Method for manufacturing disc-shaped substrate and apparatus for manufacturing disc-shaped substrate

Abstract

A method for manufacturing a disc-shaped substrate includes: a step of placing a carrier for housing the disc-shaped substrate between a lower fixed plate and an upper fixed plate; a step of grinding the disc-shaped substrate while clamping it with the lower and upper fixed plates and supplying a processing liquid between the lower and upper fixed plates; a step of supplying a first stripping fluid to the upper fixed plate and the disc-shaped substrate using a first supply system to peel the disc-shaped substrate from the upper fixed plate; and a step of supplying a second stripping fluid to the upper fixed plate and the carrier using a second supply system independent of the first supply system to peel the carrier from the upper fixed plate.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a disc-shaped substrate and an apparatus for manufacturing a disc-shaped substrate. Background Technology

[0002] Previously, it was known that in the manufacturing process of a disk-shaped substrate used as a substrate for magnetic recording media, a polishing apparatus was used to polish the surface of the disk-shaped substrate in order to improve the flatness of the surface. For example, in the polishing apparatus disclosed in Japanese Patent Application Publication No. 2005-230978, a lower fixed disk and an upper fixed disk are arranged opposite each other, and a disk-shaped substrate is arranged between the lower fixed disk and the upper fixed disk in a state of being housed inside a carrier.

[0003] In Japanese Patent Application Publication No. 2005-230978, the surface of a disc-shaped substrate is polished by rotating the substrate while abrasive slurry is supplied between the lower and upper fixed plates, with the lower and upper fixed plates in contact with the substrate. However, in the polishing apparatus, after polishing, the polished disc-shaped substrate and the carrier adhere to the upper fixed plate with the abrasive slurry, and thus the disc-shaped substrate does not detach from the upper fixed plate even when the upper fixed plate rises.

[0004] To address this problem, Japanese Patent Application Publication No. 2005-230978 discloses a method of supplying a stripping gas, which serves as a stripping fluid, from the outside through a nozzle orifice provided on the upper fixed plate, between the upper fixed plate and the disc-shaped substrate, and between the upper fixed plate and the carrier, thereby detaching the disc-shaped substrate from the upper fixed plate. Japanese Patent Application Publication No. 2005-230978 also discloses that, through the supply of stripping gas, polishing slurry is discharged from between the upper fixed plate and the disc-shaped substrate, and between the upper fixed plate and the carrier. After the disc-shaped substrate and the carrier are detached from the upper fixed plate, the disc-shaped substrate is transferred from the polishing apparatus to a device for performing the next process.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-230978 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] Here, typically, the thickness of the carrier surrounding the disc-shaped substrate is thinner than the thickness of the disc-shaped substrate. Therefore, if the carrier housing the disc-shaped substrate is positioned on the lower fixed plate, the height of the disc-shaped substrate is greater than the height of the carrier. That is, between the lower and upper fixed plates, the volume per unit area of ​​the carrier in the upper portion of the carrier is greater than the volume per unit area of ​​the disc-shaped substrate in the upper portion of the disc-shaped substrate.

[0008] In Japanese Patent Application Publication No. 2005-230978, the supply sources for the stripping gas supply system (which serves as a stripping fluid) supplied to the upper side of the disc-shaped substrate and the supply system for the stripping gas supply system (which serves as a stripping fluid) supplied to the upper side of the carrier are shared, and a common pipe extending from the shared supply source is used as part of the supply path. In Japanese Patent Application Publication No. 2005-230978, the supply system for the stripping gas on the disc-shaped substrate side and the supply system for the stripping gas on the carrier side share a single supply system.

[0009] Therefore, when stripping fluid is supplied to the upper side of the disc-shaped substrate, the stripping fluid tends to flow towards the upper side of the carrier with a larger volume per unit area. In other words, the stripping fluid flows towards the upper side of the carrier where the pressure loss is smaller than that on the upper side of the disc-shaped substrate. As a result, the pressure of the stripping fluid supplied to the upper side of the disc-shaped substrate decreases. Consequently, the polishing slurry accumulated on the upper side of the disc-shaped substrate cannot be adequately drained, resulting in situations where the disc-shaped substrate cannot be peeled off from the upper platen.

[0010] The present invention addresses the aforementioned problems by providing a method and apparatus for manufacturing a disc-shaped substrate that allows for easy peeling of a ground disc-shaped substrate from an upper fixed plate.

[0011] Methods for solving problems

[0012] The specific means to achieve the above-mentioned goals are as follows.

[0013] <1> A method for manufacturing a disk-shaped substrate includes the following steps:

[0014] A carrier for holding a disc-shaped substrate is positioned between a lower fixed plate and an upper fixed plate; while the disc-shaped substrate is held by the lower fixed plate and the upper fixed plate and a processing fluid is supplied between the lower fixed plate and the upper fixed plate, the disc-shaped substrate is subjected to grinding or polishing processing; a first stripping fluid for peeling the disc-shaped substrate from the upper fixed plate is supplied between the upper fixed plate and the disc-shaped substrate using a first supply system; and a second stripping fluid for peeling the carrier from the upper fixed plate is supplied between the upper fixed plate and the carrier using a second supply system independent of the first supply system.

[0015] <2> according to <1> The method for manufacturing the disk-shaped substrate, wherein,

[0016] The process of supplying a stripping fluid to at least one of the first stripping fluid and the second stripping fluid includes: a process of contacting the liquid with the treatment liquid by introducing the liquid; and a process of applying pressure to the liquid in contact with the treatment liquid by introducing gas after the liquid.

[0017] <3> An apparatus for manufacturing a disc-shaped substrate, comprising:

[0018] A lower platen, which holds a carrier for receiving the disc-shaped substrate on its upper side; an upper platen, which is disposed on the upper side of the lower platen in a manner that allows it to approach or separate from the lower platen, and has a first nozzle orifice formed on the portion opposite to the disc-shaped substrate and a second nozzle orifice formed on the portion opposite to the carrier; a processing liquid supply unit, which supplies processing liquid between the lower platen and the upper platen; a first supply system, which has a first supply source for accumulating a first stripping fluid for peeling the disc-shaped substrate from the upper platen and a first pipe connecting the first supply source and the first nozzle orifice; and a second supply system, which has a second supply source for accumulating a second stripping fluid for peeling the carrier from the upper platen and a second pipe connecting the second supply source and the second nozzle orifice, and the second supply system is provided independently of the first supply system.

[0019] <4> according to <3> The apparatus for manufacturing the disk-shaped substrate, wherein,

[0020] It also includes a control device that performs the following processes: supplying the first stripping fluid between the upper platen and the disc-shaped substrate through the first supply system; and supplying the second stripping fluid between the upper platen and the carrier through the second supply system.

[0021] <5> according to <4> The apparatus for manufacturing the disk-shaped substrate, wherein,

[0022] As a process for supplying stripping fluid to at least one of the first stripping fluid and the second stripping fluid, the control device controls at least one of the first supply system and the second supply system to contact the liquid with the processing liquid by introducing liquid and to apply pressure to the liquid in contact with the processing liquid by introducing gas after the liquid.

[0023] Invention Effects

[0024] According to the present invention, a method for manufacturing a disc-shaped substrate and an apparatus for manufacturing a disc-shaped substrate are provided, which allow for easy peeling of a ground disc-shaped substrate from an upper fixed plate. Attached Figure Description

[0025] Figure 1 This is a top view illustrating the manufacturing apparatus for a disc-shaped substrate according to an embodiment of the present invention.

[0026] Figure 2 yes Figure 1 2-2 line section view.

[0027] Figure 3 This is a cross-sectional view (1) illustrating the manufacturing method of the disc-shaped substrate of this embodiment.

[0028] Figure 4 This is a cross-sectional view (2) illustrating the manufacturing method of the disc-shaped substrate of this embodiment.

[0029] Figure 5 This is a cross-sectional view illustrating the manufacturing method of the disc-shaped substrate of the comparative example. Detailed Implementation

[0030] The following describes embodiments of the present invention. However, the present invention is not limited to the following embodiments. In the case of embodiments described with reference to the accompanying drawings, the structure of these embodiments is not limited to the structure shown in the drawings. Furthermore, the sizes of the components in the figures are conceptual, and the relative sizes between components are not limited thereto.

[0031] In the following figures, the same reference numerals are used to denote the same parts. However, the figures are schematic, and the relationship between thickness and planar dimensions, as well as the ratio of thickness of each device and component, may differ from the actual components. Therefore, specific thicknesses and dimensions should be determined with reference to the following description. Furthermore, the figures also include parts with different dimensional relationships and ratios. Additionally, unless otherwise specified in the specification, the number of constituent elements of the present invention is not limited to one, and multiple elements may exist.

[0032] In the following embodiments, the constituent elements (including element steps, etc.) are not essential unless specifically stated otherwise. Similarly, numerical values ​​and their ranges are not intended to limit the invention.

[0033] In this invention, within the numerical range represented by "~", the values ​​recorded before and after "~" are respectively taken as the minimum and maximum values.

[0034] In the numerical ranges described in stages in this invention, the upper or lower limit value of a single numerical range can be replaced with the upper or lower limit value of other numerical ranges described in stages. Furthermore, in the numerical ranges described in this invention, the upper or lower limit value of that range can be replaced with the values ​​shown in the embodiments.

[0035] In this invention, when components are included, each component may contain multiple corresponding substances. When multiple substances equivalent to each component are present in the composition, unless otherwise specified, the content or percentage of each component refers to the total content or percentage of the multiple substances present in the composition.

[0036] In this invention, the particles corresponding to each component may contain multiple particles. When multiple particles corresponding to each component are present in the composition, unless otherwise specified, the particle size of each component refers to a value relating to the mixture of the multiple particles present in the composition.

[0037] In this invention, the terms "layer" or "film" include not only the case where the layer or film is formed entirely in the region where it is observed, but also the case where it is formed only in a portion of the region.

[0038] <Fabrication apparatus for disc-shaped substrates>

[0039] First, refer to Figures 1-2 The manufacturing apparatus 10 for the disc-shaped substrate of this embodiment will be described. For example... Figure 1 and Figure 2 As shown, the manufacturing apparatus 10 for a disc-shaped substrate includes a lower platen 12, an upper platen 14, a polishing slurry supply unit 30, a first supply system 41, and a second supply system 42.

[0040] In this embodiment, the disc-shaped substrate manufacturing apparatus 10 is a grinding apparatus. In this invention, the disc-shaped substrate manufacturing apparatus 10 may be configured to include one or more other apparatuses required for manufacturing the disc-shaped substrate.

[0041] Specifically, the apparatus may include a grinding device that grinds the disc-shaped substrate 50 at the front end of the grinding apparatus, a device for transferring the unprocessed or processed disc-shaped substrate 50 together, and a standby device for idling the unprocessed or processed disc-shaped substrate 50. Additionally, it may include, independently or in combination with these, a receiving rack for accommodating the unprocessed or processed disc-shaped substrate, a cleaning device for cleaning the disc-shaped substrate 50, and a drying device for drying the disc-shaped substrate 50.

[0042] (Disc-shaped substrate)

[0043] The disc-shaped substrate 50 is housed inside the receiving hole 52A of the carrier 52. In this embodiment, the disc-shaped substrate 50 is, for example, an aluminum substrate or an aluminum alloy substrate, but in this invention, it is not limited to these, and a glass substrate or the like may also be used. Hereinafter, aluminum substrates, aluminum alloy substrates, and glass substrates will be collectively referred to as "substrate." Furthermore, aluminum substrates and aluminum alloy substrates will be collectively referred to as "aluminum substrates." A plating layer can be formed on the surface of the aluminum substrate. In this case, the surface of the object to be polished can be a plating layer. Aluminum substrates are advantageous in terms of excellent processability and the ability to control manufacturing costs.

[0044] On the other hand, a glass strengthening layer can be formed on the surface of the glass substrate. In this case, the surface of the object to be ground can be a glass strengthening layer. The formation of a glass strengthening layer is not necessary in the glass substrate. The present invention can also be applied to the grinding of the surface of a homogeneous glass substrate without a glass strengthening layer. Compared with aluminum substrates, glass substrates have superior strength, surface flatness, heat resistance, etc., thus facilitating the miniaturization and high density of disc-shaped substrates.

[0045] like Figure 1 As shown, in this embodiment, three disc-shaped substrates 50 housed in one carrier 52 are illustrated. However, this is not a limitation in the present invention, and the number of disc-shaped substrates housed can be one or any number. Similarly, in this embodiment, four carriers 52 placed on the lower fixed plate 12 are illustrated. However, this is not a limitation in the present invention, and the number of carriers can be one or any number.

[0046] The disk-shaped substrate 50 in this embodiment is used for a magnetic recording medium, but it is not limited to this in the present invention. The disk-shaped substrate of the present invention can also be other information recording disks, such as those for optical discs.

[0047] In the grinding apparatus, the disc-shaped substrate 50 rotates automatically around the axis of the disc-shaped substrate 50 by means of the carrier 52, that is, it rotates on its own axis, and rotates around the axis of the sun gear 16, that is, it revolves around the sun gear 16.

[0048] (Setting a price)

[0049] like Figure 2 As shown, the lower base 12 has a disc-shaped lower base 12A and is disposed on... Figure 2 The lower grinding pad 12B is a disc-shaped material placed on the lower base 12A. Known abrasive materials such as abrasive cloth can be used as the lower grinding pad 12B. It should be noted that, in this invention, the term "lower base" is sometimes used as a general term encompassing the lower grinding pad.

[0050] A carrier 52 for receiving a disc-shaped substrate 50 is placed on the upper side of the lower grinding pad 12B of the lower mounting plate 12. For example... Figure 1 As shown, a sun gear 16 is disposed at the center of the lower fixed plate 12, meshing with the gears on the periphery of the four carriers 52. An external gear 18 is disposed around the lower fixed plate 12, meshing with the gears on the periphery of the four carriers 52. Figure 2 As shown, a discharge path D for discharging grinding fluid 60 is formed between the lower fixed plate 12 and the external gear 18.

[0051] (Upper plate)

[0052] like Figure 2As shown, the upper base 14 has a disc-shaped upper base 14A and is disposed on... Figure 2 The upper grinding pad 14B is a disc-shaped material located below the upper base 14A. Like the lower grinding pad 12B, the upper grinding pad 14B can be made of known abrasive materials such as abrasive cloth. It should be noted that in this invention, the term "upper disc" is sometimes used as a general term encompassing the upper grinding pad.

[0053] The upper fixed plate 14 is disposed above the lower fixed plate 12, opposite to the lower fixed plate 12. In this embodiment, both the lower fixed plate 12 and the upper fixed plate 14 are flexibly raised and lowered via connection to a hydraulic drive device, an electric drive device, or the like. Therefore, the upper fixed plate 14 can approach or separate from the lower fixed plate 12. In this invention, at least one of the lower fixed plate 12 and the upper fixed plate 14 is flexibly raised and lowered, thereby the upper fixed plate 14 can also be configured to approach or separate from the lower fixed plate 12.

[0054] The upper plate 14 has a first nozzle hole 21 and a second nozzle hole 22. The first nozzle hole 21 is formed by penetrating the upper base 14A and the upper polishing pad 14B in the portion opposite to the disc-shaped substrate 50. The second nozzle hole 22 is formed by penetrating the upper base 14A and the upper polishing pad 14B in the portion opposite to the carrier 52.

[0055] In this embodiment, Figure 1 The example shown depicts a configuration where two first nozzle holes 21 are formed in the portion opposite to a disc-shaped substrate 50, and six second nozzle holes 22 are formed in the portion opposite to a carrier 52. However, this invention is not limited to this configuration. In this invention, the number of each of the first nozzle holes 21 and the second nozzle holes 22 can be appropriately varied.

[0056] In this embodiment, by Figure 1 As shown by line 2-2, this illustration depicts two first nozzle holes 21 and two second nozzle holes 22 arranged in a straight line when viewed from above. However, this is not the limitation in this invention. The arrangement pattern of the first nozzle holes 21 and the second nozzle holes 22 can be appropriately changed.

[0057] (Grinding Fluid Supply Department)

[0058] The polishing slurry supply unit 30 includes a polishing slurry tank 30A that stores polishing slurry 60 and a polishing slurry pipe 30B connecting the polishing slurry tank 30A and the upper fixed plate 14. The polishing slurry supply unit 30 supplies polishing slurry 60 between the lower fixed plate 12 and the upper fixed plate 14. Specifically, for example, the polishing slurry 60 drips onto... Figure 2The polishing slurry 60 is supplied to the upper base 14A of the upper fixed plate 14, and moves on the surface from the upper surface side toward the lower side of the upper fixed plate 14, thereby enabling supply between the lower fixed plate 12 and the upper fixed plate 14. A through hole can also be formed through the upper base 14A and the upper polishing pad 14B as the path for the flow of the polishing slurry 60. The polishing slurry 60 of this embodiment corresponds to the processing liquid of the present invention. The polishing slurry supply unit 30 of this embodiment corresponds to the processing liquid supply unit of the present invention.

[0059] (First Supply System)

[0060] like Figure 2 As shown, the first supply system 41 has a first supply source 41A and a first piping 41B. A first stripping fluid (see reference 41B) is accumulated in the first supply source 41A to strip the disk-shaped substrate 50 from the upper fixed plate 14. Figure 4 The first stripping fluid 71 is connected to the first supply source 41A and the first nozzle orifice 21. The first supply source 41A includes a storage device such as a tank capable of storing the first stripping fluid. In the case where the first stripping fluid is a combination of multiple stripping fluids, each of which is different at the start of its supply, the individual stripping fluids are stored in the storage device in a manner that allows them to be used selectively without mixing with each other.

[0061] (Second Supply System)

[0062] The second supply system 42 has a second supply source 42A and a second piping 42B. The second supply source 42A contains a second stripping fluid (see reference 42A) that strips the carrier 52 from the upper platen 14. Figure 4 The second stripping fluid 72). The second piping 42B is connected between the second supply source 42A and the second nozzle orifice 22. The other structures of the second supply source 42A are the same as those of the first supply source 41A, so repeated descriptions are omitted. The second supply system 42 is set independently of the first supply system 41.

[0063] (Stripping fluid)

[0064] The first or second stripping fluid can be a known liquid such as pure water or a known gas such as air. In this embodiment, the first and second stripping fluids are the same, but this is not a limitation in the present invention, and the first and second stripping fluids may be different from each other.

[0065] (Independent configuration of the supply system)

[0066] In this embodiment, the first supply system 41 and the second supply system 42 are independent supply systems. Specifically, the first supply source 41A of the first supply system 41 and the second supply source 42A of the second supply system 42 are different and separate supply sources. The first piping 41B of the first supply system 41 and the second piping 42B of the second supply system 42 are not connected to each other.

[0067] Here, the independence of each supply system includes both the case where the supply paths are not connected and the case where the supply sources are different from each other. In other words, the non-independence of each supply system in the multiple stripping fluid supply systems includes at least one of the cases where the supply sources of the stripping fluids are common and the supply paths of the stripping fluids are connected.

[0068] (Control device)

[0069] In this embodiment, such as Figure 2 As shown, a control device 44, which enables the grinding apparatus to perform one or more processes included in the grinding process, is connected to a first supply system 41 and a second supply system 42. In this invention, the one or more processes included in the grinding process can be provided to the control device 44, for example, in the form of a program.

[0070] In this embodiment, a case is illustrated where one control device 44 is connected to both the first supply system 41 and the second supply system 42. However, in this invention, the number of control devices can be arbitrarily set to more than one. For example, one control device can be connected to each of the first supply system 41 and the second supply system 42 respectively. Regardless of the number of control devices provided on the manufacturing apparatus 10 of the disc-shaped substrate, the first supply system 41 and the second supply system 42 can be configured independently of each other.

[0071] <Manufacturing Method of Disk-Shaped Substrate>

[0072] Next, refer to Figures 3-4 A method for manufacturing a disk-shaped substrate using the disk-shaped substrate manufacturing apparatus 10 of this embodiment will be described. The method for manufacturing a disk-shaped substrate according to this embodiment includes:

[0073] (A) The process of placing the carrier 52 for housing the disc-shaped substrate 50 between the lower platen 12 and the upper platen 14;

[0074] (B) A process in which a disc-shaped substrate 50 is held between a lower fixed plate 12 and an upper fixed plate 14, polishing fluid 60 is supplied between the lower fixed plate 12 and the upper fixed plate 14, and the disc-shaped substrate 50 is polished.

[0075] (C) A process of supplying a first stripping fluid, which peels the disk-shaped substrate 50 from the upper platen 14, between the upper platen 14 and the disk-shaped substrate 50 using the first supply system 41; and

[0076] (D) A process of supplying a second stripping fluid, which separates the carrier 52 from the upper platen 14, between the upper platen 14 and the carrier 52 using a second supply system 42 independent of the first supply system 41.

[0077] In this embodiment, the case in which the manufacturing method of a disc-shaped substrate, including steps (A) to (D), is implemented by operating the control device 44 using a procedure for implementing the manufacturing method of a disc-shaped substrate. In the present invention, the manufacturing method of a disc-shaped substrate can also be executed by operating the control device 44 by an operator of the disc-shaped substrate manufacturing apparatus 10.

[0078] In this embodiment, the method for manufacturing a disc-shaped substrate includes a peeling process of the disc-shaped substrate 50 from the upper fixed plate 14 during a grinding step. In this invention, the method for manufacturing a disc-shaped substrate can be configured, depending on the type of disc-shaped substrate, to include one or more other processes generally known for manufacturing the disc-shaped substrate 50.

[0079] For example, in the case of an aluminum substrate, the manufacturing method of a disc-shaped substrate includes the following steps.

[0080] Blank substrate preparation process: Aluminum alloy ingots are rolled to obtain aluminum alloy sheets with a thickness of less than 2 mm. The obtained aluminum alloy sheets are then punched into disc shapes to prepare aluminum alloy substrates of the desired dimensions.

[0081] Cutting process: Chamfering of the inner and outer diameters and cutting of the two main surfaces are performed on the prepared aluminum alloy substrate.

[0082] Grinding process: In order to reduce the surface roughness and undulation of the aluminum alloy substrate after cutting, grinding is performed on the two main surfaces of the aluminum alloy substrate using grinding stones.

[0083] Plating process: For substrates that have undergone grinding, electroless nickel plating (NiP) or other plating processes are performed on the surface of aluminum alloy substrates to impart surface hardness and suppress surface defects.

[0084] Grinding process: Grinding is performed on the two main surfaces of the aluminum alloy substrate with the coating film.

[0085] In the case of a glass substrate, the manufacturing method of a disc-shaped substrate includes, for example, the following steps.

[0086] Preform substrate preparation process: A glass preform, which serves as the raw material for a plate-shaped glass substrate for magnetic recording media having a pair of main surfaces, is produced by pressing and molding. The glass preform is formed into a ring shape by forming a circular hole in its center. Next, a glass substrate with chamfered surfaces is obtained through shaping. The inner and outer peripheral end faces of the shaped glass substrate are then subjected to grinding and polishing processes.

[0087] Grinding process: Grinding based on fixed abrasive grains is performed on the main surface of the glass substrate after end face grinding.

[0088] Grinding process: The main surface of the glass substrate after the grinding process is ground using a specified abrasive. During the grinding process, the glass substrate may undergo chemical strengthening treatment.

[0089] The grinding process of this embodiment will be described in detail below.

[0090] [Grinding process]

[0091] In the grinding process, while the lower fixed platen 12 and the upper fixed platen 14 are in contact with the disc-shaped substrate 50, the disc-shaped substrate 50 is rotated while grinding fluid 60 is supplied between the lower fixed platen 12 and the upper fixed platen 14, thereby grinding the surface of the disc-shaped substrate 50 by the lower fixed platen 12 and the upper fixed platen 14.

[0092] There are no particular restrictions on the polishing slurry used when polishing aluminum substrates, as long as it is a commonly used polishing slurry. For example, slurries containing alumina, colloidal silica, etc., can be used. There are also no particular restrictions on the polishing slurry used when polishing glass substrates, as long as it is a commonly used polishing slurry. For example, slurries containing cerium oxide, zirconium oxide, colloidal silica, etc., can be used.

[0093] Here, as Figure 3 As shown, after the disc-shaped substrate 50 is polished, the polished disc-shaped substrate 50 and the carrier 52 are adsorbed onto the upper fixed plate 14 by the polishing liquid 60. Therefore, even if the upper fixed plate 14 rises, the disc-shaped substrate 50 may not peel off from the upper fixed plate 14. Thus, the first peeling fluid 71 is supplied from the outside through the first nozzle hole 21 provided on the upper fixed plate 14 via the first supply system 41 to the space between the upper fixed plate 14 and the disc-shaped substrate 50 independently of the second supply system 42. Furthermore, the second peeling fluid 72 is supplied from the outside through the second nozzle hole 22 provided on the upper fixed plate 14 to the space between the upper fixed plate 14 and the carrier 52 independently of the first supply system 41.

[0094] In this invention, "supply" means reaching the target location as a result. For example, the supply of the first stripping fluid 71 means that the first stripping fluid 71 reaches between the upper fixed plate 14 and the disc-shaped substrate 50. The supply of the second stripping fluid 72 means that the second stripping fluid 72 reaches between the upper fixed plate 14 and the carrier 52.

[0095] In order to supply the first stripping fluid 71, the first supply system 41 may begin to apply driving force to the first stripping fluid 71 before or after the upper fixed plate 14 begins to rise. The driving force to the first stripping fluid 71 may be stopped before or after the upper fixed plate 14 has reached a predetermined height and the rise is complete.

[0096] To supply the second stripping fluid 72, the second supply system 42 may begin applying driving force to the second stripping fluid 72 either before or after the upper platen 14 begins to rise. The application of driving force to the second stripping fluid 72 may cease before or after the upper platen 14 has reached a predetermined height and the rise is complete. In this invention, it is not excluded that the supply of the first stripping fluid 71 and the second stripping fluid 72 may be carried out without the process of raising the upper platen 14.

[0097] (A combination of two-phase stripping fluids)

[0098] In this embodiment, the first stripping fluid 71 and the second stripping fluid 72 respectively comprise the initially introduced liquid and the gas introduced after the liquid. In this invention, the first stripping fluid 71 and the second stripping fluid 72 need not both comprise the initially introduced liquid and the gas introduced after the liquid; at least one of the first stripping fluid 71 and the second stripping fluid 72 may comprise the initially introduced liquid and the gas introduced after the liquid.

[0099] In this invention, "the initially introduced liquid" refers to the liquid introduced before the introduction of the pressurized gas in a combination of a liquid in contact with the polishing slurry 60 and a gas pressurizing the liquid. Therefore, "the initially introduced liquid" is not limited to the liquid initially introduced after the start of a polishing process. For example, even if, after the start of a polishing process, after the introduction of the polishing slurry 60 has been performed more than once, the introduced liquid for contacting the polishing slurry 60 and subsequently the gas pressurizing the liquid are introduced, the introduced liquid is also considered "the initially introduced liquid" according to this invention.

[0100] The process of supplying the first stripping fluid 71 includes: a process of contacting the liquid with the polishing slurry 60 by introducing the liquid; and a process of applying pressure to the liquid in contact with the polishing slurry 60 by introducing gas after the liquid. That is, the two-phase fluid constituting the first stripping fluid 71 is supplied in two stages in the order of liquid and gas.

[0101] Similarly, the second stripping fluid 72 is a combination of liquid and gas phases. Furthermore, the process of supplying the second stripping fluid 72 includes: a process of contacting the liquid with the polishing slurry 60 by introducing the liquid; and a process of applying pressure to the liquid in contact with the polishing slurry 60 by introducing gas after the liquid. The two-phase fluid constituting the second stripping fluid 72 is also supplied in two stages in the order of liquid and gas.

[0102] In this invention, the process of supplying at least one of the first stripping fluid 71 and the second stripping fluid 72 includes the following steps: contacting the liquid with the polishing slurry 60 by introducing the liquid; and applying pressure to the liquid in contact with the polishing slurry 60 by introducing gas after the liquid.

[0103] The liquid used in this embodiment can be appropriately selected based on the content of the pre- and post-treatment processes and the recycling of the treatment liquid used; examples include pure water and coolant. The gas used in this embodiment is, for example, air, but this invention is not limited to this, and other gases can be appropriately used.

[0104] When using the control device 44, the control device 44 performs the process of supplying the first stripping fluid 71 between the upward platen 14 and the disc-shaped substrate 50 via the first supply system 41, and the process of supplying the second stripping fluid 72 between the upward platen 14 and the carrier 52 via the second supply system 42. Furthermore, the control device 44 controls at least one of the first supply system 41 and the second supply system 42 to perform the process of contacting the liquid with the polishing slurry 60 by introducing liquid, and the process of applying pressure to the liquid in contact with the polishing slurry 60 by introducing gas after the liquid.

[0105] In this embodiment, when the disc-shaped substrate 50 and the carrier 52 are peeled from the upper platen 14, the first stripping fluid 71 and the second stripping fluid 72 suppress the time difference and reach the corresponding first nozzle orifice 21 or second nozzle orifice 22, respectively. In this invention, it is not excluded that a time interval may form between the arrival time of the first stripping fluid 71 at the first nozzle orifice 21 and the arrival time of the second stripping fluid 72 at the second nozzle orifice 22.

[0106] like Figure 4As shown, by independently supplying the first stripping fluid 71 and the second stripping fluid 72, the polishing liquid 60 adsorbed on the upper fixed plate 14 by the polished disc-shaped substrate 50 and the carrier 52 is discharged through the discharge path D between the lower fixed plate 12 and the external gear 18. Thus, both the disc-shaped substrate 50 and the carrier 52 are peeled off from the upper fixed plate 14. Afterwards, the disc-shaped substrate 50 is removed from the inside of the carrier 52 by a transfer device (not shown) and transferred to a subsequent process.

[0107] In this invention, the polishing process can be performed multiple times. When performing multiple polishing processes, the type of polishing slurry 60 used in each polishing process can be different. Furthermore, for example, between multiple polishing processes, a chemical strengthening treatment of the disc-shaped substrate 50 can be included to improve its impact resistance. Moreover, by performing predetermined processes such as cleaning, magnetic film formation, and cooling on the transferred disc-shaped substrate 50, a magnetic recording medium with desired specifications can be manufactured.

[0108] (Comparative example)

[0109] exist Figure 5 The comparative example shows a disc-shaped substrate manufacturing apparatus 10Z. It should be noted that in the manufacturing apparatus 10Z, the same reference numerals are used for components that are the same as those in the disc-shaped substrate manufacturing apparatus 10 of this embodiment, and descriptions are omitted.

[0110] The manufacturing apparatus 10Z includes a common supply source 43A and a common piping 43B, and a common supply system 43 that supplies stripping fluid 73 to a first nozzle orifice 21 opposite to the disc-shaped substrate 50 and a second nozzle orifice 22 opposite to the carrier 52, respectively. Thus, in the manufacturing apparatus 10Z, the stripping gas supply system on the disc-shaped substrate 50 side and the stripping gas supply system on the carrier 52 side are shared by one supply system and are not independent of each other.

[0111] Therefore, in the comparative example, after the disc-shaped substrate 50 is polished, even if the disc-shaped substrate 50 is not detached from the upper fixed plate 14, the peeling fluid supplied to the upper side of the disc-shaped substrate 50 tends to flow towards the upper side of the carrier 52, which has a large volume per unit area. As a result, the pressure of the peeling fluid supplied to the upper side of the disc-shaped substrate 50 decreases. Consequently, the polishing liquid 60 accumulated on the upper side of the disc-shaped substrate 50 is not sufficiently drained, resulting in situations where the disc-shaped substrate 50 is not detached from the upper fixed plate 14.

[0112] In contrast, in this embodiment, a second supply system 42, independent of the first supply system 41 that supplies the first stripping fluid 71 for the upper platen 14, is used to supply the second stripping fluid 72 to the carrier 52 between the upper platen 14 and the carrier 52. Therefore, it is possible to suppress the stripping fluid from the upper platen 50 from flowing towards the upper portion of the carrier 52; that is, it is possible to suppress the flow of the first stripping fluid 71 towards the upper portion of the carrier 52 where the pressure loss is smaller than that of the upper portion of the disc-shaped substrate 50. Thus, it is possible to supply stripping fluid for discharging the abrasive slurry 60 accumulated between the upper platen 14 and the disc-shaped substrate 50 while suppressing pressure drop. Therefore, in this embodiment, the disc-shaped substrate 50 is easily stripped from the upper platen 14.

[0113] Furthermore, in this embodiment, the first stripping fluid 71 and the second stripping fluid 72 are supplied independently. Therefore, when the upper platen 14 is raised, it is easier to suppress the backflow of the first stripping fluid 71 through the first nozzle orifice 21 to the side of the first pipe 41B and the first supply source 41A, compared to the comparative example. Similarly, it is easier to suppress the backflow of the second stripping fluid 72 through the second nozzle orifice 22 to the side of the second pipe 42B and the second supply source 42A, compared to the comparative example.

[0114] Furthermore, in this embodiment, the disc-shaped substrate 50 can be peeled off using the manufacturing apparatus 10 alone. Therefore, this embodiment is particularly effective in automated production lines that do not require manual labor.

[0115] Furthermore, in this embodiment, at least one of the first stripping fluid 71 and the second stripping fluid 72 comprises both liquid and gas, thus the drying of the polishing slurry 60 around the surface of the disc-shaped substrate 50 can be suppressed by using liquid. Therefore, it is possible to prevent the dried polishing slurry 60 from adhering to the surface and reducing the surface flatness. However, the effect of this embodiment is not limited to this reason. In addition, the present invention is not limited to this embodiment, and the first stripping fluid and the second stripping fluid may both be liquids or both be gases without impairing the effect of this embodiment.

[0116] Furthermore, in this embodiment, the polishing slurry 60 is further facilitated to be discharged along with the liquid. The rationale for this is that, after the liquid is supplied, pressure is further applied to the liquid in contact with the polishing slurry 60 using gas.

[0117] <Other Implementation Methods>

[0118] The present invention has been described through the embodiments disclosed above, but it should not be construed as limiting the present invention by the descriptions and drawings that form part of the invention.

[0119] For example, in this embodiment, a case is illustrated where the carrier 52 is rotated and revolved by using the external gear 18 and the sun gear 16 to simultaneously grind multiple disk-shaped substrates 50, but this is not the limitation of the present invention. In the present invention, for example, multiple disk-shaped substrates may be held in a state of protruding upwards, and the grinding disc may be brought into contact with the surface of the disk-shaped substrates from above. Furthermore, the simultaneous grinding of multiple disk-shaped substrates may also be performed by rotating the upper grinding disc. Alternatively, the grinding disc may be rotated and revolved without rotating the disk-shaped substrates.

[0120] (Grinding device)

[0121] In this embodiment, the manufacturing apparatus 10 for the disc-shaped substrate is described as a polishing apparatus, but the present invention is not limited to this, and the manufacturing apparatus 10 may also be a grinding apparatus. In this embodiment, as a method for manufacturing a disc-shaped substrate, a method for manufacturing a disc-shaped substrate after polishing using a polishing apparatus as the manufacturing apparatus 10 is exemplified, but in the present invention, a method for manufacturing a disc-shaped substrate after grinding using a grinding apparatus as the manufacturing apparatus may also be a method for manufacturing a disc-shaped substrate after grinding.

[0122] When the manufacturing apparatus for the disc-shaped substrate is a grinding apparatus, Figure 2 In the manufacturing apparatus 10, the lower grinding pad 12B in the lower fixed plate 12 and the upper grinding pad 14B in the upper fixed plate 14 are respectively fitted with grinding stones. At this time, the terms "upper fixed plate" and "lower fixed plate" are sometimes used as general terms that include grinding stones.

[0123] Furthermore, in the grinding process of the grinding apparatus, a coolant is supplied as the processing fluid instead of the grinding fluid 60 to perform the grinding process. Therefore, in this embodiment, the grinding fluid tank 30A, grinding fluid piping 30B, etc., are appropriately replaced with a coolant tank, coolant piping, etc. It should be noted that the processing fluid in the grinding process is not limited to a coolant; any liquid supplied between the upper and lower fixed plates can be used, or other liquids.

[0124] When the manufacturing apparatus is a grinding apparatus, similarly to the embodiment described above, a second stripping fluid for the stripping carrier is supplied between the upper fixed plate and the carrier using a second supply system independent of the first supply system for supplying the first stripping fluid for stripping the disc-shaped substrate. Therefore, it is possible to suppress the stripping fluid for stripping the disc-shaped substrate from flowing towards the upper part of the carrier. Thus, it is possible to supply stripping fluid for discharging the processing fluid accumulated between the upper fixed plate and the disc-shaped substrate while suppressing pressure drop. Therefore, similar to the embodiment described above, it has the advantage of easily stripping the disc-shaped substrate from the upper fixed plate.

[0125] Furthermore, when the manufacturing apparatus is a grinding apparatus, similarly to the embodiment described above, the first stripping fluid and the second stripping fluid are supplied independently. Therefore, when the upper platen is raised, it is easy to suppress the backflow of the first stripping fluid through the first nozzle orifice to the side of the first piping and the first supply source. Similarly, it is easy to suppress the backflow of the second stripping fluid through the second nozzle orifice to the side of the second piping and the second supply source.

[0126] (Manufacturing method)

[0127] The method for manufacturing a disc-shaped substrate after grinding according to the present invention includes: steps identical to steps (A), (C), and (D) in the method for manufacturing a disc-shaped substrate after grinding according to this embodiment; and a step corresponding to step (B) in the method for manufacturing a disc-shaped substrate according to this embodiment. Specifically, the following steps in the grinding apparatus may include: (A1) a step of placing a carrier for housing the disc-shaped substrate between a lower fixed plate and an upper fixed plate; (B1) a step of grinding the disc-shaped substrate 50 while supplying a processing fluid between the lower fixed plate and the upper fixed plate using the lower fixed plate and the upper fixed plate; (C1) a step of supplying a first stripping fluid for peeling the disc-shaped substrate from the upper fixed plate using a first supply system between the upper fixed plate and the disc-shaped substrate; and (D1) a step of supplying a second stripping fluid for peeling the carrier from the upper fixed plate using a second supply system independent of the first supply system between the upper fixed plate and the carrier.

[0128] The method for manufacturing a polished disc-shaped substrate according to this embodiment may also include: each of the steps (A1), (B1), (C1), and (D1) in the above-described method for manufacturing a polished disc-shaped substrate as a processing step in a grinding apparatus; and each of the steps (A), (B), (C), and (D) in this embodiment as a processing step in a grinding apparatus.

[0129] Therefore, it is possible to obtain both the advantages of the method for manufacturing a disc-shaped substrate after grinding and the method for manufacturing a disc-shaped substrate after polishing, and to obtain a disc-shaped substrate after grinding and polishing efficiently.

[0130] This invention includes various embodiments not described above, and the technical scope of this invention is determined by the specific inventive aspects of the appropriate technical solution based on the description.

[0131] The invention in its entirety, as applied for in Japanese Patent Application No. 2024-050265 filed on March 26, 2024, is incorporated herein by reference.

[0132] In addition, all documents, patent applications and technical standards described herein are incorporated herein by reference to the same extent as the specific and separately described cases.

[0133] Explanation of reference numerals in the attached figures

[0134] 10, 10Z Disk-shaped substrate manufacturing apparatus 12 Lower plate

[0135] 12A Lower base 12B Lower grinding pad

[0136] 14 Upper base plate 14A

[0137] 14B Upper Grinding Pad 16 Sun Gear

[0138] 18 External gear 21 First nozzle hole

[0139] 22 Second nozzle hole 30 Grinding fluid supply section

[0140] 30A Grinding slurry tank; 30B Grinding piping.

[0141] 41. First Supply System 41A. First Supply Source

[0142] 41B First piping; 42 Second supply system

[0143] 42A Second supply source; 42B Second piping

[0144] 43 Shared Supply System 43A Shared Supply Source

[0145] 43B Shared piping 44 Control device

[0146] 50 Disk-shaped substrate 52 Carrier

[0147] 52A Storage Hole 60 Grinding Fluid

[0148] 71 First stripping fluid 72 Second stripping fluid

[0149] 73. Stripping fluid D discharge path

[0150] G gap.

Claims

1. A method for manufacturing a disk-shaped substrate, comprising the following steps: The carrier for receiving the disc-shaped substrate is positioned between the lower fixed plate and the upper fixed plate; While the disc-shaped substrate is clamped by the lower fixed plate and the upper fixed plate and a processing liquid is supplied between the lower fixed plate and the upper fixed plate, the disc-shaped substrate is subjected to grinding or polishing processing. A first stripping fluid is supplied between the upper fixed plate and the disk-shaped substrate using a first supply system to peel the disk-shaped substrate from the upper fixed plate; as well as A second stripping fluid, independent of the first supply system, is supplied between the upper platen and the carrier to detach the carrier from the upper platen.

2. The method for manufacturing a disk-shaped substrate according to claim 1, wherein, The step of supplying a stripping fluid to at least one of the first stripping fluid and the second stripping fluid includes: A process that brings the liquid into contact with the treatment solution by introducing the liquid; and A process that applies pressure to the liquid in contact with the treatment liquid by introducing gas after the liquid.

3. An apparatus for manufacturing a disc-shaped substrate, comprising: The lower plate has a carrier for receiving the disc-shaped substrate placed on its upper side; The upper plate is disposed on the upper side of the lower plate in a manner that allows it to approach or separate from the lower plate, and has a first nozzle hole formed in the portion opposite to the disc-shaped substrate and a second nozzle hole formed in the portion opposite to the carrier. A processing fluid supply unit supplies processing fluid between the lower fixed plate and the upper fixed plate; A first supply system having a first supply source storing a first stripping fluid for stripping the disc-shaped substrate from the upper platen and a first piping connecting the first supply source and the first nozzle orifice; as well as The second supply system has a second supply source for storing a second stripping fluid that strips the carrier from the upper platen and a second piping connecting the second supply source to the second nozzle orifice, and the second supply system is provided independently of the first supply system.

4. The apparatus for manufacturing a disk-shaped substrate according to claim 3, wherein, The manufacturing apparatus for the disc-shaped substrate further includes a control device that performs the following processes: supplying the first stripping fluid between the upper platen and the disc-shaped substrate via the first supply system; and supplying the second stripping fluid between the upper platen and the carrier via the second supply system.

5. The apparatus for manufacturing a disk-shaped substrate according to claim 4, wherein, As a process for supplying stripping fluid to at least one of the first stripping fluid and the second stripping fluid, the control device controls at least one of the first supply system and the second supply system to contact the liquid with the processing liquid by introducing liquid and to apply pressure to the liquid in contact with the processing liquid by introducing gas after the liquid.

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