Wide-temperature high-reliability MEMS optical switch

Abstract

The utility model relates to the technical field of optical switches, in particular to a wide-temperature high-reliability MEMS optical switch, which comprises a rotating mirror chip, a temperature adjusting unit, a ceramic gasket, a temperature sensitive resistor and an optical engine assembly, the optical engine assembly comprises a packaging tube seat and a packaging tube shell, the ceramic gasket is arranged on the packaging tube seat, the rotating mirror chip is arranged on the ceramic gasket, the temperature-sensitive resistor is arranged on the ceramic gasket, and the temperature-sensitive resistor is located on one side of the rotating mirror chip; the rotating mirror chip, the ceramic gasket and the temperature-sensitive resistor are packaged in the packaging tube shell; and the temperature adjusting unit is arranged on the packaging tube seat. The MEMS optical switch integrates the miniaturized temperature adjusting unit and the temperature-sensitive resistor, the temperature adjusting unit and the temperature-sensitive resistor are matched with the peripheral temperature control circuit, accurate control over the internal temperature of the MEMS optical switch is achieved, then the reliability hidden danger of water vapor condensation at the ultralow temperature is avoided, the large problem of optical transmission loss at the wide temperature of the optical switch is optimized and improved, and the reliability of the MEMS optical switch is improved. And the product performance and reliability are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical switches, in particular to a MEMS optical switch with wide temperature and high reliability. Background Art

[0002] Micro-Electromechanical System (MEMS) optical switches with one-dimensional or two-dimensional rotating mirror technology are commonly used devices in optical communication networks. The basic principle is to switch the optical path between different channels by applying voltage to the MEMS and controlling the rotation of the reflector on the MEMS. MEMS optical switches have the advantages of large ports (1xN, N>128), small size, low insertion loss, low crosstalk, fast switching time and low power consumption.

[0003] With the changes in client application scenarios, MEMS optical switch products need to be deployed in some special outdoor environments. MEMS optical switches need to work at -40-85℃ or even -55-85℃ for a long time. In this scenario, current MEMS optical switches will have functional failure or performance degradation problems, which are specifically manifested as:

[0004] 1. When working in an ultra-low temperature environment for a long time, the water vapor inside the transistor outline package (TO) of the MEMS optical switch will condense, affecting the rotation of the MEMS mirror and causing the switch to fail.

[0005] 2. When working under a wide temperature range, the stress on the rotating shaft of the MEMS mirror will change with the temperature, causing the angle of the MEMS mirror to change under the same voltage, and ultimately leading to changes in the loss of the MEMS optical switch, that is, the temperature-related loss increases.

[0006] Existing technologies usually deal with these problems by tightening production control, improving MEMS chip mounting stress (such as selecting low-stress glue or adding gaskets with special structures), stricter screening of devices during shipment, and multi-temperature point calibration, which are very difficult and costly to implement.

[0007] In view of this, how to overcome the defects of the prior art and solve the above-mentioned technical problems is a difficult problem to be solved in this technical field. Utility Model Content

[0008] The utility model aims to overcome the problem that a MEMS optical switch may fail in function or deteriorate in performance when operating under a wide temperature condition.

[0009] The utility model is achieved in this way:

[0010] The utility model provides a wide temperature range and high reliability MEMS optical switch, comprising: a rotating mirror chip 1, a temperature adjustment unit 2, a ceramic gasket 3, a temperature sensitive resistor 4 and an optical engine component 5;

[0011] The light engine assembly 5 includes a package tube seat 50 and a package tube shell 51, the ceramic gasket 3 is arranged on the package tube seat 50, the rotating mirror chip 1 is arranged on the ceramic gasket 3, the temperature-sensitive resistor 4 is arranged on the ceramic gasket 3, and the temperature-sensitive resistor 4 is located on one side of the rotating mirror chip 1; the rotating mirror chip 1, the ceramic gasket 3 and the temperature-sensitive resistor 4 are packaged in the package tube shell 51;

[0012] The temperature adjustment unit 2 is disposed on one side of the package tube holder 50 .

[0013] Preferably, the temperature adjustment unit 2 is a TEC unit;

[0014] The temperature regulating unit 2 is disposed on the packaging tube seat 50 , and the ceramic gasket 3 is disposed between the rotating mirror chip 1 and the temperature regulating unit 2 ; the temperature regulating unit 2 is packaged in the packaging tube shell 51 .

[0015] Preferably, the temperature regulating unit 2 is a thin film heating sheet;

[0016] The temperature regulating unit 2 is disposed at the outer bottom of the packaging tube seat 50 , the ceramic gasket 3 is disposed on the packaging tube seat 50 , the rotating mirror chip 1 is disposed on the ceramic gasket 3 , and the temperature regulating unit 2 is located outside the packaging tube shell 51 .

[0017] Preferably, the temperature adjustment unit 2 is provided with a first pin 20 and a second pin 21 , the first pin 20 is connected to the positive electrode of the temperature adjustment unit 2 , and the second pin 21 is connected to the negative electrode of the temperature adjustment unit 2 .

[0018] Preferably, the first pin 20 and the second pin 21 are electrically connected to the temperature adjustment unit 2 by gold wire bonding.

[0019] Preferably, the temperature-sensitive resistor 4 is provided with a third pin 40 and a fourth pin 41 , the third pin 40 is connected to the positive electrode of the temperature-sensitive resistor 4 , and the fourth pin 41 is connected to the negative electrode of the temperature-sensitive resistor 4 .

[0020] Preferably, the third pin 40 and the fourth pin 41 are electrically connected to the temperature-sensitive resistor 4 by gold wire bonding.

[0021] Preferably, the light engine assembly 5 further includes a lens 52 , which is disposed on one side of the rotating mirror chip 1 . The lens 52 is embedded in the packaging tube shell 51 and is used for collimating input light or focusing reflected light of the rotating mirror chip 1 .

[0022] Preferably, the optical engine assembly 5 further includes a glass tube 53 and a capillary 54 , wherein the glass tube 53 connects the lens 52 and the capillary 54 , and the capillary 54 is used to maintain the position of the optical fiber and guide the propagation of the optical signal.

[0023] Preferably, the rotating mirror chip 1 includes a fifth pin 10, a sixth pin 11 and a seventh pin 12, the fifth pin 10 is connected to the X-axis direction control electrode of the rotating mirror chip 1, the sixth pin 11 is connected to the Y-axis direction control electrode of the rotating mirror chip 1, and the seventh pin 12 is used to ground the rotating mirror chip 1 and the packaging tube shell 51;

[0024] The rotating mirror chip 1 is electrically connected to the fifth pin 10 , the sixth pin 11 and the seventh pin 12 by gold wire bonding.

[0025] Compared with the prior art, the beneficial effect of the utility model is that compared with the current traditional solutions, the MEMS optical switch integrates a miniaturized temperature adjustment unit 2 and a thermistor 4. By coordinating the temperature adjustment unit 2 and the thermistor 4 with the peripheral temperature control circuit, the internal temperature of the MEMS optical switch can be accurately controlled, thereby avoiding the reliability risk of water vapor condensation under ultra-low temperature, and optimizing and improving the major problem of optical transmission loss under a wide temperature range of the optical switch, thereby improving product performance and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 This is a schematic diagram of the overall structure of a wide temperature and high reliability MEMS optical switch provided in Example 2 of the utility model;

[0028] Figure 2 A schematic diagram of a temperature adjustment unit of a MEMS optical switch with wide temperature and high reliability provided in Example 2 of the utility model;

[0029] Figure 3 A pin diagram of a wide temperature and high reliability MEMS optical switch provided in Example 2 of the utility model;

[0030] Figure 4 This is a schematic diagram of a second solution of a wide temperature and high reliability MEMS optical switch provided in Example 3 of the utility model.

[0031] Wherein, the reference numerals are:

[0032] 1-rotating mirror chip, 10-fifth pin, 11-sixth pin, 12-seventh pin, 2-temperature adjustment unit, 20-first pin, 21-second pin, 3-ceramic gasket, 4-thermistor, 40-third pin, 41-fourth pin, 5-light engine assembly, 50-package tube seat, 51-package tube shell, 52-lens, 53-glass tube, 54-capillary. DETAILED DESCRIPTION

[0033] In the description of the present invention, the terms "inside", "outside", "longitudinal", "lateral", "upper", "lower", "top", "bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present invention.

[0034] The terms "first", "second", etc. in this utility model are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this utility model, unless otherwise specified, "plurality" means two or more.

[0035] In the present invention, unless otherwise specified or limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. In addition, the term "coupling" can be a way of achieving electrical connection for signal transmission.

[0036] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0037] Embodiment 1:

[0038] This embodiment provides a MEMS optical switch with high reliability over a wide temperature range. Figure 1 and Figure 4 As shown, it includes: a rotating mirror chip 1, a temperature adjustment unit 2, a ceramic gasket 3, a thermic resistor 4 and a light engine component 5; the light engine component 5 includes a packaging tube seat 50 and a packaging tube shell 51, the ceramic gasket 3 is arranged on the packaging tube seat 50, the rotating mirror chip 1 is arranged on the ceramic gasket 3, the thermic resistor 4 is arranged on the ceramic gasket 3, and the thermic resistor 4 is located on one side of the rotating mirror chip 1; the rotating mirror chip 1, the ceramic gasket 3 and the thermic resistor 4 are packaged in the packaging tube shell 51; the temperature adjustment unit 2 is arranged on one side of the packaging tube seat 50.

[0039] Wherein, the rotating mirror chip 1 is an electrostatic micro-electromechanical (MEMS) chip, which is made by MEMS processing technology. Usually, structures such as comb-shaped electrodes, cantilever beams, reflective micromirrors and pads are processed on silicon wafers. Driven by electrostatic force, the reflective micromirrors will rotate around the cantilever beams, thereby changing the transmission direction of light and finally realizing the routing selection of optical signals (realizing the function of optical switches). The temperature adjustment unit 2 is used to control the temperature of the optical device. When the temperature of the optical device is lower than the preset temperature, the temperature adjustment unit 2 generates heat to compensate the temperature of the optical device; or when the temperature of the optical device is higher than the preset temperature, the temperature adjustment unit 2 cools the optical device to ensure the stability and reliability of the optical device during operation. The ceramic gasket 3 is used to realize the electrical connection between the temperature adjustment unit 2 and the temperature-sensitive resistor 4 and the rotating mirror chip 1. The temperature-sensitive resistor 4 is used to collect the temperature data inside the optical device and transmit the temperature data signal to the externally connected temperature control circuit. After the temperature control circuit receives the temperature data signal, if the temperature data is not within the preset normal temperature range, it will issue a heating or cooling instruction to the temperature adjustment unit 2. Compared with the current traditional solutions, the MEMS optical switch integrates a miniaturized temperature adjustment unit 2 and a thermistor 4. By coordinating the temperature adjustment unit 2 and the thermistor 4 with the peripheral temperature control circuit, the internal temperature of the MEMS optical switch can be precisely controlled, thereby avoiding the reliability risks of water vapor condensation under ultra-low temperatures, and optimizing and improving the major problem of optical transmission loss under a wide temperature range of the optical switch, thereby improving product performance and reliability.

[0040] In order to complete the description of the complete solution of the utility model, the details of the above structures are further described below.

[0041] The temperature adjustment unit 2 is provided with a first pin 20 and a second pin 21, wherein the first pin 20 is connected to the positive electrode of the temperature adjustment unit 2, and the second pin 21 is connected to the negative electrode of the temperature adjustment unit 2. Specifically, the first pin 20 and the second pin 21 are electrically connected to the temperature adjustment unit 2 in a gold wire bonding manner.

[0042] The temperature-sensitive resistor 4 is provided with a third pin 40 and a fourth pin 41, wherein the third pin 40 is connected to the positive electrode of the temperature-sensitive resistor 4, and the fourth pin 41 is connected to the negative electrode of the temperature-sensitive resistor 4. Specifically, the third pin 40 and the fourth pin 41 are electrically connected to the temperature-sensitive resistor 4 in a gold wire bonding manner.

[0043] The optical engine assembly 5 further includes a lens 52, which is disposed on one side of the rotating mirror chip 1 and is embedded in the package tube shell 51, and is used to collimate the input light or focus the reflected light of the rotating mirror chip (1). In addition, the optical engine assembly 5 further includes a glass tube 53 and a capillary 54, wherein the glass tube 53 connects the lens 52 and the capillary 54, and the capillary 54 is used to maintain the position of the optical fiber and guide the propagation of the optical signal.

[0044] The rotating mirror chip 1 includes a fifth pin 10, a sixth pin 11 and a seventh pin 12, the fifth pin 10 is connected to the X-axis direction control electrode of the rotating mirror chip 1, the sixth pin 11 is connected to the Y-axis direction control electrode of the rotating mirror chip 1, and the seventh pin 12 is used to ground the rotating mirror chip 1 and the packaging tube shell 51; the rotating mirror chip 1 is electrically connected to the fifth pin 10, the sixth pin 11 and the seventh pin 12 by gold wire bonding.

[0045] In this embodiment, the temperature adjustment unit 2 is a TEC unit or a thin film heating plate. These two types of temperature adjustment units 2 will be described in detail in Embodiment 2 and Embodiment 3 below.

[0046] Embodiment 2:

[0047] Embodiment 2 of the present utility model provides a wide temperature and high reliability MEMS optical switch in which the temperature adjustment unit 2 is a TEC unit on the basis of embodiment 1. Figure 1 As shown, it includes: a rotating mirror chip 1, a temperature adjustment unit 2, a ceramic gasket 3, a temperature-sensitive resistor 4 and a light engine component 5.

[0048] In the embodiment of the utility model, the temperature regulating unit 2 is a semiconductor refrigerator (Thermo Electric Cooler, abbreviated as TEC) unit; the temperature regulating unit 2 is arranged on the package tube seat 50, the ceramic gasket 3 is arranged between the rotating mirror chip 1 and the temperature regulating unit 2; the temperature regulating unit 2 is packaged in the package tube shell 51. The temperature regulating unit 2 is used to control the temperature of the optical device. When the temperature of the optical device is lower than the preset temperature, the temperature regulating unit 2 generates heat to compensate the temperature of the optical device; when the temperature of the optical device is higher than the preset temperature, the temperature regulating unit 2 cools the optical device to reduce the temperature, so as to ensure the stability and reliability of the optical device when working.

[0049] Wherein, the model of the temperature adjustment unit 2 is one of FBM-009394, FBP-011632, FBM-012487, FBP-014038, FBP-013189 or FBP-015289. Figure 2 As shown, it is a schematic diagram of one structure of the temperature adjustment unit 2.

[0050] The model of the temperature-sensitive resistor 4 is one of NTCG06 (0603), NTCG10 (1005), NTCG16 (1608) or NTCG20 (2012). The temperature-sensitive resistor 4 obtains a resistance value through a peripheral circuit, and then obtains temperature information by acquisition. The formula for obtaining temperature data is: Wherein, B is a constant (K), T1 is an arbitrary temperature (K), T2 is an arbitrary reference temperature different from T1 (K), R1 is the resistance value at temperature T1 (Ω), R2 is the resistance value at reference temperature T2 (Ω), and the temperature unit is absolute temperature (0℃=273.15K).

[0051] The temperature adjustment unit 2 can control the temperature of the optical device through the action of electric current. Figure 3As shown, the temperature regulating unit 2 is provided with a first pin 20 and a second pin 21, the first pin 20 is connected to the positive electrode of the temperature regulating unit 2, and the second pin 21 is connected to the negative electrode of the temperature regulating unit 2. The first pin 20 and the second pin 21 are electrically connected to the temperature regulating unit 2 by gold wire bonding. Specifically, the first pin 20 and the second pin 21 are connected to the external temperature control circuit, the temperature regulating unit 2 is bonded to the package tube holder 50 by glue, and the positive electrode pad and the negative electrode pad of the temperature regulating unit 2 are electrically connected to the first pin 20 and the second pin 21 by a gold wire bonding process. The working principle of heating and cooling of the temperature regulating unit 2 is based on the Peltier effect, which refers to the absorption or release of heat when current passes through the contact of two different materials (usually a P-type semiconductor and an N-type semiconductor to form a thermocouple). In the temperature regulating unit 2, the exothermic end is connected to the negative electrode, and the heat absorbing end is connected to the positive electrode. When the current passes through the semiconductor material, the Peltier effect is generated, so that heat is generated on the path where the current passes. Since the semiconductor materials of the negative electrode and the positive electrode are different, the heat generated by their Peltier effects is also different, thereby forming an exothermic end and a heat absorbing end. That is, by changing the direction and intensity of the current, the heating and cooling side of the TEC can be controlled, thereby achieving the heating and cooling effects. In refrigeration applications, when the current passes through the temperature regulating unit 2, from the P-type semiconductor to the N-type semiconductor side, the electrons will jump from the high energy level to the low energy level, absorb heat and cause the temperature of this side to decrease; and from the N-type semiconductor to the P-type semiconductor side, the electrons will jump from the low energy level to the high energy level, release heat and cause the temperature of this side to increase, that is, the heating function of the temperature regulating unit 2 is realized. In order to enable the external temperature control circuit to receive the temperature data inside the optical device and send the temperature adjustment instruction to the temperature adjustment unit 2, a temperature sensitive resistor 4 is arranged inside the optical device. The temperature value formula collected by the temperature sensitive resistor 4 has been described in detail in the above content. Figure 3 As shown, the temperature-sensitive resistor 4 is provided with a third pin 40 and a fourth pin 41, the third pin 40 is connected to the positive electrode of the temperature-sensitive resistor 4, and the fourth pin 41 is connected to the negative electrode of the temperature-sensitive resistor 4. Specifically, the third pin 40 and the fourth pin 41 are electrically connected to the temperature-sensitive resistor 4 in a gold wire bonding manner. The third pin 40 and the fourth pin 41 are connected to an external temperature control circuit.

[0052] In optical devices, the rotating mirror chip 1 is an electrostatic micro-electromechanical (MEMS) chip, which is made using MEMS processing technology. Usually, structures such as comb electrodes, suspension beams, reflective micro-mirrors and pads are processed on silicon wafers. Driven by electrostatic force, the reflective micro-mirrors will rotate around the suspension beams, thereby changing the transmission direction of light and ultimately realizing the routing selection of optical signals (realizing the function of optical switches). Figure 3As shown, the rotating mirror chip 1 includes a fifth pin 10, a sixth pin 11 and a seventh pin 12, the fifth pin 10 is connected to the X-axis direction control electrode of the rotating mirror chip 1, the sixth pin 11 is connected to the Y-axis direction control electrode of the rotating mirror chip 1, and the seventh pin 12 is used to ground the rotating mirror chip 1 and the packaging tube shell 51; the rotating mirror chip 1 is electrically connected to the fifth pin 10, the sixth pin 11 and the seventh pin 12 by gold wire bonding.

[0053] The rotating mirror chip 1 transmits the optical signal to the optical engine component 5. Figure 1 As shown, the optical engine assembly 5 further includes a lens 52, which is disposed on one side of the rotating mirror chip 1, and is embedded in the packaging tube shell 51, and is used to collimate the input light or focus the reflected light of the rotating mirror chip (1). In addition, the optical engine assembly 5 further includes a glass tube 53 and a capillary 54, and the glass tube 53 connects the lens 52 and the capillary 54, and is used to collimate the input light or focus the reflected light of the rotating mirror chip 1.

[0054] Embodiment 3:

[0055] Embodiment 3 of the present utility model provides a wide temperature and high reliability MEMS optical switch in which the temperature adjustment unit 2 is a thin film heating plate on the basis of embodiment 1, such as Figure 4 As shown, it includes: a rotating mirror chip 1, a temperature adjustment unit 2, a ceramic gasket 3, a temperature-sensitive resistor 4 and a light engine component 5.

[0056] In an embodiment of the utility model, the temperature regulating unit 2 is a thin film heating plate; the temperature regulating unit 2 is arranged at the outer bottom of the packaging tube seat 50, the ceramic gasket 3 is arranged on the packaging tube seat 50, the rotating mirror chip 1 is arranged on the ceramic gasket 3, and the temperature regulating unit 2 is located outside the packaging tube shell 51.

[0057] Specifically, the model of the temperature-sensitive resistor 4 is one of NTCG06 (0603), NTCG10 (1005), NTCG16 (1608) or NTCG20 (2012).

[0058] The temperature adjustment unit 2 is provided with a first pin 20 and a second pin 21, wherein the first pin 20 is connected to the positive electrode of the temperature adjustment unit 2, and the second pin 21 is connected to the negative electrode of the temperature adjustment unit 2. Specifically, the first pin 20 and the second pin 21 are electrically connected to the temperature adjustment unit 2 by gold wire bonding. The peripheral circuit supplies power to the temperature adjustment unit 2 to heat the package socket 50, and transfers the heat to the rotating mirror chip 1, thereby performing unidirectional heating compensation on the MEMS optical switch.

[0059] The temperature-sensitive resistor 4 is provided with a third pin 40 and a fourth pin 41, wherein the third pin 40 is connected to the positive electrode of the temperature-sensitive resistor 4, and the fourth pin 41 is connected to the negative electrode of the temperature-sensitive resistor 4. Specifically, the third pin 40 and the fourth pin 41 are electrically connected to the temperature-sensitive resistor 4 in a gold wire bonding manner.

[0060] The rotating mirror chip 1 includes a fifth pin 10, a sixth pin 11 and a seventh pin 12, the fifth pin 10 is connected to the X-axis direction control electrode of the rotating mirror chip 1, the sixth pin 11 is connected to the Y-axis direction control electrode of the rotating mirror chip 1, and the seventh pin 12 is used to ground the rotating mirror chip 1; the rotating mirror chip 1 is electrically connected to the fifth pin 10, the sixth pin 11 and the seventh pin 12 by gold wire bonding.

[0061] The optical engine assembly 5 further comprises a lens 52, which is disposed on one side of the rotating mirror chip 1 and is embedded in the package tube shell 51, and is used to collimate the input light or focus the reflected light of the rotating mirror chip (1). Specifically, the optical engine assembly 5 further comprises a glass tube 53 and a capillary tube 54, and the glass tube 53 connects the lens 52 and the capillary tube 54, and is used to collimate the input light or focus the reflected light of the rotating mirror chip 1.

[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A MEMS optical switch with wide temperature and high reliability, characterized in that: include: A rotating mirror chip (1), a temperature adjustment unit (2), a ceramic gasket (3), a temperature-sensitive resistor (4) and a light engine component (5); The optical engine assembly (5) comprises a package tube seat (50) and a package tube shell (51); the ceramic gasket (3) is arranged on the package tube seat (50); the rotating mirror chip (1) is arranged on the ceramic gasket (3); the temperature-sensitive resistor (4) is arranged on the ceramic gasket (3); and the temperature-sensitive resistor (4) is located on one side of the rotating mirror chip (1); the rotating mirror chip (1), the ceramic gasket (3) and the temperature-sensitive resistor (4) are packaged in the package tube shell (51); The temperature adjustment unit (2) is arranged on one side of the packaging tube seat (50).

2. The wide temperature and high reliability MEMS optical switch according to claim 1, characterized in that: The temperature regulating unit (2) is a TEC unit; The temperature regulating unit (2) is arranged on the packaging tube seat (50), and the ceramic gasket (3) is arranged between the rotating mirror chip (1) and the temperature regulating unit (2); the temperature regulating unit (2) is packaged in the packaging tube shell (51).

3. The wide temperature and high reliability MEMS optical switch according to claim 1, characterized in that: The temperature regulating unit (2) is a thin film heating plate; The temperature regulating unit (2) is arranged at the outer bottom of the package tube seat (50), the ceramic gasket (3) is arranged on the package tube seat (50), the rotating mirror chip (1) is arranged on the ceramic gasket (3), and the temperature regulating unit (2) is located outside the package tube shell (51).

4. The wide temperature and high reliability MEMS optical switch according to claim 1, characterized in that: The temperature regulating unit (2) is provided with a first pin (20) and a second pin (21), the first pin (20) being connected to the positive pole of the temperature regulating unit (2), and the second pin (21) being connected to the negative pole of the temperature regulating unit (2).

5. The wide temperature and high reliability MEMS optical switch according to claim 4, characterized in that: The first pin (20) and the second pin (21) are electrically connected to the temperature adjustment unit (2) by means of gold wire bonding.

6. The wide temperature and high reliability MEMS optical switch according to claim 1, characterized in that: The temperature-sensitive resistor (4) is provided with a third pin (40) and a fourth pin (41), the third pin (40) being connected to the positive electrode of the temperature-sensitive resistor (4), and the fourth pin (41) being connected to the negative electrode of the temperature-sensitive resistor (4).

7. The wide temperature and high reliability MEMS optical switch according to claim 6, characterized in that: The third pin (40) and the fourth pin (41) are electrically connected to the temperature-sensitive resistor (4) by means of gold wire bonding.

8. The wide temperature and high reliability MEMS optical switch according to claim 1, characterized in that: The light engine component (5) further comprises a lens (52), wherein the lens (52) is arranged on one side of the rotating mirror chip (1), and the lens (52) is embedded in the packaging tube shell (51) and is used for collimating input light or focusing reflected light of the rotating mirror chip (1).

9. The wide temperature and high reliability MEMS optical switch according to claim 8, characterized in that: The optical engine component (5) further comprises a glass tube (53) and a capillary tube (54); the glass tube (53) connects the lens (52) and the capillary tube (54); and the capillary tube (54) is used to maintain the position of the optical fiber and guide the propagation of the optical signal.

10. The wide temperature and high reliability MEMS optical switch according to any one of claims 1 to 9, characterized in that: The rotating mirror chip (1) comprises a fifth pin (10), a sixth pin (11) and a seventh pin (12), wherein the fifth pin (10) is connected to an X-axis direction control electrode of the rotating mirror chip (1), the sixth pin (11) is connected to a Y-axis direction control electrode of the rotating mirror chip (1), and the seventh pin (12) is used to ground the rotating mirror chip (1) and the packaging tube shell (51); The rotating mirror chip (1) is electrically connected to the fifth pin (10), the sixth pin (11) and the seventh pin (12) by means of gold wire bonding.

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