Electrostatic wafer cassette

Abstract

The utility model provides an electrostatic wafer cassette, which relates to the technical field of wafer cassettes, and comprises a first cover body and a second cover body, the first cover body is provided with a wafer placing groove used for bearing wafers, the second cover body is detachably covered on the first cover body, the second cover body is provided with a first electrostatic column, and the first electrostatic column is provided with a second electrostatic column. The bottom end of the first electrostatic column penetrates through the second cover body and extends into the wafer placement groove, a first electrostatic ring is further arranged on the surface of the side, away from the first cover body, of the second cover body, the first electrostatic ring makes contact with the first electrostatic column, and the first electrostatic column and the first electrostatic ring are used for eliminating static electricity in the wafer placement groove. Compared with the prior art, by additionally arranging the first electrostatic column and the second electrostatic ring, static electricity in the wafer placing groove can be effectively eliminated, a transistor is prevented from being punctured by the processed wafer due to the static electricity, and the quality of the wafer is ensured.

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