Wiring structure of IGBT power module and IGBT power module
By simplifying the conductive sheet layout and connection design of the IGBT module, reducing the number and distance of the bridges, the stability and short-circuit problems caused by complex wiring structures in the prior art are solved, and the stability and yield of the module are improved.
Patent Information
- Application Number
- CN202420287981.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-07
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-02-07
Smart Images

Figure CN222146212U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductors, in particular to a wiring structure and packaging of an IGBT power module. Background Art
[0002] IGBT (Insulated Gate Bipolar Transistor), insulated gate bipolar transistor, is a composite fully controlled voltage-driven power semiconductor device composed of a bipolar junction transistor (BJT) and an insulated gate field effect transistor (MOS). It has the advantages of high input impedance of metal-oxide-semiconductor field-effect transistor (MOSFET) and low on-state voltage drop of power transistor (Giant Transistor, GTR). GTR has low saturation voltage drop and high current density, but large driving current; MOSFET has low driving power and fast switching speed, but large on-state voltage drop and low current density. IGBT combines the advantages of the above two devices, with low driving power and low saturation voltage drop. It is very suitable for use in converter systems with DC voltage of 600V and above, such as AC motors, inverters, switching power supplies, lighting circuits, traction drives and other fields.
[0003] The IGBT module includes an IGBT chip and an FRD diode chip, and the IGBT power module generally welds the IGBT chip and the diode chip on a heat dissipation substrate with a circuit, and then electrically connects the chip electrodes and the corresponding conductive structures on the circuit through a bonding wire or a bridge such as CLIP. Since bonding wire bridging often causes problems such as cold soldering and poor heat dissipation, the existing IGBT module will use CLIP bridging. When CLIP bridging, in order to leave enough space for CLIP, and in order to electrically connect the E pole of the IGBT chip and the electrode of the diode chip and lead out the electrical connection sheet, two bridges and a transfer conductive sheet need to be set, one bridge is welded between the electrode of the diode chip and the transfer conductive sheet, and the other bridge is welded between the E pole of the IGBT chip and the transfer conductive sheet, so as to electrically connect the electrode of the diode chip and the E pole of the IGBT chip and form a conductive sheet for outputting signals.
[0004] However, referring to Chinese patent CN116469878A, the structure of the conductive sheet in the existing IGBT module is often too complicated. When pasting the conductive sheet, it is easy to scrap the DBC board due to the high positioning accuracy requirement. In addition, since the bridge piece cannot be made too long to prevent the bridge piece from deforming and bending, a large number of bridge pieces are required in an IGBT module to bridge between the conductive sheets to relay the signal, and some bridge pieces need to be tilted. In order to reduce the volume of the IGBT module, the spacing between the conductive sheets in the wiring structure is often very small, and the conductive sheet at the signal transmission end is often made very narrow. When welding the bridge piece, it is easy to cause the wiring on the IGBT to short-circuit due to unstable positioning or the bridge piece tilting during welding or solder paste outflow.
[0005] Therefore, there is an urgent need for an IGBT wiring structure and an IGBT packaging module that can solve the above problems. Utility Model Content
[0006] The utility model aims to provide a wiring structure of an IGBT power module and an IGBT power module. The layout of each conductive sheet on the wiring structure is simple and the bridge components between the conductive sheets are effectively reduced.
[0007] In order to achieve the above-mentioned object, the utility model provides a wiring structure of an IGBT power module, comprising a substrate and a signal conductive unit, a first conductive unit and a second conductive unit sequentially laid on the substrate from front to back, the first conductive unit comprising a first conductive sheet, a second conductive sheet and a third conductive sheet sequentially arranged from front to back, the second conductive unit comprising a fourth conductive sheet, a fifth conductive sheet and a sixth conductive sheet sequentially arranged from front to back, the signal conductive unit is used to electrically connect a signal terminal, the second conductive sheet and the fifth conductive sheet are used to weld an IGBT chip and a diode chip, the first conductive sheet and the sixth conductive sheet are used to electrically connect a G-pole signal of the IGBT chip, and the third conductive sheet and the fourth conductive sheet are used to electrically connect an E-pole signal of the IGBT chip; a first conductive strip and a second conductive strip are sequentially arranged at intervals on the left side and the left half of the front side of the first conductive unit, a third conductive strip bent and connected to the third conductive strip is arranged on the right side and the right half of the front side of the first conductive unit, a fourth conductive strip bent and connected to the sixth conductive strip is arranged on the left side of the second conductive unit, the first conductive strip is opposite to the edge area of the fourth conductive sheet close to the left side, and the second conductive strip is opposite to the fourth conductive strip.
[0008] Compared with the prior art, the utility model arranges the first to sixth conductive sheets in sequence along the front-to-back direction, and then leads the signals of the third conductive sheet, the fourth conductive sheet and the sixth conductive sheet to the position adjacent to the signal conductive unit through the first conductive strip to the fourth conductive strip, which not only makes the layout of each conductive sheet more concise, but also effectively reduces the number of bridge components for leading out signals between the first conductive unit and the second conductive unit and the bridging distance of the bridge components, so that the structure of the manufactured IGBT module is more stable, not prone to short circuit, and has a high yield rate.
[0009] Preferably, the signal conductive unit includes a first signal conductive sheet welded to the first G-pole signal terminal, a second signal conductive sheet welded to the first E-pole signal terminal, a third signal conductive sheet welded to the second E-pole signal terminal, and a fourth signal conductive sheet welded to the second G-pole signal terminal, which are arranged in sequence from left to right. The second conductive strip is extended along the front-to-back direction to form a first signal welding portion at a location opposite to the first signal conductive sheet, and the first conductive strip is extended along the front-to-back direction to form a second signal welding portion at a location opposite to the second signal conductive sheet. The third signal conductive sheet and the fourth signal conductive sheet are opposite to the right half of the first conductive unit. The extended first signal welding portion and the second signal welding portion can effectively prevent the short circuit problem caused by the overflow of solder during the welding of the bridge, and make the signal transmission between the corresponding signal welding portion and the signal conductive sheet stable. The signal conductive sheet is opposite to the corresponding signal welding portion or the right half of the first conductive unit, which also makes the signal of the signal conductive sheet and the corresponding area of the IGBT more stable.
[0010] Specifically, the first signal welding part is formed by the second conductive strip extending backward, the second signal welding part is formed by the first conductive strip extending forward, the first conductive sheet is rectangular and the front side of the first conductive sheet is provided with a gap for the first conductive strip to pass through and avoid the second signal welding part, the third conductive strip includes a transition strip located on the right side of the first conductive unit and a welding strip located on the front side of the first conductive unit, the width of the welding strip is equal to the width of the first signal welding part and is greater than the width of the transition strip, and the first signal welding part, the second signal welding part and the third conductive strip are located opposite to the welding strip in the front and rear directions. This solution has high space utilization, reasonable layout, easy pasting and positioning of each conductive sheet and conductive strip, and makes the width of the welding strip sufficient to weld the bridge and prevent solder from overflowing the short-circuit conductive sheet.
[0011] Specifically, the wiring structure of the IGBT power module also includes signal connectors arranged along the front-to-back direction, the signal connectors including a first signal connector electrically connected between the first signal conductive sheet and the first signal welding portion, a second signal connector electrically connected between the second signal conductive sheet and the second signal welding portion, a third signal connector electrically connected between the third signal conductive sheet and a portion of the third conductive strip located on the front side of the first conductive unit, and a fourth signal connector electrically connected between the fourth signal conductive sheet and the first conductive sheet.
[0012] Wherein, the signal connection component is a CLIP component, a gold wire or a metal sheet, and the metal sheet is a copper sheet.
[0013] Preferably, the second conductive sheet, the third conductive sheet, the fourth conductive sheet, the fifth conductive sheet and the sixth conductive sheet are rectangular, and the first conductive sheet is rectangular or has a gap on the front side to avoid air. This solution makes the wiring structure of the utility model very regular, makes the process simpler, has a high yield rate, and has stable signal transmission. Moreover, the rectangular conductive sheet also allows more groups of IGBT units to be arranged thereon, for example, eight groups of IGBT units.
[0014] Preferably, the wiring structure of the IGBT power module further includes a first DBC board, a second DBC board and a third DBC board arranged at intervals along the front-to-back direction, the first DBC board includes a first heat sink and the signal conductive unit laid on the first heat sink, the second DBC board includes a second heat sink, the first conductive unit laid on the second heat sink, a first conductive strip, a second conductive strip and a third conductive strip, the third DBC board includes a third heat sink, the second conductive unit laid on the third heat sink and a fourth conductive strip, the first conductive strip and the fourth conductive strip are spaced opposite to each other at an edge region near the left side of the fourth conductive sheet, and the second conductive strip and the fourth conductive strip are spaced opposite to each other. Three DBC boards can be made first, and then the three DBC boards are pasted on the substrate, so that the process is easier to implement. Of course, the first conductive unit and the second conductive unit can also be arranged on a DBC board, and then the first conductive strip and the edge region near the left side of the fourth conductive sheet are connected by wiring (that is, the first conductive strip and the fourth conductive sheet are connected as a conductive member), and the second conductive strip and the fourth conductive strip are connected by wiring (that is, the second conductive strip and the fourth conductive strip are connected as a conductive strip).
[0015] Preferably, the wiring structure of the IGBT power module also includes a connecting bridge arranged in the front-to-back direction, the first conductive strip and the fourth conductive sheet are spaced opposite to each other in the edge area close to the left side, the second conductive strip and the fourth conductive sheet are spaced opposite to each other, and the connecting bridge includes a first connecting bridge electrically connected between the first conductive strip and the fourth conductive sheet, and a second connecting bridge electrically connected between the second conductive strip and the fourth conductive sheet, so that the bridging distance between the first connecting bridge and the second connecting bridge is short and does not pass through other conductive sheets to prevent short circuit during welding.
[0016] The connecting bridge is a CLIP piece, a metal sheet or a gold wire, etc., and the cross section of the gold wire is rectangular, circular or elliptical, etc.
[0017] Preferably, a first power welding area for welding the first power terminal is formed on the second conductive sheet, a second power welding area for welding the second power terminal is formed on the fourth conductive sheet, and a third power welding area for welding the third power terminal is formed on the fifth conductive sheet.
[0018] The utility model also discloses an IGBT power module, comprising the above-mentioned wiring structure, IGBT chip, diode chip and electrical connection structure, one or more IGBT chips and multiple diode chips are respectively installed on each of the second conductive sheet and the fifth conductive sheet along the left and right directions, each IGBT chip and a diode chip are in a group and arranged along the front and back directions, and the electrical connection structure electrically connects the electrodes of the IGBT chip and diode chip and the wiring structure together.
[0019] Preferably, the electrical connection structure includes a first CLIP component and a second CLIP component, the C pole of the same group of IGBT chips and the negative electrode of the diode chip are welded to the second conductive sheet or the fifth conductive sheet along the front-to-back direction, each of the first CLIP components is welded to the E pole of the IGBT chip, the positive electrode of the diode chip and the corresponding third conductive sheet or fourth conductive sheet at the same time, and each of the second CLIP components is welded to the G pole of the IGBT chip and the corresponding first conductive sheet or sixth conductive sheet at the same time. The first CLIP component welds the IGBT chip, the diode chip and the conductive sheet along the front-to-back direction, which is easy to position.
[0020] Specifically, the first CLIP piece is formed by bending a rectangular sheet, and includes a root welding portion welded on the third conductive sheet or the fourth conductive sheet, a main welding portion longitudinally arranged along the front-to-back direction and welded on the E pole of the IGBT chip and the positive electrode of the diode chip, and an elastic connection portion connected between the root welding portion and the main welding portion, the elastic connection portion is bent upward relative to the root welding portion and the main welding portion to form one or more first elastic folds, the main welding portion forms a first welding area welded to the E electrode of the IGBT chip and in a straight shape and a second welding area welded to the positive electrode of the diode chip and in a straight shape along the front-to-back direction, the thickness of the IGBT chip is less than the thickness of the diode chip, and the first welding area is away from the root welding portion relative to the second welding area; the first elastic fold and the second elastic fold can be elastically stretched in the first direction. In the utility model, when the height required for welding in the first welding area is lower than the height required for welding in the second welding area, the first elastic fold can make the main welding portion tilt more with respect to the root welding portion, so as to prevent the sinking of the first welding area from affecting the stability of the root welding portion.
[0021] More preferably, the main welding portion further comprises one or more upwardly arched second elastic folds located between the first welding area and the second welding area, or the main welding portion is a rectangular flat sheet. The second elastic folds can reduce the mutual interference between the first welding area and the second welding area, and adjust the welding height of the first welding area and the second welding area when there is a deviation in the height of the first welding area and the second welding area. The main welding portion is a rectangular flat sheet, which makes the main welding portion simple in structure, low in cost and easy to grasp.
[0022] Preferably, the second CLIP component includes a rectangular positioning piece, a first welding foot formed by bending downward and extending from a side of the positioning piece away from the IGBT chip, and two second welding feet formed by bending downward and extending from two opposite corners of the positioning piece on a side adjacent to the IGBT chip, the two second welding feet are respectively welded to the G poles of two adjacent IGBT chips, and the first welding foot is welded to the corresponding first conductive sheet or the sixth conductive sheet.
[0023] Compared with the prior art, the utility model arranges the first to sixth conductive sheets in sequence, and then leads the signals of the third conductive sheet, the fourth conductive sheet and the sixth conductive sheet to the position adjacent to the signal conductive unit through the first to fourth conductive strips, which not only makes the layout of each conductive sheet more concise, but also effectively reduces the number of bridge components for leading out signals between the first conductive unit and the second conductive unit and the bridging distance of the bridge components, so that the structure of the manufactured IGBT module is more stable, not prone to short circuit, and has a high yield rate. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a stereoscopic diagram of the IGBT power module of the utility model after the signal terminal and the power terminal are installed.
[0025] Figure 2 It is a stereoscopic diagram of the wiring structure in the IGBT power module of the utility model.
[0026] Figure 3 It is a three-dimensional diagram of the second DBC plate (first conductive unit) of the utility model.
[0027] Figure 4 It is a three-dimensional diagram of the third DBC plate (second conductive unit) of the present invention.
[0028] Figure 5 It is a stereoscopic diagram of the IGBT power module of the utility model without installing the signal terminal and the power terminal.
[0029] Figure 6 yes Figure 5 Enlarged view of part a. DETAILED DESCRIPTION
[0030] In order to explain the technical content, structural features, achieved objectives and effects of the present invention in detail, the following is a detailed description in conjunction with the implementation modes and the accompanying drawings.
[0031] refer to Figure 1 and Figure 5 The utility model discloses an IGBT power module 100, the IGBT power module 100 includes a wiring structure 200 (such as Figure 2 As shown), the IGBT chip 301, the diode chip 302 and the electrical connection structure are welded on the wiring structure 200.
[0032] refer to Figure 2 The wiring structure 200 includes a substrate 10 and a signal conductive unit, a first conductive unit and a second conductive unit sequentially arranged on the substrate 10 from front to back. The first conductive unit includes a first conductive sheet 21, a second conductive sheet 22 and a third conductive sheet 23 sequentially arranged from front to back, and the second conductive unit includes a fourth conductive sheet 24, a fifth conductive sheet 25 and a sixth conductive sheet 26 sequentially arranged from front to back. Specifically, refer to Figure 1 , the signal conductive unit is used to electrically connect the signal terminal. Figure 5, the second conductive sheet 22 and the fifth conductive sheet 25 are used to weld the IGBT chip 301 and the diode chip 302. The first conductive sheet 21 and the sixth conductive sheet 26 are used to electrically connect the G-pole signal of the IGBT chip 301, and the third conductive sheet 23 and the fourth conductive sheet 24 are used to electrically connect the E-pole signal of the IGBT chip 301. The electrical connection structure conducts the G-pole signal of the IGBT chip 301 to the first conductive sheet 21 and the sixth conductive sheet 26, and conducts the E-pole signal of the IGBT chip 301 to the third conductive sheet 23 and the fourth conductive sheet 24.
[0033] refer to Figure 2 and Figure 3 , the left side and the left half of the front side of the first conductive unit are sequentially and spaced outwardly with a first conductive strip 31 and a second conductive strip 32, wherein the first conductive strip 31 continuously surrounds the left side and the left half of the front side of the first conductive unit, the first conductive strip 31 is opposite to the edge area of the fourth conductive sheet 24 close to the left side, and the second conductive strip 32 continuously surrounds the outside of the first conductive strip 31. The first conductive strip 31 and the second conductive strip 32 are used to lead the relevant signals in the second conductive unit to the front side of the first conductive unit, so as to facilitate the electrical connection of the signal conductive unit. The first conductive strip 31 and the second conductive strip 32 are L-shaped or approximately L-shaped.
[0034] refer to Figure 2 and Figure 3 The third conductive strip 33 is provided on the right side and the right half of the front side of the first conductive unit, and is bent and connected to the third conductive sheet 23. The third conductive strip 33 surrounds the right side and the right half of the front side of the first conductive unit, and the front end of the third conductive strip 33 is directly bent and connected to the third conductive sheet 23. The third conductive strip 33 is convenient for electrically connecting the signal conductive unit in order to lead the electrical signal of the third conductive sheet 23 to the front side of the first conductive unit. The third conductive strip 33 is L-shaped or approximately L-shaped.
[0035] refer to Figure 2 and Figure 4 A fourth conductive strip 34 is provided on the left side of the second conductive unit and is bent and connected to the sixth conductive strip 26. The second conductive strip 32 is opposite to the fourth conductive strip 34, so that the electrical signal of the sixth conductive strip 26 can be guided to a position close to the second conductive strip 32, so that the second conductive strip 32 can lead it to the front side of the first conductive unit.
[0036] The second conductive sheet 22 , the third conductive sheet 23 , the fourth conductive sheet 24 , the fifth conductive sheet 25 and the sixth conductive sheet 26 are rectangular, and the first conductive sheet 21 is rectangular or has a gap 211 on the front side.
[0037] The better, reference Figures 2 to 4The wiring structure 200 further includes a first DBC board 203, a second DBC board 201, and a third DBC board 202 arranged at intervals along the front-to-back direction. The first DBC board 203 includes a first heat dissipation board 2031 and the signal conductive unit laid on the first heat dissipation board 2031. The second DBC board 201 includes a second heat dissipation board 2011, the first conductive unit laid on the second heat dissipation board 2011, a first conductive strip 31, a second conductive strip 32, and a third conductive strip 33. The third DBC board 202 includes a third heat dissipation board 2021, the second conductive unit laid on the third heat dissipation board 2021, and a fourth conductive strip 34. The first conductive strip 31 is spaced opposite to the edge area of the fourth conductive sheet 24 near the left side, and the second conductive strip 32 is spaced opposite to the fourth conductive strip 34. Of course, the first DBC board 203, the second DBC board 201, and the third DBC board 202 can also be replaced by other heat dissipation conductive boards, not limited to DBC boards.
[0038] The wiring structure 200 of the IGBT power module further includes a connecting bridge arranged in the front-to-back direction, the first conductive strip 31 and the edge area of the fourth conductive sheet 24 close to the left side are spaced opposite to each other, the second conductive strip 32 and the fourth conductive strip 34 are spaced opposite to each other, and the connecting bridge includes a first connecting bridge 41 electrically connected between the first conductive strip 31 and the fourth conductive sheet 24, and a second connecting bridge 42 electrically connected between the second conductive strip 32 and the fourth conductive strip 34, so that the bridging distance between the first connecting bridge 41 and the second connecting bridge 42 is short, and does not pass through other conductive sheets, so as to prevent short circuit during welding. The connecting bridge (the first connecting bridge 41 and the second connecting bridge 42) is a gold wire, and the cross section of the gold wire is circular. Of course, the cross section of the gold wire can also be rectangular or elliptical, etc. In this area, the connecting bridge can also be a copper sheet or a CLIP piece.
[0039] refer to Figure 5 and Figure 6, the electrical connection structure includes a first CLIP component 51 and a second CLIP component 52. Four IGBT chips 301 and four diode chips 302 are mounted on the second conductive sheet 22. Each IGBT chip 301 and one diode chip 302 are in a group and are welded on the second conductive sheet 22 along the front-to-back direction, so that the C pole of the IGBT chip 301 and the negative electrode of the diode chip 302 are electrically connected to the second conductive sheet 22. The first CLIP component electrically connects the E pole of the IGBT chip 301 on the second conductive sheet 22, the positive electrode of the diode chip 302 and the third conductive sheet 23, so that the E pole signal of the IGBT chip 301 on the second conductive sheet 22 is transmitted to the third conductive sheet 23. Among them, one first conductive unit corresponds to four first CLIP components 51 and two second CLIP components 52. One end of a second CLIP component 52 is welded to the first conductive sheet 21 , and the other end is welded to the G poles of the two IGBT chips 301 , so that one second CLIP component 52 corresponds to two IGBT chips 301 .
[0040] refer to Figure 5 and Figure 6 The first CLIP piece 51 is formed by bending a rectangular sheet and includes a root welding portion 511 welded on the third conductive sheet 23 or the fourth conductive sheet 24, a main welding portion 512 longitudinally arranged in the front-to-back direction and welded on the E pole of the IGBT chip 301 and the positive electrode of the diode chip 302, and an elastic connecting portion connected between the root welding portion 511 and the main welding portion 512, wherein the elastic connecting portion is bent upward relative to the root welding portion 511 and the main welding portion 512 to form one or more first elastic folds 513, and the main welding portion 512 sequentially forms, from front to back, a first welding area 5122 welded to the E pole of the IGBT chip 301 and in a straight shape, and a second welding area 5121 welded to the electrode of the diode chip 302 and in a straight shape.
[0041] The center of gravity of the first CLIP part 51 is located at the second welding area 5121, so that the upper surface of the second welding area 5121 forms a gripping and positioning area, which is convenient for gripping and positioning the first CLIP part during welding. In this embodiment, the length ratio of the main welding part 512 to the first CLIP part 51 in the front-to-back direction is greater than or equal to three quarters, and the length ratio of the main welding part 512 to the elastic connecting part in the front-to-back direction is greater than or equal to five.
[0042] Among them, the first welding area 5122 and the second welding area 5121 are at the same height. The main welding part 512 further includes one or more upwardly arched second elastic folds 5123 located between the first welding area 5122 and the second welding area 5121. Of course, differently, the main welding part 512 may also be a rectangular flat sheet.
[0043] Preferably, the first elastic fold 513 is in a bow shape, a "匚" shape, a V shape, a U shape, etc., and the second elastic fold 5123 is in a bow shape, a "匚" shape, a V shape, a U shape, etc. In this embodiment, there is only one first elastic fold 513 and one second elastic fold 5123, and both are in a "匚" shape.
[0044] Among them, the first elastic fold 513 can have a certain amount of expansion and contraction in the front-rear direction to increase the free movement range in the up-down direction of the first welding area 5122 and the second welding area 5121. The second elastic fold 5123 can have a certain amount of expansion and contraction in the front-rear direction to increase the free movement range in the up-down direction of the first welding area 5122.
[0045] Reference Figure 5 and Figure 6 , the second CLIP part 52 includes a rectangular positioning piece 521, a first welding leg 522 formed by bending and extending downward from the side of the positioning piece 521 away from the IGBT chip 301, and two second welding legs 523 formed by bending and extending downward from two opposite corners of the side of the positioning piece 521 adjacent to the IGBT chip 301. The two second welding legs 523 are respectively welded to the G poles of two adjacent IGBT chips, and the first welding leg 522 is welded to the first conductive sheet 21 or the sixth conductive sheet 26.
[0046] Continue to refer to Figure 5 , 4 IGBT chips 301 and 4 diode chips 302 are installed on the fifth conductive sheet 25. Each IGBT chip 301 and a diode chip 302 form a group and are welded to the fifth conductive sheet 25 in the front-rear direction, and the C pole of the IGBT chip 301 and the negative electrode of the diode chip 302 are electrically connected to the fifth conductive sheet 25. A first CLIP part electrically connects the E pole of the IGBT chip 301, the positive electrode of the diode chip 302, and the sixth conductive sheet 26 on the fifth conductive sheet 25, so that the E pole signal of the IGBT chip 301 on the fifth conductive sheet 25 is transmitted to the sixth conductive sheet 26. Among them, one second conductive unit corresponds to four first CLIP parts 51 and two second CLIP parts 52. One end of a second CLIP part 52 is welded to the sixth conductive sheet 26, and the other end is respectively welded to the G poles of two IGBT chips 301, so that one second CLIP part 52 corresponds to two IGBT chips 301.
[0047] Of course, different from this embodiment, the number of IGBT chips 301 and diode chips 302 mounted on the second conductive sheet 22 and the fifth conductive sheet 25 is not limited to 4, and may be 1, 2, 3, etc. When a plurality of IGBT chips 301 and a plurality of diode chips 302 are mounted on each of the second conductive sheet 22 and the fifth conductive sheet 25, the plurality of IGBT chips 301 and the plurality of diode chips 302 are arranged at intervals in the left-right direction.
[0048] refer to Figure 1 and Figure 2 The signal conductive unit includes a first signal conductive sheet 35 which is arranged in sequence from left to right and welded to the first G-pole signal terminal 101, a second signal conductive sheet 36 which is welded to the first E-pole signal terminal 102, a third signal conductive sheet 37 which is welded to the second E-pole signal terminal 103, and a fourth signal conductive sheet 38 which is welded to the second G-pole signal terminal 104. The second conductive strip 32 is extended along the front-to-back direction to form a first signal welding portion 321 at a position opposite to the first signal conductive sheet 35. The first conductive strip 31 is extended along the front-to-back direction to form a second signal welding portion 311 at a position opposite to the second signal conductive sheet 36. The third signal conductive sheet 37 and the fourth signal conductive sheet 38 are opposite to the right half of the first conductive unit.
[0049] The first signal welding portion 321 is formed by the second conductive strip 32 extending backward, and the second signal welding portion 311 is formed by the first conductive strip 31 extending forward. Different from this, the first signal welding portion 321 can also be formed by the second conductive strip 32 extending backward. Different from this, the second signal welding portion 311 is formed by the first conductive strip 31 extending backward.
[0050] refer to Figure 1 The second conductive sheet 22 is formed with a first power supply welding area for welding the first power supply terminal 105 (see Figure 5 The fourth conductive sheet 24 is formed with a second power supply welding area (see the shaded portion on the second conductive sheet 22 in FIG. 1 ) for welding the second power supply terminal 106. Figure 5 The fifth conductive sheet 25 is formed with a third power supply welding area 107 (see FIG. 1 ) for welding a third power supply terminal. Figure 5 The shaded portion on the fifth conductive sheet 25 in FIG. 1 is a diagram showing a portion of the conductive sheet 25 in FIG. 1 . The shaded portion on the signal conductive unit is a welding area of the first G pole signal terminal 101, the first E pole signal terminal 102, the second E pole signal terminal 103, and the second G pole signal terminal 104. The first conductive sheet 24 is wider than the third conductive sheet 23.
[0051] Continue to refer Figure 2The first conductive sheet 21 is rectangular and a gap 211 is provided on the front side of the first conductive sheet 21 for the first conductive strip 31 to pass through and avoid the second signal welding portion 311. The third conductive strip 33 includes a transition strip located on the right side of the first conductive unit and a welding strip 331 located on the front side of the first conductive unit. The width of the welding strip 331 is equal to the width of the first signal welding portion 321 and is greater than the width of the transition strip 332. The first signal welding portion 321, the second signal welding portion 311 and the third conductive strip 33 are located opposite to the welding strip 331 in the front-to-back direction.
[0052] Continue to refer Figure 2 The wiring structure 200 also includes signal connectors arranged along the front-to-back direction, the signal connectors include a first signal connector 43 electrically connected between the first signal conductive sheet 35 and the first signal welding portion 321, a second signal connector 44 electrically connected between the second signal conductive sheet 36 and the second signal welding portion 311, a third signal connector 45 electrically connected between the third signal conductive sheet 37 and the portion of the third conductive strip 33 located on the front side of the first conductive unit, and a fourth signal connector 46 electrically connected between the fourth signal conductive sheet 38 and the first conductive sheet 21, the signal connectors are CLIP pieces or gold wires. In this embodiment, the first signal connector 43, the second signal connector 44 and the third signal connector 45 are metal straight strips, which are thin copper strips. The fourth signal connector 46 is a CLIP piece.
[0053] The conductive sheet in this embodiment is a copper sheet, and the CLIP piece is a copper piece. Of course, the conductive sheet and the CLIP piece can also be conductive pieces made of other materials.
[0054] It should be noted that the front, back, left and right mentioned in the present invention are not absolute up, down, left and right, but relative position relationships. The up direction and the down direction are two opposite directions, the left direction and the right direction are two opposite directions, and the up and down directions and the left and right directions are directions perpendicular to each other.
[0055] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.
Claims
1. A wiring structure of an IGBT power module, characterized in that: The invention comprises a substrate and a signal conductive unit, a first conductive unit and a second conductive unit which are sequentially laid on the substrate from front to back, wherein the first conductive unit comprises a first conductive sheet, a second conductive sheet and a third conductive sheet which are sequentially arranged from front to back, and the second conductive unit comprises a fourth conductive sheet, a fifth conductive sheet and a sixth conductive sheet which are sequentially arranged from front to back, the signal conductive unit is used to electrically connect a signal terminal, the second conductive sheet and the fifth conductive sheet are used to weld an IGBT chip and a diode chip, the first conductive sheet and the sixth conductive sheet are used to electrically connect a G-pole signal of the IGBT chip, and the third conductive sheet and the fourth conductive sheet are used to electrically connect an E-pole signal of the IGBT chip; a first conductive strip and a second conductive strip are sequentially arranged at intervals on the left side and the left half of the front side of the first conductive unit, a third conductive strip which is bent and connected to the third conductive sheet is arranged on the right side and the right half of the front side of the first conductive unit, a fourth conductive strip which is bent and connected to the sixth conductive sheet is arranged on the left side of the second conductive unit, the first conductive strip is opposite to the edge area of the fourth conductive sheet close to the left side, and the second conductive strip is opposite to the fourth conductive strip.
2. The wiring structure of the IGBT power module according to claim 1, characterized in that: The signal conductive unit includes a first signal conductive plate welded to a first G-pole signal terminal, a second signal conductive plate welded to a first E-pole signal terminal, a third signal conductive plate welded to a second E-pole signal terminal, and a fourth signal conductive plate welded to a second G-pole signal terminal, which are arranged in sequence from left to right. The second conductive strip is extended along the front-to-back direction to form a first signal welding portion at a position opposite to the first signal conductive plate. The first conductive strip is extended along the front-to-back direction to form a second signal welding portion at a position opposite to the second signal conductive plate. The third signal conductive plate and the fourth signal conductive plate are opposite to the right half of the first conductive unit.
3. The wiring structure of the IGBT power module according to claim 2, characterized in that: The first signal welding portion is formed by extending the second conductive strip backward, and the second signal welding portion is formed by extending the first conductive strip forward. The first conductive sheet is rectangular and a gap is provided on the front side of the first conductive sheet for the first conductive strip to pass through and avoid the second signal welding portion. The third conductive strip includes a transition strip located on the right side of the first conductive unit and a welding strip located on the front side of the first conductive unit. The width of the welding strip is equal to the width of the first signal welding portion and is greater than the width of the transition strip. The first signal welding portion, the second signal welding portion and the third conductive strip are located opposite to each other in the front-to-back direction of the welding strip.
4. The wiring structure of the IGBT power module according to claim 2, characterized in that: It also includes signal connectors arranged along the front-to-back direction, the signal connectors including a first signal connector electrically connected between the first signal conductive sheet and the first signal welding portion, a second signal connector electrically connected between the second signal conductive sheet and the second signal welding portion, a third signal connector electrically connected between the third signal conductive sheet and a portion of the third conductive strip located on the front side of the first conductive unit, and a fourth signal connector electrically connected between the fourth signal conductive sheet and the first conductive sheet.
5. The wiring structure of the IGBT power module according to claim 4, characterized in that: The signal connection component is a CLIP component, a gold wire or a metal sheet.
6. The wiring structure of the IGBT power module according to claim 1, characterized in that: The second conductive sheet, the third conductive sheet, the fourth conductive sheet, the fifth conductive sheet and the sixth conductive sheet are rectangular, and the first conductive sheet is rectangular or has a gap on the front side to avoid air flow.
7. The wiring structure of the IGBT power module according to claim 1, characterized in that: It also includes a first DBC board, a second DBC board and a third DBC board arranged at intervals along the front-to-back direction, the first DBC board includes a first heat dissipation plate and the signal conductive unit laid on the first heat dissipation plate, the second DBC board includes a second heat dissipation plate, the first conductive unit laid on the second heat dissipation plate, a first conductive strip, a second conductive strip and a third conductive strip, the third DBC board includes a third heat dissipation plate, the second conductive unit laid on the third heat dissipation plate and a fourth conductive strip, the first conductive strip is spaced opposite to the edge area of the fourth conductive sheet close to the left side, and the second conductive strip is spaced opposite to the fourth conductive strip.
8. The wiring structure of the IGBT power module according to claim 1, characterized in that: It also includes a connecting bridge arranged in the front-to-back direction, the first conductive strip and the edge area of the fourth conductive sheet close to the left side are spaced opposite to each other, the second conductive strip and the fourth conductive strip are spaced opposite to each other, and the connecting bridge includes a first connecting bridge electrically connected between the first conductive strip and the fourth conductive sheet, and a second connecting bridge electrically connected between the second conductive strip and the fourth conductive strip.
9. The wiring structure of the IGBT power module according to claim 8, characterized in that: The connecting bridge is a CLIP piece, a metal sheet or a gold wire, and the cross section of the gold wire is rectangular, circular or elliptical.
10. The wiring structure of the IGBT power module according to claim 1, characterized in that: A first power welding area for welding the first power terminal is formed on the second conductive sheet, a second power welding area for welding the second power terminal is formed on the fourth conductive sheet, and a third power welding area for welding the third power terminal is formed on the fifth conductive sheet.
11. An IGBT power module, characterized in that: It includes a wiring structure, an IGBT chip, a diode chip and an electrical connection structure as described in any one of claims 1 to 10, one or more IGBT chips and a plurality of diode chips are respectively installed on each of the second conductive sheet and the fifth conductive sheet along the left-right direction, each IGBT chip and a diode chip are in a group and arranged along the front-to-back direction, and the electrical connection structure electrically connects the electrodes of the IGBT chip and the diode chip and the wiring structure together.
12. The IGBT power module according to claim 11, characterized in that: The electrical connection structure includes a first CLIP component and a second CLIP component. The C pole of the IGBT chip and the negative electrode of the diode chip of the same group are welded to the second conductive sheet or the fifth conductive sheet along the front-to-back direction. Each of the first CLIP components is simultaneously welded to the E pole of the IGBT chip, the positive electrode of the diode chip and the corresponding third conductive sheet or fourth conductive sheet. Each of the second CLIP components is simultaneously welded to the G pole of the IGBT chip and the corresponding first conductive sheet or sixth conductive sheet.
13. The IGBT power module according to claim 12, characterized in that: The first CLIP piece is formed by bending a rectangular sheet, and comprises a root welding portion welded on the third conductive sheet or the fourth conductive sheet, a main welding portion longitudinally arranged along the front-to-back direction and welded on the E pole of the IGBT chip and the positive electrode of the diode chip, and an elastic connection portion connected between the root welding portion and the main welding portion, the elastic connection portion is bent upward relative to the root welding portion and the main welding portion to form one or more first elastic folds, the main welding portion forms a first welding area welded to the E pole of the IGBT chip and in a straight shape and a second welding area welded to the positive electrode of the diode chip and in a straight shape along the front-to-back direction, the thickness of the IGBT chip is less than the thickness of the diode chip, and the first welding area is away from the root welding portion relative to the second welding area; The main welding portion further comprises one or more upwardly arched second elastic folds located between the first welding area and the second welding area, or the main welding portion is a rectangular flat sheet; The first elastic gathers and the second elastic gathers are elastically expandable and contractible in a first direction.
14. The IGBT power module according to claim 12, characterized in that: The second CLIP component includes a rectangular positioning piece, a first welding foot formed by bending downward and extending from a side of the positioning piece away from the IGBT chip, and two second welding feet formed by bending downward and extending from two opposite corners of the positioning piece on a side adjacent to the IGBT chip, the two second welding feet are respectively welded to the G poles of two adjacent IGBT chips, and the first welding foot is welded to the corresponding first conductive sheet or the sixth conductive sheet.
