Heat dissipation film and electronic device including the same

Abstract

An electronic device according to an embodiment of the disclosure can include a housing, a circuit board disposed inside the housing, an antenna module disposed inside the housing and including an antenna pattern unit electrically connected to the circuit board, and a heat dissipation film attached to the antenna module. The heat dissipation film can include a first layer formed of an electrically conductive material, a second layer having a predetermined width to surround the antenna pattern unit and disposed on one surface of the first layer, and a third layer disposed on one surface of the second layer and made of an insulating material. The second layer can be hydrogen-bonded with the first layer and covalently bonded with the third layer.

Description

Technical Field

[0001] This disclosure relates to heat dissipation films and electronic devices including heat dissipation films. Background Technology

[0002] With the development of electronic, information, and communication technologies, electronic devices are equipped with a variety of functions. For example, in addition to communication functions, smartphones can include audio players, imaging devices, and calendar management programs. Furthermore, they can achieve even more functions by installing applications. Electronic devices can not only run their built-in applications or store files, but also access servers or other electronic devices via wired or wireless means to receive various information in real time.

[0003] As integration increases, electronic devices can perform a variety of functions despite shrinking in size. With high integration, control components (e.g., processors or communication modules) or electronic components (e.g., antenna modules) used for wireless communication can become more compact or advanced. For example, enhanced performance can be achieved as various electronic components become more advanced or integrated.

[0004] Electronic components or devices can exhibit stable performance in suitable temperature environments. However, integrated and advanced electronic components may generate heat during operation, leading to a deterioration in power efficiency or performance. Desktop computers, laptops, or such electronic devices can use mechanical devices such as cooling fans to quickly cool their internal spaces or self-heating electronic components (hereinafter referred to as "heat-generating components"). However, it may be difficult to equip small portable or wearable electronic devices with cooling devices.

[0005] A heat dissipation film with high thermal conductivity can be attached to or positioned adjacent to the surface of a heat-generating component to cool (or dissipate heat) the component. For components coupled to an antenna, considering the antenna's radiation characteristics, the heat dissipation film can be formed from a material with both thermal conductivity and insulation properties. For example, the heat dissipation film can be based on fluorinated graphene. However, fluorinated graphene-based heat dissipation films may not ensure uniform insulation because, during the fabrication of fluorinated graphene particles, the insulating fluorine (F) atoms are unevenly bonded to the graphene surface. Furthermore, the film's brittleness due to low bonding strength makes it difficult to achieve the desired thickness.

[0006] The above information is provided for background purposes only to aid in understanding this disclosure. No determination or assertion has been made as to whether any of the above content constitutes prior art relating to this disclosure. Summary of the Invention

[0007] The present disclosure aims to address at least the aforementioned problems and / or disadvantages, and to provide at least the following advantages. Therefore, one aspect of the present disclosure is to provide a heat dissipation film and an electronic device including the heat dissipation film, the heat dissipation film being attachable to antenna-coupled electronic components and having patterned insulating areas.

[0008] Other aspects will be set forth in part in the description which follows, and will be apparent in part from the description, or may be learned by practice of the embodiments given.

[0009] According to one aspect of this disclosure, an electronic device may be provided. The electronic device may include a housing, a circuit board disposed within the housing, an antenna module disposed within the housing and including an antenna pattern portion electrically connected to the circuit board, and a heat dissipation film attached to the antenna module. The heat dissipation film may include: a first layer formed of a conductive material; a second layer having a predetermined width to surround the antenna pattern portion and disposed on one surface of the first layer; and a third layer disposed on one surface of the second layer and formed of an insulating material. The second layer may be configured to be hydrogen-bonded to the first layer and covalently bonded to the third layer.

[0010] According to another aspect of this disclosure, a heat dissipation film can be provided attached to an antenna module having an antenna pattern portion. The heat dissipation film may include: a first layer formed of a conductive material; a second layer having a predetermined width to surround the antenna pattern portion and disposed on one surface of the first layer; and a third layer disposed on one surface of the second layer and formed of an insulating material. The second layer may be hydrogen-bonded to the first layer and covalently bonded to the third layer.

[0011] Other aspects, advantages, and distinctive features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of this disclosure, taken in conjunction with the accompanying drawings. Attached Figure Description

[0012] The above and other aspects, features and advantages of certain embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0013] Figure 1 This is a view illustrating an electronic device in a network environment according to various embodiments of the present disclosure;

[0014] Figure 2 This is an exploded perspective view of the front side of an electronic device according to an embodiment of the present disclosure;

[0015] Figure 3 This is a rear perspective view showing an electronic device according to an embodiment of the present disclosure;

[0016] Figure 4This is an exploded perspective view of the front side of an electronic device according to an embodiment of the present disclosure;

[0017] Figure 5 This is an exploded rear perspective view showing an electronic device according to an embodiment of the present disclosure;

[0018] Figure 6 This is a top view showing a speaker module according to an embodiment of the present disclosure;

[0019] Figure 7 This is a bottom view showing a speaker module according to an embodiment of the present disclosure;

[0020] Figure 8 This is a perspective view showing a heat dissipation film according to an embodiment of the present disclosure;

[0021] Figure 9 This is a cross-sectional view showing a heat dissipation film according to an embodiment of the present disclosure;

[0022] Figure 10 This illustrates an embodiment according to the present disclosure, such as... Figure 7 An enlarged view of the area of ​​the antenna pattern of the speaker module shown;

[0023] Figure 11a This is a diagram showing the connection structure of the layers constituting the heat dissipation film according to an embodiment of the present disclosure;

[0024] Figure 11b This is a view showing the connection structure of the layers constituting the heat dissipation film according to an embodiment of the present disclosure;

[0025] Figure 12 This is a view showing the stacked structure of the heat dissipation film according to an embodiment of the present disclosure;

[0026] Figure 13 This is a flowchart illustrating the basic unit structure constituting the heat dissipation film manufactured according to an embodiment of the present disclosure;

[0027] Figure 14 This is a flowchart illustrating the manufacture of a heat dissipation film according to an embodiment of the present disclosure;

[0028] Figure 15 This is a plan view showing an antenna according to an embodiment of the present disclosure;

[0029] Figure 16 This is a front perspective view showing an electronic device according to an embodiment of the present disclosure;

[0030] Figure 17 This is a rear top view showing an electronic device according to an embodiment of the present disclosure;

[0031] Figure 18This illustrates various embodiments of the hinge device according to the present disclosure. Figure 16 and Figure 17 A partial exploded perspective view of an electronic device;

[0032] Figure 19 This is a top view showing a connector according to an embodiment of the present disclosure;

[0033] Figure 20a and Figure 20b This is a diagram illustrating the bonding force between the particles constituting the heat dissipation film according to an embodiment of the present disclosure;

[0034] Figure 21 It is a graph showing the tensile stress of the heat dissipation film according to an embodiment of the present disclosure; and

[0035] Figure 22 This is a graph showing the energy storage modulus of the heat dissipation film according to an embodiment of the present disclosure.

[0036] In all the accompanying drawings, the same reference numerals are used to denote the same elements. Detailed Implementation

[0037] The following description, with reference to the accompanying drawings, is provided to aid in a full understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. This description includes various specific details to aid understanding, but these details should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and constructions may be omitted.

[0038] The terms and words used in the following description and claims are not limited to their documentary meaning, but are used by the inventors only to enable this disclosure to be clearly and consistently understood. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this disclosure is provided for illustrative purposes only and is not intended to limit the disclosure as defined by the appended claims and their equivalents.

[0039] It should be understood that, unless the context clearly specifies otherwise, the singular forms “a,” “an,” and “the” include plural references. Thus, for example, a reference to “the surface of a component” includes a reference to one or more such surfaces.

[0040] As used herein, each of the phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “at least one of A, B or C” can include all possible combinations of the items listed together in the corresponding phrase.

[0041] The term “and / or” can refer to a combination of the listed related components or any one of the components.

[0042] As used herein, terms such as “first” and “second” or “first” and “second” may be used only to distinguish the corresponding component from another component, without otherwise limiting the components (e.g., importance or order).

[0043] As used herein, the terms “front surface,” “rear surface,” “upper surface,” “side surface,” “left side,” “right side,” “upper part,” and “lower part” are defined relative to the accompanying drawings, and the shape and position of the components are not limited by these terms.

[0044] It should also be understood that the terms “comprising” and / or “having” as used herein specify the presence of the stated features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0045] It should be understood that when a component is referred to as being “connected to,” “attached to,” “supported on,” or “in contact” with another component, these components may be directly or via a third component connected, attached, supported, or in contact with each other.

[0046] Throughout the specification, when one component is "on" another component, the first component may be directly on the second component, or one or more other components may be located between the first and second components.

[0047] It should be understood that the boxes in each flowchart, and combinations of these flowcharts, can be executed by one or more computer programs including instructions. The entirety of the one or more computer programs can be stored in a single memory device, or the one or more computer programs can be divided so that different parts are stored in different multiple memory devices.

[0048] Any function or operation described herein can be processed by a single processor or a combination of processors. The single processor or combination of processors is a circuit that performs the processing and includes, for example, an application processor (AP, such as a central processing unit (CPU)), a communication processor (CP, such as a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (such as an artificial intelligence (AI) chip), a Wi-Fi chip, Bluetooth, etc. ®Circuits including chips, GPS chips, NFC chips, connectivity chips, sensor controllers, touch controllers, fingerprint sensor controllers, display driver integrated circuits (ICs), audio CODEC chips, Universal Serial Bus (USB) controllers, camera controllers, image processing ICs, microprocessor units (MPUs), system-on-a-chip (SoCs), integrated circuits (ICs), etc.

[0049] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0050] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module (SIM) 196, or antenna module 197. In an embodiment, at least one of these components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. According to the implementation, some of the components (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as an integrated single component (e.g., display module 160).

[0051] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to embodiments, as at least part of the data processing or calculations, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121, or may be designated for a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as a part of the main processor 121.

[0052] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 may control at least some of the functions or states associated with at least one component of the electronic device 101 (other than the main processor 121) (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware structures designated for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. Such learning can be performed, for example, by an electronic device 101 that performs artificial intelligence, or via a separate server (e.g., server 108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of these, but is not limited to these. Additionally or alternatively, the artificial intelligence model can include software structures in addition to hardware structures.

[0053] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0054] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0055] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0056] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0057] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of the force generated by the touch.

[0058] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0059] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0060] Interface 177 may support one or more specific protocols used to enable direct (e.g., wired) or wireless connection between electronic device 101 and external electronic device (e.g., electronic device 102). Depending on the implementation, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0061] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0062] The tactile module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0063] Camera module 180 can capture still or moving images. Depending on the implementation, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0064] The power management module 188 manages the power supply to the electronic device 101. According to embodiments, the power management module 188 may be implemented as at least a portion of, for example, a power management integrated circuit (PMIC).

[0065] Battery 189 can power at least one component of electronic device 101. According to embodiments, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0066] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules may communicate with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 may use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify or verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199).

[0067] Wireless communication module 192 can support 5G networks beyond fourth-generation (4G) networks and next-generation communication technologies, such as new radio (NR) access technologies. NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communications (mMTC), or ultra-reliable low-latency communications (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure high-frequency band performance, such as beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to the implementation, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or higher) for implementing eMBB, loss coverage (e.g., 164 dB or lower) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or lower for each of the downlink (DL) and uplink (UL), or 1 ms or lower for round trip) for implementing URLLC.

[0068] Antenna module 197 can transmit or receive signals or power to or from an external source (e.g., an external electronic device). According to one embodiment, antenna module 197 may include an antenna comprising a radiator formed of a conductor or conductive pattern on a substrate (e.g., a printed circuit board (PCB)). According to another embodiment, antenna module 197 may include multiple antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to another embodiment, other components besides the radiator (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 197.

[0069] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., millimeter-wave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving signals of the specified high frequency band.

[0070] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0071] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. External electronic devices 102 or 104 can be devices of the same or different types as electronic device 101. According to an embodiment, all or some operations to be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service or should perform a function or service in response to a request from a user or another device, electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, the one or more external electronic devices may perform the requested at least portion of the function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing can be used. Electronic device 101 may provide ultra-low latency services, for example, using distributed computing or mobile edge computing. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0072] Figure 2 This is an exploded perspective view of the front side of an electronic device according to an embodiment of the present disclosure.

[0073] Figure 3 This is a rear perspective view showing an electronic device according to an embodiment of the present disclosure.

[0074] Figure 2 and Figure 3 The components of the electronic device 101 may be wholly or partially connected with Figure 1 The components of the electronic device 101 are the same.

[0075] Reference Figure 2 and Figure 3According to the embodiment, electronic device 101 (e.g., Figure 1 The electronic device 101 may include a housing 110, which includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding the space between the first surface 110A and the second surface 110B. According to an embodiment (not shown), the housing 110 may represent a structure forming... Figure 2 First surface 110A, Figure 3 Some of the structures in the second surface 110B and the side surface 110C.

[0076] According to an embodiment, at least a portion of the first surface 110A may have a substantially transparent front panel 502 (e.g., a glass or polymer panel including various coatings). The second surface 110B may be formed of a substantially opaque back panel 111. The back panel 111 may be formed of, for example, laminated or tinted glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these. The side surface 110C may be formed of a side structure (or “side frame structure”) 118 that connects to the front panel 502 and the back panel 111 and includes metal and / or polymer. In an embodiment, the back panel 111 and the side structure 118 may be integrally formed together and include the same material (e.g., a metal such as aluminum).

[0077] According to an embodiment, the front panel 502 may include a region that curves and extends seamlessly toward the rear panel 111 from at least a portion of its edge. For example, only one of the regions of the front panel 502 (or the rear panel 111) that curve and extend toward the rear panel 111 (or the front panel 502) may be included in one edge of the first surface 110A. According to an embodiment, the front panel 502 or the rear panel 111 may be substantially flat, in which case the curved and extending region may not be included. When a curved and extending region is included in the front panel 502 or the rear panel 111, the thickness of the electronic device 101 at the portion including the curved and extending region may be less than the thickness of the remaining portion.

[0078] According to an embodiment, the electronic device 101 may include at least one of the following: a display 115, an audio module (e.g., a microphone hole 103, an external speaker hole 107, and a telephone receiver hole 114), a sensor module (e.g., a first sensor module 504, a second sensor module (not shown), or a third sensor module 119), a camera module (e.g., a first camera device 105, a second camera device 112, or a flash 113), a key input device 117, a light-emitting device 106, and a connector hole (e.g., a first connector hole 508 or a second connector hole 109). In an embodiment, the electronic device 101 may exclude at least one of these components (e.g., a key input device 117 or a light-emitting device 106), or other components may be added.

[0079] For example, a substantial portion of the display 115 may be exposed to the screen or visually through the first surface 110A (e.g., the front panel 502). In one embodiment, at least a portion of the display 115 may be exposed to the screen through the front panel 502 forming the first surface 110A or through a portion of the side surface 110C. In another embodiment, the edges of the display 115 may be formed to be substantially identical in shape to the adjacent outer edges of the front panel 502. In another embodiment (not shown), the spacing between the outer edges of the display 115 and the outer edges of the front panel 502 may be kept substantially uniform to provide a larger visual exposure area for the display 115.

[0080] According to an embodiment, a recess or opening may be formed in a portion of the screen display area of ​​the display 115, and at least one of an audio module (e.g., a telephone receiver hole 114), a sensor module (e.g., a first sensor module 504), a camera module (e.g., a first camera device 105), and a light-emitting device 106 aligned with the recess or opening may be included. In an embodiment (not shown), at least one of the audio module (e.g., a telephone receiver hole 114), the sensor module (e.g., a first sensor module 504), the camera module (e.g., a first camera device 105), the fingerprint sensor (not shown), and the light-emitting device 106 may be included on the rear surface of the screen display area of ​​the display 115. In an embodiment (not shown), the display 115 may be configured to be connected to or adjacent to a touch detection circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a magnetic field type stylus.

[0081] According to embodiments, audio modules 103, 107, and 114 may include a microphone hole 103 and a speaker hole (e.g., an external speaker hole 107 and a telephone receiver hole 114). A microphone for acquiring external sound may be disposed in the microphone hole 103. In embodiments, multiple microphones may be disposed to detect the direction of sound. The speaker hole may include an external speaker hole 107 and a telephone receiver hole 114. According to embodiments, the speaker hole (e.g., an external speaker hole 107 and a telephone receiver hole 114) and the microphone hole 103 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without a speaker hole (e.g., an external speaker hole 107 and a telephone receiver hole 114).

[0082] According to embodiments, the sensor module can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 101. The sensor module may include a first sensor module 504 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 110A of the housing 110, and / or a third sensor module 119 disposed on a second surface 110B of the housing 110. The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on the second surface 110B or side surface 110C of the housing 110, and on the surface 110A of the housing 110 (e.g., a display 115). The electronic device 101 may further include at least one of, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (e.g., the first sensor module 504).

[0083] According to an embodiment, the camera module may include a first camera device 105 disposed on a first surface 110A of the electronic device 101 and a second camera device 112 disposed on a second surface 110B and / or a flash 113. The camera devices (e.g., the first camera device 105 and the second camera device 112) may include one or more lenses, an image sensor, and / or an image signal processor. The flash 113 may include, for example, a light-emitting diode or a xenon lamp. In an embodiment, one or more lenses (infrared (IR) camera, wide-angle lens, and telephoto lens) and an image sensor may be disposed on one surface of the electronic device 101. In an embodiment, the flash 113 may emit infrared light. The infrared light emitted by the flash 113 and reflected by an object may be received by a third sensor module 119. The electronic device 101 or the processor of the electronic device 101 (e.g., Figure 1The processor 120 can detect depth information about an object based on the time point at which infrared light is received from the third sensor module 119.

[0084] According to an embodiment, the key input device 117 may be disposed on the side surface 110C of the housing 110. In an embodiment, the electronic device 101 may exclude all or some of the key input devices 117, and the excluded key input devices 117 may be implemented on the display 115 in other forms, such as as soft keys. In an embodiment, the key input device may include a sensor module disposed on the second surface 110B of the housing 110.

[0085] According to an embodiment, for example, a light-emitting device 106 may be disposed on a first surface 110A of the housing 110. The light-emitting device 106 may provide information about the state of the electronic device 101, for example, in the form of light. In an embodiment, the light-emitting device 106 may provide a light source that interacts with, for example, a camera module (e.g., a first camera device 105). The light-emitting device 106 may include, for example, a light-emitting diode (LED), an infrared (IR) LED, or a xenon lamp.

[0086] According to an embodiment, the connector hole (e.g., a first connector hole 508 or a second connector hole 109) may include, for example, a first connector hole 508 and / or a second connector hole 109 (e.g., a headphone jack), wherein the first connector hole 508 is used to receive a connector for external electronic devices (e.g., Figure 1 The electronic device 102) has a connector (e.g., a USB connector) that transmits power and / or data or receives power and / or data from an external electronic device, and a second connector hole 109 for receiving a connector for transmitting audio signals to or receiving audio signals from an external electronic device.

[0087] Figure 4 This is an exploded perspective view of the front side of an electronic device according to an embodiment of the present disclosure.

[0088] Figure 5 This is an exploded rear perspective view showing an electronic device according to an embodiment of the present disclosure.

[0089] Figure 4 and Figure 5 The components of the electronic device 101 may be wholly or partially connected with Figures 1 to 3 The components of the electronic device 101 are the same.

[0090] Reference Figure 4 and Figure 5 Electronic device 101 (e.g., Figure 1 , Figure 2 or Figure 3The electronic device 101 may include a side structure 210, a first support member 211 (e.g., a bracket), and a front panel 220 (e.g., Figure 2 Front panel 502), display 230 (e.g., Figure 2 and Figure 3 The display 115), printed circuit board (or board assembly) 240, battery 250, second support member 260 (e.g., rear housing), antenna, camera assembly 207, and rear plate 280 (e.g., Figure 3 Back panel 111).

[0091] According to embodiments, the electronic device 101 may exclude at least one of these components (e.g., the first support member 211 or the second support member 260), or it may add other components. At least one component of the electronic device 101 may be associated with... Figure 2 or Figure 3 At least one component of the electronic device 101 is the same as or similar to that of the other device, and will not be described again below.

[0092] According to an embodiment, the first support member 211 may be disposed inside the electronic device 101 to connect to or integrate with the side structure 210. The first support member 211 may be formed of, for example, a metallic material and / or a non-metallic material (e.g., a polymer). When at least partially formed of a metallic material, a portion of the side structure 210 or the first support member 211 may function as an antenna. A display 230 may be bonded to one surface of the first support member 211, and a printed circuit board 240 may be bonded to the other surface of the first support member 211. A processor (e.g., Figure 1 The processor 120), memory (e.g., Figure 1 The memory 130) and / or interface (e.g., Figure 1 The interface 177 can be mounted on the printed circuit board 240. The processor may include one or more of, for example, a central processing unit, an application processor, a graphics processing device, an image signal processing unit, a sensor hub processor, or a communication processor.

[0093] According to embodiments, the first support member 211 and the side structure 210 can be collectively referred to as the front shell or housing 201. According to embodiments, the housing 201 can generally be understood as a structure for accommodating, protecting, or housing the printed circuit board 240 or the battery 250. In embodiments, the housing 201 can be understood as including structures that can be visually or tactilely identified by the user from the exterior of the electronic device 101, such as the side structure 210, the front panel 220, and / or the rear panel 280. In embodiments, "front surface or rear surface of housing 201" can mean... Figure 2 First surface 110A or Figure 3The second surface 110B. In an embodiment, the first support member 211 may be provided on the front plate 220 (e.g., Figure 2 The first surface 110A) and the rear plate 280 (e.g., Figure 3 Between the second surface 110B, and can be used as a structure for placing electrical / electronic components such as printed circuit board 240 or camera assembly 207.

[0094] According to an embodiment, the display 230 may include a display panel 231 and a flexible printed circuit board 233 extending from the display panel 231. It is understood that the flexible printed circuit board 233 is electrically connected to the display panel 231, for example, while being at least partially disposed on the rear surface of the display panel 231. In an embodiment, the reference numeral "231" may be understood as a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood as part of the display panel 231. In an embodiment, the protective sheet may serve as a buffer structure absorbing external forces (e.g., a low-density elastic material such as sponge) or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to an embodiment, the display 230 may be disposed on the inner surface of the front panel 220 and, by including a light-emitting layer, via at least a portion or Figure 2 The first surface 110A outputs the image. As described above, the display 230 can cover substantially the entire area of ​​the front panel 220 or Figure 2 The entire area of ​​the first surface 110A is output as a screen.

[0095] According to the implementation, the memory may include, for example, volatile memory or non-volatile memory.

[0096] According to the implementation, the interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0097] According to an embodiment, the second support member 260 may include, for example, an upper support member 260a and a lower support member 260b. In an embodiment, the upper support member 260a may be arranged together with a portion of the first support member 211 to surround the printed circuit board 240. Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memory) or various electrical / electronic components may be disposed on the printed circuit board 240. According to an embodiment, the printed circuit board 240 may obtain an electromagnetic shielding environment from the upper support member 260a. In an embodiment, the lower support member 260b may be used as a mounting surface for components such as speaker modules (e.g., Figure 6 and Figure 7 The structure includes the speaker module 300 and electrical / electronic components such as interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors). In an embodiment, the electrical / electronic components, such as the speaker module and interfaces (e.g., USB connectors, SD card / MMC connectors, or audio connectors), may be disposed on an additional printed circuit board (not shown). In this case, the lower support member 260b may be disposed together with another portion of the first support member 211 to surround the additional printed circuit board. The speaker module or interface disposed on the additional printed circuit board (not shown) or the lower support member 260b may be configured to correspond to... Figure 2 Connector holes (e.g., first connector hole 508 or second connector hole 109) or audio modules (e.g., microphone hole 103 or speaker holes (e.g., external speaker hole 107 or telephone receiver hole 114)).

[0098] According to an embodiment, battery 250 may be a device for supplying power to at least one component of electronic device 101. Battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of battery 250 may be disposed on a plane substantially the same as printed circuit board 240. Battery 250 may be integrally or detachably disposed within electronic device 101.

[0099] According to an embodiment, the electronic device 101 may further include a separate sub-circuit board 290 spaced apart from the printed circuit board 240 in the first support member 211. The sub-circuit board 290 may be electrically connected to the printed circuit board 240 via a connecting member such as a connecting flexible board or cable. The sub-circuit board 290 may be electrically connected to electrical components (such as a battery 289 or a speaker, USB connector, antenna connector, and / or SIM socket) disposed in the end region of the electronic device 101, and may transmit signals and power.

[0100] Although not shown, the antenna may include, for example, a conductor pattern formed on the surface of the second support member 260 by laser direct forming. In embodiments, the antenna may include a printed circuit pattern formed on the surface of a thin film. A thin-film antenna may be disposed between the rear plate 280 and the battery 250. The antenna may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device, or may wirelessly transmit or receive power required for charging. In embodiments of this disclosure, another antenna structure may be formed from a portion or combination of the side structure 210 and / or the first support member 211.

[0101] According to one embodiment, camera assembly 207 may include at least one camera module. Inside electronic device 101, camera assembly 207 may receive at least a portion of light incident through optical apertures or camera windows 212, 213, and 219. In one embodiment, camera assembly 207 may be disposed on a first support member 211 adjacent to printed circuit board 240. In another embodiment, the camera module of camera assembly 207 may be generally aligned with any one of camera windows 212, 213, and 219 and is at least partially surrounded by a second support member 260 (e.g., upper support member 260a).

[0102] Figure 6 This is a top view showing a speaker module according to an embodiment of the present disclosure.

[0103] Figure 7 This is a bottom view showing a speaker module according to an embodiment of the present disclosure.

[0104] Figure 6 and Figure 7 The implementation method can be with Figures 1 to 5 Implementation methods and Figures 8 to 10 , Figure 11a , Figure 11b and Figures 12 to 22 The implementation methods are selectively combined.

[0105] Reference Figure 6 and Figure 7 The speaker module 300 according to the embodiment can be installed in an electronic device (e.g., Figures 1 to 5 The supporting components of the electronic device 101 (e.g., Figure 4 and Figure 5 The lower support member 260b) or printed circuit board (e.g., Figure 4 and Figure 5 The speaker module 300 can be electrically connected to the printed circuit board (PCB).

[0106] According to an embodiment, the loudspeaker module 300 may include a loudspeaker housing 310, a loudspeaker component 320 disposed on a first surface 310a of the loudspeaker housing 310, and an antenna pattern portion 330 disposed on a second surface 310b of the loudspeaker housing 310 opposite to the first surface 310a. The loudspeaker housing 310 may be referred to as a casing.

[0107] In an embodiment, the antenna pattern portion 330 may be formed from a conductor or conductive pattern on the surface of the speaker housing 310 (e.g., the second surface 310b). The antenna pattern portion 330 may be a laser direct forming (LDS) pattern. The antenna pattern portion 330 may be formed from a conductive material, for example, a metallic material including copper or nickel. An LDS pattern may be formed by selectively processing a pattern on an injection-molded product (e.g., a material including a thermoplastic resin) using a laser, followed by plating and coating processes. Laser processing facilitates the plating of metallic materials onto micron-scale rough resin surfaces. The antenna pattern portion 330 may be electrically connected to a communication module of an electronic device (e.g., Figure 1 The communication module 192). The speaker module 300 can be used as an antenna by including an antenna pattern portion 330 on its surface. In this case, the speaker module 300 can be referred to as an antenna (or an antenna module and an antenna radiator).

[0108] According to an embodiment, the speaker module 300 may be an electronic component (hereinafter referred to as a heat-generating component) that generates heat when the speaker module 300 is operating. In the case of a heat-generating component such as the speaker module 300, a heat dissipation film (e.g., Figures 8 to 10 A heat dissipation film 340 is attached to its surface to dissipate heat generated during operation to the outside.

[0109] The heat dissipation film can include, for example, a graphite film or a copper film. Graphite or copper films can be highly efficient in heat dissipation due to their high thermal conductivity. Graphite or copper films can also have high thermal conductivity and high electrical conductivity. However, when a graphite or copper film is attached to an electronic component coupled to an antenna (e.g., a speaker module 300), its high electrical conductivity may affect the antenna's radiation characteristics, thus making it unsuitable for antenna-coupled electronic components. Therefore, for antenna-coupled electronic components, a heat dissipation film based on fluorinated graphene (GF) with high thermal conductivity and insulating properties can be attached. However, in the case of a fluorinated graphene-based heat dissipation film, during the manufacture of fluorinated graphene particles, the insulating fluorine atoms are unevenly bonded to the graphene surface, making it difficult to uniformly ensure insulating properties. Furthermore, in the case of a fluorinated graphene-based heat dissipation film, during manufacturing, it is difficult to form the film due to the low bonding force (or surface energy) between the fluorinated graphene particles. In addition, for the heat dissipation film of fluorinated graphene, a polymer-based binder formed of carbon, oxygen and / or hydrogen can be used to form the film, but in this case, the thermal conductivity of the film may be reduced.

[0110] The following describes a heat dissipation film with high thermal conductivity and insulating properties, which can solve the above problems.

[0111] Figure 8 This is a perspective view showing a heat dissipation film according to an embodiment of the present disclosure.

[0112] Figure 9 This is a cross-sectional view showing a heat dissipation film according to an embodiment of the present disclosure.

[0113] Figure 10 This illustrates an embodiment according to the present disclosure, such as... Figure 7 An enlarged view of the antenna pattern area of ​​the speaker module shown.

[0114] Figures 8 to 10 The implementation method can be with Figures 1 to 7 as well as Figure 11a , Figure 11b and Figures 12 to 22 The implementation methods are selectively combined.

[0115] Reference Figure 8 and Figure 9 According to the embodiments, the heat dissipation film 340 may include a first layer 341 having high thermal conductivity, a second layer 342 laminated (or coated) on one surface of the first layer 341 and having adhesive properties, and a third layer 343 laminated (or coated) on one surface of the second layer 342 and having insulating properties.

[0116] According to an embodiment, the first layer 341 may be based on graphene or graphite. The first layer 341 may include, for example, graphene oxide (GO), wherein oxygen (or -0 functional groups) are bonded to the carbon atom structure of graphene. The first layer 341 may be referred to as the substrate layer.

[0117] According to an embodiment, the second layer 342 may be laminated only in a specific region (e.g., an insulating region) on one surface of the first layer 341. This specific region may refer to the area within a predetermined width that contacts the antenna pattern portion 330 of the speaker module. For example, the second layer 342 may be patterned only in this specific region to insulate it from the antenna pattern portion 330. In an embodiment, the second layer 342 may be based on dopamine. The second layer 342 may be formed, for example, by polymerizing dopamine molecules and may include polydopamine (PDA) having hydroxyl (or -OH) functional groups and / or hydrogen atoms on its surface. The second layer 342 may be a layer connecting the first layer 341 and the third layer 343. The second layer 342 may be referred to as an interface layer or adhesive layer.

[0118] According to an embodiment, the third layer 343 may be laminated on one surface of the second layer 342 patterned on the first layer 341. For example, the third layer 343 may be disposed only in a specific region (e.g., an insulating region) on said one surface of the first layer 341, and may be patterned together with the second layer 342 on the first layer 341. In an embodiment, the third layer 343 may be formed of a fluorocarbon-based polymer (FP) (or a fluoropolymer). The third layer 343 may be referred to as an insulating layer.

[0119] According to an embodiment, the heat dissipation film 340 may be attached to the surface of a heat-generating component (or electronic component) (e.g., speaker module 300) on which an antenna (e.g., antenna pattern portion 330) is provided.

[0120] Reference Figure 10 The second layer 342 and / or the third layer 343 can be configured to surround at least a portion of the antenna pattern portion 330 of the speaker module 300. The second layer 342 and / or the third layer 343 can space an area of ​​the first layer 341 exposed on the surface of the heat dissipation film 340 from the antenna pattern portion 330 within a predetermined distance, such that this exposed area of ​​the first layer 341 does not affect the antenna radiation performance. For example, the second layer 342 and / or the third layer 343 can be stacked on the first layer 341 to have a width w, which is substantially the same as the spacing between an area of ​​the first layer 341 and the antenna pattern portion 330. The width w of the second layer 342 and / or the third layer 343 can be designed to be within a range that does not affect the antenna radiation performance, for example, within 2 mm.

[0121] According to an embodiment, the first layer 341, the second layer 342, and the third layer 343 can form multiple basic unit structures constituting the heat dissipation film 340. For example, the multiple basic unit structures including layers 341, 342, and 343 can be repeatedly stacked in an order such as "first layer 341-second layer 342-third layer 343-second layer 342-first layer 341…" using a second layer 342 as an adhesive layer. In other words, the second layer 342 can be disposed between the multiple basic unit structures. The thickness of the basic unit structure can be designed to be, for example, within 0.1 to 1 μm. The heat dissipation film 340 can have a desired predetermined thickness by continuously stacking the basic unit structures. The thickness of the heat dissipation film 340 can be designed to be, for example, within 10 μm.

[0122] By being manufactured to a predetermined thickness using a stack of basic unit structures, the heat dissipation film 340 can have a high thermal conductivity of 1000 W / mK or higher. Furthermore, the heat dissipation film 340 can also possess insulating properties through patterned second layers 342 and third layers 343.

[0123] The following is for reference Figure 11a , Figure 11b and Figure 12 Describe the connection structure and stacking structure between layers 341, 342 and 343 that constitute the heat dissipation film 340.

[0124] Figure 11a This is a view showing the connection structure of the layers constituting the heat dissipation film according to an embodiment of the present disclosure.

[0125] Figure 11b This is a view showing the connection structure of the layers constituting the heat dissipation film according to an embodiment of the present disclosure.

[0126] Figure 12 This is a view showing the stacked structure of the heat dissipation film according to an embodiment of the present disclosure.

[0127] According to the embodiments, the heat dissipation film 340 or 340' may include a first layer 341 or 341', a second layer 342 and a third layer 343.

[0128] Figure 11a , Figure 11b and Figure 12 The heat dissipation film 340 or 340' can be wholly or partially connected with... Figures 8 to 10 The heat dissipation film 340 has the same structure.

[0129] Figure 11a , Figure 11b and Figure 12 The implementation method can be with Figures 1 to 10 as well as Figures 13 to 22 The implementation methods are selectively combined.

[0130] Reference Figure 11a According to an embodiment, the second layer 342 can be chemically coupled to one side of the graphene-based first layer 341. For example, when the first layer 341 is formed of graphene oxide (GO) and the second layer 342 is formed of polydopamine (PDA), the first layer 341 and the second layer 342 can be bonded to each other through hydrogen bonds between oxygen atoms present on the surface of the first layer 341 and hydroxyl groups present on the surface of the second layer 342. According to an embodiment, the third layer 343 can be chemically coupled to one side of the second layer 342. For example, when the second layer 342 is formed of polydopamine (PDA) and the third layer 343 is formed of a fluoropolymer (FP), the hydroxyl and / or hydrogen atoms present on the surface of the second layer 342 and the fluorine (F) atoms present on the surface of the third layer 343 can be covalently bonded to each other. Therefore, the first layer 341, the second layer 342, and the third layer 343 can be sequentially stacked to form a basic unit structure.

[0131] Reference Figure 11b ,and Figure 11a Unlike the first layer 341 shown, which is formed of graphene oxide, the first layer 341' according to the embodiment can be formed of graphite (GR). In this case, in Figure 11b On the surface of the first layer 341', hydrogen atoms and / or hydroxyl groups may exist, rather than existing in Figure 11a The first layer 341 has oxygen atoms on its surface. In an embodiment, the second layer 342 can be chemically coupled to one side of the first layer 341' formed of graphite GR. For example, when the first layer 341' is formed of graphite (GR) and the second layer 342 is formed of polydopamine (PDA), the first layer 341' and the second layer 342 can be bonded to each other by hydrogen bonds between hydrogen atoms and / or hydroxyl groups present on the surface of the first layer 341' and hydroxyl groups present on the surface of the second layer 342. As described above, the third layer 343 can be covalently bonded to the second layer 342. Therefore, the first layer 341', the second layer 342, and the third layer 343 can be sequentially stacked to form a basic unit structure.

[0132] Reference Figure 12 ,like Figure 11a As shown, a heat dissipation film 340 with a predetermined thickness can be formed by repeatedly stacking multiple basic unit structures 340-1 and 340-2, including the first layer 341, the second layer 342 and the third layer 343, in the second layer 342 used as an adhesive layer. For example, multiple basic unit structures 340-1, 340-2, ... can be stacked such that the thickness of the heat dissipation film 340 is within 10 μm.

[0133] Although not shown, but even in Figure 11bIn the case where the first layer 341' shown is a basic unit structure formed of graphite, multiple basic unit structures including the first layer 341', the second layer 342 and the third layer 343 can also be repeatedly stacked by the second layer 342, which serves as an adhesive layer, to form a heat dissipation film 340' with a predetermined thickness.

[0134] Table 1

[0135]

[0136] Table 1 shows the dielectric constants of samples of a heat dissipation film B with a thickness of approximately 10 μm, formed by stacking multiple basic unit structures, and a basic unit structure A. Referring to Table 1, it can be determined that a basic unit structure A has an average dielectric constant of 2.12 F / m, and the heat dissipation film B with a thickness of approximately 10 μm has an average dielectric constant of 2.88 F / m. Therefore, it can be determined that the insulating properties are maintained before / after the stacking of the basic unit structures.

[0137] Figure 13 This is a flowchart illustrating the basic unit structure constituting the heat dissipation film manufactured according to an embodiment of the present disclosure.

[0138] Figure 14 This is a flowchart illustrating the manufacture of a heat dissipation film according to an embodiment of the present disclosure.

[0139] Figure 13 and Figure 14 The implementation method can be with Figures 1 to 10 , Figure 11a , Figure 11b and Figure 12 Implementation methods and Figures 15 to 22 The implementation methods are selectively combined.

[0140] According to an embodiment, based on a mask process, the process of patterning the second layer 342 and / or the third layer 343 on the first layer 341 can be performed by at least one of spraying, dip coating and / or screen printing.

[0141] Reference Figure 13The mask M is attached to a surface region of the first layer 341 (e.g., graphene oxide (GO)) that does not require insulation. Furthermore, the raw material 342a of the second layer 342 (e.g., polydopamine (PDA)) is sprayed (or applied) to the side of the first layer 341 to which the mask M is attached, such that the second layer 342 (e.g., polydopamine (PDA)) is stacked in the region where the mask M is not located (or the insulating region). Subsequently, the mask M, the second layer 342, and the raw material 343a of the third layer 343 are stacked on the upper surface of the first layer 341 by spraying (or applying) the raw material 343a of the third layer 343 (e.g., fluoropolymer FP) to one side of the first layer 341. Thereafter, when the mask M attached to the surface of the first layer 341 is removed, the second layer 342 and the third layer 343 can be patterned only in the insulating regions that require insulation. By repeating the above process, the second layer 342 and the third layer 343 can be patterned only in the insulating region on the opposite side 341b of the first layer 341 to the side 341a of the first layer 341.

[0142] Reference Figure 14 It can be done by... Figure 13 In the same manner shown, a second layer 342 and a third layer 343 are sequentially stacked on the surface of the first layer 341 in the area requiring insulation, forming a basic unit structure 340-1 constituting the heat dissipation film 340. Subsequently, a second layer 342 can be stacked again on the third layer 343 of the basic unit structure 340-1, and then another basic unit structure 340-2 can be stacked on the basic unit structure 340-1, thereby continuously stacking the basic unit structures 340-1 and 340-2. In other words, the basic unit structures 340-1 and 340-2 can be stacked in the manner described above to form a heat dissipation film 340 with a desired thickness.

[0143] Figure 15 This is a plan view showing an antenna according to an embodiment of the present disclosure.

[0144] Figure 15 The implementation method can be with Figures 1 to 10 , Figure 11a , Figure 11b as well as Figures 12 to 14 Implementation method or Figures 16 to 22 The implementation methods are selectively combined.

[0145] Reference Figure 15 According to the implementation method, the electronic device (e.g., Figure 4 and Figure 5 The electronic device 101 may include a rear panel disposed on the electronic device (e.g., Figure 3 and Figure 4 The rear panel 280) and the battery (e.g., Figure 3 and Figure 4One or more antennas 350 (e.g., NFC antenna, wireless charging antenna, or MST antenna) between the battery 250.

[0146] According to one embodiment, the antenna 350 may be provided in the form of a thin film. Although not shown, the antenna 350 may include printed circuit patterns, wireless charging circuitry, or a heat sink formed on the surface of the thin film.

[0147] According to an embodiment, antenna 350 (e.g., an MST antenna) (e.g., a first antenna) may include a heat dissipation film 340 configured to overlap with another antenna (e.g., a millimeter-wave antenna module) (e.g., a second antenna) provided in the electronic device. The heat dissipation film 340 may be provided integrally with the thin film of the antenna. As described above, the heat dissipation film 340 has high thermal conductivity and insulating properties, and is provided integrally with antenna 350, thereby further ensuring a heat transfer path and thus enhancing heat dissipation of the other antenna provided in the electronic device.

[0148] In this disclosure, a speaker module (e.g., Figure 6 and Figure 8 The speaker module 300 and antenna 350 are described as electronic components (or heat-generating components) coupled to an antenna with a heat dissipation film 340 attached, but this disclosure is not limited thereto, and the heat dissipation film 340 can be applied to any component that is a heat-generating component and is related to the radiation characteristics of the antenna.

[0149] Figure 16 This is a front perspective view showing an electronic device according to an embodiment of the present disclosure.

[0150] Figure 17 This is a rear top view showing an electronic device according to an embodiment of the present disclosure.

[0151] Reference Figure 16 and Figure 17The electronic device 400 can be foldably coupled relative to each other about a folding axis F via at least one hinge device 440 or 440-1 (e.g., a hinge module or hinge structure), and may include a first housing 410 (e.g., a first housing structure) and a second housing 420 (e.g., a second housing structure), the first housing 410 including a first side member 413 (e.g., a side frame), and the second housing 420 including a second side member 423 (e.g., a side frame). For example, the first housing 410 and the second housing 420 may be configured as foldable housings (e.g., housing structures). For example, the electronic device 400 may include a first display 430 (e.g., a flexible display, a foldable display, or a main display) configured to be supported by the first housing 410 and the second housing 420. For example, the first housing 410 may include a first surface 411 and a second surface 412 opposite to the first surface 411 (e.g., in the -z-axis direction). For example, the second housing 420 may include a third surface 421 and a fourth surface 422 opposite to the third surface 421 (e.g., in the -z-axis direction). For example, the first housing 410 may include a first rear cover 414 coupled to the first side member 413. For example, the second housing 420 may include a second rear cover 424 coupled to the second side member 423. For example, when the electronic device 400 is in a fully unfolded first state (e.g., unfolded or open state), the electronic device 400 may be operated such that the first surface 411 and the third surface 421 face substantially the same direction (e.g., the z-axis direction). For example, when the electronic device 400 is in a fully folded second state (e.g., folded or closed state), the electronic device 400 may be operated such that the first surface 411 and the third surface 421 face each other or are opposite to each other. For example, the electronic device 400 may be operated to maintain a third state (e.g., an intermediate state) between the first and second states.

[0152] According to embodiments, the electronic device 400 may include a first receiver 401, at least one first sensor module 404 (e.g., an illuminance sensor), and / or at least one first camera module 405 (e.g., an under-display camera (UDC)) disposed on a first surface 411 of the first housing 410. For example, the electronic device 400 may include at least one button 406 disposed on a first side member 413. For example, the electronic device 400 may include at least one second camera module 408 and / or a flash 409 disposed on a second surface 412 (e.g., a first rear cover 414) of the first housing 410. For example, the electronic device 400 may include a second display 431, at least one third camera module 425 (e.g., an under-display camera (UDC)), at least one second sensor module 426, and / or a second receiver 427 disposed on a fourth surface 422 of the second housing 420. For example, the second display 431 may be configured to be visible from the outside through at least a portion of the second rear cover 424. For example, electronic device 400 may include a speaker 402 disposed on second side member 423, a microphone 403 disposed on first side member 413, and / or connector port 407. At least some of the above-mentioned components may be disposed in first housing 410 and / or second housing 420.

[0153] According to an embodiment, the first display 430 (e.g., a flexible display) may include a first region 430a (e.g., a first flat portion) corresponding to at least a portion of a first surface 411, a second region 430b (e.g., a second flat portion) corresponding to at least a portion of a third surface 421, and a third region 430c (e.g., a flexible portion), the third region 430c connecting the first region 430a and the second region 430b, wherein the electronic device 400 deforms from a second state (e.g., a folded state) and / or a third state. For example, when the first display 430 is viewed from above (e.g., in the z-axis direction), the third region 430c may be positioned at a location that at least partially overlaps with at least one hinge device 440 or 440-1. For example, in the second state, since the first surface 411 and the third surface 421 face each other, the first display 430 may be configured to be invisible from the outside (e.g., an inward-folding type). For example, in the second state, since the first surface 411 and the third surface 421 are opposite to each other, the first display 430 may be configured to be visible from the outside (e.g., an outward-folding type).

[0154] Figure 18 This illustrates various embodiments of the hinge device according to the present disclosure. Figure 16 and Figure 17 A partial exploded perspective view of the electronic device.

[0155] Figure 18 The implementation method can be with Figure 16 , Figure 17 as well as Figures 19 to 22 The implementation methods are selectively combined.

[0156] Reference Figure 18 The electronic device 400 may include at least one hinge device 440 or 440-1 (e.g., a hinge module or hinge structure) connecting the first housing 410 and the second housing 420 below the first display 430 (e.g., in the -z axis direction). For example, at least one hinge device 440 or 440-1 may include a first hinge device 440 and a second hinge device 440-1 spaced apart from the first hinge device 440 in a direction parallel to the folding axis F (e.g., the ±y axis direction). For example, at least one hinge device 440 or 440-1 may be supported by a first support member 4131 extending from the first side member 413 to the first space 4101 of the first housing 410 and a second support member 4231 extending from the second side member 423 to the second space 4201 of the second housing 420. For example, at least one hinge device 440 or 440-1 may be disposed between the first housing 410 and the second housing 420 such that it is not visible from the outside through the hinge housing 450 (e.g., a hinge cover).

[0157] According to an embodiment, the first hinge device 440 may include a first rotating member 441 (e.g., a first arm or a first rotating body) disposed on a first support member 4131 of the first housing 410, a second rotating member 442 (e.g., a second arm or a second rotating body) disposed on a second support member 4231 of the second housing 420, and a gear assembly 443 connected to the first housing 410 and the second housing 420 to allow the first housing 410 and the second housing 420 to rotate symmetrically relative to each other. For example, the gear assembly 443 may include a plurality of gears (e.g., spur gears and / or worm gears) meshing relative to each other. For example, the gear assembly 443 may include a cam coupling structure for pressing the first housing 410 and the second housing 420 in a direction from a first state (e.g., an unfolded state or an open state) to a second state (e.g., a folded state or a closed state) or from a second state to a first state based on a predetermined angle relative to each other, and providing a pre-stop at various folding angles. For example, the second hinge device 440-1 may have a substantially the same construction as the first hinge device 440.

[0158] According to an embodiment, the electronic device 400 may include a first hinge plate 461 connected to a first support member 4131 and / or a first rotating member 441. The electronic device 400 may also include a second hinge plate 462 connected to a second support member 4231 and / or a second rotating member 442. For example, when the electronic device 400 is in a first state, at least one hinge device 440 or 440-1, the first rotating member 441, the second rotating member 442, the first hinge plate 461, and the second hinge plate 462 may form a plane substantially the same as the first support member 4131 and the second support member 4231. For example, the second hinge device 440-1 may be substantially symmetrical to the first hinge device 440, or may have a substantially identical construction to the first hinge device 440.

[0159] According to an embodiment, although not shown, the electronic device 400 may include a plurality of printed circuit boards respectively disposed in housings 410 and 420. A processor (e.g., Figure 1 The processor 120), memory (e.g., Figure 1 The memory 130) and / or interface (e.g., Figure 1 The interface 177 can be mounted on multiple printed circuit boards.

[0160] According to an embodiment, the electronic device 400 may include a plurality of connectors 470 for electrical connections between various components (e.g., transmission of control signals, power signals, or communication signals) or between printed circuit boards. Various types of connection structures (or connector structures) may be employed among the plurality of connectors 470, such as flexible printed circuit (FPC) or flexible flat cable (FFC) type, board-to-board (B to B) type, zipper type, adhesive type formed by hot-rolling process, low insertion force (LIF), and zero insertion force (ZIF) types, through which related components or printed circuit boards can be electrically connected. In addition to various types of connection structures, the plurality of connectors 470 may also employ a connector-to-connector (or C2C) electrical connection structure (or connector structure) connecting two different connectors 470.

[0161] Figure 19 This is a top view showing a connector according to an embodiment of the present disclosure.

[0162] Figure 20a and Figure 20b This is a view showing the bonding force between the particles constituting the heat dissipation film according to an embodiment of the present disclosure.

[0163] Figure 21 It is a graph showing the tensile stress of the heat dissipation film according to an embodiment of the present disclosure.

[0164] Figure 22This is a graph showing the energy storage modulus of the heat dissipation film according to an embodiment of the present disclosure.

[0165] Figures 19 to 22 The implementation method can be with Figure 1 as well as Figures 16 to 18 The implementation methods are selectively combined.

[0166] Figure 19 The structure of the heat dissipation film 480 can be wholly or partially integrated with... Figures 8 to 10 , Figure 11a , Figure 11b as well as Figures 12 to 14 The heat dissipation film 340 has the same structure.

[0167] Reference Figure 19 According to an embodiment, the connector 470 may include: a first connecting portion 471 electrically connected at one end to various components or printed circuit boards; a second connecting portion 472 electrically connected at the other end to various components or printed circuit boards; and a flexible portion 473 connecting the first connecting portion 471 and the second connecting portion 472 and being bendable. The flexible portion 473 of the connector 470 may be compatible with electronic devices (e.g., Figure 16 The first display of the electronic device 400 (e.g., Figure 16 The third area of ​​the first display 430 (e.g., Figure 16 The third region 430c) overlaps with the portion. When the housing of the electronic device (e.g., Figure 16 When the first housing 410 and the second housing 420 rotate, the flexible part 473 of the connector 470 can deform together with the first display.

[0168] According to an embodiment, a heat dissipation film 480 may be attached to the flexible portion 473 of the connector 470. Heat dissipation films 480a or 480b may be attached to the flexible portion 473 of the connector 470, respectively. The heat dissipation film 480 attached to the flexible portion 473 of the connector 470 can serve as a heat transfer path for various electronic components and / or printed circuit boards connected to each other via the connector 470. The heat dissipation film 480 may be a graphite-based film. However, with a graphite heat dissipation film 480, when the flexible portion 473 of the connector 470 deforms, the heat dissipation film 480 may peel off from the connector 470 due to the low bonding force between the graphite particles, and signal loss may occur due to its high conductivity. Therefore, as referred to above... Figures 8 to 10 , Figure 11a , Figure 11b , Figure 12 and Figure 13 The heat dissipation film 480 may include a first layer based on graphene (e.g., Figure 8 The first layer 341), and the second layer based on polydopamine (e.g., Figure 8The second layer 342) and the third layer formed of a fluoropolymer (e.g., Figure 8 The third layer 343). In the heat dissipation film 480, the third layer formed of fluoropolymer can be omitted as needed.

[0169] When the heat dissipation film 480 is formed based on graphene and polydopamine, polydopamine can act as a binder during the bonding of graphene particles and can compensate for defects that may occur during the bonding process. As a result, the bonding force between graphene particles can be increased, and the flexibility of the heat dissipation film 480 can be enhanced (see [link to relevant documentation]). Figure 20a and Figure 20b Furthermore, compared to the case where the heat dissipation film 480 is based on graphite (comparative example), when the heat dissipation film 480 is based on graphene and polydopamine (implementation method), the tensile stress of the heat dissipation film can be increased from 0.7 kgf to 1.24 kgf (see [implementation method]). Figure 21 Furthermore, the energy storage modulus can be increased from 4885 MPa (@ 25°C) to 14069 (@ 25°C) (see [reference]). Figure 22 ).

[0170] The electronic device according to various embodiments of this disclosure can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0171] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions for the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0172] As used herein, the term "module" can include units implemented in hardware, software, or firmware, and is used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, depending on the implementation, a module can be implemented as an application-specific integrated circuit (ASIC).

[0173] The various implementations set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media can be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0174] According to various embodiments, methods according to this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0175] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities. Some of the multiple entities may be located within different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0176] An electronic device 101 according to an embodiment of the present disclosure may include a housing 110, a circuit board 240 disposed in the housing 110, an antenna module 300 disposed in the housing 110 and including an antenna pattern portion 330 electrically connected to the circuit board, and a heat dissipation film 340 attached to the antenna module 300. The heat dissipation film 340 may include: a first layer 341 formed of a conductive material; a second layer 342 having a predetermined width to surround the antenna pattern portion 330 and disposed on one surface of the first layer 341; and a third layer 343 disposed on one surface of the second layer 342 and formed of an insulating material. The second layer 342 may be configured to be hydrogen-bonded to the first layer 341 and covalently bonded to the third layer 343.

[0177] According to an embodiment, the heat dissipation film 340 may include multiple basic unit structures, in which a first layer 341, a second layer 342, and a third layer 343 are sequentially stacked. The heat dissipation film 340 may be configured such that the multiple basic unit structures are repeatedly stacked, and the second layer 342 may be disposed between the multiple basic unit structures.

[0178] According to an implementation, the first layer 341 may include graphene- or graphite-based units.

[0179] According to an implementation, the second layer 342 may include dopamine-based units.

[0180] According to an implementation, the third layer 343 may include fluoride-based units.

[0181] According to an embodiment, the third layer 343 may be formed of a fluorocarbon-based polymer (FP).

[0182] According to the implementation, the second layer 342 may have a width that is substantially the same as the predetermined width of the third layer 343.

[0183] According to the implementation method, the predetermined width of the second layer 342 can be 2 mm or less.

[0184] According to an embodiment, the antenna module 300 may include a speaker module or a camera module, the speaker module or camera module having an antenna pattern portion electrically connected to a circuit board.

[0185] According to an embodiment, the electronic device 101 may further include a first antenna 350 and a second antenna. The first antenna 350 may include a heat dissipation film 340 configured to overlap with the second antenna.

[0186] According to embodiments of this disclosure, a heat dissipation film 340 attached to an antenna module 300 having an antenna pattern portion 330 may include: a first layer 341 formed of a conductive material; a second layer 342 having a predetermined width to surround the antenna pattern portion 330 and disposed on one surface of the first layer 341; and a third layer 343 disposed on one surface of the second layer 342 and formed of an insulating material. The second layer 342 may be hydrogen-bonded to the first layer 341 and covalently bonded to the third layer 343.

[0187] According to an implementation, the first layer 341 may include graphene- or graphite-based units.

[0188] According to an implementation, the second layer 342 may include dopamine-based units.

[0189] According to an implementation, the third layer 343 may include fluoride-based units.

[0190] According to an embodiment, the third layer 343 may be formed of a fluorocarbon-based polymer (FP).

[0191] According to the implementation, the second layer 342 may have a width that is substantially the same as the predetermined width of the third layer 343.

[0192] According to the implementation method, the predetermined width of the second layer 342 can be 2 mm or less.

[0193] According to an embodiment, the antenna pattern portion 330 may include a thin-film antenna.

[0194] According to an embodiment, the antenna pattern portion 330 may include at least one of a near field communication (NFC) antenna, a wireless charging antenna, or a magnetically secure transmission (MST) antenna.

[0195] Although this disclosure has been shown and described with reference to various embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device (101), comprising: Casing (110); A circuit board is disposed in the housing (110); Antenna module (300) is disposed in the housing (110) and includes an antenna pattern portion (330) electrically connected to the circuit board. as well as A heat dissipation film (340) is attached to the antenna module (300). The heat dissipation film (340) includes: The first layer (341) is formed of a conductive material. The second layer (342) has a predetermined width to surround the antenna pattern portion (330) and is disposed on one surface of the first layer (341), and The third layer (343) is disposed on one surface of the second layer (342) and is formed of an insulating material, and The second layer (342) is configured to be hydrogen bonded to the first layer (341) and covalently bonded to the third layer (343).

2. The electronic device according to claim 1, wherein The heat dissipation film (340) includes a plurality of basic unit structures in which a first layer (341), a second layer (342), and a third layer (343) are sequentially stacked, wherein the heat dissipation film (340) is configured such that the plurality of basic unit structures are repeatedly stacked, and The second layer (342) is disposed between the plurality of basic unit structures.

3. The electronic device according to claim 1 or 2, wherein, The first layer (341) comprises graphene- or graphite-based units.

4. The electronic device according to any one of claims 1 to 3, wherein, The second layer (342) includes dopamine-based units.

5. The electronic device according to any one of claims 1 to 4, wherein, The third layer (343) includes fluoride-based units.

6. The electronic device according to claim 5, wherein, The third layer (343) is formed of a fluorocarbon-based polymer (FP).

7. The electronic device according to any one of claims 1 to 6, wherein, The second layer (342) has a width that is substantially the same as the predetermined width of the third layer (343).

8. The electronic device according to any one of claims 1 to 7, wherein, The predetermined width of the second layer (342) is 2 mm or less.

9. The electronic device according to any one of claims 1 to 8, wherein, The antenna module (300) includes a speaker module or a camera module, the speaker module or the camera module having an antenna pattern portion electrically connected to the circuit board.

10. The electronic device according to any one of claims 1 to 9, further comprising a first antenna (350) and a second antenna, in, The first antenna (350) includes a heat dissipation film (340) configured to overlap with the second antenna.

11. A heat dissipation film (340) attached to an antenna module (300) having an antenna pattern portion (330). in, The heat dissipation film (340) includes: The first layer (341) is formed of a conductive material. The second layer (342) has a predetermined width to surround the antenna pattern portion (330) and is disposed on one surface of the first layer (341), and The third layer (343) is disposed on one surface of the second layer (342) and is formed of an insulating material, and The second layer (342) is hydrogen-bonded to the first layer (341) and covalently bonded to the third layer (343).

12. The heat dissipation film according to claim 11, in, The heat dissipation film (340) includes multiple basic unit structures, including the first layer (341), the second layer (342) and the third layer (343). The heat dissipation film (340) is configured such that the plurality of basic unit structures are repeatedly stacked, and The second layer (342) is disposed between the plurality of basic unit structures.

13. The heat dissipation film according to claim 11 or 12, wherein, The first layer (341) comprises graphene- or graphite-based units.

14. The heat dissipation film according to any one of claims 11 to 13, wherein, The second layer (342) includes dopamine-based units.

15. The heat dissipation film according to any one of claims 11 to 14, wherein, The third layer (343) includes fluoride-based units.

Images