Laminated flexible circuit board
CN222216037UActive Publication Date: 2024-12-20LIANJUE ELECTRONIC TECH CO LTD
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Patent Information
- Application Number
- CN202420574993.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-03-22
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Figure CN222216037U_ABST
Abstract
The utility model relates to the technical field of circuit boards, in particular to a laminated flexible circuit board, which comprises a circuit board base material, a bottom plate is fixedly mounted at the bottom of the circuit board base material, a polyimide film is arranged on the surface of the top of the circuit board base material, a copper foil layer is arranged on the top of the polyimide film, and the copper foil layer is arranged on the surface of the circuit board base material. A protection mechanism is arranged above the circuit board base material, and through the arrangement of the laminated flexible circuit board, by means of the structural design in the protection mechanism, fit contact between limiting holes and limiting columns is achieved, so that a protection plate extrudes a supporting spring and enables the supporting spring to generate elastic potential energy, and therefore the supporting spring is prevented from being damaged. The elastic potential energy can weaken the impact force borne by the circuit board base material, so that the circuit board is conveniently protected, and the subsequent use of the circuit board is facilitated.
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