Chip cleaning method

Abstract

This application discloses a chip cleaning method, comprising: placing a chip that has undergone delamination processing on a substrate; attaching a cellulose composite film to the chip surface; treating the cellulose composite film to encapsulate particles on the chip surface; and peeling the cellulose composite film off the chip to remove the particles from the chip surface. By introducing a cellulose composite film, utilizing its flexibility and encapsulation capabilities, and subjecting it to specific treatment, the film material of the cellulose composite film can penetrate deep into the tiny gaps between the particles and the chip surface, forming a tight encapsulation structure. By peeling the cellulose composite film encapsulating the particles off the chip, non-destructive and efficient removal of particles from the chip surface can be achieved, thereby improving the clarity of the observed images and the accuracy of the analytical conclusions in chip failure analysis.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, specifically relating to a chip cleaning method. Background Technology

[0002] In chip failure analysis (FA), dry etching is used to remove the oxide layer on the chip surface to expose the underlying aluminum wiring layer for SEM (Scanning Electron Microscope) observation in order to observe the internal metal interconnects, vias, and device structures. However, for aluminum-manufactured chips, a large amount of particulate contaminants remain on the exposed aluminum surface after the delamination process. This contaminant covers the aluminum surface and severely obscures the microscopic morphology of metal grains, electromigration holes, or defects, thus affecting the clarity of observation and the accuracy of failure analysis conclusions. Summary of the Invention

[0003] To address the aforementioned technical problems, this application provides a chip cleaning method that can effectively and non-destructively remove particulate contaminants from the chip surface.

[0004] The technical solution adopted to achieve the purpose of this application is as follows: This application provides a chip cleaning method, including: The chip that has completed the delamination process is placed on the carrier wafer; A cellulose replica membrane is attached to the surface of the chip; The cellulose replica membrane is processed to coat the particles on the surface of the chip. The cellulose replica membrane is peeled off the chip to remove particles from the chip surface.

[0005] In some embodiments, treating the cellulose replica membrane to encapsulate the particles on the chip surface includes: The substrate containing the chip and the cellulose replica membrane is transferred to a heating stage, and the heating stage is set to a preset temperature. The cellulose replica membrane is heated, causing it to shrink and encapsulate the particles on the chip surface.

[0006] In some embodiments, before transferring the substrate containing the chip and the cellulose replica membrane onto the heating stage, the method further includes: An acetone solution is dropped onto the surface of the cellulose replica membrane, causing the cellulose replica membrane to adhere tightly to the chip surface and the gaps between the particles on the chip surface.

[0007] In some embodiments, when heating the cellulose replica membrane, the preset temperature is 60°C to 80°C, and the heating time is 3 min to 5 min.

[0008] In some embodiments, peeling the cellulose replica membrane off the chip includes: Remove the substrate from the heating stage; The cellulose replica membrane is cooled; The cellulose replica membrane is peeled off the chip.

[0009] In some embodiments, peeling the cellulose replica membrane off the chip includes: The slide is then transferred to the lens of the microscope; Use tweezers to grasp the edge of the cellulose replica membrane and peel it off from the chip.

[0010] In some embodiments, before placing the chip, after the delamination process, onto the carrier wafer, the method further includes: The chip surface after the delamination process is completed is rinsed with acetone solution; The chip is then dried.

[0011] In some embodiments, rinsing the chip surface after the delamination process using an acetone solution includes: Use a dropper or wash bottle to draw up the acetone solution; The acetone solution is dropped onto the chip surface at an angle above the chip surface after the delamination process is completed, and the chip surface is rinsed with the acetone solution.

[0012] In some embodiments, rinsing the chip surface after the delamination process using an acetone solution includes: The chip surface after the delamination process is completed is rinsed multiple times with acetone solution, with each rinse lasting 10 to 15 seconds.

[0013] In some embodiments, the cellulose replica film comprises cellulose acetate paper.

[0014] As can be seen from the above technical solution, this application introduces a cellulose composite membrane, utilizes the flexibility and encapsulation ability of the cellulose composite membrane, and performs specific treatments on it, so that the membrane material of the cellulose composite membrane can penetrate into the tiny gaps between the particles and the chip surface and form a tight encapsulation structure. By peeling the cellulose composite membrane containing the particles from the chip, the particles on the chip surface can be removed non-destructively and efficiently, thereby improving the clarity of the observed images and the accuracy of the analysis conclusions in chip failure analysis. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a first flowchart of a chip cleaning method provided in an embodiment of this application; Figure 2 This is a second flowchart of a chip cleaning method provided in an embodiment of this application. Detailed Implementation

[0017] To enable those skilled in the art to more clearly understand this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0018] In semiconductor device failure analysis, dry etching is commonly used to remove the oxide layer on the chip surface to expose the underlying aluminum metal wiring structure, facilitating the observation of internal metal interconnects, vias, and device microstructure using a scanning electron microscope (SEM). For aluminum-based chips, after the delamination process, the exposed aluminum surface is prone to retaining a large number of micron- or submicron-sized particulate contaminants. These contaminants mainly originate from chemical reaction byproducts during etching, environmental dust, and impurities introduced during the process. Due to the softness and microstructure of the aluminum surface, these particles can adhere tightly and even embed themselves in surface gaps, forming a stubborn coating. During SEM observation, these particles severely interfere with the focusing and scanning of the electron beam, obscuring the boundary details of metal grains, voids caused by electromigration, and potential defect areas, resulting in blurred images and making it impossible to accurately identify failure characteristics. The decreased observation clarity directly affects the reliability of failure analysis conclusions, leading to biased fault diagnosis and hindering effective diagnosis and improvement of chip performance issues. In response, this application proposes a chip cleaning method. Please refer to [link / reference]. Figure 1 The method mainly includes the following steps: S100. Place the chip that has completed the delamination process onto the carrier wafer.

[0019] First, the chip, after the delamination process, is placed on a carrier to provide a stable working platform for subsequent cleaning operations. For example, the chip can be placed directly and stably in the center of the carrier; alternatively, to ensure the chip does not shift during operation, it can be lightly secured using mechanical clamps, or grooves can be provided on the carrier to allow the chip to be embedded. The carrier can be a glass slide or other flat and heat-resistant substrate; no special restrictions are placed here.

[0020] S200, attach the cellulose composite membrane to the chip surface.

[0021] Next, take a cellulose replica film slightly larger than the chip surface and attach it to the chip surface to ensure close contact between the cellulose replica film and the chip surface and its attached particles. For example, a cellulose replica film can be laid flat on the chip surface and gently pressed with a soft tool to ensure full contact with the chip surface.

[0022] S300: The cellulose composite membrane is processed to encapsulate the particles on the chip surface.

[0023] Subsequently, the cellulose composite membrane is treated to encapsulate the particles on the chip surface. For example, the cellulose composite membrane can be left on the chip surface for a period of time at room temperature, utilizing the membrane material's microstructure and surface tension to gradually penetrate and encapsulate the tiny particles on the chip surface. Alternatively, uniform external pressure can be applied to the cellulose composite membrane, causing the membrane material to deform better under pressure, thereby encapsulating the particles more tightly.

[0024] S400: Peel the cellulose composite membrane off the chip to remove particles from the chip surface.

[0025] Finally, the cellulose replica membrane is peeled off the chip to remove particles from the chip surface. For example, tweezers or fingertips can be used to carefully peel the cellulose replica membrane slowly and evenly, starting from the edge. Alternatively, airflow assistance can be used to separate the cellulose replica membrane from the chip surface by blowing air along its edges, thus reducing potential damage to the chip surface during the peeling process.

[0026] This application's embodiments introduce a cellulose composite membrane, utilizing its flexibility and encapsulation capabilities, and subject it to specific treatments. This allows the membrane material to penetrate deep into the tiny gaps between particles and the chip surface, forming a tight encapsulation structure. By peeling the cellulose composite membrane containing the particles from the chip, non-destructive and efficient removal of particles from the chip surface can be achieved, thereby improving the clarity of the observed images and the accuracy of the analytical conclusions in chip failure analysis.

[0027] In some embodiments, the process of processing the cellulose replica film in step S300 to make the cellulose replica film wrap around the particles on the chip surface mainly includes: transferring the carrier sheet carrying the chip and the cellulose replica film to the heating stage and setting the heating stage to a preset temperature; heating the cellulose replica film to shrink and wrap around the particles on the chip surface.

[0028] The heating stage is a device that provides controlled heat, its core function being to provide the heat energy needed to shrink the cellulose composite film. The heating stage can be an electric heating plate, using resistance wire for temperature control; it can also be a device that uses infrared radiation or hot air convection for heating. The preset temperature is a specific temperature value pre-set to achieve effective shrinkage of the cellulose composite film. Its purpose is to ensure that the heating process takes place within the effective shrinkage temperature range of the cellulose composite film, avoiding damage to the film from excessively high temperatures or insufficient shrinkage from excessively low temperatures. The preset temperature can be set through the temperature controller built into the heating stage.

[0029] Heating the cellulose multilayer membrane is a crucial step in triggering its shrinkage. This process utilizes the thermal response characteristics of the cellulose multilayer membrane material to induce deformation upon heating. Heating can be achieved through heat conduction, transferring heat from the heating stage to the cellulose multilayer membrane via a carrier sheet; or it can be achieved by direct application of heat radiation or convection to the membrane surface. When the cellulose multilayer membrane shrinks due to heat, its volume or area decreases, generating an inward tightening force. This causes the membrane to adhere more tightly to the chip surface and actively traps particles attached to the chip surface, including microparticles and particles located in depressions, firmly encapsulating them within the membrane or at the membrane-chip interface.

[0030] This active shrinkage mechanism allows the cellulose composite membrane to adhere more tightly to the chip surface and penetrate deep into the microstructure and particle gaps of the chip surface. The cohesive force or surface tension generated during the shrinkage process of the cellulose composite membrane effectively and firmly encapsulates the particles on the chip surface, forming a stable composite. Compared to relying solely on passive adhesion, this active heat-shrinkage method significantly enhances the cellulose composite membrane's particle encapsulation ability and removal efficiency, thereby ensuring the complete removal of particles from the chip surface.

[0031] In some embodiments, please refer to Figure 2 Before transferring the substrate containing the chip and the cellulose replica film to the heating stage, the process may further include: S30, adding acetone solution to the surface of the cellulose replica film to make the cellulose replica film adhere tightly to the chip surface and between the particles on the chip surface.

[0032] Acetone, as an organic solvent, exhibits good wettability and some solubility for cellulose replica films, softening their surface and enhancing their flowability. For example, acetone solution can be precisely added to specific areas of the cellulose replica film using a dropper, or evenly sprayed across the entire surface using a spray device to ensure thorough wetting. The addition of acetone solution makes the cellulose replica film more flexible and malleable, allowing for better contact with the chip surface. This softening effect enables the cellulose replica film to more effectively fill microscopic irregularities on the chip surface and penetrate the tiny gaps between the adhering particles and the chip surface, achieving tight adhesion.

[0033] Before transferring the substrate containing the chip and cellulose replica membrane to the heating stage, an acetone solution is pre-dropped onto the surface of the cellulose replica membrane. The wetting and slight swelling effect of the acetone solution on the cellulose replica membrane enhances its flexibility and flowability before heat shrinkage. This pretreatment allows the cellulose replica membrane to more effectively fill the microstructure of the chip surface and penetrate into the tiny gaps between the adhering particles and the chip surface, achieving a more thorough initial adhesion. Subsequently, when the substrate is transferred to the heating stage and the cellulose replica membrane is heated, the already tightly adhered and penetrated cellulose replica membrane further shrinks, thus firmly encapsulating the particles on the chip surface with stronger encapsulation force. This pre-adhesive adhesion provides a superior foundation for subsequent heat shrinkage, ensuring complete particle encapsulation and significantly improving the thoroughness and efficiency of cleaning.

[0034] In some embodiments, the preset temperature for heating the cellulose replica film can be 60°C to 80°C. If the preset temperature is too high, it may cause annealing and discoloration of the aluminum layer in the chip; if the preset temperature is too low, the drying rate of the cellulose replica film may be too slow. By setting the preset temperature range to 60°C to 80°C, it can be ensured that the membrane material of the cellulose replica film receives sufficient energy to deform, thereby tightly adhering to and encapsulating the tiny particles on the chip surface. For example, a heating controller with a high-precision temperature sensor can be used to monitor the temperature of the heating stage in real time through a closed-loop feedback mechanism and adjust the power according to the preset value; alternatively, a heating element with good thermal stability can be used in conjunction with a heat transfer medium to ensure that heat is uniformly and stably transferred to the substrate and the cellulose replica film.

[0035] Correspondingly, the heating time can be set to 3-5 minutes to ensure that the cellulose replica membrane has sufficient time to complete the shrinkage process and fully encapsulate the particles on the chip surface, while avoiding membrane material degradation or chip damage that may occur due to prolonged heating. For example, a timer module integrated into the heating device can be used, which can automatically start the heating process and send a signal or automatically stop heating after the preset time is reached; alternatively, operators can use an external timer for manual monitoring and control.

[0036] By precisely controlling the preset temperature within the range of 60℃ to 80℃ and limiting the heating time to 3 to 5 minutes, the cellulose replica membrane can be ensured to shrink in a controlled and sufficient manner upon heating. Within this specific temperature range, the polymer segments of the cellulose replica membrane receive appropriate thermal energy, enhancing their molecular mobility. This promotes uniform shrinkage of the membrane, allowing it to tightly adhere to the chip surface and effectively encapsulate the tiny particles attached to the chip surface. Simultaneously, the limited heating time ensures that the membrane has sufficient time to complete this shrinkage and encapsulation process, allowing the particles to be firmly fixed within the membrane without causing a decline in membrane material performance or thermal damage to the chip due to overheating. This precise temperature and time control allows the cellulose replica membrane to perform its replicating and adsorption capabilities at their optimal state, laying the foundation for subsequent peeling steps and ensuring that particles can be efficiently and completely removed from the chip surface.

[0037] In some embodiments, peeling the cellulose replica film from the chip in step S400 may include: removing the carrier from the heating stage; cooling the cellulose replica film; and peeling the cellulose replica film from the chip. Removing the carrier from the heating stage aims to terminate the heating of the cellulose replica film. This operation can be performed manually, such as using tweezers or a suction cup to smoothly remove the carrier from the heated area; or it can be performed automatically using automated equipment, such as a robotic arm or a conveyor system, to automatically move the carrier to a non-heated area after a preset heating time.

[0038] Cooling the cellulose multilayer membrane aims to lower its temperature and restore its physical properties (such as hardness, toughness, and adhesion) to a suitable state for peeling. Cooling methods can include natural cooling, where the substrate is placed at room temperature, allowing it to gradually cool through heat exchange with the surrounding air, preventing the membrane from becoming brittle due to sudden cooling. Peeling the cellulose multilayer membrane from the chip can be done manually, for example, by carefully lifting it from the edge using fine tweezers or a blade; or it can be done using an automated peeling device that precisely controls the peeling angle and speed to ensure complete removal of the membrane. This cooling-then-peeling sequence ensures that the cellulose multilayer membrane has good mechanical strength and low adhesion during peeling, allowing for complete and clean removal from the chip surface, effectively removing the encapsulated particles and avoiding problems such as peeling difficulties, membrane breakage, or residue residue caused by membranes that are too soft, too sticky, or too brittle.

[0039] In some embodiments, peeling the cellulose replica membrane from the chip may include: transferring the slide to the lens of a microscope; using tweezers to grasp the edge of the cellulose replica membrane and peeling it off the chip. Placing the slide carrying the chip and the cellulose replica membrane within the microscope's observation area provides high-magnification visual assistance for subsequent peeling operations, allowing the operator to clearly observe the chip surface, the edge of the cellulose replica membrane, and any microparticles that may be present, thereby enabling precise positioning and manipulation.

[0040] The tweezers used can be pointed tweezers with fine tips, allowing for easy insertion into the tiny gaps between the membrane edge and the chip surface. Alternatively, a vacuum pen can be used, employing suction to adhere to the membrane edge, achieving contactless or low-contact gripping to avoid physical damage to the membrane or chip surface. The tweezers can be made of anti-static material to prevent electrostatic adsorption of particles or electrostatic damage to the chip. The peeling process can be performed manually by manipulating the tweezers to slowly and evenly lift the cellulose replica membrane from the chip surface at an appropriate angle. Alternatively, an automated robotic arm system can be used, with preset peeling paths and speeds, to achieve precise and highly repeatable peeling operations, further improving efficiency and consistency.

[0041] By transferring the substrate containing the chip and the cellulose replica membrane under the lens of a microscope, operators can observe the microscopic details of the chip surface and the cellulose replica membrane. With this high-magnification vision, operators can precisely grasp the edges of the cellulose replica membrane using tweezers. Through this precise gripping and visual guidance, operators can slowly and evenly peel the cellulose replica membrane from the chip in a controlled manner. This peeling method minimizes membrane tearing or secondary particle detachment, ensuring that the encapsulated particles are removed along with the cellulose replica membrane, thereby achieving efficient cleaning of the chip surface.

[0042] In some embodiments, please refer to Figure 2 Before placing the chip, after the delamination process, onto the carrier wafer, the process may further include: S10, rinsing the surface of the chip with an acetone solution; and S20, drying the chip. Acetone solution, as an organic solvent, has good solubility and volatility, and can be used to clean organic contaminants and particles from the surface of semiconductor devices. Analytical grade acetone solution can be selected. For example, the acetone solution can be sprayed onto the chip surface in a mist or fine stream using a spraying device, utilizing the impact and dissolving power of the solution for cleaning. Alternatively, an immersion cleaning method can be used, completely submerging the chip in the acetone solution, supplemented with gentle stirring or ultrasonic vibration to enhance the cleaning effect.

[0043] The purpose of drying the chip is to remove residual acetone solution from its surface, preventing adverse effects on the performance of the cellulose replica film in subsequent steps, or the formation of bubbles during heating that could compromise the cleaning process. Simultaneously, ensuring the chip surface is dry facilitates uniform adhesion of the cellulose replica film. Various methods can be employed for drying. For example, high-purity nitrogen or clean air can be used for purging, carrying away the solvent from the chip surface. Alternatively, the chip can be placed in a clean vacuum environment for vacuum drying to accelerate solvent evaporation.

[0044] Before placing the chip, after delamination, onto a carrier and attaching the cellulose replica film, the chip surface is rinsed with acetone solution and then dried. The acetone solution effectively dissolves and removes any organic contaminants and loose particles present on the chip surface, while the drying process ensures no residual solvent remains. This pretreatment provides a highly clean and dry surface for subsequent cellulose replica film attachment, significantly enhancing the adhesion between the cellulose replica film and the chip surface and its particles. When the cellulose replica film is treated, it more thoroughly and uniformly coats the tiny particles on the chip surface, avoiding incomplete coating or reduced cleaning efficiency caused by surface uncleanliness. Finally, when peeling off the cellulose replica film, particles on the chip surface can be more effectively removed, improving the thoroughness and reliability of chip cleaning.

[0045] In some embodiments, rinsing the chip surface after delamination with acetone solution may include: drawing up the acetone solution using a dropper or wash bottle; dripping the acetone solution onto the chip surface at an angle above it, and rinsing the chip surface with the acetone solution. Using a dropper or wash bottle to draw up the acetone solution provides a controlled and convenient method for obtaining and initially delivering the acetone solution. Droppers are suitable for scenarios requiring small doses and precise application, while wash bottles are suitable for rinsing larger areas or applications requiring a certain flow rate. Besides droppers or wash bottles, syringes, peristaltic pumps with nozzles, etc., can also be used to draw up and initially deliver the acetone solution to meet different cleaning needs and operational precision requirements.

[0046] Adding acetone solution at an angle allows it to form a flowing liquid film on the chip surface, rather than through direct impact or accumulation. This allows the liquid's fluidity to carry away loose particles and contaminants. This angled application helps avoid dead zones or bubbles on the chip surface, ensuring uniform rinsing. Furthermore, compared to high-pressure methods like jetting, dripping acts more gently on the chip surface, reducing potential damage to the chip structure and lowering the risk of particles re-embedding into the chip surface upon impact. Besides dripping, similar effects can be achieved by tilting the chip and slowly injecting the acetone solution along its edges, or by using a low-pressure spray system with nozzles at specific angles.

[0047] In some embodiments, rinsing the chip surface after the delamination process using acetone solution may include: rinsing the chip surface multiple times with acetone solution, each rinse lasting 10-15 seconds. Multiple rinsing refers to repeatedly applying acetone solution to the chip surface to achieve repeated cleaning. This repeated application aims to gradually remove particles and residues adhering to the chip surface through multiple contact and dissolution processes. For example, after one acetone solution rinse, a new acetone solution may be applied for a second rinse, or a short interval may be placed between two rinses.

[0048] The duration of each acetone rinsing process is controlled within 10 to 15 seconds to ensure that the acetone solution has sufficient time to fully contact the particles and contaminants on the chip surface, thereby effectively dissolving or loosening these deposits, while avoiding the adverse effects that prolonged immersion may have on the chip material. This time can be precisely controlled by a timer or an automated control system.

[0049] By repeatedly rinsing the chip surface with acetone solution, and precisely controlling the duration of each rinse to between 10 and 15 seconds, the thoroughness of the chip surface pre-cleaning can be improved. During each rinse, the acetone solution can fully penetrate and act on the tiny particles and residues on the chip surface, loosening or dissolving them. By repeating this process multiple times, even particles with strong adhesion or hidden in the microstructure can be effectively removed. After each rinse, the dissolved or loosened contaminants are carried away from the chip surface along with the acetone solution, preventing the redeposition of contaminants on the chip surface. This iterative and time-controlled rinsing mechanism ensures that the chip surface reaches a high level of cleanliness before the subsequent cellulose replica membrane is attached, facilitating subsequent fine cleaning steps.

[0050] In some embodiments, the cellulose multilayer membrane includes cellulose acetate paper. Cellulose acetate paper is a paper-like film made primarily of cellulose acetate, possessing good flexibility, transparency, and the ability to plasticize and shrink under the action of specific solvents (such as acetone). Its surface has a certain microporous structure or adhesiveness, enabling it to effectively adsorb and encapsulate micron- or even submicron-sized particles. Furthermore, cellulose acetate paper retains a certain mechanical strength after drying and cooling, facilitating its complete peeling from the chip surface. Besides cellulose acetate paper, the cellulose multilayer membrane can also be nitrocellulose membrane, regenerated cellulose membrane, etc., all of which possess a certain degree of flexibility and surface adsorption capacity.

[0051] The thickness of the cellulose replica membrane can be 20μm to 50μm. For example, cellulose replica membranes with thicknesses of 20μm, 30μm, 40μm or 50μm can be selected. The specific thickness value can be selected according to the actual application requirements, and there are no special restrictions here.

[0052] It should be noted that after the chip tilting is completed, the chip with the delamination process can be placed in the SEM sample chamber for observation. Because the micro-masked particles on the chip surface have been removed, failure characteristics such as the grain structure, electromigration phenomena, or micro-cracks on the aluminum layer surface can be clearly revealed, thereby effectively improving the accuracy of chip failure analysis results.

[0053] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0054] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0055] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0056] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0057] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A chip cleaning method, characterized in that, include: The chip that has completed the delamination process is placed on the carrier wafer; A cellulose replica membrane is attached to the surface of the chip; The cellulose replica membrane is processed to coat the particles on the surface of the chip. The cellulose replica membrane is peeled off the chip to remove particles from the chip surface.

2. The chip cleaning method according to claim 1, characterized in that, The process of treating the cellulose replica membrane to encapsulate the particles on the chip surface includes: The substrate containing the chip and the cellulose replica membrane is transferred to a heating stage, and the heating stage is set to a preset temperature. The cellulose replica membrane is heated, causing it to shrink and encapsulate the particles on the chip surface.

3. The chip cleaning method according to claim 2, characterized in that, Before transferring the substrate containing the chip and the cellulose replica membrane onto the heating stage, the procedure further includes: An acetone solution is dropped onto the surface of the cellulose replica membrane, causing the cellulose replica membrane to adhere tightly to the chip surface and the gaps between the particles on the chip surface.

4. The chip cleaning method according to claim 2, characterized in that, When heating the cellulose composite membrane, the preset temperature is 60℃~80℃ and the heating time is 3min~5min.

5. The chip cleaning method according to claim 2, characterized in that, The step of peeling the cellulose replica membrane off the chip includes: Remove the substrate from the heating stage; The cellulose replica membrane is cooled; The cellulose replica membrane is peeled off the chip.

6. The chip cleaning method according to claim 5, characterized in that, The step of peeling the cellulose replica membrane off the chip includes: The slide is then transferred to the lens of the microscope; Use tweezers to grasp the edge of the cellulose replica membrane and peel it off from the chip.

7. The chip cleaning method according to claim 1, characterized in that, Before placing the chip, after the delamination process, onto the substrate, the process further includes: The chip surface after the delamination process is completed is rinsed with acetone solution; The chip is then dried.

8. The chip cleaning method according to claim 7, characterized in that, The step of rinsing the chip surface after the delamination process using acetone solution includes: Use a dropper or wash bottle to draw up the acetone solution; The acetone solution is dropped onto the chip surface at an angle above the chip surface after the delamination process is completed, and the chip surface is rinsed with the acetone solution.

9. The chip cleaning method according to claim 7, characterized in that, The step of rinsing the chip surface after the delamination process using acetone solution includes: The chip surface after the delamination process is completed is rinsed multiple times with acetone solution, with each rinse lasting 10 to 15 seconds.

10. The chip cleaning method according to any one of claims 1 to 9, characterized in that, The cellulose replica film includes cellulose acetate paper.

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