Base assembly, process chamber and semiconductor process equipment
By designing a semiconductor process equipment with a base assembly and a lifting shaft with a bearing portion and a barrier groove, the problems of uneven temperature distribution and edge bias of the wafer are solved, and uniform heating and stable position of the wafer are achieved, which meets the thickness of the process and flatness requirements.
CN222226549UActive Publication Date: 2024-12-24BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information
- Application Number
- CN202420085168.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-12
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-01-12
Smart Images
Figure CN222226549U_ABST
Abstract
The utility model discloses a base assembly, a process chamber and semiconductor process equipment, and belongs to the technical field of semiconductor processing. The base assembly comprises a base body, an annular base edge part and a lifting shaft; the base body comprises a main body part, a bearing part protruding out of the main body part and an avoiding groove sunken downwards relative to the upper surface of the bearing part, the bearing part is used for bearing a wafer, and the avoiding groove is used for avoiding a mechanical arm when the mechanical arm is used for placing the wafer; the base edge part is arranged around the base body, the base edge part and the base body are coaxially arranged, and the base edge part can ascend and descend relative to the base body; the lifting shaft is connected with the base edge part and used for driving the base edge part to ascend and descend relative to the base body. According to the scheme, the problems that the wafer temperature distribution is not uniform and the wafer is easy to deviate in the prior art can be solved.
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