Underpad formation using uv curable formulation

Abstract

This disclosure provides a UV-curable underpad for chemical mechanical planarization, comprising (a) a (meth)acrylate monomer unit and (b) an oligomer unit selected from difunctional (meth)acrylate-terminated polyether urethane oligomer units, difunctional (meth)acrylate-terminated polyester urethane oligomer units, difunctional (meth)acrylate-terminated urethane oligomer units, and combinations thereof. This disclosure also provides a polishing pad for chemical mechanical planarization, the polishing pad comprising a top sheet and a UV-curable underpad; a method for preparing the polishing pad; and an apparatus for performing the method for preparing the polishing pad for chemical mechanical planarization.

Description

[0001] Cross-reference of related applications

[0002] This application claims priority to U.S. Provisional Application No. 63 / 561,528, filed March 5, 2024, which is incorporated herein by reference in its entirety for all purposes. Technical Field

[0003] This disclosure generally relates to pads used in chemical mechanical planarization (CMP) processes for manufacturing semiconductor devices. More specifically, this disclosure relates to a pad, a method of forming a pad from a UV-curable formulation, and a CMP pad including a pad formed from a UV-curable formulation. Background Technology

[0004] Integrated circuits are typically formed on a substrate by sequentially depositing conductive, semiconductive, and / or insulating layers on a silicon wafer. Various manufacturing processes require planarization of at least one of these layers on the substrate. For example, for some applications (e.g., polishing metal layers to form holes, plugs, and lines in trenches of patterned layers), the overlay is planarized until the top surface of the patterned layer is exposed. In other applications (e.g., planarization of dielectric layers for photolithography), the overlay is polished until the desired thickness is maintained on the overlay. Chemical mechanical planarization (CMP) is one such planarization method. This method typically involves mounting a substrate on a carrier head. The exposed surface of the substrate is typically placed against a polishing pad on a rotating platen. The carrier head provides a controllable load (e.g., downward force) on the substrate to push it toward the rotating polishing pad. During polishing, a polishing liquid (e.g., a slurry containing abrasive particles) may also be applied to the surface of the polishing pad.

[0005] One goal of these manufacturing processes (such as the manufacture of integrated circuits) is to achieve high polishing uniformity. Therefore, one objective in manufacturing polishing pads for these processes is to provide polishing pads with a uniform pressure distribution while maintaining consistent mechanical properties from pad to pad. Summary of the Invention

[0006] A typical polishing pad consists of a top sheet (whose surface contacts the surface to be polished) and a bottom pad that provides support for the top sheet. Typically, the bottom pad material used in CMP applications in the semiconductor industry comprises a thermosetting material, which is then laminated to the top sheet using an adhesive. This process requires multiple steps, introduces additional chemicals (e.g., solvents) for the lamination process, and potentially introduces pad inconsistencies due to uneven adhesion.

[0007] Therefore, there remains a need in the art for alternative polishing pads and alternative methods for manufacturing such pads, which are easy to prepare and promote improved polishing performance to meet the increasingly challenging polishing requirements of new integrated circuit designs. This disclosure provides such polishing pads and methods. These and other advantages, as well as additional inventive features of this disclosure, will become apparent from the description provided herein.

[0008] This disclosure provides a UV-curable underpad for chemimechanical planarization, comprising (a) a (meth)acrylate monomer unit and (b) an oligomer unit selected from difunctional (meth)acrylate-terminated polyether urethane oligomer unit, difunctional (meth)acrylate-terminated polyester urethane oligomer unit, difunctional (meth)acrylate-terminated urethane oligomer unit, and combinations thereof.

[0009] This disclosure also provides a polishing pad for chemical mechanical planarization, comprising a top sheet and a UV-curable undersheet as described herein, wherein the UV-curable undersheet is bonded to the surface of the top sheet.

[0010] This disclosure also provides a method for preparing a polishing pad for chemical mechanical polishing planarization as described herein, the method comprising: (i) providing a top sheet having a polishing side and a side opposite to the polishing side; (ii) applying a UV-curable composition to the side opposite to the polishing side; (iii) uniformly distributing the UV-curable composition on the side opposite to the polishing side; and (iv) UV curing the UV-curable composition to provide the polishing pad.

[0011] This disclosure further provides an apparatus for performing the method of preparing a polishing pad for chemical mechanical planarization as described herein, the apparatus comprising (i) a jig including a circular notch, (ii) a scraper, and (iii) a UV light source. Attached Figure Description

[0012] Figure 1A This is a schematic side view of an exemplary arrangement for preparing a polishing pad for chemical mechanical planarization as described herein, wherein 1 is the top sheet of the polishing pad, 2 is the bottom pad of the polishing pad, 3 is the sidewall of a recess in a fixture (e.g., a carrier plate), and 4 is a light source. Figure 1A An exemplary notch is shown in a jig measuring 95 mils (approximately 2.4 mm).

[0013] Figure 1B This is a schematic top view illustrating an exemplary arrangement for preparing the polishing pad for chemical mechanical planarization described herein. Figure 1B An example diameter of a 32-inch (approximately 81 cm) polishing pad is shown.

[0014] Figure 2To illustrate an exemplary fixture (e.g., a carrier plate), 5 is a circular notch in the fixture, 6 is a groove, and 7 is a punch hole.

[0015] Figure 3 A schematic diagram of an exemplary apparatus for preparing a polishing pad for chemical mechanical planarization as described herein is provided, wherein 8 is a fixture (e.g., a carrier plate) having a circular notch (5), a groove (6) and a punch hole (7), 9 is a scraper, and 10 is a light source.

[0016] While this disclosure is readily adaptable to various modifications and alternatives, its specific details have been illustrated in the accompanying drawings and will be described in detail below. However, it should be understood that this disclosure is not intended to be limited to the described embodiments. Rather, this disclosure is intended to cover all modifications, equivalents, and alternatives that fall within the scope of this disclosure as defined by the appended claims. Detailed Implementation

[0017] Among the disclosed benefits and improvements, other objectives and advantages of this disclosure will become apparent from the following description taken in conjunction with the accompanying drawings. Detailed embodiments of this disclosure are disclosed herein; however, it should be understood that the disclosed embodiments are merely illustrative of the disclosure as it may be embodied in various forms. Furthermore, each example given with respect to the various embodiments of this disclosure is intended to be illustrative and not restrictive.

[0018] In this specification and claims, unless explicitly indicated herein, the following terms shall have their explicitly relevant meanings. The phrases “in one embodiment,” “in one embodiment,” and “in some embodiments,” as used herein, do not necessarily refer to the same embodiment, but may refer to the same embodiment. Similarly, the phrases “in another embodiment” and “in some other embodiments,” as used herein, do not necessarily refer to different embodiments, although they may refer to different embodiments. All embodiments of this disclosure are intended to be combinable without departing from the scope or spirit of this disclosure.

[0019] As used herein, unless otherwise expressly indicated herein, the term "based on" is not exclusive and may be based on other factors not described.

[0020] As used in this specification and the appended claims, unless expressly indicated herein, the singular forms “a,” “an,” and “the” include the plural referents. As used in this specification and the appended claims, unless expressly indicated herein, the term “or” is generally used in its sense that it includes “and / or.”

[0021] The term "approximately" generally refers to a series of numerical values ​​that are considered equivalent to the listed values ​​(e.g., having the same function or result). In many cases, the term "approximately" may include numerical values ​​rounded to the nearest significant figure.

[0022] This disclosure provides a UV-curable underpad for chemimechanical planarization, comprising (a) a (meth)acrylate monomer unit and (b) an oligomer unit selected from difunctional (meth)acrylate-terminated polyether urethane oligomer unit, difunctional (meth)acrylate-terminated polyester urethane oligomer unit, difunctional (meth)acrylate-terminated urethane oligomer unit, and combinations thereof.

[0023] The UV-curable underpad used for chemimechanical planarization comprises (meth)acrylate monomer units. As used herein, the term "(meth)acrylate" refers to methacrylates and acrylate variants. Therefore, as used herein, "(meth)acrylate" may be used interchangeably with "methacrylate and / or acrylate". The (meth)acrylate monomer unit may be formed from any polymerizable (i.e., UV-curable) monomer containing methacrylate groups and / or acrylate groups. In other words, the term "unit" refers to the polymer residue remaining after polymerization (i.e., UV curing). For example, polymerizable (i.e., UV-curable) monomers may be acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, methyl acrylate, methyl methacrylate, ethyl methacrylate, isocamphene acrylate, isocamphene methacrylate, isoamyl acrylate, isoamyl methacrylate, isodecyl acrylate, isodecyl methacrylate, hexanediol diacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, 2-(tert-butyl)methacrylate, 2-(tert-butylamino)ethyl methacrylate, trimethylolpropane trimethacrylate, their salts, or combinations thereof. Therefore, in some embodiments, the underpad comprises (meth)acrylate monomer units formed from: acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, methyl acrylate, methyl methacrylate, ethyl methacrylate, isoborneol acrylate, isoborneol methacrylate, isoamyl acrylate, isoamyl methacrylate, isodecyl acrylate, isodecyl methacrylate, hexanediol diacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, 2-(tert-butyl)methacrylate, 2-(tert-butylamino)ethyl methacrylate, trimethylolpropane trimethacrylate, their salts, or combinations thereof. In some embodiments, the underpad comprises (meth)acrylate monomer units formed from isoborneol acrylate, isoborneol methacrylate, or combinations thereof.

[0024] The UV-curable underpad used for chemimechanical planarization may contain any suitable amount of (meth)acrylate monomer units. For example, the UV-curable underpad used for chemimechanical planarization may contain about 95% by weight or less of (meth)acrylate monomer units, such as about 90% by weight or less, about 85% by weight or less, about 80% by weight or less, about 75% by weight or less, about 70% by weight or less, about 65% by weight or less, about 60% by weight or less, about 55% by weight or less, or about 50% by weight or less of (meth)acrylate monomer units.

[0025] Alternatively, the UV-curable underpad for chemimechanical planarization may contain about 1% by weight or more of (meth)acrylate monomer units, such as about 5% by weight or more, about 10% by weight or more, 15% by weight or more, about 20% by weight or more, about 25% by weight or more, about 30% by weight or more, about 40% by weight or more, or about 50% by weight or more of (meth)acrylate monomer units. Therefore, depending on the circumstances, the UV-curable underpad for chemimechanical planarization may contain any amount of (meth)acrylate monomer units bounded by any two of the aforementioned endpoints.

[0026] For example, in some embodiments, the (meth)acrylate monomer unit can be from about 1 wt% to about 95 wt%, such as about 1 wt% to about 90 wt%, about 1 wt% to about 80 wt%, about 1 wt% to about 70 wt%, about 1 wt% to about 60 wt%, about 1 wt% to about 50 wt%, about 5 wt% to about 95 wt%, about 5 wt% to about 90 wt%, about 5 wt% to about 80 wt%, about 5 wt% to about 70 wt%, about 5 wt% to about 60 wt%, about 5 wt% to about 50 wt%, about 10 wt% to about 95 wt%, about 10 wt% to about 90 wt%, about 10 wt% to about 80 wt%. The amount of (meth)acrylate monomer units is present in the UV-curable underpad for chemical mechanical planarization, ranging from about 10% to about 70% by weight, about 10% to about 60% by weight, about 10% to about 50% by weight, about 25% to about 95% by weight, about 25% to about 90% by weight, about 25% to about 80% by weight, about 25% to about 70% by weight, about 25% to about 60% by weight, about 25% to about 50% by weight, about 50% to about 95% by weight, about 50% to about 90% by weight, about 50% to about 80% by weight, or about 50% to about 70% by weight. In some embodiments, the UV-curable underpad for chemical mechanical planarization comprises about 25% to about 50% by weight of (meth)acrylate monomer units. In some embodiments, the UV-curable underpad for chemical mechanical planarization comprises about 30% to about 50% by weight of (meth)acrylate monomer units.

[0027] The UV-curable underpad for chemimechanical planarization comprises oligomer units selected from difunctional (meth)acrylate-terminated polyether urethane oligomer units, difunctional (meth)acrylate-terminated polyester urethane oligomer units, difunctional (meth)acrylate-terminated urethane oligomer units, and combinations thereof.

[0028] In some embodiments, the UV-curable underpad for chemimechanical planarization comprises bifunctional (meth)acrylate-terminated polyether urethane oligomer units. In some embodiments, the underpad comprises aromatic polyether urethane di(meth)acrylate oligomer units, aliphatic polyether urethane di(meth)acrylate oligomer units, or a combination thereof. For example, the underpad may contain oligomeric units formed from the following: BR-202 (aromatic polyether urethane methacrylate), BR-204 (aromatic polyether urethane methacrylate), BR-3042 (aromatic polyether urethane methacrylate), BR-5541 (aliphatic polyether urethane methacrylate), BR-1044MB (aliphatic polyether urethane methacrylate), BR-543 (aliphatic polyether urethane acrylate), BR-543MB (aliphatic polyether urethane acrylate), BR-374 (aliphatic polyether urethane acrylate), BR-541S (aliphatic polyether urethane acrylate), or BR-345 (aliphatic polyether urethane acrylate), which are available from Bomar Chemicals. In some embodiments, the underpad comprises oligomeric units formed of BR-204 (aromatic polyether urethane methacrylate), BR-543 (aliphatic polyether urethane acrylate), BR-374 (aliphatic polyether urethane acrylate), or combinations thereof.

[0029] In some embodiments, the UV-curable underpad for chemimechanical planarization comprises bifunctional (meth)acrylate-terminated polyester urethane oligomer units. In some embodiments, the underpad comprises aliphatic polyester urethane di(meth)acrylate oligomer units. For example, the underpad may comprise oligomer units formed from XR-741MS (aliphatic polyester urethane methacrylate), BR-742M (aliphatic polyester urethane methacrylate), BR-742S (aliphatic polyester urethane methacrylate), BR-7432GI30 (aliphatic polyester urethane methacrylate), BR-752MS (aliphatic polyester urethane acrylate), or BR-744BT (aliphatic polyester urethane acrylate), which are available from Boma Chemicals. In some embodiments, the underpad comprises oligomer units formed from BR-744BT (aliphatic polyester urethane acrylate).

[0030] In some embodiments, the UV-curable underpad for chemimechanical planarization comprises bifunctional (meth)acrylate-terminated urethane oligomer units. In some embodiments, the underpad comprises polybutadiene urethane di(meth)acrylate oligomer units. For example, the underpad may comprise oligomer units formed from BR-640D (aliphatic polybutadiene urethane acrylate), BR-641E (aliphatic polybutadiene urethane acrylate), or BR-643 (aliphatic polybutadiene urethane acrylate), which are available from Boma Chemicals.

[0031] The UV-curable underpad for chemimechanical planarization may contain any suitable amount of oligomeric units. For example, a UV-curable underpad for chemimechanical planarization may contain about 95% by weight or less of oligomeric units, such as about 90% by weight or less, about 85% by weight or less, about 80% by weight or less, about 75% by weight or less, about 70% by weight or less, about 65% by weight or less, about 60% by weight or less, about 55% by weight or less, or about 50% by weight or less of oligomeric units. Alternatively, the UV-curable underpad for chemimechanical planarization may contain about 1% by weight or more of oligomeric units, such as about 5% by weight or more, about 10% by weight or more, 15% by weight or more, about 20% by weight or more, about 25% by weight or more, about 30% by weight or more, about 40% by weight or more, or about 50% by weight or more of oligomeric units. Thus, depending on the circumstances, a UV-curable underpad for chemimechanical planarization may contain any amount of oligomeric units bounded by any two of the aforementioned endpoints.

[0032] For example, in some embodiments, the oligomer units can be from about 1 wt% to about 95 wt%, such as about 1 wt% to about 90 wt%, about 1 wt% to about 80 wt%, about 1 wt% to about 70 wt%, about 1 wt% to about 60 wt%, about 1 wt% to about 50 wt%, about 5 wt% to about 95 wt%, about 5 wt% to about 90 wt%, about 5 wt% to about 80 wt%, about 5 wt% to about 70 wt%, about 5 wt% to about 60 wt%, about 5 wt% to about 50 wt%, about 10 wt% to about 95 wt%, about 10 wt% to about 90 wt%, about 10 wt% to about 80 wt%, about 10 wt% to about 10 wt%. The amount of oligomer units present in the UV-curable underpad for chemical mechanical planarization is from about 70% to about 70% by weight, from about 10% to about 60% by weight, from about 10% to about 50% by weight, from about 25% to about 95% by weight, from about 25% to about 90% by weight, from about 25% to about 80% by weight, from about 25% to about 70% by weight, from about 25% to about 50% by weight, from about 50% to about 95% by weight, from about 50% to about 90% by weight, from about 50% to about 80% by weight, from about 50% to about 70% by weight, or from about 50% to about 60% by weight. In some embodiments, the UV-curable underpad for chemical mechanical planarization contains about 50% to about 75% by weight of oligomer units.

[0033] In some embodiments, the UV-curable underpad for chemical mechanical planarization further comprises an additive selected from pore fillers, pigments, or combinations thereof. In some embodiments, the UV-curable underpad for chemical mechanical planarization further comprises a pore filler. The UV-curable underpad for chemical mechanical planarization may contain any suitable amount of pore filler (where present), but generally, the UV-curable underpad for chemical mechanical planarization contains pore filler in an amount of about 1% to about 10% by weight (e.g., about 1% to about 5% by weight or about 2% to about 4% by weight).

[0034] In some embodiments, the UV-curable underpad for chemical mechanical planarization further comprises one or more additional components resulting from the manufacturing process. For example, the underpad may contain a photoinitiator or a derivative thereof, such as residual components from acylphosphine oxides, α-aminoalkylphenyl ketones, α-dialkoxyacetophenones, α-hydroxyalkylphenyl ketones, benzyl ketals, benzoinethers, anthraquinones, benzophenones, polyurethane acrylates, or thioxanthones. Additionally, the UV-curable underpad for chemical mechanical planarization may further comprise various diluents, pore fillers, and pigments.

[0035] In some embodiments, the UV-curable underpad for chemimechanical planarization is circular. The circular underpad may have any suitable diameter. For example, the UV-curable underpad for chemimechanical planarization may have a diameter of about 2 cm or greater, such as about 5 cm or greater, about 10 cm or greater, about 25 cm or greater, about 50 cm or greater, about 60 cm or greater, or about 70 cm or greater. Alternatively, the UV-curable underpad for chemimechanical planarization may have a diameter of about 200 cm or less, such as about 150 cm or less, about 100 cm or less, about 90 cm or less, about 80 cm or less, about 70 cm or less, about 60 cm or less, or about 50 cm or less. Thus, depending on the circumstances, the UV-curable underpad for chemimechanical planarization may have any amount of diameter bounded by any two of the aforementioned endpoints.

[0036] For example, in some embodiments, the UV-cured underpad for chemimechanical planarization may have a diameter of about 2 cm to about 200 cm, such as about 2 cm to about 150 cm, about 2 cm to about 100 cm, about 2 cm to about 90 cm, about 2 cm to about 80 cm, about 2 cm to about 70 cm, about 2 cm to about 60 cm, about 2 cm to about 50 cm, 5 cm to about 200 cm, about 5 cm to about 150 cm, about 5 cm to about 100 cm, about 5 cm to about 90 cm, about 5 cm to about 80 cm, about 5 cm to about 70 cm, about 5 cm to about 60 cm, about 5 cm to about 50 cm, 25 cm to about 200 cm, about 25 cm to about 150 cm, about 25 cm to about 100 cm, about 25 cm to about 90 cm, about 25 cm to about 80 cm, about 25 cm to about 70 cm, about 25 cm to about 60 cm, about 25 cm to about 60 cm, about 25 cm to about 7 ...70 cm, about 25 cm to about 70 cm, about 25 cm to about 70 cm, about 25 cm to about 70 cm, about 25 cm to about 70 cm, about 25 cm to about 70 The diameter of the pad is from about 5 cm to about 200 cm, for example, from about 50 cm to about 150 cm, about 50 cm to about 100 cm, about 50 cm to about 90 cm, about 50 cm to about 80 cm, or about 50 cm to about 70 cm. In some embodiments, the pad is circular and has a diameter of about 5 cm to about 150 cm. In some embodiments, the pad is circular and has a diameter of about 50 cm to about 100 cm. In some embodiments, the pad is circular and has a diameter of about 70 cm to about 90 cm.

[0037] The UV-curable underlay for chemimechanical planarization can have any suitable thickness. For example, the UV-curable underlay for chemimechanical planarization can have a thickness of about 0.1 mm or greater, such as about 0.2 mm or greater, about 0.3 mm or greater, about 0.4 mm or greater, or about 0.5 mm or greater. Alternatively, the UV-curable underlay for chemimechanical planarization can have a thickness of about 2 mm or less, such as about 1.8 mm or less, about 1.6 mm or less, about 1.4 mm or less, about 1.2 mm or less, or about 1 mm or less. Therefore, depending on the circumstances, the UV-curable underlay for chemimechanical planarization can have any amount of thickness bounded by any two of the aforementioned endpoints.

[0038] For example, in some embodiments, the UV-cured underpad for chemical mechanical planarization may have a thickness of about 0.1 mm to about 2 mm, such as about 0.1 mm to about 1.8 mm, about 0.1 mm to about 1.6 mm, about 0.1 mm to about 1.4 mm, about 0.1 mm to about 1.2 mm, about 0.1 mm to about 1 mm, about 0.2 mm to about 2 mm, about 0.2 mm to about 1.8 mm, about 0.2 mm to about 1.6 mm, about 0.2 mm to about 1.4 mm, about 0.2 mm to about 1.2 mm, about 0.2 mm to about 1 mm, about 0.3 mm to about 2 mm, about 0.3 mm to about 1.8 mm, about 0.3 mm to about 1.6 mm, about 0.3 mm to about 1.4 mm, about 0.3 mm to about 1.2 mm, about 0.3 mm to about 1 mm, about 0.4 mm to about 2 mm, and about 0.4 mm to about 1.8 mm. The thickness is approximately 0.4 mm to about 1.6 mm, approximately 0.4 mm to about 1.4 mm, approximately 0.4 mm to about 1.2 mm, approximately 0.4 mm to about 1 mm, approximately 0.5 mm to about 2 mm, approximately 0.5 mm to about 1.8 mm, approximately 0.5 mm to about 1.6 mm, approximately 0.5 mm to about 1.4 mm, approximately 0.5 mm to about 1.2 mm, or approximately 0.5 mm to about 1 mm. In some embodiments, the lower pad has a thickness of approximately 0.1 mm to about 2 mm. In some embodiments, the lower pad has a thickness of approximately 0.5 mm to about 1 mm.

[0039] In some embodiments, the UV-cured underpad used for chemimechanical planarization has a uniform thickness, and the thickness variation at each location of the UV-cured underpad relative to the average thickness of the UV-cured underpad is less than about 20%, less than about 15%, less than about 10%, less than about 5%, less than about 1%, or less than about 0.1%.

[0040] The UV-curable underpad used for chemical mechanical planarization can have any suitable hardness. For example, the UV-curable underpad used for chemical mechanical planarization can have a hardness of about 25 Shore A or greater, such as about 30 Shore A or greater, about 31 Shore A or greater, about 32 Shore A or greater, about 33 Shore A or greater, about 34 Shore A or greater, or about 35 Shore A or greater. Alternatively, the UV-curable underpad used for chemical mechanical planarization can have a hardness of about 100 Shore A or less, such as about 99 Shore A or less, about 98 Shore A or less, about 97 Shore A or less, about 96 Shore A or less, about 95 Shore A or less, about 94 Shore A or less, about 93 Shore A or less, about 92 Shore A or less, about 91 Shore A or less, about 90 Shore A or less, about 85 Shore A or less, or about 80 Shore A or less. Therefore, depending on the circumstances, the UV-cured underpad used for chemical mechanical planarization can have any amount of hardness bounded by any two of the aforementioned endpoints.

[0041] For example, in some embodiments, the UV-cured underpad for chemical mechanical planarization may have a strength of about 25 Shore A to about 100 Shore A, such as about 25 Shore A to about 99 Shore A, about 25 Shore A to about 98 Shore A, about 25 Shore A to about 97 Shore A, about 25 Shore A to about 96 Shore A, about 25 Shore A to about 95 Shore A, about 25 Shore A to about 94 Shore A, about 25 Shore A to about 93 Shore A, about 25 Shore A to about 92 Shore A, about 25 Shore A to about 91 Shore A, about 25 Shore A to about 90 Shore A, about 25 Shore A... A to about 85 Shore A, about 25 Shore A to about 80 Shore A, about 30 Shore A to about 100 Shore A, about 30 Shore A to about 99 Shore A, about 30 Shore A to about 98 Shore A, about 30 Shore A to about 97 Shore A, about 30 Shore A to about 96 Shore A, about 30 Shore A to about 95 Shore A, about 30 Shore A to about 94 Shore A, about 30 Shore A to about 93 Shore A, about 30 Shore A to about 92 Shore A, about 30 Shore A to about 91 Shore A, about 30 Shore A to about 90 Shore A, about 30 Shore A to about 85 Shore A, Approximately 30 Shore A to approximately 80 Shore A, approximately 31 Shore A to approximately 100 Shore A, approximately 31 Shore A to approximately 99 Shore A, approximately 31 Shore A to approximately 98 Shore A, approximately 31 Shore A to approximately 97 Shore A, approximately 31 Shore A to approximately 96 Shore A, approximately 31 Shore A to approximately 95 Shore A, approximately 31 Shore A to approximately 94 Shore A, approximately 31 Shore A to approximately 93 Shore A, approximately 31 Shore A to approximately 92 Shore A, approximately 31 Shore A to approximately 91 Shore A, approximately 31 Shore A to approximately 90 Shore A, approximately 31 Shore A to approximately 85 Shore A, approximately 31 Shore A to approximately 8 The hardness ranges from 0 Shore A to about 100 Shore A, from about 35 Shore A to about 99 Shore A, from about 35 Shore A to about 98 Shore A, from about 35 Shore A to about 97 Shore A, from about 35 Shore A to about 96 Shore A, from about 35 Shore A to about 95 Shore A, from about 35 Shore A to about 94 Shore A, from about 35 Shore A to about 93 Shore A, from about 35 Shore A to about 92 Shore A, from about 35 Shore A to about 91 Shore A, from about 35 Shore A to about 90 Shore A, from about 35 Shore A to about 85 Shore A, or from about 35 Shore A to about 80 Shore A. In some embodiments, the lower pad has a hardness of about 30 Shore A to about 100 Shore A. In some embodiments, the lower pad has a hardness of about 30 Shore A to about 95 Shore A.

[0042] This disclosure also provides a polishing pad for chemical mechanical planarization, comprising a top sheet and a UV-curable undersheet as described herein, wherein the UV-curable undersheet is bonded to a surface of the top sheet (i.e., the surface of the top sheet opposite the surface to be polished). The polishing pad for chemical mechanical planarization comprises a top sheet and a UV-curable undersheet as described herein. The top sheet can be any suitable top sheet capable of chemical mechanical planarization, many of which are known in the art and commercially available. In some embodiments, the top sheet is a woven top sheet. In other embodiments, the top sheet is a non-woven top sheet.

[0043] In some embodiments, the UV-curable underpad is bonded to the surface of the top sheet without the use of an adhesive. For example, the UV-curable underpad can be directly bonded to the surface of the top sheet via UV curing. Without wishing to be bound by any particular theory, it is believed that the manufacturing process disclosed herein (which includes UV curing) provides a crosslinked UV-curable underpad that is entangled with the top sheet via UV curing, thereby eliminating the need for an adhesive.

[0044] In other embodiments, the UV-cured undersheet is bonded to the surface of the top sheet using an adhesive (e.g., through a lamination process).

[0045] In some embodiments, the polishing pad for chemical mechanical planarization is circular. The circular polishing pad may have any suitable diameter. For example, a polishing pad for chemical mechanical planarization may have a diameter of about 2 cm or greater, such as about 5 cm or greater, about 10 cm or greater, about 25 cm or greater, about 50 cm or greater, about 60 cm or greater, or about 70 cm or greater. Alternatively, a polishing pad for chemical mechanical planarization may have a diameter of about 200 cm or less, such as about 150 cm or less, about 100 cm or less, about 90 cm or less, about 80 cm or less, about 70 cm or less, about 60 cm or less, or about 50 cm or less. Thus, depending on the circumstances, a polishing pad for chemical mechanical planarization may have any amount of diameter bounded by any two of the aforementioned endpoints.

[0046] For example, in some embodiments, the polishing pad for chemical mechanical planarization may have a diameter of about 2 cm to about 200 cm, such as about 2 cm to about 150 cm, about 2 cm to about 100 cm, about 2 cm to about 90 cm, about 2 cm to about 80 cm, about 2 cm to about 70 cm, about 2 cm to about 60 cm, about 2 cm to about 50 cm, 5 cm to about 200 cm, about 5 cm to about 150 cm, about 5 cm to about 100 cm, about 5 cm to about 90 cm, about 5 cm to about 80 cm, about 5 cm to about 70 cm, about 5 cm to about 60 cm, about 5 cm to about 50 cm, 25 cm to about 200 cm, about 25 cm to about 150 cm, about 25 cm to about 100 cm, about 25 cm to about 90 cm, about 25 cm to about 80 cm, about 25 cm to about 70 cm, about 25 cm to about 60 cm, about 25 cm to about 50 cm. The diameter can be from about 50 cm to about 200 cm, for example, from about 50 cm to about 150 cm, about 50 cm to about 100 cm, about 50 cm to about 90 cm, about 50 cm to about 80 cm, or about 50 cm to about 70 cm. In some embodiments, the polishing pad is circular and has a diameter of about 5 cm to about 150 cm. In some embodiments, the polishing pad is circular and has a diameter of about 50 cm to about 100 cm. In some embodiments, the polishing pad is circular and has a diameter of about 70 cm to about 90 cm.

[0047] Polishing pads for chemical mechanical planarization can have any suitable thickness. For example, polishing pads for chemical mechanical planarization can have a thickness of about 0.5 mm or greater, such as about 0.75 mm or greater, about 1 mm or greater, about 1.5 mm or greater, or about 2 mm or greater. Alternatively, polishing pads for chemical mechanical planarization can have a thickness of about 4 mm or less, such as about 3.5 mm or less, about 3 mm or less, about 3.5 mm or less, or about 2 mm or less. Therefore, depending on the circumstances, polishing pads for chemical mechanical planarization can have any amount of thickness bounded by any two of the aforementioned endpoints.

[0048] For example, in some embodiments, the polishing pad for chemical mechanical planarization may have a thickness of about 0.5 mm to about 4 mm, such as about 0.5 mm to about 3.5 mm, about 0.5 mm to about 3 mm, about 0.5 mm to about 2.5 mm, about 0.5 mm to about 2 mm, 0.75 mm to about 4 mm, about 0.75 mm to about 3.5 mm, about 0.75 mm to about 3 mm, about 0.75 mm to about 2.5 mm, about 0.75 mm to about 2 mm, 1 mm to about 4 mm, about 1 mm to about 3.5 mm, about 1 mm to about 3 mm, about 1 mm to about 2.5 mm, about 1 mm to about 2 mm, 1.5 mm to about 4 mm, about 1.5 mm to about 3.5 mm, about 1.5 mm to about 3 mm, about 1.5 mm to about 2.5 mm, about 1.5 mm to about 2 mm, 2 mm to about 4 mm, about 2 mm to about 3.5 mm, about 2 mm to about 3 mm. The polishing pad has a thickness of about 2 mm to about 2.5 mm. In some embodiments, the polishing pad has a thickness of about 0.5 mm to about 4 mm. In some embodiments, the polishing pad has a thickness of about 2 mm to about 3 mm.

[0049] In some embodiments, the polishing pad for chemical mechanical planarization has a uniform thickness, and the thickness variation at each location of the polishing pad for chemical mechanical planarization relative to the average thickness of the polishing pad for chemical mechanical planarization is less than about 20%, less than about 15%, less than about 10%, less than about 5%, less than about 1%, or less than 0.1%.

[0050] This disclosure also provides a method for preparing the polishing pad for chemical mechanical polishing planarization described herein, the method comprising: (i) providing a top sheet having a polishing side and a side opposite to the polishing side; (ii) applying a UV-curable composition to the side opposite to the polishing side; (iii) uniformly distributing the UV-curable composition on the side opposite to the polishing side; and (iv) UV curing the UV-curable composition to provide the polishing pad. Side and top views of exemplary arrangements for preparing the polishing pad for chemical mechanical polishing planarization described herein are provided respectively. Figure 1A and 1B middle.

[0051] Without wishing to be bound by any particular theory, it is believed that the methods described herein provide a polishing pad for chemical mechanical planarization that (i) has increased durability and stability compared to conventional methods, (ii) has higher yield (i.e. less waste material) than conventional methods, (iii) is less expensive than conventional methods, and (iv) is more efficient than conventional methods.

[0052] The method includes providing a top sheet having a polished side and a side opposite to the polished side. The top sheet can be any suitable top sheet disclosed herein. In this respect, the top sheet can be any suitable top sheet capable of chemical mechanical planarization, many of which are known in the art and commercially available. In some embodiments, the top sheet is a woven top sheet. In other embodiments, the top sheet is a non-woven top sheet. The top sheet can have any suitable thickness. For example, the top sheet can have a thickness of about 0.1 mm or greater, such as about 0.2 mm or greater, about 0.3 mm or greater, about 0.4 mm or greater, or about 0.5 mm or greater. Or, additionally, the top sheet can have a thickness of about 3 mm or less, such as about 2.5 mm or less, or about 2 mm or less. Thus, depending on the circumstances, the top sheet can have any amount of thickness bounded by any two of the aforementioned endpoints.

[0053] For example, in some embodiments, the top sheet may have a thickness of about 0.1 mm to about 3 mm, such as about 0.1 mm to about 2.5 mm, about 0.1 mm to about 2 mm, about 0.2 mm to about 3 mm, about 0.2 mm to about 3.5 mm, about 0.2 mm to about 2 mm, about 0.3 mm to about 3 mm, about 0.3 mm to about 2.5 mm, about 0.3 mm to about 2 mm, about 0.4 mm to about 3 mm, about 0.4 mm to about 2.5 mm, about 0.4 mm to about 2 mm, about 0.5 mm to about 3 mm, about 0.5 mm to about 2.5 mm, or about 0.5 mm to about 2 mm. In some embodiments, the bottom pad has a thickness of about 0.5 mm to about 2 mm. In some embodiments, the bottom pad has a thickness of about 1 mm to about 2 mm.

[0054] The method includes applying a UV-curable composition to a side opposite to the polished side. The UV-curable composition can be applied by any suitable method. For example, the UV-curable composition can be poured, sprayed, or brushed onto the side opposite the polished side. In some embodiments, the method further includes applying a vacuum to the polishing pad of the top sheet before applying the UV-curable composition to the side opposite the polished side of the top sheet.

[0055] In some embodiments, the UV-curable composition comprises (a) a (meth)acrylate monomer and (b) an oligomer selected from difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof.

[0056] In some embodiments, the UV-curable composition comprises a (meth)acrylate monomer. The (meth)acrylate monomer may be any polymerizable (i.e., UV-curable) monomer containing a methacrylate group and / or an acrylate group. For example, the (meth)acrylate monomer may be acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, methyl acrylate, methyl methacrylate, ethyl methacrylate, isoborneol acrylate, isoborneol methacrylate, isoamyl acrylate, isoamyl methacrylate, isodecyl acrylate, isodecyl methacrylate, hexanediol diacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, 2-(tert-butyl)methacrylate, 2-(tert-butylamino)ethyl methacrylate, trimethylolpropane trimethacrylate, their salts, or combinations thereof. Therefore, in some embodiments, the (meth)acrylate monomer is acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, methyl acrylate, methyl methacrylate, ethyl methacrylate, isoborneol acrylate, isoborneol methacrylate, isoamyl acrylate, isoamyl methacrylate, isodecyl acrylate, isodecyl methacrylate, hexanediol diacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, 2-(tert-butyl)methacrylate, 2-(tert-butylamino)ethyl methacrylate, trimethylolpropane trimethacrylate, its salts, or combinations thereof. In some embodiments, the UV-curable composition comprises isoborneol acrylate, isoborneol methacrylate, or combinations thereof.

[0057] UV-curable compositions may contain any suitable amount of (meth)acrylate monomers. For example, a UV-curable composition may contain about 95% by weight or less (meth)acrylate monomers based on the total weight of the polymerizable monomers and oligomers, such as about 90% by weight or less, about 85% by weight or less, about 80% by weight or less, about 75% by weight or less, about 70% by weight or less, about 65% by weight or less, about 60% by weight or less, about 55% by weight or less, or about 50% by weight or less (meth)acrylate monomers based on the total weight of the polymerizable monomers and oligomers. Alternatively, the UV-curable composition may contain about 1% by weight or more of (meth)acrylate monomers based on the total weight of the curable monomers and oligomers, for example, about 5% by weight or more, about 10% by weight or more, 15% by weight or more, about 20% by weight or more, about 25% by weight or more, about 30% by weight or more, about 40% by weight or more, or about 50% by weight or more of (meth)acrylate monomers based on the total weight of the polymerizable monomers and oligomers. Therefore, depending on the circumstances, the UV-curable composition may contain any amount of (meth)acrylate monomers bounded by any of the two aforementioned endpoints.

[0058] For example, in some embodiments, the (meth)acrylate monomer may be from about 1% by weight to about 95% by weight based on the total weight of the polymerizable monomers and oligomers, such as from about 1% by weight to about 90% by weight, from about 1% by weight to about 80% by weight, from about 1% by weight to about 70% by weight, from about 1% by weight to about 60% by weight, from about 1% by weight to about 50% by weight, from about 5% by weight to about 95% by weight, from about 5% by weight to about 90% by weight, from about 5% by weight to about 80% by weight, from about 5% by weight to about 70% by weight, from about 5% by weight to about 60% by weight, from about 5% by weight to about 50% by weight, from about 10% by weight to about 95% by weight, or from about 10% by weight. The UV-curable composition contains amounts ranging from about 90 wt%, about 10 wt% to about 80 wt%, about 10 wt% to about 70 wt%, about 10 wt% to about 60 wt%, about 10 wt% to about 50 wt%, about 25 wt% to about 95 wt%, about 25 wt% to about 90 wt%, about 25 wt% to about 80 wt%, about 25 wt% to about 70 wt%, about 25 wt% to about 60 wt%, about 25 wt% to about 50 wt%, about 50 wt% to about 95 wt%, about 50 wt% to about 90 wt%, about 50 wt% to about 80 wt%, about 50 wt% to about 70 wt%, or about 50 wt% to about 60 wt%. In some embodiments, the UV-curable composition comprises about 25 wt% to about 50 wt% (meth)acrylate monomers based on the total weight of the polymerizable monomers and oligomers. In some embodiments, the UV-curable composition comprises about 30% to about 50% by weight of (meth)acrylate monomers based on the total weight of polymerizable monomers and oligomers.

[0059] In some embodiments, the UV-curable composition comprises oligomers selected from difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof.

[0060] In some embodiments, the UV-curable composition comprises a bifunctional (meth)acrylate-terminated polyether urethane oligomer. In some embodiments, the UV-curable composition comprises an aromatic polyether urethane di(meth)acrylate oligomer, an aliphatic polyether urethane di(meth)acrylate oligomer, or a combination thereof. For example, the UV-curable composition may contain oligomers selected from the following: BR-202 (aromatic polyether urethane methacrylate), BR-204 (aromatic polyether urethane methacrylate), BR-3042 (aromatic polyether urethane methacrylate), BR-5541 (aliphatic polyether urethane methacrylate), BR-1044MB (aliphatic polyether urethane methacrylate), BR-543 (aliphatic polyether urethane acrylate), BR-543MB (aliphatic polyether urethane acrylate), BR-374 (aliphatic polyether urethane acrylate), BR-541S (aliphatic polyether urethane acrylate), and BR-345 (aliphatic polyether urethane acrylate), which are available from Boma Chemicals. In some embodiments, the UV-curable composition comprises an oligomer selected from the following: BR-204 (aromatic polyether urethane methacrylate), BR-543 (aromatic polyether urethane acrylate), BR-374 (aromatic polyether urethane acrylate), and combinations thereof.

[0061] In some embodiments, the UV-curable composition comprises a bifunctional (meth)acrylate-terminated polyester urethane oligomer. In some embodiments, the UV-curable composition comprises an aliphatic polyester urethane di(meth)acrylate oligomer. For example, the UV-curable composition may comprise oligomers selected from XR-741MS (aliphatic polyester urethane methacrylate), BR-742M (aliphatic polyester urethane methacrylate), BR-742S (aliphatic polyester urethane methacrylate), BR-7432GI30 (aliphatic polyester urethane methacrylate), BR-752MS (aliphatic polyester urethane acrylate), and BR-744BT (aliphatic polyester urethane acrylate), which are available from Boma Chemicals. In some embodiments, the UV-curable composition comprises BR-744BT (aliphatic polyester urethane acrylate).

[0062] In some embodiments, the UV-curable composition comprises a bifunctional (meth)acrylate-terminated urethane oligomer. In some embodiments, the UV-curable composition comprises a polybutadiene urethane di(meth)acrylate oligomer. For example, the UV-curable composition may comprise oligomers selected from BR-640D (aliphatic polybutadiene urethane acrylate), BR-641E (aliphatic polybutadiene urethane acrylate), and BR-643 (aliphatic polybutadiene urethane acrylate), which are available from Boma Chemicals.

[0063] UV-curable compositions may contain any suitable amount of oligomers selected from: difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof. For example, a UV-curable composition may contain about 95% by weight or less of oligomers based on the total weight of polymerizable monomers and oligomers, such as about 90% by weight or less, about 85% by weight or less, about 80% by weight or less, about 75% by weight or less, about 70% by weight or less, about 65% by weight or less, about 60% by weight or less, about 55% by weight or less, or about 50% by weight or less of oligomers based on the total weight of polymerizable monomers and oligomers.

[0064] Alternatively, the UV-curable composition may contain about 1% by weight or more of oligomers based on the total weight of the polymerizable monomers and oligomers, for example, about 5% by weight or more, about 10% by weight or more, 15% by weight or more, about 20% by weight or more, about 25% by weight or more, about 30% by weight or more, about 40% by weight or more, or about 50% by weight or more of oligomers based on the total weight of the polymerizable monomers and oligomers. Therefore, depending on the circumstances, the UV-curable composition may contain oligomers selected from: difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof, the content of which is defined by any two of the foregoing endpoints, as specifically required.

[0065] For example, in some embodiments, oligomers selected from difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof may be from about 1 wt% to about 95 wt% based on the total weight of the polymerizable monomers and oligomers, for example, from about 1 wt% to about 90 wt%, from about 1 wt% to about 80 wt%, from about 1 wt% to about 70 wt%, from about 1 wt% to about 60 wt%, from about 1 wt% to about 50 wt%, from about 5 wt% to about 95 wt%, from about 5 wt% to about 90 wt%, from about 5 wt% to about 80 wt%, from about 5 wt% to about 70 wt%, from about 5 wt% to about 60 wt% based on the total weight of the polymerizable monomers and oligomers. The UV-curable composition is present in amounts of about 5% to about 50% by weight, about 10% to about 95% by weight, about 10% to about 90% by weight, about 10% to about 80% by weight, about 10% to about 70% by weight, about 10% to about 60% by weight, about 10% to about 50% by weight, about 25% to about 95% by weight, about 25% to about 90% by weight, about 25% to about 80% by weight, about 25% to about 70% by weight, about 25% to about 60% by weight, about 25% to about 50% by weight, about 50% to about 95% by weight, about 50% to about 90% by weight, about 50% to about 80% by weight, about 50% to about 70% by weight, or about 50% to about 60% by weight. In some embodiments, the UV-curable composition comprises about 50% to about 75% by weight, based on the total weight of the polymerizable monomers and oligomers, an oligomer selected from difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof. In some embodiments, the UV-curable composition comprises about 50% to about 70% by weight, based on the total weight of the polymerizable monomers and oligomers, an oligomer selected from difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof.

[0066] In some embodiments, the UV-curable composition further comprises an additive selected from pore fillers, pigments, and combinations thereof. In some embodiments, the UV-curable composition further comprises a pore filler. The UV-curable composition may contain a pore filler in any suitable amount (where present), but generally, the UV-curable composition contains a pore filler in an amount of about 1% to about 10% by weight (e.g., about 1% to about 5% by weight or about 2% to about 4% by weight) based on the total weight of the UV-curable composition.

[0067] In some embodiments, the UV-curable composition further comprises a photoinitiator. The photoinitiator may be any suitable initiator capable of forming a reactive substance upon irradiation with light. In some embodiments, the photoinitiator is selected from acylphosphine oxides, α-aminoalkylphenyl ketones, α-dialkoxyacetophenones, α-hydroxyalkylphenyl ketones, benzyl ketals, benzoin ethers, anthraquinones, benzophenones, thioxanthones, and combinations thereof. In some embodiments, the UV-curable composition comprises an acylphosphine oxide photoinitiator, for example, phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide.

[0068] The method includes uniformly distributing a UV-curable composition on the side opposite the polished side. As used herein, the terms "uniformly" or "uniformly" refer to a specific property (i.e., thickness when referring to "uniformly distributed" or "uniformly coated") at each location of the component relative to the average value of the overall component, which is less than about 20% (e.g., less than about 15%, less than about 10%, less than about 5%, less than about 1%, or less than about 0.1%). The UV-curable composition can be distributed by any suitable means to provide a uniform amount of UV-curable composition having the thickness described herein on the side opposite the polished side. For example, the UV-curable composition can be distributed by gravity, a scraper, a spatula, or the like. In some embodiments, the UV-curable composition is uniformly distributed on the side opposite the polished side using a scraper.

[0069] The method includes UV curing the UV-curable composition to provide the polishing pad. The UV-curable composition can be cured at any suitable wavelength using any suitable component, which induces the polymerization of polymerizable monomers and oligomers. In some embodiments, the UV-curable composition is used at a wavelength of about 350 nm to about 420 nm, such as about 350 nm to about 415 nm, about 350 nm to about 410 nm, about 350 nm to about 405 nm, about 350 nm to about 400 nm, about 355 nm to about 420 nm, about 355 nm to about 415 nm, about 355 nm to about 410 nm, about 355 nm to about 405 nm, about 355 nm to about 400 nm, about 360 nm to about 420 nm, about 360 nm to about 415 nm, about 360 nm to about 410 nm, about 360 nm to about 405 nm, about 360 nm to about 400 nm, about 365 nm to about 420 nm, about 365 nm to about 415 nm, about 365 nm to about 410 nm, about 365 nm to about 405 nm, or about 365 nm. UV curing is performed using light with wavelengths from about 365 nm to about 405 nm. In some embodiments, the UV-curable composition is UV-cured using light with wavelengths from about 365 nm to about 405 nm.

[0070] In some embodiments, the UV-curable composition is UV-cured using a UV lamp attached to the scraper. For example, the UV-curable composition is simultaneously uniformly distributed on the side opposite to the polishing side. In other words, steps (iii) and (iv) of the claimed method can occur simultaneously.

[0071] This disclosure further provides an apparatus for performing the method of preparing a polishing pad for chemical mechanical planarization as described herein, the apparatus comprising (i) a jig including a circular notch, (ii) a scraper, and (iii) a UV light source.

[0072] In some embodiments, the apparatus for performing the methods described herein includes a fixture comprising a circular notch. As used herein, a “fixture” refers to any object (e.g., a carrier plate) having a circular notch for receiving (a) a top sheet and (b) a UV-curable composition or a UV-curable underpainting for chemical mechanical planarization. There is no particular limitation on the depth of the notch in the fixture; however, the depth of the notch is set to the ideal thickness of the polishing pad for chemical mechanical planarization. In some embodiments, the fixture further includes holes in the notch. The holes in the notch can be used to (a) apply a vacuum to the polishing side of the top sheet before applying the UV-curable composition to the side opposite the polishing side of the top sheet and / or (b) punch holes (i.e., punch holes) in the polishing pad after completion for chemical mechanical planarization. Alternatively or additionally, the fixture further includes grooves around the periphery of the notch. The grooves can be used to collect excess UV-curable composition formed due to the uniform distribution of the UV-curable composition (e.g., by using a scraper). Exemplary fixtures (e.g., carrier plates) including punch holes and grooves are depicted in Figure 2 middle.

[0073] In some embodiments, the apparatus for performing the methods described herein includes a scraper. As the fixture passes beneath the scraper, a UV-curable composition is distributed onto a top sheet within a circular notch, thereby forming a uniform coating having the UV-curable composition, such as... Figure 3 As depicted in the text.

[0074] In some embodiments, the apparatus for performing the methods described herein includes a UV light source. As the fixture passes beneath the UV light source, a UV-curable composition, such as... Figure 3 As depicted in the text. The light source can emit light at any suitable wavelength. In some embodiments, the light source emits light at a wavelength of about 350 nm to about 420 nm, such as about 350 nm to about 415 nm, about 350 nm to about 410 nm, about 350 nm to about 405 nm, about 350 nm to about 400 nm, about 355 nm to about 420 nm, about 355 nm to about 415 nm, about 355 nm to about 410 nm, about 355 nm to about 405 nm, about 355 nm to about 400 nm, about 360 nm to about 420 nm, about 360 nm to about 415 nm, about 360 nm to about 410 nm, about 360 nm to about 405 nm, about 360 nm to about 400 nm, about 365 nm to about 420 nm, about 365 nm to about 415 nm, about 365 nm to about 410 nm, about 365 nm to about 405 nm, or about 365 nm to about 400 nm. Light at wavelengths of nm. In some embodiments, the light source emits light at wavelengths of about 365 nm to about 405 nm.

[0075] The aspects disclosed herein (including embodiments) may be beneficial individually or in combination with one or more other aspects or embodiments. Without limiting the foregoing description, certain non-limiting embodiments numbered 1 to 43 of this disclosure are provided below. As will be appreciated by those skilled in the art upon reading this disclosure, each of the individually numbered embodiments may be used or combined with any of the foregoing or hereinafter individually numbered embodiments. This is intended to support all such combinations of embodiments, and not be limited to, the combinations of embodiments explicitly provided below:

[0076] Example

[0077] (1) Example (1) presents a UV-curable underpad for chemical mechanical planarization, comprising

[0078] (a) (meth)acrylate monomer units and

[0079] (b) Oligomeric units selected from difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof.

[0080] (2) In Example (2), a UV-cured underpad as in Example (1) is presented, wherein the underpad is circular and has a diameter of about 5 cm to about 150 cm.

[0081] (3) In Example (3), a UV-cured underpad as in Example (1) is presented, wherein the underpad is circular and has a diameter of about 50 cm to about 100 cm.

[0082] (4) In Example (4), a UV-cured underpad as in Example (1) is presented, wherein the underpad is circular and has a diameter of about 70 cm to about 90 cm.

[0083] (5) In Example (5), a UV-cured underpad as in any of Examples (1) to (4) is presented, wherein the underpad has a thickness of about 0.1 mm to about 2 mm.

[0084] (6) In Example (6), a UV-cured underpad as in any of Examples (1) to (4) is presented, wherein the underpad has a thickness of about 0.5 mm to about 1 mm.

[0085] (7) A UV-curable underpad as in any of Examples (1) to (6) is presented in Example (7), wherein the underpad comprises a (meth)acrylate monomer unit formed from the following: acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, methyl acrylate, methyl methacrylate, ethyl methacrylate, isocamphene acrylate, isocamphene methacrylate, isoamyl acrylate, isoamyl methacrylate, isodecyl acrylate, isodecyl methacrylate, hexanediol diacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, 2-(tert-butyl)methacrylate, 2-(tert-butylamino)ethyl methacrylate, trimethylolpropane trimethacrylate, salts thereof, or combinations thereof.

[0086] (8) A UV-curable underpad as in any of Examples (1) to (7) is presented in Example (8), wherein the underpad comprises a bifunctional (meth)acrylate-terminated polyether urethane oligomer unit.

[0087] (9) In Example (9), a UV-curable underpad as in Example (8) is presented, wherein the underpad comprises aromatic polyether urethane di(meth)acrylate oligomer units, aliphatic polyether urethane di(meth)acrylate oligomer units, or a combination thereof.

[0088] (10) A UV-curable underpad as in any of Examples (1) to (9) is presented in Example (10), wherein the underpad comprises a bifunctional (meth)acrylate-terminated polyester urethane oligomer unit.

[0089] (11) In Example (11), a UV-curable underpad as in Example (10) is presented, wherein the underpad comprises aliphatic polyester urethane di(meth)acrylate oligomer units.

[0090] (12) In Example (12), a UV-curable underpad as in any of Examples (1) to (11) is presented, wherein the underpad comprises a bifunctional (meth)acrylate-terminated urethane oligomer unit.

[0091] (13) In Example (13), a UV-curable underpad as in Example (12) is presented, wherein the underpad comprises polybutadiene urethane di(meth)acrylate oligomer units.

[0092] (14) In Example (14), a UV-cured underpad as in any of Examples (1) to (13) is presented, wherein the underpad has a hardness of about 30 Shore A to about 100 Shore A.

[0093] (15) In Example (15), a UV-cured underpad as in any of Examples (1) to (13) is presented, wherein the underpad has a hardness of about 30 Shore A to about 95 Shore A.

[0094] (16) In Example (16), a polishing pad for chemical mechanical planarization is presented, comprising a top sheet and a UV-curable underpad as in any of Examples (1) to (15), wherein the UV-curable underpad is bonded to the surface of the top sheet.

[0095] (17) In Example (17), a polishing pad as in Example (16) is presented, wherein the UV-cured underpad is bonded to the surface of the top sheet without adhesive.

[0096] (18) A polishing pad as in Example (16) or Example (17) is presented in Example (18), wherein the UV-cured underpad is directly bonded to the surface of the top sheet by UV curing.

[0097] (19) In Example (19), a polishing pad as in any of Examples (16) to (18) is presented, wherein the polishing pad is circular and has a diameter of about 5 cm to about 150 cm.

[0098] (20) In Example (20), a polishing pad as in any of Examples (16) to (18) is presented, wherein the polishing pad is circular and has a diameter of about 50 cm to about 100 cm.

[0099] (21) In Example (21), a polishing pad as in any of Examples (16) to (18) is presented, wherein the polishing pad is circular and has a diameter of about 70 cm to about 90 cm.

[0100] (22) A polishing pad as in any of the embodiments of (16) to (21) is presented in Example (22), wherein the polishing pad has a thickness of about 0.5 mm to about 4 mm.

[0101] (23) A polishing pad as in any of the embodiments of (16) to (21) is presented in Example (23), wherein the polishing pad has a thickness of about 2 mm to about 3 mm.

[0102] (24) Example (24) presents a method for preparing a polishing pad for chemical mechanical planarization as in any of Examples (16) to (23), the method comprising:

[0103] (i) Providing a top sheet having a polished side and a side opposite to the polished side, and applying a UV-curable composition to the side opposite to the polished side.

[0104] (ii) The UV-curable composition is uniformly distributed on the side opposite to the polished side, and

[0105] (iii) UV curing the UV-curable composition to provide the polishing pad.

[0106] (25) The method presented in Example (25) is as in Example (24), wherein the UV-curable composition comprises

[0107] (a) (Meth)acrylate monomers and

[0108] (b) Oligomers selected from difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof.

[0109] (26) The method of Example (25) is presented in Example (26), wherein the (meth)acrylate monomer is acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, methyl acrylate, methyl methacrylate, ethyl methacrylate, isocamphene acrylate, isocamphene methacrylate, isoamyl acrylate, isoamyl methacrylate, isodecyl acrylate, isodecyl methacrylate, hexanediol diacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, 2-(tert-butyl)methacrylate, 2-(tert-butylamino)ethyl methacrylate, trimethylolpropane trimethacrylate, their salts or combinations thereof.

[0110] (27) The method presented in Example (27) is as in Example (25) or Example (26), wherein the UV curable composition comprises a bifunctional (meth)acrylate-terminated polyether urethane oligomer.

[0111] (28) The method of Example (27) is presented in Example (28), wherein the UV curable composition comprises an aromatic polyether urethane di(meth)acrylate oligomer, an aliphatic polyether urethane di(meth)acrylate oligomer, or a combination thereof.

[0112] (29) The method presented in Example (29) is as in any of Examples (25) to (28), wherein the UV curable composition comprises a difunctional (meth)acrylate-terminated polyester urethane oligomer.

[0113] (30) The method presented in Example (30) is as in Example (29), wherein the UV curable composition comprises an aliphatic polyester urethane di(meth)acrylate oligomer.

[0114] (31) The method presented in Example (31) is as in any of the examples (25) to (30), wherein the UV curable composition comprises a bifunctional (meth)acrylate-terminated urethane oligomer.

[0115] (32) The method of Example (31) is presented in Example (32), wherein the UV curable composition comprises polybutadiene urethane di(meth)acrylate oligomer.

[0116] (33) The method presented in Example (33) is as in any of Examples (25) to (32), wherein the UV curable composition further comprises a photoinitiator.

[0117] (34) The method of Example (33) is presented in Example (34), wherein the photoinitiator is selected from acylphosphine oxide, α-aminoalkylphenyl ketone, α-dialkoxyacetophenone, α-hydroxyalkylphenyl ketone, benzyl ketal, benzoin ether, anthraquinone, benzophenone, thioxanone and combinations thereof.

[0118] (35) The method presented in Example (35) is as in any of the examples (25) to (34), wherein the UV curable composition further comprises an additive selected from pore fillers, pigments or combinations thereof.

[0119] (36) The method presented in Example (36) is as in any of Examples (24) to (35), wherein the UV curable composition is uniformly spread on the side opposite to the polished side using a scraper.

[0120] (37) The method of any of the embodiments of Examples (24) to (36) is presented in Example (37), wherein the UV curable composition is UV cured with light at a wavelength of about 350 nm to about 420 nm.

[0121] (38) The method of any of the embodiments of Examples (24) to (36) is presented in Example (38), wherein the UV curable composition is UV cured with light at a wavelength of about 365 nm to about 405 nm.

[0122] (39) The method of any of the embodiments of Examples (24) to (38) is presented in Example (39), wherein the UV curable composition is UV cured with a UV lamp attached to a scraper.

[0123] (40) The method presented in Example (40) is as in any of Examples (24) to (39), wherein the method further includes applying a vacuum to the polished side of the top sheet before applying the UV-curable composition to the side opposite to the polished side of the top sheet.

[0124] (41) In embodiment (41), an apparatus is presented for performing the method as in any of embodiments (24) to (40), the apparatus comprising:

[0125] (i) A fixture containing a circular notch,

[0126] (ii) scraper, and

[0127] (iii) UV light source.

[0128] (42) In embodiment (42), the device as in embodiment (41) is presented, wherein the fixture further includes a hole in the recess.

[0129] (43) The device presented in embodiment (43) is as in embodiment (41) or embodiment (42), wherein the fixture is further included in a groove surrounding the notch.

[0130] Example

[0131] The following examples further illustrate this disclosure, but should not, of course, be construed as limiting its scope in any way.

[0132] Example 1

[0133] This example provides an exemplary UV-curable composition containing oligomers and (meth)acrylate monomers for preparing a UV-curable underpad for chemical mechanical planarization, and an analysis of its physical properties.

[0134] UV-curable compositions 1A to 1D contain oligomers (i.e., BR-204 (aromatic polyether urethane methacrylate), BR-374 (aliphatic polyether urethane acrylate), BR-543 (aliphatic polyether urethane acrylate), or BR-744BT (aliphatic polyester urethane acrylate)) (purchased from Boma Chemicals) in a 70:30 weight ratio, and (meth)acrylate monomers (i.e., isoborneol acrylate). In addition, UV-curable compositions 1A to 1D contain 2 to 4% by weight of a pore filler and phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide as a photoinitiator. The physical properties of UV-curable compositions 1A to 1D are described in Table 1.

[0135] Table 1. Physical properties of UV-curable compositions varying with oligomer

[0136]

[0137] The UV-curable compositions 1A to 1D are applied to the top sheet using a doctor blade assembly to perform chemical-mechanical planarization on the side opposite to the polished side. The coated top sheet is then passed through UV light at wavelengths of 365 nm to 405 nm to cure the UV-curable compositions 1A to 1D. The physical properties of the UV-cured undersheet resulting from the UV-curable compositions 1A to 1D are described in Table 2.

[0138] Table 2. Physical properties of UV-cured underlayment varying with oligomer

[0139]

[0140] All references cited in this document (including publications, patent applications and patents) are incorporated herein by reference as if each reference were individually and specifically cited and presented in its entirety in this document.

[0141] Unless otherwise indicated herein or clearly contradicted by the context, the use of the terms “a,” “an,” “the,” “at least one,” and similar references in the context of describing this disclosure (especially in the context of the appended claims) shall be construed as covering both singular and plural. Unless otherwise indicated herein or clearly contradicted by the context, the use of the term “at least one” followed by a list of one or more items (e.g., “at least one of A and B”) shall be construed as meaning one item (A or B) selected from the list or any combination of two or more of the list (A and B). Unless otherwise noted, the terms “comprising,” “having,” “including,” and “containing” shall be construed as open-ended terms (i.e., meaning “including but not limited to”). Unless otherwise indicated herein, the description of ranges of values ​​herein is intended only as a way of individually referring to individual values ​​falling within the ranges, and the individual values ​​are incorporated into this specification as if they were individually cited herein. Unless otherwise indicated herein or clearly contradicted by the context, all methods described herein may be performed in any suitable order. Unless otherwise asserted, the use of any and all instances or exemplary language (e.g., “for example”) provided herein is intended only to better illustrate this disclosure and does not limit its scope. No language in this specification shall be construed as indicating any unclaimed element essential to the practice of this disclosure.

[0142] The preferred embodiments of this disclosure described herein include the best modes known to the inventors for carrying out this disclosure. Variations of those preferred embodiments will be apparent to those skilled in the art upon reading the foregoing description. The inventors expect those skilled in the art to appropriately employ such variations, and the inventors desire to practice this disclosure in ways other than those specifically described herein. Therefore, this disclosure includes all modifications and equivalents to the objectives set forth in the appended claims of this disclosure as permitted by applicable law. Furthermore, unless otherwise indicated herein or clearly contradicted by the context, this disclosure covers any combination of the foregoing elements in all possible variations.

Claims

1. A UV-curable underpad for chemical mechanical planarization, comprising (a) (meth)acrylate monomer units, and (b) An oligomer unit selected from difunctional (meth)acrylate-terminated polyether urethane oligomer units, difunctional (meth)acrylate-terminated polyester urethane oligomer units, difunctional (meth)acrylate-terminated urethane oligomer units, or combinations thereof.

2. The UV-curable underpad according to claim 1, wherein the underpad is circular and has a diameter of about 50 cm to about 100 cm.

3. The UV-curable underpad according to claim 1, wherein the underpad has a thickness of about 0.1 mm to about 2 mm.

4. The UV-curable underpad according to claim 1, wherein the underpad has a thickness of about 0.5 mm to about 1 mm.

5. The UV-curable underpad according to claim 1, wherein the underpad comprises (meth)acrylate monomer units formed from: acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, methyl acrylate, methyl methacrylate, ethyl methacrylate, isocamphene acrylate, isocamphene methacrylate, isoamyl acrylate, isoamyl methacrylate, isodecyl acrylate, isodecyl methacrylate, hexanediol diacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, 2-(tert-butyl)methacrylate, 2-(tert-butylamino)ethyl methacrylate, trimethylolpropane trimethacrylate, their salts or combinations thereof.

6. The UV-curable underpad according to claim 1, wherein the underpad comprises bifunctional (meth)acrylate-terminated polyether urethane oligomer units.

7. The UV-curable underpad according to claim 1, wherein the underpad comprises bifunctional (meth)acrylate-terminated polyester urethane oligomer units.

8. The UV-curable underpad according to claim 1, wherein the underpad comprises bifunctional (meth)acrylate-terminated urethane oligomer units.

9. The UV-curable underpad according to claim 1, wherein the underpad has a hardness of about 30 Shore A to about 100 Shore A.

10. A polishing pad for chemical mechanical planarization, comprising: Top sheet and UV-curable undersheet, the UV-curable undersheet for chemical mechanical planarization comprising (a) (meth)acrylate monomer units, and (b) Oligomeric units selected from difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof. The UV-cured underpad is bonded to the surface of the top sheet.

11. The polishing pad of claim 10, wherein the UV-cured underpad is bonded to the surface of the top sheet without adhesive.

12. The polishing pad of claim 10, wherein the UV-cured underpad is directly bonded to the surface of the top sheet by UV curing.

13. The polishing pad of claim 10, wherein the polishing pad is circular and has a diameter of about 50 cm to about 100 cm.

14. The polishing pad of claim 10, wherein the polishing pad has a thickness of about 0.5 mm to about 4 mm.

15. A method for preparing a polishing pad for chemical mechanical planarization, comprising: (i) A top sheet having a polished side and a side opposite to the polished side is provided. (ii) Apply the UV-curable composition to the side opposite the polished side. (iii) The UV-curable composition is uniformly distributed on the side opposite to the polished side, and (iv) UV curing of the UV-curable composition to provide the polishing pad.

16. The method of claim 15, wherein the UV-curable composition comprises (a) (meth)acrylate monomers, and (b) Oligomers selected from difunctional (meth)acrylate-terminated polyether urethane oligomers, difunctional (meth)acrylate-terminated polyester urethane oligomers, difunctional (meth)acrylate-terminated urethane oligomers, and combinations thereof.

17. The method according to claim 15, wherein the (meth)acrylate monomer is acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, methyl acrylate, methyl methacrylate, ethyl methacrylate, isocamphene acrylate, isocamphene methacrylate, isoamyl acrylate, isoamyl methacrylate, isodecyl acrylate, isodecyl methacrylate, hexanediol diacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, 2-(tert-butyl)methacrylate, 2-(tert-butylamino)ethyl methacrylate, trimethylolpropane trimethacrylate, its salts, or combinations thereof.

18. The method of claim 15, wherein the UV-curable composition comprises a bifunctional (meth)acrylate-terminated polyether urethane oligomer.

19. The method of claim 15, wherein the UV-curable composition comprises a difunctional (meth)acrylate-terminated polyester urethane oligomer.

20. The method of claim 15, wherein the UV-curable composition comprises a bifunctional (meth)acrylate-terminated urethane oligomer unit.

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