Wearable electronic device including a battery support plate

Abstract

An electronic device according to embodiments disclosed in this document may include a front surface, a rear surface opposite to the front surface, and side surfaces surrounding a space between the front and rear surfaces, and may include a support including an internal space extending from the front surface toward the rear surface. The wearable electronic device may include a battery, at least a portion of which is located within the internal space of the support. The wearable electronic device may include a printed circuit board configured to face the rear surface of the support. The wearable electronic device may include a first shield disposed on the printed circuit board to cover electronic components and face the battery. The wearable electronic device may include a support plate comprising a conductive material, at least a portion of which is disposed between the battery and the printed circuit board to support the battery.

Description

Technical Field

[0001] The various embodiments disclosed in this document relate to a wearable electronic device including a battery support plate. Background Technology

[0002] With technological advancements, following user terminals such as smartphones and tablets, the use of wearable electronic devices (e.g., smartwatches) is becoming increasingly widespread. Wearable electronic devices can include smartwatches that are worn on parts of a user's body (e.g., the wrist) to perform various functions.

[0003] The above information is provided as relevant technology to enhance understanding of this disclosure. No assertion or determination is made regarding the applicability of any of the above content as prior art in relation to this disclosure. Summary of the Invention

[0004] Technical issues A wearable electronic device (such as a smartwatch) may include a housing, at least a portion of which forms the appearance of the wearable electronic device. Inside the housing, a support may be disposed to hold electronic components, a printed circuit board, and a battery. The battery may be disposed within the support, adjacent to a shield disposed on the printed circuit board. For components including conductive materials (such as the battery and the shield), capacitance may be generated based on the adjacent arrangement, and this capacitance may generate a parasitic resonant frequency at a specific frequency. The parasitic resonant frequency may be considered when designing the antenna resonant frequency of the wearable electronic device. For example, the parasitic resonant frequency value may be considered when setting the antenna resonant frequency to transmit or receive wireless signals. However, when the parasitic resonant frequency changes, the antenna performance may degrade as the set antenna resonant frequency changes. For example, for a battery, expansion may occur as the battery expands according to its state of charge. In this case, due to the battery expansion, the gap between the battery and the shield is changed, causing the parasitic resonant frequency value to become different. Therefore, when the set antenna resonant frequency is changed, the antenna performance may degrade.

[0005] Various embodiments of this disclosure may provide a wearable electronic device including a support plate configured such that the value of the parasitic resonant frequency remains constant.

[0006] Various embodiments may provide a wearable electronic device including a support plate electrically connected to a wireless communication circuit on a printed circuit board to operate as an antenna radiator in a predetermined resonant frequency band.

[0007] The technical problems to be solved in this document are not limited to those mentioned above. Those skilled in the art to which this document pertains can clearly understand other technical problems not mentioned above from the following description.

[0008] Technical solution According to embodiments disclosed in this document, an electronic device may include: a support including a front surface, a rear surface as an opposing surface to the front surface, and side surfaces surrounding a space between the front and rear surfaces, and including an internal space extending from the front surface toward the rear surface. The wearable electronic device may include: a battery, at least a portion of which is located within the internal space of the support. The wearable electronic device may include: a printed circuit board configured to face the rear surface of the support. The wearable electronic device may include: a first shield disposed on the printed circuit board to cover electronic components and facing the battery. The wearable electronic device may include: a support plate, at least a portion of which is disposed between the battery and the printed circuit board to support the battery and includes a conductive material.

[0009] According to embodiments disclosed in this document, a component arrangement structure for a wearable electronic device may include: a support, including a front surface, a rear surface opposite to the front surface, and side surfaces surrounding the space between the front and rear surfaces, and including an internal space extending from the front surface toward the rear surface. The wearable electronic device may include: a battery, at least a portion of which is located within the internal space of the support. The wearable electronic device may include: a printed circuit board, configured to face the rear surface of the support. The wearable electronic device may include: a first shield, disposed on the printed circuit board to cover the electronic components and facing the battery. The wearable electronic device may include: a support plate, at least a portion of which is disposed between the battery and the printed circuit board to support the battery and includes a conductive material.

[0010] Beneficial effects According to an exemplary embodiment of this disclosure, a wearable electronic device can maintain a constant parasitic resonant frequency by configuring the gap between the support plate and the shielding member and / or the gap between the support plate and the first shielding cover to remain constant. Additionally, by electrically connecting the support plate to a wireless communication circuit on a printed circuit board, the support plate can be configured to operate as an antenna radiator in a predetermined resonant frequency band.

[0011] In addition, various effects that can be directly or indirectly identified through this document may be provided.

[0012] The effects obtained through this disclosure are not limited to those described above, and those skilled in the art to which this disclosure pertains will clearly understand from the following description other effects not mentioned above. Attached Figure Description

[0013] In conjunction with the description in the accompanying drawings, the same or similar reference numerals may be used for the same or similar components.

[0014] Figure 1 This is a block diagram of an electronic device in a network environment according to various embodiments.

[0015] Figure 2 This is a front perspective view of a wearable electronic device according to an embodiment of the present disclosure.

[0016] Figure 3 This is a rear perspective view of a wearable electronic device according to an embodiment of the present disclosure.

[0017] Figure 4 yes Figure 2 An exploded perspective view of the wearable electronic device shown in the image.

[0018] Figure 5a and Figure 5b This is an exploded perspective view of the battery, support plate, bracket, and printed circuit board of a wearable electronic device according to embodiments of the present disclosure.

[0019] Figure 6 This is a plan view of a printed circuit board and a first shielding cover according to an embodiment of the present disclosure.

[0020] Figure 7 It is along Figure 5b A sectional view cut by line AA.

[0021] Figure 8a and Figure 8b It is an explanation Figure 7 A view showing the electrical connections between the printed circuit board and the support plate.

[0022] Figure 8c This explains the embodiments according to the present disclosure. Figure 7 A view showing the relationship between the printed circuit board and the support plate electrically connected by spring pins.

[0023] Figure 8d This is a view illustrating the electrical connection relationship between a printed circuit board and a support plate according to an embodiment of the present disclosure.

[0024] Figure 8e This is a view of a support plate formed around a battery according to an embodiment of the present disclosure.

[0025] Figure 9a , Figure 9b and Figure 9c This is a view illustrating the electrical connection relationship between the printed circuit board and the support plate according to an embodiment.

[0026] Figure 10a and Figure 10b This is a view illustrating the electrical connection relationship between the printed circuit board and the support plate according to an embodiment. Detailed Implementation

[0027] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art to which this disclosure pertains can readily implement these embodiments. However, the present disclosure can be implemented in various different ways and is not limited to the embodiments described herein. Similar or identical reference numerals may be used for similar or identical constituent elements (i.e., components) in conjunction with the accompanying drawings. Furthermore, descriptions of well-known features and configurations may be omitted in the drawings and related descriptions for clarity and brevity.

[0028] In this document, each of the phrases “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B or C” may include any one of the items listed together in the corresponding phrases of these phrases, or any possible combination thereof. Terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another without limiting the component in any other respect (e.g., importance or order). When the terms “functionally” or “communically” are used, or when the terms “functionally” or “communically” are not used, if any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, this means that the component may be connected directly (e.g., wired), wirelessly, or via a third component to the other component.

[0029] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. (Refer to...) Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0030] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0031] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0032] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0033] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0034] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0035] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0037] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0038] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0039] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0040] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0042] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0043] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0044] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0045] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0046] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0047] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197. According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0048] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0049] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0050] Figure 2 This is a front perspective view of a wearable electronic device according to an embodiment of the present disclosure. Figure 3 This is a rear perspective view of a wearable electronic device according to an embodiment of the present disclosure.

[0051] Reference Figure 2 and Figure 3The electronic device 200 according to an embodiment may include a housing 210 and fastening members 250 and 260, wherein the housing 210 includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B, and the fastening members 250 and 260 are connected to at least a portion of the housing 210 and configured to detachably fasten the electronic device 200 to a user's body part (e.g., wrist, ankle, etc.). In another embodiment (not shown), the housing 210 may also refer to forming Figure 2 The structure comprises a portion of a first surface 210A, a second surface 210B, and a side surface 210C. According to an embodiment, at least a portion of the first surface 210A may be formed of a substantially transparent front panel 201 (e.g., a glass or polymer panel including various coatings). The second surface 210B may be formed of a substantially opaque rear panel 207. The rear panel 207 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above. The side surface 210C may be coupled to the front panel 201 and the rear panel 207 and may be formed of a side frame structure (or “side member”) 206 comprising metal and / or polymer. In some embodiments, the rear panel 207 and the side frame structure 206 may be integrally formed and comprise the same material (e.g., a metallic material such as aluminum). Fastening members 250 and 260 may be formed in various materials and shapes. Integrated unit links and multiple unit links can be formed in a way that allows them to move relative to each other by means of woven fabric, leather, rubber, polyurethane, metal, ceramic, or a combination of at least two of the above materials.

[0052] According to an embodiment, the electronic device 200 may include a display 220 (see reference 220). Figure 4 The electronic device 200 may include at least one or more of the following components: audio modules 205 and 208, sensor module 211, key input devices 202, 203 and 204, and connector hole 209. In some embodiments, the electronic device 200 may omit at least one of the components (e.g., key input devices 202, 203 and 204, connector hole 209, or sensor module 211), or may additionally include other components.

[0053] Display 220 may be exposed through, for example, a large portion of front panel 201. The shape of display 220 may correspond to the shape of front panel 201 and may be of various shapes (such as circular, elliptical, or polygonal). Display 220 may be coupled to touch sensing circuitry, a pressure sensor capable of measuring the intensity (pressure) of touch, and / or a fingerprint sensor, or may be configured to be adjacent to touch sensing circuitry, a pressure sensor capable of measuring the intensity (pressure) of touch, and / or a fingerprint sensor.

[0054] Audio modules 205 and 208 may include a microphone hole 205 and a speaker hole 208. The microphone hole 205 may internally house a microphone for acquiring external sound, and in some embodiments, multiple microphones may be provided to detect the direction of sound. The speaker hole 208 may be used as an external speaker and a receiver for making calls.

[0055] Sensor module 211 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 200. Sensor module 211 may include, for example, a biometric sensor module 211 (e.g., an HRM sensor) disposed on the second surface 210B of housing 210. Electronic device 200 may also include at least one of the sensor modules not shown, such as a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0056] Key input devices 202, 203, and 204 may include a wheel key 202 disposed on a first surface 210A of housing 210 and rotatable in at least one direction, and / or side key buttons 202 and 203 disposed on a side surface 210C of housing 210. The wheel key may be a shape corresponding to the shape of the front panel 202. In another embodiment, electronic device 200 may not include some or all of the aforementioned key input devices 202, 203, and 204, and the excluded key input devices 202, 203, and 204 may be implemented in another form (such as soft keys on display 220). Connector hole 209 may accommodate a connector (e.g., a USB connector) for sending or receiving power and / or data with an external electronic device, and may include another connector hole (not shown) capable of accommodating a connector for sending or receiving audio signals with an external electronic device. Electronic device 200 may also include, for example, a connector cover (not shown) that covers at least a portion of connector hole 209 and prevents external foreign objects from entering the connector hole.

[0057] Fastening members 250 and 260 can be detachably fastened to at least a portion of the housing 210 using locking members 251 and 261. Fastening members 250 and 260 may include one or more of a retaining member 252, a retaining member fastening hole 253, a guide member 254, and a retaining ring 255.

[0058] The fixing member 252 can be configured to secure the housing 210 and the fastening members 250 and 260 to a user's body part (e.g., wrist, ankle, etc.). The fixing member fastening hole 253 corresponds to the fixing member 252 to secure the housing 210 and the fastening members 250 and 260 to the user's body part. The guide member 254 is configured to restrict the range of motion of the fixing member 252 when it is fastened to the fixing member fastening hole 253, thereby allowing the fastening members 250 and 260 to be fastened to close contact with the user's body part. The retaining ring 255 can restrict the range of motion of the fastening members 250 and 260 when the fixing member 252 and the fixing member fastening hole 253 are fastened.

[0059] Figure 4 yes Figure 2 An exploded perspective view of the wearable electronic device shown in the image.

[0060] Reference Figure 4 The electronic device 400 may include a side bezel structure 410, a wheel key 420, a front panel 201, a display 220, a first antenna 450, a second antenna 455, a support member 460 (e.g., a bracket), a battery 470, a printed circuit board 480, a sealing member 490, a rear panel 493, and fastening members 495 and 497. At least one of the components of the electronic device 400 may be compatible with... Figure 2 or Figure 3 At least one of the components of the electronic device 200 is identical or similar, and repeated descriptions are omitted below. The support member 460 may be disposed inside the electronic device 400 to connect with the side bezel structure 410, or may be integrally formed with the side bezel structure 410. The support member 460 may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. With respect to the support member 460, the display 220 may be coupled to one surface, and the printed circuit board 480 may be coupled to another surface. A processor (e.g., ...) may be mounted on the printed circuit board 480. Figure 1 The processor 120), memory (e.g., Figure 1 The memory 130) and / or interface (e.g., Figure 1 Interface 177). The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing unit (GPU), an application processor signal processing unit, or a communication processor.

[0061] The memory may include, for example, volatile or non-volatile memory. The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 400 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0062] Battery 470 is a device for supplying power to at least one component of electronic device 400, and may include, for example, a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell. For example, at least a portion of battery 470 may be disposed on a plane substantially the same as printed circuit board 480. Battery 470 may be integrally disposed within electronic device 200, or may be configured to be removable from electronic device 200.

[0063] A first antenna 450 may be disposed between the display 220 and the support member 460. The first antenna 450 may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The first antenna 450 may, for example, perform short-range communication with an external device, or wirelessly send or receive power required for charging, and transmit short-range communication signals or magnetically based signals including payment data. In another embodiment, the antenna structure may be formed by a portion or combination of the side bezel structure 410 and / or the support member 460.

[0064] In the embodiment, the second antenna 455 (e.g., Figure 4 The second antenna 455 and / or Figure 6 The second antenna 455 (b) may be disposed between the circuit board 480 and the rear panel 493. The second antenna 455 may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The second antenna 455 may, for example, perform short-range communication with external devices, or wirelessly send or receive power required for charging, and transmit short-range communication signals or magnetically based signals including payment data. In another embodiment, the antenna structure may be formed by a portion of the side frame structure 410 and / or the rear panel 493, or a combination thereof.

[0065] The sealing member 490 may be located between the side frame structure 410 and the rear panel 493. The sealing member 490 may be configured to block moisture and foreign matter introduced from the outside into the space surrounded by the side frame structure 410 and the rear panel 493.

[0066] Figure 5a and Figure 5b This is an exploded perspective view of the battery, support plate, bracket, and printed circuit board of a wearable electronic device according to embodiments of the present disclosure. Figure 6 This is a plan view of a printed circuit board and a first shielding cover according to an embodiment of the present disclosure. Figure 7 It is along Figure 5b A sectional view cut by line AA.

[0067] According to the embodiments, such as Figure 5a and Figure 5b As shown, wearable electronic devices (e.g., Figure 1Electronic device 101 Figure 2 a's electronic device 200 and / or Figure 4 Electronic device 400) may include a housing (e.g., Figure 2 The housing 210 and / or Figure 4 The support 520 inside the side frame structure 410) (e.g., Figure 4 Supporting member 460), battery 540 (e.g., Figure 4 The battery 470), support plate 530 and printed circuit board 510 (e.g., Figure 4 (Printed circuit board 480). In an embodiment, it can be based on Figure 5a The battery 540, support plate 530 and printed circuit board 510 are arranged sequentially along the Z-axis.

[0068] In the embodiments, reference is made to Figure 5a and Figure 5b The bracket 520 may include a front surface 520A (e.g., facing...). Figure 5a The surface in the +Z direction), and the rear surface 520B (e.g., facing the front surface 520A) which is opposite to the front surface 520A. Figure 5a The bracket 520 is a surface in the -Z direction and a side surface 520C surrounding the space between the front surface 520A and the rear surface 520B. In an embodiment, the bracket 520 may be disposed on the display (e.g., the surface in the -Z direction) and the side surface 520C surrounding the space between the front surface 520A and the rear surface 520B. Figure 1 Display module 160 Figure 4 The display 220 is positioned between the display and the printed circuit board 510. The display may be positioned facing the front surface 520A of the bracket 520. For example, the display may be positioned on the front surface 520A of the bracket 520. The printed circuit board 510 may be positioned facing the rear surface 520B of the bracket 520. For example, the printed circuit board 510 may be positioned on the rear surface 520B of the bracket 520.

[0069] In the embodiments, reference is made to Figure 5a The bracket 520 may include an internal space 5201. In an embodiment, the internal space 5201 may be an opening extending from the front surface 520A of the bracket 520 toward the rear surface 520B. In an embodiment, at least a portion of the battery 540 and the support plate 530 may be disposed within the internal space 5201 of the bracket 520. In an embodiment, a printed circuit board 510 may be disposed on the rear surface 520B of the bracket 520, such that at least a portion of the printed circuit board 510 is disposed within the internal space 5201 of the bracket 520. For example, as described later. Figure 7 As shown in Figure a, at least a portion of the electronic component 511 disposed on the first surface 510A of the printed circuit board 510 and the first shield 501 covering the electronic component 511 may be located in the internal space 5201 of the bracket 520.

[0070] In the embodiments, reference is made to Figure 5a and Figure 5b A support plate 530, comprising a conductive material, may be disposed within the interior space 5201 of the bracket 520. In an embodiment, the support plate 530 may support a battery 540 within the interior space 5201 of the bracket 520. For example, the battery 540 may be supported by the support plate 530 and may be located between the display and the support plate 530 on the front surface 520A of the bracket 520.

[0071] In an embodiment, since the support plate 530 includes a conductive material, it can diffuse heat generated from components adjacent to the support plate 530, such as the battery 540, the first shield 501, the printed circuit board 510, and / or the electronic component 511.

[0072] In the embodiments, reference is made to Figure 5a The support plate 530 may include a support portion 531 on which the battery 540 is located, and coupling portions (e.g., a first coupling portion 532 and / or a second coupling portion 533) extending from the support portion 531 and secured to the bracket 520. In an embodiment, the battery 540 may be adhered to the support portion 531 of the support plate 530 by means of an adhesive member P (e.g., tape). In an embodiment, coupling portions 532 and 533 may be secured to the front surface 520A of the bracket 520.

[0073] In the embodiments, reference is made to Figure 5a and Figure 5bThe coupling portions 532 and 533 may include a first coupling portion 532 extending from one end of the support portion 531 and fixed to the front surface 520A of the bracket 520, and a second coupling portion 533 extending from the other end of the support portion 531 and fixed to the front surface 520A of the bracket 520. The first coupling portion 532 and the second coupling portion 533 may face each other. In an embodiment, the first coupling portion 532 and the second coupling portion 533 may include first portions 5321 and 5331 and second portions 5322 and 5332, wherein at least a portion of the first portions 5321 and 5331 extends substantially perpendicular to the support portion 531, and the second portions 5322 and 5332 are bent from the first portions to be parallel to the support portion 531 and are disposed on the front surface 520A of the bracket 520. In an embodiment, the first coupling portion 532 and the second coupling portion 533 may include a hole H through which a fixing member F (e.g., a screw or bolt) passes. In this embodiment, holes H may be formed in the second portion 5322 of the first coupling portion 532 and the second portion 5332 of the second coupling portion 533, respectively. A fixing member F may pass through the hole in the first coupling portion 532 and the hole formed in the front surface 520A of the bracket 520, and another fixing member F may pass through the hole in the second coupling portion 533 and another hole formed in the front surface 520A of the bracket 520. Therefore, the support plate 530 can be fixed to the bracket 520 by the fixing member F.

[0074] The shape of the support plate 530 described above is an example, and the support plate 530 can be modified into various shapes. For example, as described later. Figure 9a As shown, the support plate 630 can be formed into a shape including a support portion 631 and a coupling portion 632 extending from the support portion 631. Furthermore, as shown in FIG. 10, which will be described later, the support plate 730 can be formed into a planar shape. (Described later...) Figure 9a And a description of the support plates 630 and 730 shown in Figure 10.

[0075] According to the embodiments, such as Figure 6 and Figure 7 As shown, electronic component 511 may be disposed on the first surface 510A of printed circuit board 510 (e.g., facing). Figure 7 The surface in the +Z direction) and the second surface 510B (e.g., facing the +Z direction) Figure 7The first shield 501 may be disposed on the first surface 510A of the printed circuit board 510 to cover at least a portion of the electronic component 511 disposed on the first surface 510A of the printed circuit board 510. The second shield 502 may be disposed on the second surface 510B of the printed circuit board 510 to cover at least a portion of the electronic component 511 disposed on the second surface 510B of the printed circuit board 510. In an embodiment, the first shield 501 and the second shield 502 may be coupled to the printed circuit board 510 when the first shield 501 and the second shield 502 are soldered (tin-soldered) to the first surface 510A and the second surface 510B of the printed circuit board 510, respectively. Furthermore, the first shield 501 and the second shield 502 may be coupled to the printed circuit board 510 in various ways, such as by clips and sockets.

[0076] In this embodiment, the first shield 501 and the second shield 502 may comprise conductive materials to shield electromagnetic waves generated from the printed circuit board 510 and the electronic component 511, or to dissipate heat generated from the electronic component 511 to the surrounding environment. For example, the first shield 501 and the second shield 502 may comprise metallic materials or materials such as graphite. Furthermore, the first shield 501 and the second shield 502 may comprise various materials having electromagnetic wave shielding properties and thermal conductivity properties. Additionally, the first shield 501 and the second shield 502 may comprise materials with a certain level of rigidity to protect the internally located electronic component 511 from external impacts.

[0077] According to an embodiment, liquid resin may be injected into the first shield 501 and the second shield 502. In this embodiment, when an impact is applied to the wearable electronic devices 101, 200, 400, the liquid resin can prevent the electronic component 511 from separating from the printed circuit board 510 and protect the electronic component 511 from external impacts. Furthermore, a liquid thermal interface material (TIM) that diffuses heat generated by the electronic component 511 into the surrounding environment may be injected into the first shield 501 and the second shield 502.

[0078] According to the embodiments, such as Figure 6As shown, an opening 5011, serving as a channel for injecting liquid heat transfer material, can be formed in the first shield 501. A nozzle for applying liquid resin and / or liquid heat transfer material can be inserted into the opening 5011 of the first shield 501 to apply the liquid resin and / or liquid heat transfer material to the space between the printed circuit board 510 and the first shield 501. Therefore, the space between the first shield 501 and the printed circuit board 510 can be filled with liquid resin and / or liquid heat transfer material. For example, an opening (not shown) serving as a channel for injecting liquid resin and / or liquid heat transfer material can be formed in the second shield 502.

[0079] According to the embodiments, such as Figure 7 As shown, electromagnetic waves generated by an electronic component 511 disposed on a first surface 510A of a printed circuit board 510 can be emitted to the outside of the first shielding cover 501 through the opening 5011 of the first shielding cover 501. Therefore, a shielding member 550 (e.g., a shielding sheet or shielding strip) covering the opening 5011 can be disposed on the first shielding cover 501. The shielding member 550 is disposed on the first shielding cover 501 and can face the support portion 531 of the support plate 530. The shielding member 550 may include a conductive material that shields the electromagnetic waves of the electronic component 511. For example, the shielding member 550 may include a metallic material or a material such as graphite.

[0080] The above description assumes that liquid resin and / or liquid heat transfer material are applied to the interior of the first shield 501 and / or the second shield 502. However, when liquid resin and / or liquid heat transfer material are not applied to the interior of the first shield 501 and / or the second shield 502, the opening 5011 may not be formed in the first shield 501 and / or the second shield 502. In this case, the shielding member 550 can be omitted from the mounting structure of the wearable electronic devices 101, 200, 400. In the following description, the shielding member 550 will be described under the premise that it is provided on the first shield 501. However, even if the shielding member 550 provided on the first shield 501 is omitted, the following description can be applied substantially the same way.

[0081] In a comparative embodiment, the support plate 530 is disposed on the front surface 520A of the bracket 520 and may not be located between the battery 540 and the first shield 501. In this case, the battery 540 may directly face the first shield 501 and the shielding member 550. Components including conductive materials (such as the battery 540, the first shield 501, and the shielding member 550) may generate capacitance when they are arranged adjacent to each other, and the capacitance may generate a parasitic resonant frequency at a specific frequency. The parasitic resonant frequency may be taken into account when designing the antenna resonant frequency of the wearable electronic devices 101, 200, 400. For example, the parasitic resonant frequency value may be taken into account when setting the antenna resonant frequency to transmit or receive wireless signals. However, when the parasitic resonant frequency is changed, the antenna performance may degrade as the set antenna resonant frequency changes. For example, for the battery 540, expansion may occur as the battery 540 expands according to its state of charge. In this situation, due to the expansion of the battery 540, the gap between the battery 540 and the first shield 501 and / or between the battery 540 and the shielding member 550 is altered, potentially causing the parasitic resonant frequency value to change. Therefore, when the set antenna resonant frequency is changed, the antenna performance may deteriorate. Furthermore, the first shield 501 may be formed with a partially open shape facing the battery 540. This open shape can be one where the exterior and interior of the first shield 501 are interconnected. In this case, as heat generated from the electronic components 511 disposed on the first surface 510A of the printed circuit board 510 is directly transferred to the shielding member 550, the shape of the shielding member 550 may deform. Therefore, as the gap between the shielding member 550 and the battery 540 becomes different, the parasitic resonant frequency value changes, potentially deteriorating the antenna performance.

[0082] like Figure 7 As shown, at least a portion of the support plate 530 can be disposed between the battery 540 and the first shield 501, thereby preventing the parasitic resonant frequency of the comparative embodiment described above from being altered. In this case, for wearable electronic devices 101, 200, and 400, a parasitic resonant frequency can be generated due to the capacitance generated by the adjacent arrangement of the support plate 530 (containing conductive material) and the first shield 501 and / or the adjacent arrangement of the support plate 530 and the shielding member 550. The support plate 530 is fixed to the bracket 520 and is formed of a metallic material to have a certain level of rigidity. Therefore, the gap between the support plate 530 and the shielding member 550 and / or between the support plate 530 and the first shield 501 can remain unchanged. In this case, the value of the parasitic resonant frequency generated by the support plate 530 and the first shield 501 and / or the support plate 530 and the shielding member 550 can remain unchanged. Therefore, since the antenna resonant frequency is not changed, the wearable electronic device can ensure the antenna performance.

[0083] Furthermore, in this embodiment, the first shield 501 may not be formed with its surface open to the support plate 530. In the first shield 501, the opening 5011 for injecting liquid resin and / or liquid heat transfer material may be formed only in the surface facing the support plate 530. In this case, compared to the comparative embodiment where the first shield 501 is formed with an open shape, heat transfer from the electronic components 511 disposed inside the first shield 501 to the shielding member 550 can be reduced. Therefore, the deformation of the shielding member 550 due to the heat from the electronic components 511 can be reduced. Therefore, the value of the parasitic resonant frequency generated due to the adjacent arrangement of the support plate 530 and the shielding member 550 may not be changed or may be changed within the error range of the set resonant frequency. Therefore, antenna performance based on the set antenna resonant frequency can be ensured.

[0084] Figure 8a and Figure 8b It is an explanation Figure 7 A view showing the electrical connections between the printed circuit board and the support plate. Figure 8c This explains the embodiments according to the present disclosure. Figure 7 A view showing the relationship between the printed circuit board and the support plate electrically connected by spring pins. Figure 8d This is a view illustrating the electrical connection relationship between a printed circuit board and a support plate according to an embodiment of the present disclosure. Figure 8e This is a view of a support plate formed around a battery according to an embodiment of the present disclosure.

[0085] According to an embodiment, the printed circuit board 510 (e.g., Figure 4 The printed circuit board 480 may include wireless communication circuitry for transmitting or receiving wireless signals in at least one frequency band (e.g., Figure 1 The communication module 190 may include, for example, a radio frequency IC (RFIC). The RFIC may transmit wireless signals (RF signals) processed in the communication module 190 to an antenna radiator (e.g., housing 210 or side frame structure 410), or transmit wireless signals received from the antenna radiator to the communication module 190.

[0086] According to an embodiment, the support plate 530 can be electrically connected to the printed circuit board 510 for grounding. For example, the printed circuit board 510, on which wireless communication circuitry is disposed, can be electrically connected to the support plate 530 in various ways. In an embodiment, reference is made to... Figure 8a and Figure 8b , bracket 520 (e.g., Figure 4 The support member 460 may include a conductive portion 5202 formed of a conductive material.

[0087] In the embodiments, reference is made to Figure 8a and Figure 8bA conduit (e.g., a second connection hole 521) may be formed in the conductive portion 5202, and a fixing member F (e.g., a screw, bolt, or...) formed of a conductive material (e.g., metal) may be used. Figure 8b A spring pin (PO) is inserted into the conduit line. In an embodiment, the printed circuit board 510 facing the rear surface 520B of the bracket 520 may include a first connection hole 512 corresponding to the second connection hole 521 of the bracket 520. The bracket 520 and the printed circuit board 510 may be disposed in the housing (e.g., Figure 2 The housing 210 and / or Figure 4 Inside the side frame structure 410, the first connection hole 512 and the second connection hole 521 correspond to each other. In an embodiment, the fixing member F can be inserted into the first connection hole 512 of the printed circuit board 510 and the second connection hole 521 of the bracket 520. In an embodiment, a portion of the support plate 530 (e.g., the second coupling portion 533) can contact the conductive portion 5202 and / or the fixing member F. Therefore, the ground portion of the wireless communication circuit can be electrically connected to the support plate 530 through the fixing member F and the conductive portion 5202.

[0088] In the embodiments, reference is made to Figure 8b One end of the spring pin PO is connected to the printed circuit board 510, and the other end of the spring pin PO is inserted into the interior of the bracket 520 through the second connection hole 521 of the bracket 520 to contact a part of the support plate 530 (e.g., the second coupling portion 533). Therefore, the ground portion of the wireless communication circuit can be electrically connected to the support plate 530 through the spring pin PO.

[0089] In the embodiments, reference is made to Figure 8c The printed circuit board 510 can be directly connected to the support plate 530 via spring pin PO. Therefore, the grounding part of the wireless communication circuit can be electrically connected to the support plate 530 via spring pin PO.

[0090] According to the embodiments, such as Figure 8a , Figure 8b , Figure 8c and Figure 8d As shown, the support plate 530 can be an antenna radiator electrically connected to the wireless communication circuitry of the printed circuit board 510 to operate as an antenna in a predetermined resonant frequency band. In an embodiment, the feed portion of the wireless communication circuitry can be electrically connected to the support plate 530 to transmit a feed signal. For example, when the support plate 530 is connected to the printed circuit board 510 via a fixing member F and / or a spring pin PO, the support plate 530 can be electrically connected to the feed portion of the wireless communication circuitry to operate as an antenna radiator in a specific resonant frequency band. In an embodiment, the resonant frequency band can vary depending on the shape and / or length of the support plate 530.

[0091] According to the embodiments, such as Figure 8a , Figure 8b , Figure 8c and Figure 8d As shown, the support plate 530 is adjustable to various antenna resonant frequency bands for communication of wearable electronic devices 101, 200, and 400. For example, when the support plate 530 is connected to the printed circuit board 510 via the fixing member F and / or the spring pin PO, the support plate 530 can be electrically connected to a wireless communication circuit. The wearable electronic devices 101, 200, and 400 may include a switching circuit (not shown) disposed in the electrical path connecting the support plate 530 and the printed circuit board 510. The switching circuit may include at least one switch and / or passive components with different element values, which are connected or disconnected from the electrical path via at least one switch. The passive components may include capacitors with various capacitance values ​​and / or inductors with various inductance values. Therefore, the wireless communication circuit can change the resonant frequency band by changing the length of the antenna via the switching circuit.

[0092] According to the embodiments, such as Figure 8d As shown, the support plate 530 can be electrically connected to the printed circuit board 510 via at least two fixing members F or spring pins PO. For example, any one of the plurality of fixing members F (or spring pins PO) can electrically connect the first coupling portion 532 of the support plate 530 and the printed circuit board 510. The remaining one of the plurality of fixing members F (or spring pins PO) can electrically connect the second coupling portion 533 of the support plate 530 and the printed circuit board 510. In an embodiment, the ground portion of the wireless communication circuit can be connected to the support plate 530 via any one of the plurality of fixing members F (or spring pins PO). The support plate 530 can be connected to the feed portion of the wireless communication circuit via the remaining one of the plurality of fixing members F (or spring pins PO) to function as an antenna radiator in a specific resonant frequency band.

[0093] In the embodiments, reference is made to Figure 8e The support plate 530 may be formed along the front surface (e.g., facing) Figure 8e The surface in the +Z direction), the back surface (e.g., facing) Figure 8e The battery 540 is surrounded by a surface in the -Z direction and a side surface surrounding the space between the front and rear surfaces. For example, the battery panel 530 may include a support portion 531 facing and Figure 7 The cover portion 534 is connected to the coupling portions 532 and 533 in the support plate 530 shown in the figure. In this case, the battery 530 can be disposed in the internal space of the support plate 530 formed by the support portion 531, the coupling portions 532 and 533 and the cover portion 534 of the support plate 530.

[0094] In embodiments, the resonant frequency band may vary depending on the shape and / or length of the support plate 530. Due to... Figure 7Compared to the support plate 530, Figure 8e The support plate 530 also includes a cover portion 534, which may result in an increased antenna length when operating as an antenna radiator. Therefore, the wearable electronics 400 can use the cover portion 534 to shift the antenna resonant frequency band of the support plate 530 to a lower frequency band than before.

[0095] Figure 9a , Figure 9b and Figure 9c This is a view illustrating the electrical connection relationship between the printed circuit board and the support plate according to an embodiment.

[0096] The following Figure 9a and Figure 9b The support plate 630 shown can be shaped and pass through Figures 5a to 8d The described support plate 530 is different from the support plate 630. In the following description, descriptions of structures that are the same as or similar to those described above will be omitted, and will be explained by... Figures 5a to 8d The description is replaced with [the description].

[0097] According to the embodiments, such as Figure 9a and Figure 9b As shown, the support plate 630 may include a battery 540 (e.g., Figure 4 The battery 470) is mounted on a support portion 631 and extends from the support portion 631 and is fixed to a bracket 520 (e.g., Figure 4 The coupling portion 632 of the support member 460. In an embodiment, the coupling portion 632 may include a substantially vertical (e.g., Figure 9a The first portion 6321 (in the +Z direction) extends from the support portion 631 to be disposed inside the bracket 520, and the second portion 6322 bends from the first portion 6321 to be fixed to the front surface 520A of the bracket 520. In an embodiment, the battery 540 can be adhered to the support portion 631 of the support plate 630 by means of an adhesive member P (e.g., tape). In an embodiment, the support plate 630 can be coupled to the bracket 520 because a portion of the coupling portion 632 (e.g., the second portion 6322) is fixed to the front surface 520A of the bracket 520. In an embodiment, when one end of the support portion 631 (e.g., located in the +Z direction) is located in the support portion 631, the battery 540 is attached to the support portion 631 of the support plate 630. Figure 9a When the end of the bracket 520 in the X direction is fixed to the rear surface 520B of the bracket 520, the support plate 630 can be coupled to the bracket 520.

[0098] According to the embodiments, such as Figure 9a As shown, wireless communication circuits (e.g., Figure 1 The communication module 190 can be electrically connected to the support plate 630 for grounding. In an embodiment, it is made of conductive material (e.g., screws, bolts, or...). Figure 8bThe retaining member F formed by the spring pin PO can be inserted into the printed circuit board 510 (e.g., Figure 4 The first connection hole 512 of the printed circuit board 480 is formed in the second connection hole 521 in the conductive portion 5202 of the bracket 520. In an embodiment, the coupling portion 632 of the support plate 630 may contact the conductive portion 5202 and / or the fixing member F. Therefore, the grounding portion of the wireless communication circuit can be electrically connected to the support plate 630 through the fixing member F and the conductive portion 5202.

[0099] According to the embodiments, such as Figure 9b As shown, the wireless communication circuit can be electrically connected to the support plate 630 via a conductive clip C. In this embodiment, the conductive clip C, disposed on the printed circuit board 510, can contact the support portion 631 of the support plate 630. Therefore, the wireless communication circuit is electrically connected to the support plate 630 via the conductive clip C and can be grounded via the support plate 630.

[0100] According to the embodiments, such as Figure 9a , Figure 9b and Figure 9c As shown, the support plate 630 can be an antenna radiator electrically connected to the wireless communication circuitry of the printed circuit board 510 to operate as an antenna in a predetermined resonant frequency band. In an embodiment, the wireless communication circuitry can transmit a feed signal to the support plate 630, which is electrically connected via a feed path. For example, the support plate 630 can be electrically connected to the wireless communication circuitry when it is connected to the printed circuit board 510 via a fixing member F and / or a spring pin PO. Therefore, the support plate 630 can operate as an antenna radiator via the wireless communication circuitry. In an embodiment, the resonant frequency band can vary depending on the shape and / or length of the support plate 630.

[0101] According to the embodiments, such as Figure 9a , Figure 9b and Figure 9c As shown, the support plate 630 can be used as an object for shifting the resonant frequency band of various antennas used in communications for wearable electronic devices 101, 200, and 400. For example, when the support plate 630 is connected to the printed circuit board 510 via a fixing member F, a conductive clip C, and / or a spring pin PO, the support plate 630 can be electrically connected to a wireless communication circuit. The wearable electronic devices 101, 200, and 400 may include a switching circuit (not shown) disposed in the electrical path connecting the support plate 630 and the printed circuit board 510. The switching circuit may include at least one switch and / or passive components with different element values, which are connected or disconnected from the electrical path via at least one switch. The passive components may include capacitors with various capacitance values ​​and / or inductors with various inductance values. Therefore, the wireless communication circuit can change the resonant frequency band by changing the length of the antenna via the switching circuit.

[0102] According to the embodiments, such as Figure 9c As shown, the support plate 630 can be electrically connected to the printed circuit board 510 via at least two fixing members F (or spring pins PO) and conductive clips C. For example, the coupling portion 632 of the support plate 630 is connected to the printed circuit board 510 via the fixing members F and the conductive portion 5202 to be electrically connected to the wireless communication circuit. The support portion 631 of the support plate 630 can be connected to the printed circuit board 510 via the conductive clips C to be electrically connected to the wireless communication circuit. In an embodiment, the grounding portion of the wireless communication circuit can be connected to the support plate 630 via either the fixing member F (or spring pins PO) or the conductive clips C. The support plate 630 can be connected to the feed portion of the wireless communication circuit via the remaining one of the fixing members F (or spring pins PO) and the conductive clips C to function as an antenna radiator in a specific resonant frequency band.

[0103] Figure 10a and Figure 10b This is a view illustrating the electrical connection relationship between the printed circuit board and the support plate according to an embodiment.

[0104] The following Figure 10a The support plate 730 shown can be shaped and pass through Figures 5a to 9c The described support plates 530 and 630 are different from the support plate 730. In the following description, descriptions of structures that are the same as or similar to those described above will be omitted, and will be explained by... Figures 5a to 9c The description is replaced with [the description].

[0105] According to the embodiments, such as Figure 10a As shown, the support plate 730 may be formed in a planar shape. In an embodiment, the battery 540 may be coupled to the support plate 730 via an adhesive member P (e.g., tape), such that at least a portion of the battery 540 is disposed on the bracket 520 (e.g., Figure 4 The support plate 730 is located within the internal space 5201 of the support member 460. In an embodiment, the support plate 730 may be coupled to the rear surface 520B of the bracket 520 so as to be positioned between the battery 540 and the printed circuit board 510 (e.g., Figure 4 Between the printed circuit boards 480. In an embodiment, since the support plate 730 is disposed on the rear surface 520B of the bracket 520, it can cover the internal space 5201 of the bracket 520.

[0106] According to the embodiments, such as Figure 10a As shown, the wireless communication circuit (e.g.,) disposed on the printed circuit board 510 Figure 1The communication module 190 can be electrically connected to the support plate 730 via a conductive clip C. In an embodiment, the conductive clip C disposed on the printed circuit board 510 can contact a portion of the support plate 730 coupled to the rear surface 520B of the bracket 520. Therefore, the wireless communication circuit is electrically connected to the support plate 730 via the conductive clip C and can be grounded via the support plate 730.

[0107] According to an embodiment, the wireless communication circuit can be connected via a fixing member F (e.g., a screw, bolt, or...) formed of a conductive material. Figure 8b The spring pin (PO) is electrically connected to the support plate 730. In an embodiment, the support plate 730 may include a second connection hole (not shown) corresponding to a first connection hole 512 formed in the printed circuit board 510. In an embodiment, the support plate 730 may be coupled to the bracket 520 such that the second connection hole corresponds to the first connection hole 512 of the printed circuit board 510. When the fixing member F passes through the first connection hole 512 of the printed circuit board 510 and the second connection hole of the support plate 730, the wireless communication circuit can be electrically connected to the support plate 730 through the fixing member F. Therefore, the wireless communication circuit is electrically connected to the support plate 730 through the fixing member F and can be grounded through the support plate 730.

[0108] According to the embodiments, such as Figure 10a and Figure 10b As shown, the support plate 730 can be an antenna radiator electrically connected to the wireless communication circuitry of the printed circuit board 510 to operate as an antenna in a predetermined resonant frequency band. In an embodiment, the wireless communication circuitry can transmit a feed signal to the support plate 730, which is electrically connected via a feed path. For example, the support plate 730 can be electrically connected to the wireless communication circuitry when it is connected to the printed circuit board 510 via a conductive clip C, a fixing member F, and / or a spring pin PO. Therefore, the support plate 730 can operate as an antenna radiator via the wireless communication circuitry. In an embodiment, the resonant frequency band can vary depending on the shape and / or length of the support plate 730.

[0109] According to the embodiments, such as Figure 10a and Figure 10bAs shown, the support plate 730 can be used as an object for shifting the resonant frequency band of various antennas used in communications for wearable electronic devices 101, 200, and 400. For example, when the support plate 730 is connected to the printed circuit board 510 via a fixing member F, a conductive clip C, and / or a spring pin PO, the support plate 730 can be electrically connected to a wireless communication circuit. Wearable electronic devices 101, 200, and 400 may include a switching circuit (not shown) disposed in the electrical path connecting the support plate 730 and the printed circuit board 510. The switching circuit may include at least one switch and / or passive components with different element values, which are connected or disconnected from the electrical path via at least one switch. The passive components may include capacitors with various capacitance values ​​and / or inductors with various inductance values. Therefore, the wireless communication circuit can change the resonant frequency band by changing the length of the antenna via the switching circuit.

[0110] According to the embodiments, such as Figure 10b As shown, the support plate 730 can be electrically connected to the printed circuit board 510 via at least two conductive clips C or fixing members F (or spring pins PO). For example, see reference... Figure 10b One end of the support plate 730 is connected to the printed circuit board 510 via a conductive clip C for electrical connection to the wireless communication circuit. The other end of the support plate 730 is also connected to the printed circuit board 510 via a conductive clip C for electrical connection to the wireless communication circuit. In this embodiment, the grounding portion of the wireless communication circuit can be grounded to the support plate 730 via any one of the plurality of conductive clips C. The support plate 730 can be connected to the feed portion of the wireless communication circuit via the remaining one of the plurality of conductive clips C to function as an antenna radiator in a specific resonant frequency band.

[0111] An electronic device 101, 200, 400 according to embodiments of the present disclosure may include: brackets 460 and 520, including a front surface 520A, a rear surface 520B as an opposing surface to the front surface, and a side surface 520C surrounding a space between the front and rear surfaces, and including an internal space 5201 extending from the front surface toward the rear surface. In embodiments, the electronic device may include: a battery 540, at least a portion of which is located in the internal space of the bracket. In embodiments, the electronic device may include: printed circuit boards 480 and 510, configured to face the rear surface of the bracket. In embodiments, the electronic device may include: a first shield 501 disposed on a first surface 510A of the printed circuit board to cover electronic components 511 and facing the battery. In embodiments, the electronic device may include: support plates 530, 630, 730, at least a portion of which is disposed between the battery and the printed circuit board to support the battery and includes a conductive material.

[0112] In an embodiment, the support plate may include: support portions 531 and 631 on which the battery is disposed; and coupling portions 532, 533 and 632, at least a portion of which extends in a direction perpendicular to the support portions to be fixed to the front surface of the bracket.

[0113] In an embodiment, the coupling portion may include: first portions 5321 and 5331 extending perpendicular to the support portion; and second portions 5322 and 5332 curved relative to the first portion to be parallel to the support portion and fixed to the front surface of the bracket.

[0114] In an embodiment, the coupling portion may include: a first coupling portion 532 extending from one end of the support portion to be fixed to the front surface of the bracket; and a second coupling portion 533 extending from the other end of the support portion to be fixed to the front surface of the bracket.

[0115] In one embodiment, the wireless communication circuitry disposed on the printed circuit board may be electrically connected to the support plate to ground.

[0116] In an embodiment, the electronic device may further include: a first connection hole 512 formed in a printed circuit board; a conductive portion 5202 formed in a bracket and including conductive material and in contact with a coupling portion of a support plate; a second connection hole 521 formed in the conductive portion; and a fixing member F passing through the first connection hole and the second connection hole and including conductive material, wherein the wireless communication circuit disposed on the printed circuit board may be electrically connected to the support plate through the fixing member and the conductive portion.

[0117] In one embodiment, the electronic device may further include a conductive clip C, coupled to the printed circuit board to contact a support portion of the support plate. In another embodiment, a wireless communication circuit disposed on the printed circuit board may be electrically connected to the support plate via the conductive clip.

[0118] In one embodiment, the support plate is fixed to the rear surface of the bracket and can cover the internal space 5201 of the bracket.

[0119] In one embodiment, the wireless communication circuit disposed on the printed circuit board may be a fixing member F, wherein the fixing member F passes through the printed circuit board and the support plate and includes conductive material.

[0120] In one embodiment, the wireless communication circuit disposed on the printed circuit board can be electrically connected to the support plate via a conductive clip C, wherein the conductive clip C is in contact with the printed circuit board and the support plate.

[0121] In an embodiment, the electronic device may further include: an opening 5011 formed in a first shield; and a shielding member 550 disposed on the first shield to cover the opening.

[0122] In one embodiment, the shielding member can shield electromagnetic waves generated from electronic components disposed on a first surface of a printed circuit board and emitted through an opening in the first shield.

[0123] In an embodiment, the electronic device may further include: a second shield 502 disposed on a second surface 510B to cover an electronic component 511 disposed on the second surface, wherein the second surface 510B is the opposite surface of the first surface of a printed circuit board on which the first shield is disposed.

[0124] In an embodiment, the electronic device may further include: housings 210 and 410, at least a portion of which constitute the exterior of the electronic device; and displays 160 and 220 disposed within the housings, with a bracket disposed between the displays and a printed circuit board inside the housings.

[0125] In this embodiment, the electronic device may be an electronic device worn on a part of the user's body.

[0126] According to the embodiments disclosed in this document, support plates 530, 630, and 730, including conductive material and supporting the battery 540, may be disposed between the battery 540 and the printed circuit board 510 (e.g., Figure 4 Between the printed circuit boards 480. For wearable electronic devices (e.g., Figure 1 Electronic device 101 Figure 2 a's electronic device 200 and / or Figure 4 The electronic device 400 can generate a structure consisting of support plates 530, 630, 730, and a shield (e.g., Figure 5a The parasitic resonant frequency is caused by the capacitance generated by the first shield 501. However, the support plates 530, 630, and 730 are fixed to the brackets 460 and 520 and are formed of metal to have a certain level of rigidity. Therefore, the gap between the support plates 530, 630, and 730 and the shield 501 can remain unchanged, and the value of the parasitic resonant frequency can also remain unchanged. Therefore, when the preset antenna resonant frequency is not changed, the wearable electronics can ensure the set antenna performance.

[0127] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in other components. According to various embodiments, one or more components or operations in the corresponding components described above may be omitted, or one or more other components or operations may be additionally included. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may still perform one or more functions of the corresponding components in the multiple components in the same or similar manner as each of the multiple components performed one or more functions before integration. According to various embodiments, operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or may be run in a different order or one or more operations may be omitted, or one or more other operations may be additionally included.

[0128] It will be understood that, in addition to the embodiments disclosed above, the present invention also contemplates and includes embodiments based on any combination of two or more of the embodiments disclosed above, as well as embodiments including any combination of features, which are disclosed in this specification. That is, the absence of an explicit indication that two features or two embodiments can be combined does not mean that such combinations are not contemplated, but rather that such combinations should be considered to be included herein.

[0129] Furthermore, the embodiments of this disclosure disclosed herein and illustrated in the accompanying drawings are provided as specific examples to explain the technical content of the embodiments according to this disclosure and to aid in understanding the embodiments of this disclosure, but are not intended to limit the scope of the embodiments of this disclosure. Therefore, the scope of the various embodiments of this disclosure should be interpreted as including all changes or modifications derived from the technical teaching of the various embodiments of this disclosure, in addition to the disclosed embodiments.

Claims

1. An electronic device (101, 200, 400), comprising: The support (460, 520) includes a front surface (520A), a rear surface (520B) which is the opposite surface of the front surface, and a side surface (520C) surrounding the space between the front surface and the rear surface, and includes an internal space (5201) extending from the front surface toward the rear surface. A battery (540), at least a portion of which is located within the interior space of the bracket; Printed circuit boards (480, 510) are positioned facing the rear surface of the bracket; A first shield (501) is disposed on a first surface (510A) of the printed circuit board to cover the electronic components (511) and face the battery; as well as Support plates (530, 630, 730), at least a portion of which are disposed between the battery and the printed circuit board to support the battery and include conductive material. 2.The electronic device of claim 1, wherein, The support plate includes: Support portions (531, 631), on which the battery is mounted; and The coupling portions (532, 533, 632) extend at least a portion of the coupling portions in a direction perpendicular to the support portions to be fixed to the front surface of the bracket.

3. The electronic device as claimed in claim 2, wherein, The coupling portion includes: The first part (5321, 5331) extends perpendicularly to the support portion; and The second part (5322, 5332) is bent relative to the first part to be parallel to the support part and is fixed to the front surface of the bracket.

4. The electronic device as claimed in claim 2, wherein, The coupling portion includes: A first coupling portion (532) extends from one end of the support portion to be fixed to the front surface of the bracket; and The second coupling portion (533) extends from the other end of the support portion to be fixed to the front surface of the bracket.

5. The electronic device as claimed in claim 1, wherein, The wireless communication circuitry disposed on the printed circuit board is electrically connected to the support plate to ground.

6. The electronic device of claim 2, further comprising: A first connection hole (512) is formed in the printed circuit board; A conductive portion (5202) is formed in the bracket and includes a conductive material and is in contact with the coupling portion of the support plate; A second connection hole (521) is formed in the conductive portion; as well as The fixing member (F) passes through the first connecting hole and the second connecting hole and includes a conductive material. The wireless communication circuit disposed on the printed circuit board is electrically connected to the support plate through the fixing member and the conductive part.

7. The electronic device of claim 2, further comprising: A conductive clip (C) is coupled to the printed circuit board to contact the support portion of the support plate. The wireless communication circuit disposed on the printed circuit board is electrically connected to the support plate through the conductive clip.

8. The electronic device as claimed in claim 1, wherein, The support plate is fixed to the rear surface of the bracket and covers the internal space of the bracket (5201).

9. The electronic device as claimed in claim 8, wherein, The wireless communication circuit disposed on the printed circuit board is electrically connected to the support plate via a fixing member (F), wherein the fixing member passes through the printed circuit board and the support plate and comprises a conductive material.

10. The electronic device of claim 8, wherein, The wireless communication circuit disposed on the printed circuit board is electrically connected to the support plate via a conductive clip (C), wherein the conductive clip is in contact with the printed circuit board and the support plate.

11. The electronic device of claim 1, further comprising: An opening (5011) is formed in the first shielding cover; as well as A shielding member (550) is disposed on the first shielding cover to cover the opening and includes a conductive material.

12. The electronic device of claim 11, wherein, The shielding member shields electromagnetic waves generated from electronic components disposed on the first surface of the printed circuit board and emitted through the opening of the first shield.

13. The electronic device of claim 1, further comprising: A second shield (502) is disposed on a second surface (510B) to cover an electronic component (511) disposed on the second surface, wherein the second surface is the opposite surface to the first surface of the printed circuit board on which the first shield is disposed.

14. The electronic device of claim 1, further comprising: Housing (210, 410), at least a portion of which constitutes the exterior of the electronic device; as well as The displays (160, 220) are housed within the casing. The bracket is disposed between the display and the printed circuit board inside the housing.

15. The electronic device as claimed in claim 1, wherein, The electronic device is a wearable electronic device worn on a part of the user's body.

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