Processing device for substrate

Abstract

The utility model provides a processing device for a substrate, which comprises a conveying chamber and a processing chamber, and the processing chamber is configured to process the substrate; the transfer chamber is configured to transfer the substrate to the processing chamber or move the substrate out of the processing chamber; a driving device is arranged in the conveying chamber, the driving device is connected with a mechanical arm assembly, the mechanical arm assembly comprises a connecting rod and fingers, the fingers are arranged at the end of the connecting rod, and the fingers are configured to bear the substrate when the mechanical arm assembly moves the substrate; an optical sensor is arranged in the conveying chamber, an incidence part is arranged on the connecting rod, and the optical sensor is configured to be matched with the incidence part to give information about whether the connecting rod reaches a target position or not. According to the embodiment of the utility model, the position of the mechanical arm assembly is judged by receiving and transmitting the optical signal based on the optical sensor, so that the size and the thickness of the mechanical arm assembly are reduced, the moving range of the mechanical arm assembly in the vertical direction is enlarged, and the positive effect on improving the production efficiency of the substrate is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of substrate processing, in particular to a processing device for a substrate. Background Art

[0002] During the operation of MOCVD equipment, the transfer and delivery of wafers (a type of substrate) are essential steps. Traditional transmission mechanisms generally use a robotic arm, which includes a drive device, fingers, and a connecting rod between the drive device and the fingers. At the same time, during the movement of the robotic arm, a mechanical limit method of limit sensors, limit blocks, and stoppers is generally used.

[0003] In this structure, a pressure sensor is provided on the driving device as a limit sensor, a guide rod and a limit block are provided on the connecting rod, and a stop block is provided at the wafer entrance of the reaction chamber, wherein one end of the guide rod corresponds to the pressure sensor, and the other end of the guide rod is fixedly connected to the limit block, and the above-mentioned limit block corresponds to the stop block. With the movement of the robotic arm, the finger carrying the wafer gradually extends into the reaction chamber. When the wafer is transported to the target position, the limit block at the other end of the guide rod just abuts the stop block, and the force is transmitted to the pressure sensor through the connecting rod, and the signal is transmitted to the controller through the pressure sensor. The controller controls the robotic arm to stop moving, thereby ensuring that the wafer is transported to the target position. However, the robotic arm adopting the above-mentioned limit structure has a large weight and volume. At the same time, in order to avoid collision with other components, it leads to restrictions on the action of taking and placing the wafer by the fingers, thereby affecting the wafer transmission speed and further affecting the production efficiency.

[0004] Under the existing technology, the limit function of the robot arm is realized by a mechanical limit structure composed of a limit sensor and a limit block. The defect of the existing design is that the limit block on the robot arm will cause the robot arm to be very heavy and thick. In addition, since the stopper in the existing mechanical limit structure is generally formed by a graphite piece located in the chamber protruding out of the chamber, such a setting method will increase the non-uniformity of the temperature field in the reaction chamber to a certain extent. Utility Model Content

[0005] In view of this, the utility model aims to provide a processing device for substrates, so as to at least partially solve the technical problems in the prior art such as the use of a mechanical limiting structure resulting in restrictions on the placement of the wafer, the heavy weight and thickness of the robot arm, and increased non-uniformity of the temperature field.

[0006] The utility model provides a processing device for a substrate, comprising a transfer chamber and a processing chamber; the processing chamber is configured to process the substrate; the transfer chamber is configured to transfer the substrate to the processing chamber or move the substrate out of the processing chamber; a driving device is arranged in the transfer chamber, the driving device is connected to a mechanical arm assembly, the mechanical arm assembly comprises a connecting rod and a finger, the finger is arranged at the end of the connecting rod, and the finger is configured to carry the substrate when the mechanical arm assembly moves the substrate; an optical sensor is arranged in the transfer chamber, an incident part is arranged on the connecting rod, and the optical sensor is configured to cooperate with the incident part to provide information on whether the connecting rod has reached a target position.

[0007] In some embodiments, a first transmitter and a first receiver are disposed in the transmission chamber, and the first transmitter and the first receiver are respectively disposed at the top and the bottom of the transmission chamber, and the incident part is a transmission part located at a first predetermined position on the connecting rod, and the signal sent by the first transmitter can pass through the transmission part and be received by the first receiver.

[0008] In some embodiments, a line connecting the first transmitter and the first receiver is perpendicular to a movement direction of the connecting rod.

[0009] In some embodiments, a second transmitter and a second receiver are disposed in the conveying chamber, and the second transmitter and the second receiver are jointly disposed at the top or bottom of the conveying chamber and are a predetermined distance apart, and the incident part is a reflecting part located at a second predetermined position on the connecting rod, and the signal sent by the second transmitter can be received by the second receiver after being reflected by the reflecting part.

[0010] In some embodiments, the optical sensor is an infrared sensor.

[0011] In some embodiments, an upper heating ring and a lower heating ring are disposed opposite to each other in the processing chamber; a reaction chamber is disposed in the processing chamber, and the reaction chamber is located between the upper heating ring and the lower heating ring; the lower heating ring has a recessed portion, a tray is disposed in the recessed portion, and the tray is configured to carry the substrate.

[0012] In some embodiments, an intake / exhaust chamber is further included, wherein the intake / exhaust chamber is configured to provide gas to the process chamber or exhaust gas exhausted from the process chamber, and the intake / exhaust chamber is located between the transfer chamber and the process chamber.

[0013] In some embodiments, a gate valve is disposed between the transfer chamber and the intake / exhaust chamber.

[0014] In some embodiments, a through hole is provided on the gate valve, and the connecting rod is configured to enter the reaction chamber by passing through the through hole.

[0015] In some embodiments, the optical sensor is 100-150 mm away from the plane where the gate valve is located.

[0016] In some embodiments, the link shields or reflects a signal from the transmitter of the optical sensor when and only when the robot assembly performs an action of extending into or withdrawing from the processing chamber.

[0017] The embodiment of the utility model is based on an optical sensor that determines the position of the robot arm assembly by sending and receiving optical signals, thereby reducing the volume and thickness of the robot arm assembly, increasing its movable range in the vertical direction in the reaction chamber, and having a positive effect on improving the production efficiency of the substrate.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In the drawings that are not necessarily drawn to scale, the same reference numerals may describe similar parts in different views. The same reference numerals with letter suffixes or different letter suffixes may represent different instances of similar parts. The drawings generally illustrate various embodiments by way of example and not limitation, and together with the specification and claims, are used to illustrate the disclosed embodiments. When appropriate, the same reference numerals are used throughout the drawings to refer to the same or similar parts. Such embodiments are illustrative and are not intended to be exhaustive or exclusive embodiments of the present apparatus or method. The drawings described herein are used to provide a further understanding of the present disclosure and constitute a part of this application. The illustrative embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation of the present disclosure. In the drawings:

[0020] Figure 1 It is a structural schematic diagram of a substrate processing device provided by the utility model;

[0021] Figure 2 It is a structural schematic diagram of a mechanical arm assembly in a substrate processing device provided by the utility model;

[0022] Figure 3 This is one of the installation schematic diagrams of an optical sensor in a substrate processing device provided by the utility model;

[0023] Figure 4 This is the second installation schematic diagram of the optical sensor in the substrate processing device provided by the utility model.

[0024] The above drawings include the following reference numerals:

[0025] 1-connecting rod; 2-finger; 10-transmission chamber; 11-transmission part; 12-reflection part; 20-processing chamber; 21-upper heating ring; 22-lower heating ring; 23-reaction chamber; 24-recessed part; 25-tray; 26-upper insulation graphite felt; 27-lower insulation graphite felt; 30-inlet / exhaust chamber; 40-driving device; 50-substrate; 60-gate valve; 101-first transmitter; 102-first receiver; 103-second transmitter; 104-second receiver. DETAILED DESCRIPTION

[0026] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings, but are not intended to limit the present disclosure.

[0027] It should be understood that various modifications may be made to the embodiments disclosed herein. Therefore, the above description should not be considered as limiting, but merely as an example of an embodiment. Other modifications within the scope and spirit of the present disclosure will occur to those skilled in the art.

[0028] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the general description of the present disclosure given above and the detailed description of the embodiments given below, serve to explain the principles of the present disclosure.

[0029] These and other characteristics of the present disclosure will become apparent from the following description of a preferred form of embodiment given as a non-limiting example, with reference to the attached drawings.

[0030] It should also be understood that, although the present disclosure has been described with reference to some specific examples, those skilled in the art will be able to realize many other equivalent forms of the present disclosure that have the features described in the claims and are therefore within the scope of protection defined thereby.

[0031] The above and other aspects, features and advantages of the present disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

[0032] Specific embodiments of the present disclosure are described hereinafter with reference to the accompanying drawings; however, it should be understood that the disclosed embodiments are merely examples of the present disclosure, which may be implemented in a variety of ways. Well-known and / or repeated functions and structures are not described in detail to avoid obscuring the present disclosure with unnecessary or redundant details. Therefore, the specific structural and functional details disclosed herein are not intended to be limiting, but merely serve as a basis and representative basis for the claims to teach those skilled in the art to use the present disclosure in a variety of ways with substantially any suitable detailed structure.

[0033] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products, or devices.

[0034] This specification may use the phrases "in one embodiment," "in another embodiment," "in a further embodiment," or "in other embodiments," all of which may refer to one or more of the same or different embodiments according to the present disclosure.

[0035] The present invention relates to a processing device for a substrate, for example, an epitaxial device for silicon carbide. Figure 1 and Figure 2 As shown, the processing apparatus includes a transfer chamber 10 and a processing chamber 20 , wherein the processing chamber 20 is configured to process a substrate 50 , and the transfer chamber 10 is configured to transfer the substrate 50 to the processing chamber 20 or remove the substrate 50 from the processing chamber 20 .

[0036] In one embodiment, the processing chamber 20 is provided with an upper heating ring 21 and a lower heating ring 22 which are arranged opposite to each other, and a reaction chamber 23 is provided in the processing chamber 20, and the reaction chamber 23 is located between the upper heating ring 21 and the lower heating ring 22; the flat plate portion of the lower heating ring 22 has a recessed portion 24, and a tray 25 is arranged in the recessed portion 24. The tray 25 here is, for example, an air-floating tray, and the substrate 50 is placed on the tray 25 for processing such as epitaxial reaction. The upper heating ring 21 and the lower heating ring 22 here are used for induction heating, and they can be graphite heating rings, and their cross-sectional shape can be a semicircular ring.

[0037] Furthermore, a driving device 40 is provided in the transfer chamber 10, and the driving device 40 is connected to a robot assembly to drive the robot assembly, and the robot assembly is used to transport the substrate 50, for example, the robot assembly is used to take the substrate 50 on the tray 25 to achieve a film taking operation, and can also transport the substrate 50 to the tray 25 to complete a film placing operation. The driving device 40 here can be provided on, for example, a robot device, or can be a special driving device, which can be provided in the transfer chamber 10, so that the robot assembly can be driven to move by the driving device 40.

[0038] Furthermore, the processing device also includes an intake / exhaust chamber 30, which is located between the transfer chamber 10 and the processing chamber 20, and the intake / exhaust chamber 30 is configured to provide gas to the processing chamber 20 or exhaust gas exhausted from the processing chamber 20.

[0039] Furthermore, a gate valve 60 is arranged between the transfer chamber 10 and the intake / exhaust chamber 30, the driving device 40 is arranged in the transfer chamber 10, and the robot arm assembly enters from the transfer chamber 10 into the processing chamber 2O to perform operations, and passes through the gate valve 60 when entering from the transfer chamber 10 into the processing chamber 20.

[0040] Specifically, the robot assembly here includes a connecting rod 1 and a finger 2, and the finger 2 is provided at the end of the connecting rod 1 as an actuator, and the finger 2 here is configured to carry the substrate 50 when the robot assembly moves the substrate 50. In this embodiment, the driving device 40 drives the connecting rod 1 to move toward or away from the processing chamber 20.

[0041] Specifically, a through hole is provided on the gate valve 60, for example, and the connecting rod 1 passes through the through hole on the gate valve 60 from the transfer chamber 10 and enters the reaction chamber 23 of the processing chamber 20, thereby transporting the substrate 50 to the tray 25 to realize the wafer placing operation or removing the substrate 50 from the tray 25 to realize the wafer taking operation.

[0042] Considering that the position of the finger 2 in the robot assembly is related to the position of the connecting rod 1, in order to determine whether the finger 2 reaches the predetermined position on the tray 25 for the operation of picking and placing the sheet, an optical sensor is provided in the transfer chamber 10, and the optical sensor is provided to optically determine whether the connecting rod 1 reaches the target position, thereby determining whether the finger 2 reaches the predetermined position based on the position of the connecting rod 1. Preferably, the optical sensor here can be an infrared sensor, and of course other sensors that realize signal transmission can also be used.

[0043] When the connecting rod 1 reaches the target position, the finger 2 correspondingly reaches the predetermined position, so that the substrate 50 can be subsequently placed or taken out. The target position to which the connecting rod 1 moves corresponds to the predetermined position to which the finger 2 moves on the tray 25, so that the position of the finger 2 can be determined by the position of the connecting rod 1.

[0044] In a specific embodiment, Figure 3 As shown, a first transmitter 101 and a first receiver 102 are arranged in the transmission chamber 10, and a transmission part 11 is arranged at a first predetermined position on the connecting rod 1. Here, the first transmitter 101 and the first receiver 102 may be, for example, an infrared transmitter and an infrared receiver, and here, the transmission part 11 may be, for example, a through hole. The shape and size of the through hole may be determined according to actual needs.

[0045] Further, the first transmitter 101 and the first receiver 102 are respectively arranged at the top and the bottom of the transfer chamber 10, and the first transmitter 101 sends a signal to the first receiver 102, and the sent signal can be received by the first receiver 102. When the connecting rod 1 moves toward the processing chamber 20, when the signal sent by the first transmitter 101 can pass through the transmission part 11 on the connecting rod 1 and is received by the first receiver 102, it means that the connecting rod 1 moves to the target position, and the target position here can mean that the finger 2 moves to the predetermined position on the tray 25 to perform the operation of picking and placing the sheet. The setting positions of the first transmitter 101 and the first receiver 102 here depend on the target position of the movement of the connecting rod 1.

[0046] Preferably, in order for the signal sent by the first transmitter 101 to accurately pass through the transmission part 11 and be received by the second receiver 102, the connection line between the first transmitter 101 and the first receiver 102 is at a predetermined angle to the movement direction of the connecting rod 1, and preferably, the connection line is perpendicular to the movement direction of the connecting rod 1. Of course, the connection line between the first transmitter 101 and the first receiver 102 can also be set to other angles to the movement direction of the connecting rod 1, as long as there is a relative position that enables the first receiver 102 to receive the signal transmitted by the first transmitter 101 and passing through the transmission part 11.

[0047] In one embodiment of the present disclosure, the connecting rod 1 is provided with the transmission part 11. In addition, the relative positions of the robot assembly, the first transmitter 101 and the first receiver 102 are set to: when and only when the robot assembly performs the extension into the processing chamber 20 (such as transferring the substrate 50 to the processing chamber 20 or extending into the processing chamber 20 to remove the epitaxial substrate 50) or the robot assembly performs the withdrawal from the processing chamber 20 (such as withdrawing after placing the wafer or withdrawing with the epitaxial substrate 50), the connecting rod 1 will shield the signal from the first transmitter 101. Specifically, the first transmitter 101 and the first receiver 102 are arranged on the top wall and the bottom wall of the transfer chamber 10 close to the gate valve 60, and the distance between the first transmitter 101 and the first receiver 102 and the plane where the gate valve 60 is located is 100mm-150mm. Preferably, the distance between the first transmitter 101 and the first receiver 102 and the plane where the gate valve 60 is located is 120 mm.

[0048] Under the above settings, the situation that the connecting rod 1 blocks the signal emitted by the first transmitter 101 will only occur when the robot arm assembly extends into or withdraws from the processing chamber 20, that is, when the robot arm assembly performs other movements (such as taking a substrate from the loading end or rotating in the home position), the connecting rod 1 is in a state of not blocking the signal emitted by the first transmitter 101, and the first receiver 102 is in a state of continuously receiving the signal from the first transmitter 101. At this time, the first receiver 102 will continuously send a first signal, such as a high-level signal, to the controller. When the connecting rod 1 in the robot arm assembly extends to the processing chamber 20, the connecting rod 1 will block the signal emitted by the first transmitter 101. At this time, if the first receiver 102 does not receive the signal, the first receiver 102 will send a second signal, such as a low-level signal, to the controller. This signal can be used as a pre-judgment signal. After this signal, if the first receiver 102 sends a high-level signal again, it means that the connecting rod 1 moves to the target position and the film is delivered in place. Subsequently, as the robot assembly further moves, the transmission portion 11 of the connecting rod 1 moves to the optical path between the first transmitter 101 and the first receiver 102, and the signal from the first transmitter 101 passes through the transmission portion 11 and is received by the first receiver 102. At this time, the first receiver 102 sends a third signal, such as a high-level signal, to the controller. At this time, as described above, it means that the connecting rod 1 moves to the target position, that is, the substrate 50 is transferred to the predetermined position on the tray 25, so the controller controls the driving device 40 to control the robot assembly to stop moving.

[0049] In another embodiment, see Figure 4 , a second transmitter 103 and a second receiver 104 are arranged in the transmission chamber 10, and a reflector 12 is arranged at a second predetermined position on the connecting rod 1, so that when the signal sent by the second transmitter 103 is reflected by the reflector 12 and received by the second receiver 104, it indicates that the connecting rod 1 has reached the target position. Specifically, the second transmitter 103 and the second receiver 104 are arranged together at the top or bottom of the transmission chamber 10. In particular, in this embodiment, the second transmitter 103 and the second receiver 104 are arranged together at the top of the transmission chamber 10. The second transmitter 103 and the second receiver 104 can be arranged together with the first transmitter 101 and the first receiver 102, or can be arranged separately.

[0050] Furthermore, the second transmitter 103 and the second receiver 104 are separated by a predetermined distance, and the predetermined distance is related to the movement speed of the connecting rod 1, so that when the connecting rod 1 moves to the target position, the second receiver 104 can receive the optical signal emitted by the second transmitter 103.

[0051] The positions of the second transmitter 103 and the second receiver 104 here depend on the target position of the movement of the connecting rod 1, so that when the connecting rod 1 moves toward the processing chamber 20, when the signal sent by the second transmitter 103 is reflected by the reflecting part 12 on the connecting rod 1 and received by the second receiver 104, it means that the connecting rod 1 moves to the target position. The target position here means that the finger 2 moves to a predetermined position on the tray 25 to perform a wafer pick-up and placement operation.

[0052] In some embodiments, the second transmitter 103 and the second receiver 104 are disposed on the top wall or the bottom wall of the transfer chamber 10 near the gate valve 60, so that the blocking of the light signal by the connecting rod 1 only occurs when the robot assembly extends into or withdraws from the processing chamber 2. Preferably, the distance between the center of the second transmitter 103 and the second receiver 104 and the plane where the gate valve 60 is located is 100-150 mm, preferably 120 mm.

[0053] According to the above embodiment, when the connecting rod 1 moves to the target position, that is, the transmitting part 11 moves to the transmitting position or the reflecting part 12 moves to the reflecting position, the first receiver 102 or the second receiver 104 receives the transmitted or emitted signal and then feedbacks a signal indicating that the finger 2 of the robotic arm assembly moves to the predetermined position, thereby achieving the purpose of position control by controlling the robotic arm assembly to realize the purpose of picking up and placing the sheet.

[0054] Through the above embodiments, by setting the transmission part 11 or the reflection part 12 on the connecting rod 1 of the robot arm assembly, it is possible to obtain an optical signal representing the position of the robot arm assembly by cooperating with an optical sensor, so as to realize rapid determination of the position of the finger 2, thereby achieving the purpose of improving the film transmission speed and optimizing the production efficiency.

[0055] The transmission part 11 and the reflection part 12 mentioned in the above embodiments are both incident parts.

[0056] In the above embodiment, the method of using an optical sensor for optical detection and then positioning the mechanical arm assembly (especially the finger 2) eliminates the guide rod and other components compared to the method of using a mechanical limit structure to position the finger, so that the length (corresponding to the height) of the mechanical arm assembly in the vertical direction becomes smaller. In addition, since the height of the through hole on the gate valve is certain, when the height of the mechanical arm assembly in the vertical direction becomes smaller, the movable distance of the mechanical arm assembly in the vertical direction becomes relatively larger, that is, the mechanical arm assembly can move a larger distance after placing the substrate 50 on the tray 25, so that the mechanical arm assembly can be withdrawn from the processing chamber 20 at a position farther away from the substrate 50, which improves the withdrawal speed of the mechanical arm assembly. In addition, the elimination of the guide rod and other components also reduces the weight of the mechanical arm assembly, so that it can be made thinner on the basis of meeting the strength, and further reduces its height in the vertical direction. In one embodiment, by adopting the technical solution disclosed in the utility model, the activity space of the mechanical arm assembly can be increased by 15% when the substrate is taken and placed, and the mechanical arm assembly can be reduced by 10%. In addition, in this embodiment, by eliminating the stopper of the mechanical limiting structure, for example, the graphite piece can be positioned entirely in the reaction chamber, so that the temperature field in the reaction chamber is more uniform.

[0057] The embodiment of the utility model is based on an optical sensor that determines the position of the robot arm assembly by sending and receiving optical signals, thereby reducing the volume and thickness of the robot arm assembly, increasing its range of movement along the substrate movement direction in the reaction chamber, and having a positive effect on improving the production efficiency of the substrate.

[0058] In the above embodiments of the present disclosure, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0059] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0060] In addition to the above, it should be noted that "one embodiment", "another embodiment", "embodiment", etc. mentioned in this specification refer to the specific features, structures or characteristics described in conjunction with the embodiment included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when describing a specific feature, structure or characteristic in conjunction with any embodiment, it is claimed that the realization of such feature, structure or characteristic in conjunction with other embodiments also falls within the scope of the present disclosure.

[0061] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0062] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A processing device for a substrate, characterized in that: Includes transfer room and processing room; The processing chamber is configured to process the substrate; The transfer chamber is configured to transfer the substrate to the process chamber or remove the substrate from the process chamber; A driving device is disposed in the transfer chamber, the driving device is connected to a robot assembly, the robot assembly includes a connecting rod and a finger, the finger is disposed at an end of the connecting rod, and the finger is configured to carry the substrate when the robot assembly moves the substrate; An optical sensor is arranged in the conveying chamber, an incident portion is arranged on the connecting rod, and the optical sensor is configured to cooperate with the incident portion to provide information on whether the connecting rod has reached the target position.

2. The processing device according to claim 1, characterized in that: A first transmitter and a first receiver are arranged in the transmission chamber, and the first transmitter and the first receiver are arranged at the top and the bottom of the transmission chamber respectively. The incident part is a transmission part located at a first predetermined position on the connecting rod, and the signal sent by the first transmitter can pass through the transmission part and be received by the first receiver.

3. The processing device according to claim 2, characterized in that: A line connecting the first transmitter and the first receiver is perpendicular to a moving direction of the connecting rod.

4. The processing device according to claim 1, characterized in that: A second transmitter and a second receiver are arranged in the conveying chamber. The second transmitter and the second receiver are jointly arranged at the top or bottom of the conveying chamber and are a predetermined distance apart. The incident part is a reflecting part located at a second predetermined position on the connecting rod. The signal sent by the second transmitter can be received by the second receiver after being reflected by the reflecting part.

5. The processing device according to claim 1, characterized in that: The optical sensor is an infrared sensor.

6. The processing device according to any one of claims 1 to 5, characterized in that: An upper heating ring and a lower heating ring are arranged opposite to each other in the processing chamber; a reaction chamber is arranged in the processing chamber, and the reaction chamber is located between the upper heating ring and the lower heating ring; the lower heating ring has a recessed portion, a tray is arranged in the recessed portion, and the tray is configured to carry the substrate.

7. The processing device according to any one of claims 1 to 5, characterized in that: The invention also includes an intake / exhaust chamber, which is configured to supply gas to the process chamber or exhaust gas exhausted from the process chamber, and the intake / exhaust chamber is located between the transfer chamber and the process chamber.

8. The processing device according to claim 7, characterized in that: A gate valve is arranged between the transfer chamber and the intake / exhaust chamber, a through hole is arranged on the gate valve, and the connecting rod is configured to enter the reaction chamber by passing through the through hole.

9. The processing device according to claim 8, characterized in that: The optical sensor is 100-150 mm away from the plane where the gate valve is located.

10. The processing device according to claim 1, characterized in that: When and only when the robot assembly performs an action of extending into or withdrawing from the processing chamber, the link will block or reflect the signal from the transmitter of the optical sensor.

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