembly, an adhesive feeding and cutting assembly, and a material unloading and wire management assembly. The feeding assembly continuously feeds the chips through multiple storage boxes and a pushing module. The encapsulation operating table assembly positions the refrigeration chip and rotates it, working in conjunction with the adhesive feeding and cutting assembly to complete the wrapping, pressing, and cutting of the sealing tape. The material unloading and wire management assembly sequentially completes the material unloading, transfer, and wire bonding pressing and fixing. The control method includes feeding, pressing and encapsulating, cutting and releasing, clamping and transferring, and wire management unloading steps, which can automatically complete the entire process. This invention has high integration, precise encapsulation positioning, effectively improving the automation level and production efficiency of semiconductor refrigeration chip edge sealing processing, and ensuring consistent edge sealing quality.

Description

Technical Field

[0001] This invention relates to the field of semiconductor cooling chip packaging technology, and more specifically to a semiconductor cooling chip encapsulation device and its control method. Background Technology

[0002] Semiconductor refrigeration chips, as core components of thermoelectric cooling, are widely used in temperature control equipment, optoelectronic communications, medical instruments, and other fields. The tape wrapping of their side seams is a critical step in the device packaging process. Tape wrapping enhances the structural reinforcement and protection of the device's sides, providing a technological foundation for subsequent adhesive coating, sealing, and welding assembly. As downstream industries continue to increase their demand for both production capacity and quality of semiconductor refrigeration chips, the industry is placing higher demands on the automation level, processing precision, and production continuity of the tape wrapping process.

[0003] Currently, the encapsulation process for semiconductor cooling chips largely relies on manual labor or single-station semi-automatic equipment. This not only results in low encapsulation efficiency and poor consistency in tape pressing position, easily leading to quality problems such as weak adhesion and misalignment, but also means that the material feeding process often uses a single storage box, requiring machine shutdown for material changes, resulting in insufficient continuous production capacity. Furthermore, the encapsulation process is separated from the lead bonding and fixing process, lacking an integrated wire management and fixing station. The lead pads are easily displaced by external forces, affecting the reliability of subsequent welding. The overall processing flow has low integration and is difficult to adapt to the needs of large-scale mass production. Summary of the Invention

[0004] This invention provides a semiconductor cooling chip encapsulation device and its control method to solve the problems of low efficiency of manual encapsulation, poor consistency of edge sealing quality, easy loosening and displacement of lead wire bonding, and insufficient automated continuous processing capability in the prior art.

[0005] To achieve the above objectives, one embodiment of the present invention provides a semiconductor cooling chip encapsulation device, comprising: a frame; a feeding assembly disposed on the frame, including a plurality of storage boxes and a pushing module for pushing cooling chips out of the storage boxes; an encapsulation operating table assembly disposed on the frame, including a guide plate, an operating table, a positioning module for pressing the cooling chips, and a rotating assembly for driving the operating table to rotate, wherein the pushing module pushes the cooling chips onto the operating table via the guide plate; a glue supply and cutting assembly disposed on the frame, including a tape reel for loading tape and an extrusion cutting module, wherein the extrusion cutting module, in conjunction with the rotation of the operating table, wraps and presses the tape into the sealing seam of the cooling chip and cuts it; and a material unloading and wire handling assembly disposed on the frame, including a clamping module for removing the encapsulated cooling chips from the operating table, a wire clamping module for pressing and fixing the cooling chip leads, and a material transfer module for transferring materials between the clamping module and the wire clamping module.

[0006] Furthermore, the feeding assembly also includes a drive module and a lifting module disposed on the frame; the drive module is used to drive a plurality of the storage boxes to move back and forth, and the lifting module is disposed inside the frame to lift the cooling chips in the storage boxes located above it upward.

[0007] Furthermore, the pushing module includes an X-axis moving component, a pusher head, and a first electric pusher cylinder; the X-axis moving component drives the pusher head to push the cooling chip at the top of the storage box onto the guide plate and move it to the end of the guide plate, and the first electric pusher cylinder drives the pusher head to push the cooling chip onto the operating table.

[0008] Furthermore, the positioning module is located above the operating table and includes a pressing plate and a lifting assembly. The lifting assembly drives the pressing plate to descend to press the cooling element. The rotating assembly is located below the operating table and is used to drive the operating table, the pressing plate and the cooling element to rotate synchronously.

[0009] Furthermore, the glue supply and cutting assembly also includes a guide pulley; the extrusion cutting module includes a cutter head, an extrusion wheel, and two sets of electric propulsion assemblies that are independently connected to the cutter head and the extrusion wheel; during the glue coating process, one set of electric propulsion assemblies pushes the extrusion wheel to press the tape into the sealing seam of the cooling sheet, and after the tape coating is completed, the other set of electric propulsion assemblies drives the cutter head to extend and cut the tape.

[0010] Furthermore, the clamping module includes an electric clamp, a second electric push cylinder, and a longitudinal moving component; a notch is provided on the operating table, the longitudinal moving component drives the electric clamp to move back and forth to the rear end of the operating table, and the second electric push cylinder drives the electric clamp to extend into the notch to clamp the cooling chip and move it backward.

[0011] Furthermore, the material transfer module includes a suction cup, a vertical transfer component that drives the suction cup to move up and down, and an X-axis transfer component that drives the suction cup to move left and right; the suction cup uses negative pressure to pick up and transfer the cooling element on the clamping module.

[0012] Furthermore, the wire clamping module includes a fixed platform, two wire clamping heads, and a driving assembly; the fixed platform is provided with fixing clamps around its perimeter for fixing the cooling chip, and the driving assembly drives the two wire clamping heads to approach each other and extend into the sealing seam of the cooling chip to press and fix the solder joint of the lead wire.

[0013] On the other hand, a control method for a semiconductor cooling chip coating apparatus is also provided, applied to the aforementioned semiconductor cooling chip coating apparatus, characterized by comprising the following steps: S1 feeding steps: The lifting module lifts the cooling chip in the storage box, and the pushing module pushes the top cooling chip onto the operating table via the guide plate. S2 pressing and wrapping steps: The pressing plate of the positioning module descends to press the cooling sheet, the end of the tape is pre-fixed in the sealing seam of the cooling sheet, the rotating component drives the operating table and the cooling sheet to rotate, and at the same time the extrusion wheel of the extrusion cutting module extends to press the tape into the sealing seam for wrapping. S3 Cutting and Release Steps: After the adhesive is wrapped, the cutting head of the extrusion cutting module extends to cut the adhesive tape, and then the pressing plate rises to release the cooling element; S4 clamping and transferring steps: The electric clamp of the clamping module extends into the operating table to clamp it and moves it backward. Then the suction cup of the transferring module picks up the cooling chip and moves it to the fixed platform of the wire clamping module. S5 cable handling and unloading steps: The fixed table fixes the cooling chip, and the drive assembly drives the two wire clamps into the sealing seam to press and fix the lead wire at the solder joint; after processing, the transfer module picks up the cooling chip again and transfers it to the next process.

[0014] Furthermore, in the S1 feeding step, the material status of the storage box is monitored. When the storage box is detected to be empty, the drive module moves all the storage boxes backward so that the next storage box is positioned directly above the lifting module.

[0015] The present invention provides a semiconductor refrigeration chip encapsulation device and its control method, which integrates a functional architecture of feeding, rotary encapsulation and pressing, automatic tape cutting, material transfer and lead wire bonding fixation to achieve continuous automated processing of semiconductor refrigeration chip edge sealing and encapsulation. The multi-storage box rotation feeding mode effectively reduces downtime for material change, and the rotary operating table and independently fed extrusion and pressing structure ensure accurate tape pressing position and consistent edge sealing quality. The synchronously set wire clamping station can position and fix the lead wire bonding points in the edge sealing seam to avoid wire displacement affecting the reliability of subsequent welding. Overall, it significantly improves production efficiency and product packaging quality stability. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the semiconductor cooling chip coating device provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the semiconductor cooling chip encapsulation device provided in an embodiment of the present invention from another angle; Figure 3 This is a schematic diagram of the internal structure of the semiconductor cooling chip encapsulation device provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the internal structure of the semiconductor cooling chip encapsulation device provided in an embodiment of the present invention from another angle; Figure 5 This is provided by the embodiments of the present invention. Figure 1 Enlarged view of a portion of point A in the middle; Figure 6 This is provided by the embodiments of the present invention. Figure 2 Enlarged view of a section at point B in the middle; Figure 7 This is provided by the embodiments of the present invention. Figure 3 Enlarged view of a section at point C; The components include: 1. Frame; 2. Storage box; 201. Drive module; 202. Lifting module; 3. Guide plate; 4. Operating table; 401. Rotating component; 5. Pushing module; 501. X-axis moving component; 502. Push head; 503. First electric push cylinder; 6. Positioning module; 601. Pressing plate; 602. Lifting component; 7. Belt reel; 701. Guide pulley; 8. Extrusion cutting module; 801. Cutting head; 802. Extrusion wheel; 803. Electric push component; 9. Clamping module; 901. Electric clamp; 902. Second electric push cylinder; 903. Longitudinal moving component; 10. Transfer module; 11. Suction cup; 111. Vertical transfer component; 12. X-axis transfer component; 13. Wire clamping module; 131. Fixing table; 132. Wire clamping head; 133. Drive component. Detailed Implementation

[0017] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the scope of the present invention.

[0018] It should be noted that the directional terms such as "front," "back," "left," and "right" mentioned in this embodiment are only used to describe the relative positional relationships shown in the accompanying drawings in order to simplify the explanation, and do not limit the present invention to be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0019] The following is combined with Figures 1-7 This invention is described in detail.

[0020] like Figures 1 to 6As shown, this embodiment discloses a semiconductor refrigeration chip encapsulation device, including a frame 1. The frame 1 is a vertical frame formed by splicing aluminum profiles, and the worktable is made of anti-static bakelite board. Along the material processing flow direction, the frame 1 is sequentially integrated with a feeding assembly, an encapsulation operation table assembly, a glue supply and cutting assembly, and a material unloading and wire management assembly. This device can continuously complete the entire process of automatic feeding of the semiconductor refrigeration chip, edge sealing tape wrapping and pressing, automatic tape cutting, and lead wire bonding and pressing, achieving integrated production of multiple processes within a single device. The semiconductor refrigeration chip targeted in this embodiment is a sheet-like structure with an internal thermopile sandwiched between upper and lower ceramic substrates. The annular side gap between the upper and lower substrates is the edge sealing seam, and the encapsulation tape used is a high-temperature resistant insulating and reinforcing tape with a width adapted to the edge sealing seam.

[0021] Specifically, the feeding assembly is located at the feeding end of the frame 1, including a material rack, several storage boxes 2, a drive module 201, a lifting module 202, and a pushing module 5. The material rack is slidably mounted on the table surface of the frame 1 in the front-to-back direction. In this embodiment, a total of 4 storage boxes 2 are provided and fixed on the material rack at equal intervals in the front-to-back direction. Each storage box 2 is a vertically through rectangular box with vertical guide ribs on the inner wall. The internal cavity size is fitted with the outer shape of the semiconductor refrigeration chip to be stacked and stored. The stacking quantity is 50-100 chips. A circular clearance through hole is opened in the center of the bottom plate of each storage box 2. The diameter of the through hole is smaller than the side length of the refrigeration chip, allowing the lifting structure to pass through. The drive module 201 is fixed to the platform of the frame 1, and specifically includes a linear guide rail arranged in the front-to-back direction, a servo drive motor, and a synchronous belt transmission mechanism. The bottom of the material rack is fixedly connected to the slider of the linear guide rail. The servo drive motor drives the material rack to move stepwise along the linear guide rail through the synchronous belt. The moving step distance is consistent with the center distance of the adjacent storage box 2, which can accurately position the designated storage box 2 directly above the lifting module 202. Figure 4As shown, the lifting module 202 is fixed inside the frame 1, directly below the storage box 2. It includes a lifting servo cylinder and a lifting plate. The lifting plate is horizontally fixed to the output end of the servo cylinder, and an anti-slip silicone pad is attached to its top surface. The total stroke of the lifting servo cylinder is adapted to the height of the storage box 2. The single lifting height is equal to the thickness of a single thermoelectric cooler. It can lift the thermoelectric coolers in the storage box 2 one by one from bottom to top to the material retrieval height above the table. The lifting module 202 is equipped with a photoelectric material shortage sensor to detect whether the thermoelectric coolers in the storage box 2 are currently empty. The pusher module 5 is mounted on the side of the storage box 2, including an X-axis moving component 501, a pusher head 502, and a first electric pusher cylinder 503. The X-axis moving component 501 is a ball screw linear module, arranged horizontally in the left-right direction, and a mounting base is fixed on its slide. The first electric pusher cylinder 503 is a miniature electric pusher, fixed on the mounting base in the front-back direction, with its output end facing the side of the operating table 4. The pusher head 502 is an L-shaped hard pusher block with a rubber buffer head attached to the front end, fixed to the output end of the first electric pusher cylinder 503. The X-axis moving component 501 can drive the pusher head 502 to move horizontally in the left-right direction, pushing the uppermost cooling chip, which has been lifted into position, horizontally onto the guide plate 3. The first electric pusher cylinder 503 can drive the pusher head 502 to feed in the left-right direction, pushing the cooling chip at the end of the guide plate 3 to the machining center of the operating table 4.

[0022] The feeding component provided in this embodiment of the invention adopts a multi-storage box rotation feeding mode. After the current storage box is emptied, the next storage box can be quickly switched to the working position through the drive module, without the need for manual replenishment, effectively extending the continuous production time of the equipment. The stepping lifting of the lifting servo cylinder, combined with photoelectric sensor detection, can achieve precise feeding of each piece, avoiding positioning deviations caused by manual feeding. The L-shaped pusher head with a buffer structure ensures a smooth and impact-free pushing process, without scratching the surface of the cooling ceramic, providing a stable foundation for the processing accuracy of the subsequent coating process.

[0023] Specifically, such as Figure 5As shown, the overmolding operating table assembly includes a guide plate 3, an operating table 4, a positioning module 6, and a rotating component 401. The guide plate 3 is a long, rigid plate horizontally fixed between the storage box 2 and the operating table 4. Its upper surface has a guide groove adapted to the shape of the thermoelectric cooler. The groove width is matched to the side length of the cooler, and the groove depth is less than the thickness of the cooler. The guide groove extends in the left-right direction. Both the inlet and outlet ends are chamfered for guidance. The bottom of the groove at the outlet end is flush with the table surface of the operating table 4, ensuring a smooth transition of the cooler to the operating table 4 during pushing. The operating table 4 is a square platform with a U-shaped notch on its rear side. The notch opening faces rearward, and its width is greater than the side length of the cooler, extending to near the center of the table surface for subsequent clamping structures to reach and retrieve the material. A shallow groove is provided at the center of the operating table 4 as a positioning reference to initially define the placement position of the cooler. The rotating component 401 is a hollow servo rotating platform, fixedly installed below the operating table 4. Its output flange is fixedly connected to the bottom center of the operating table 4, which can drive the operating table 4 to rotate uniformly around the vertical axis. The speed is adjustable within the range of 5-30 r / min, and the rotation angle can be precisely controlled to ensure that it stops precisely at the cutting position after a full circle of coating. The positioning module 6 is mounted on the top of the operating table 4 via a column, including a lifting component 602 and a pressing plate 601. The lifting component 602 is a miniature lifting electric cylinder with the output end facing downward. The output end of the lifting component 602 is fixed with a rotating connecting seat. The pressing plate 601 is rotatably mounted on the rotating connecting seat via a deep groove ball bearing. A silicone anti-slip pad is attached to the lower surface of the pressing plate. When the lifting component 602 drives the pressing plate 601 to descend, it can press and fix the semiconductor cooling chip to the center of the operating table 4. The pressing plate 601 can rotate synchronously with the operating table 4 and the cooling chip without relative friction.

[0024] The encapsulation worktable assembly provided in this embodiment of the invention uses the guide groove of the guide plate to limit the movement of the cooling chip throughout the process, ensuring the stability and positional accuracy of the pushing process and avoiding material deviation and misalignment. The hollow servo rotary platform has high rotational accuracy and stable speed. Combined with the pressing and positioning of the pressing plate, there is no relative movement of the material during the encapsulation process, ensuring that the tape is evenly wrapped along the sealing seam. The pressing plate adopts a bearing rotation connection structure, which can rotate freely with the worktable without interfering with the rotation. At the same time, the silicone anti-slip pad ensures the pressing friction and avoids damaging the ceramic substrate of the cooling chip, ensuring the smoothness of the encapsulation operation and the product yield.

[0025] Specifically, such as Figure 2 and Figure 5As shown, the glue supply and cutting assembly is located on the side of the operating table 4, including a tape reel 7, several guide rollers 701, and an extrusion cutting module 8. The tape reel 7 is rotatably mounted on a vertical support on the side of the frame 1 via a reel shaft. The reel shaft is equipped with a damping locking knob. The rolled-up glued tape is sleeved on the reel shaft. The unwinding tension can be adjusted by the damping locking knob to prevent the tape from becoming loose or excessively stretched during unwinding. There are two guide rollers 701, namely the infeed guide roller and the outlet guide roller, which are installed sequentially on the support along the tape conveying path. The infeed guide roller is equipped with a spring to maintain the tension of the tape. After the tape passes through the guide rollers, the outlet end is aligned parallel to the sealing seam of the cooling sheet to ensure that the tape can be accurately embedded into the gap. The extrusion cutting module 8 includes a cutter head 801, an extrusion roller 802, and two independent electric actuators 803. Both electric actuators 803 are miniature linear electric actuators, fixed to a bracket on the side of the operating table 4 via independent mounting bases, and arranged radially along the operating table 4, with their output ends facing the rotation center of the operating table. One set of electric actuators 803 has a wheel frame connected to its output end. The extrusion roller 802 is a cylindrical roller made of polyurethane, vertically rotating and mounted on the wheel frame, with the side of the roller in contact with the working surface of the tape. During the tape wrapping process, this set of electric actuators drives the extrusion roller 802 to feed towards the cooling plate, pressing the tape into the sealing seam with constant pressure. The roller can rotate freely with the tape feed without sliding friction. Another set of electric push assembly 803 has a cutter holder connected to its output end. The cutter head 801 is a beveled stainless steel blade that can be detachably fixed on the cutter holder. After the entire roll of tape is completed, the electric push assembly drives the cutter head 801 to feed laterally, accurately cutting the tape with a smooth cut without stringing.

[0026] The adhesive supply and cutting assembly provided in this embodiment of the invention uses a damped tape reel with an adjustable tension guide wheel to achieve constant tension and stable tape delivery, preventing tape wrinkles, loosening, or stretching deformation, and ensuring tape flatness. The extrusion wheel and the cutter head are driven by independent electric actuators, allowing for independent and precise control of the pressing force, feed speed, and cutting timing. This ensures that the tape is fully pressed into the bottom of the sealing seam, adheres firmly without lifting edges, and can accurately cut the tape after the entire tape is wrapped, eliminating the need for manual cutting. The polyurethane extrusion wheel does not damage the tape surface, and the stainless steel blade has a long service life and is easy to replace, effectively improving the tape wrapping quality and equipment maintenance efficiency.

[0027] Specifically, such as Figure 3 and Figure 7As shown, the unloading and wire sorting assembly includes a clamping module 9, a transferring module 10, and a wire clamping module 13. The clamping module 9 is located directly behind the operating table 4 and includes an electric clamp 901, a second electric push cylinder 902, and a longitudinal moving component 903. The longitudinal moving component 903 is a ball screw linear module, horizontally mounted in the front-to-back direction, with a vertical mounting plate fixed on its slide. The second electric push cylinder 902 is a transverse miniature electric push rod, fixed to the mounting plate in the front-to-back direction, with its output end facing the notch side of the operating table 4. The electric clamp 901 is a parallel opening and closing electric gripper, fixed to the output end of the second electric push cylinder 902. Both grippers have anti-slip silicone pads on their inner sides, and the clamping force is adjustable. During clamping, the gripper is aligned with the front and rear sides of the cooling element. The longitudinal moving component 903 can drive the electric clamp 901 to move back and forth as a whole. The second electric push cylinder 902 can drive the electric clamp 901 to extend laterally into the U-shaped notch of the operating table 4, clamp the cooling element, and then move it backward out of the operating table.

[0028] Specifically, the material transfer module 10 is mounted on a gantry frame above the clamping module 9 and the wire clamping module 13, and includes an X-axis transfer assembly 12, a vertical transfer assembly 111, and two negative pressure suction cups 11. The X-axis transfer assembly 12 is a synchronous belt linear module, horizontally fixed on the crossbeam of the gantry frame in the left-right direction; the vertical transfer assembly 111 is a miniature lifting electric cylinder, fixed on the slide of the X-axis transfer assembly 12, with the output end facing downwards; the two negative pressure suction cups 11 are anti-static silicone suction cups, arranged with the adsorption surface facing downwards; both negative pressure suction cups 11 are connected to an external vacuum generator through air pipes, and can adsorb the upper ceramic surface of the cooling chip through negative pressure. The X-axis transfer assembly 12 and the vertical transfer assembly 111 work together to drive the suction cups to complete lifting and lateral movement, realizing the precise transfer of the cooling chip between the clamping station, the wire clamping station, and the downstream discharge station.

[0029] Specifically, such as Figure 6As shown, the wire clamping module 13 is located on the discharge side of the transfer module 10, and includes a fixed platform 131, four fixed clamps, two wire clamping heads 132, and a drive assembly 133. The fixed platform 131 is a square anti-static bakelite platform with its surface flush with the surface of the operating table 4; the four fixed clamps are lateral electric positioning clamps, which are installed on the four sides of the fixed platform 131 respectively. When clamping, they feed synchronously towards the center, and can center and clamp the cooling chip from four sides. The drive assembly 133 is a bidirectional lead screw linear module, arranged horizontally below the fixed platform 131. Two clamping heads 132 are fixed to two opposing slides of the bidirectional lead screw, allowing them to move synchronously in opposite directions. Each clamping head 132 has a flat pressing end, with a thickness less than the width of the sealing seam, and a rounded corner at the front end. The two clamping heads 132 are symmetrically arranged on the left and right sides of the fixed platform 131. When feeding in opposite directions, they can extend into the sealing seam of the cooling chip, pressing and fixing the bonding position of the internal leads. A photoelectric positioning sensor is located on the side of the fixed platform 131. Upon detecting that the cooling chip is in place, it triggers the clamping action of the fixing clamp and the clamping head pressing action.

[0030] The material feeding and wire handling assembly provided in this invention, through the clamping module and the notch design of the operating table, can directly reach into the workstation to pick up materials. The operation is simple and efficient, without the need for additional flipping or lifting mechanisms. The material transfer module uses double negative pressure suction cups to transfer workpieces, ensuring uniform force and stable adsorption without scratching the ceramic surface, and can accurately connect the front and rear workstations. The wire clamping module integrates the overmolding and lead wire bonding fixing processes into the same equipment. The centering and positioning of the four fixed clamps ensures accurate pressing position. The bidirectional screw-driven wire clamping head has good synchronization. The flat pressure head can press and fix the lead wire in the sealing seam without damaging the internal thermopile, preventing the wire from shifting and loosening in subsequent transfer and welding processes, reducing process turnover links, and effectively improving overall processing efficiency and product welding reliability.

[0031] The complete operation and control process of the semiconductor cooling chip encapsulation device described in this embodiment is as follows: S1 Loading Procedure: After the equipment starts, the lifting servo cylinder of the lifting module 202 feeds upward, lifting the uppermost semiconductor cooling chip in the current workstation storage box 2 to the picking height; the X-axis moving component 501 of the pushing module 5 drives the pusher head 502 to move in the left and right direction, pushing the cooling chip along the guide groove of the guide plate 3 to the right workstation; then the first electric pusher cylinder 503 drives the pusher head 502 to move forward, pushing the cooling chip to the center positioning position of the operating table 4, and the pusher head resets to wait for the next push. When the material shortage sensor detects that the current storage box 2 is empty, the drive module 201 drives the material rack and all storage boxes 2 to move backward one workstation, so that the next full storage box 2 is accurately positioned directly above the lifting module 202, and the feeding continues.

[0032] S2 pressing and wrapping steps: The lifting component 602 of the positioning module 6 drives the pressing plate 601 to descend, pressing and fixing the cooling sheet onto the operating table 4; the starting end of the tape is manually pasted into the sealing seam at the front end of the cooling sheet in advance; the rotating component 401 drives the operating table 4, the pressing plate 601 and the cooling sheet to rotate synchronously and uniformly; at the same time, the electric push component 803 of the corresponding extrusion wheel 802 in the extrusion and cutting module 8 feeds, so that the extrusion wheel continuously presses the tape into the sealing seam with constant pressure, and completes the whole circle of wrapping with tape as the cooling sheet rotates.

[0033] S3 Cutting and Release Steps: After the cooling chip rotates a full circle, the rotating component 401 decelerates and stops at the cutting station. The electric push component 803 corresponding to the cutter head 801 drives the cutter head to extend and cut the tape laterally. The cutter head then resets. Subsequently, the lifting component 602 drives the pressing plate 601 to rise and release the completed cooling chip.

[0034] S4 clamping and transferring steps: The longitudinal moving component 903 of the clamping module 9 drives the electric clamp 901 to move forward to the rear side of the operating table 4. The second electric push cylinder 902 drives the electric clamp 901 to extend into the U-shaped notch of the operating table. After the electric clamp clamps the two sides of the cooling sheet, the longitudinal moving component 903 drives it to move backward to the transfer station. The vertical transfer component 111 of the transfer module 10 drives the negative pressure suction cup 11 to descend. The vacuum generator starts to adsorb the cooling sheet. After the suction cup rises, the X-axis transfer component 12 drives the cooling sheet to move laterally to the fixed platform 131 of the clamping module 13. The suction cup descends to release the cooling sheet onto the table surface.

[0035] S5 wire handling and unloading steps: The fixing clamps around the fixed table 131 feed synchronously, clamping and positioning the cooling chip from four directions; the drive assembly 133 drives the two wire clamping heads 132 to feed synchronously towards each other, extending into the sealing seams on the left and right sides of the cooling chip, pressing and fixing the lead wire bonding points; after pressing, the wire clamping heads and fixing clamps are reset in sequence, and the material transfer module 10 picks up the cooling chip again and transfers it to the downstream laser welding process station to complete a single cycle of processing.

[0036] In summary, the semiconductor cooling chip encapsulation device and its control method provided by this invention effectively reduce downtime for material replenishment and achieve long-term continuous automated feeding by using a multi-storage box rotating feeding structure combined with a chip-by-chip lifting and pushing mechanism. Relying on a rotating operating table and an independently driven extrusion and cutting structure, the tape can be precisely pressed into the sealing seam, ensuring uniform and firm encapsulation, significantly improving the stability of the sealing quality. Simultaneously, the device integrates a wire clamping and fixing station, allowing direct pressing and positioning of the lead wires within the sealing seam after encapsulation, preventing wire displacement and ensuring the reliability of subsequent welding processes. The entire device integrates multiple processes such as feeding, encapsulation, cutting, transfer, and wire management, with smooth connections between stations, significantly reducing manual operation intensity and process turnover losses, effectively improving the production efficiency and product yield of semiconductor cooling chip edge sealing, and adapting to the processing needs of large-scale mass production.

[0037] The above description is merely a preferred embodiment of the technical solution of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A device for coating semiconductor cooling chips, characterized in that, include: Rack (1); The feeding assembly is mounted on the frame (1) and includes a plurality of storage boxes (2) and a pusher module (5) for pushing out the cooling chips in the storage boxes (2). The coating operation table assembly is set on the frame (1) and includes a guide plate (3), an operation table (4), a positioning module (6) for pressing the cooling sheet, and a rotating assembly (401) for driving the operation table (4) to rotate. The pushing module (5) pushes the cooling sheet onto the operation table (4) via the guide plate (3). The adhesive supply and cutting assembly is set on the frame (1) and includes a tape reel (7) for loading tape and an extrusion cutting module (8). The extrusion cutting module (8) works in conjunction with the rotation of the operating table (4) to wrap the tape around and press it into the sealing seam of the cooling sheet and cut it. The unloading and wire sorting assembly is set on the frame (1) and includes a clamping module (9) for removing the coated cooling chip from the operating table (4), a wire clamping module (13) for pressing and fixing the cooling chip lead wire, and a material transfer module (10) for transferring materials between the clamping module (9) and the wire clamping module (13).

2. The semiconductor cooling chip coating apparatus according to claim 1, characterized in that, The feeding assembly also includes a drive module (201) and a lifting module (202) disposed on the frame (1); the drive module (201) is used to drive a plurality of the storage boxes (2) to move back and forth, and the lifting module (202) is disposed inside the frame (1) to lift the cooling chip in the storage box (2) located above it upward.

3. The semiconductor cooling chip coating apparatus according to claim 1, characterized in that, The pushing module (5) includes an X-axis moving component (501), a pusher (502), and a first electric pusher cylinder (503); the X-axis moving component (501) drives the pusher (502) to push the cooling chip at the top of the storage box (2) onto the guide plate (3) and move it to the end of the guide plate (3); the first electric pusher cylinder (503) drives the pusher (502) to push the cooling chip onto the operating table (4).

4. The semiconductor cooling chip coating apparatus according to claim 1, characterized in that, The positioning module (6) is located above the operating table (4) and includes a pressing plate (601) and a lifting component (602). The lifting component (602) drives the pressing plate (601) to descend to press the cooling chip. The rotating component (401) is located below the operating table (4) and is used to drive the operating table (4), the pressing plate (601) and the cooling chip to rotate synchronously.

5. The semiconductor cooling chip coating apparatus according to claim 1, characterized in that, The glue supply and cutting assembly also includes a guide pulley (701); the extrusion cutting module (8) includes a blade (801), an extrusion wheel (802), and two sets of electric push assemblies (803) that are independently connected to the blade (801) and the extrusion wheel (802); during the glue wrapping process, one set of electric push assemblies (803) pushes the extrusion wheel (802) to press the tape into the sealing seam of the cooling sheet. After the tape wrapping is completed, the other set of electric push assemblies (803) drives the blade (801) to extend and cut the tape.

6. The semiconductor cooling chip coating apparatus according to claim 1, characterized in that, The clamping module (9) includes an electric clamp (901), a second electric push cylinder (902), and a longitudinal moving component (903); a notch is provided on the operating table (4), and the longitudinal moving component (903) drives the electric clamp (901) to move back and forth to the rear end of the operating table (4), and the second electric push cylinder (902) drives the electric clamp (901) to extend into the notch to clamp the cooling chip and move it backward.

7. The semiconductor cooling chip coating apparatus according to claim 1, characterized in that, The material transfer module (10) includes a suction cup (11), a vertical transfer component (111) that drives the suction cup (11) to move up and down, and an X-axis transfer component (12) that drives the suction cup (11) to move left and right; the suction cup (11) picks up the cooling chip on the clamping module (9) by negative pressure and transfers it.

8. The semiconductor cooling chip coating apparatus according to claim 1, characterized in that, The wire clamping module (13) includes a fixed platform (131), two wire clamping heads (132) and a driving component (133); the fixed platform (131) is provided with fixing clamps around the perimeter for fixing the cooling chip, and the driving component (133) drives the two wire clamping heads (132) to approach each other and extend into the sealing seam of the cooling chip to press and fix the solder joint of the lead wire.

9. A control method for a semiconductor cooling chip coating apparatus, applied to the semiconductor cooling chip coating apparatus according to any one of claims 1-8, characterized in that, Includes the following steps: S1 feeding steps: The lifting module (202) lifts the cooling chip in the storage box (2), and the pushing module (5) pushes the uppermost cooling chip onto the operating table (4) via the guide plate (3); S2 pressing and wrapping steps: The pressing plate (601) of the positioning module (6) descends to press the cooling sheet, the end of the tape is pre-fixed in the sealing seam of the cooling sheet, the rotating component (401) drives the operating table (4) and the cooling sheet to rotate, and at the same time the extrusion wheel (802) of the extrusion cutting module (8) extends to press the tape into the sealing seam for wrapping. S3 Cutting and Releasing Steps: After the adhesive is wrapped, the cutting head (801) of the extrusion cutting module (8) extends to cut the adhesive tape, and then the pressing plate (601) rises to release the cooling chip; S4 clamping and transferring steps: The electric clamp (901) of the clamping module (9) extends into the operating table (4) to clamp it and move it backward. Then the suction cup (11) of the transfer module (10) picks up the cooling chip and transfers it to the fixed table (131) of the wire clamping module (13). S5 Wire handling and unloading steps: The fixed table (131) fixes the cooling chip, and the drive assembly (133) drives the two wire clamps (132) into the sealing seam to press and fix the lead wire at the welding point; after the processing is completed, the transfer module (10) picks up the cooling chip again and transfers it to the next process.

10. The control method according to claim 9, characterized in that, In the S1 feeding step, the material status of the storage box (2) is monitored. When the storage box (2) is detected to be empty, the drive module (201) drives all the storage boxes (2) to move backward, so that the next storage box (2) is positioned directly above the lifting module (202).

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