Ear amplifier convenient for audio frequency adjustment

Abstract

The utility model is suitable for the technical field of earphone amplifiers, and provides an earphone amplifier convenient for audio frequency adjustment, which comprises an aluminum alloy shell, a plurality of positioning columns and an earphone, the circuit board is arranged on the plurality of positioning columns and is provided with an analog signal processing module, a Bluetooth module, a Wi F i module and a communication module; the active heat dissipation mechanism is arranged on the aluminum alloy shell and used for conducting heat dissipation and cooling on the analog signal processing module, the Bluetooth module, the Wi F i module and the communication module. According to the earphone amplifier convenient to adjust the audio frequency, audio signals of different channels can be perfectly fused, switching between a wired mode and a Bluetooth mode is facilitated, meanwhile, the earphone amplifier has an active heat dissipation function, and therefore the operation stability of the earphone amplifier in hot weather is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of headphone amplifiers, and in particular relates to a headphone amplifier which is convenient for adjusting audio. Background Art

[0002] A headphone amplifier is a type of amplifier, specifically designed to drive headphones. Headphone amplifiers are usually found in electronic devices, music players, and televisions in the form of integrated circuits, but there are also standalone headphone amplifiers.

[0003] Existing headphone amplifiers have relatively simple functions. They often only perform simple audio amplification processing and do not have the function of mixing multiple audios. In addition, existing headphone amplifiers often do not have active heat dissipation mechanisms. Therefore, in hot weather, the headphone amplifier may overheat and shut down, causing inconvenience to users. Utility Model Content

[0004] The utility model provides an earphone amplifier which is convenient for adjusting audio frequency, aiming to solve the problems that the existing earphone amplifier mentioned in the background technology often does not have the mixing function of multiple audio frequencies and does not have an active heat dissipation mechanism.

[0005] To solve the above problems, the utility model is implemented as follows: an earphone amplifier that is easy to adjust audio, comprising: an aluminum alloy shell with a plurality of positioning posts fixedly mounted on the inner wall of the bottom; a circuit board arranged on the plurality of positioning posts and having an analog signal processing module, a Bluetooth module, a WiFi module and a communication module; an active heat dissipation mechanism arranged on the aluminum alloy shell, the active heat dissipation mechanism being used to dissipate heat and cool the analog signal processing module, the Bluetooth module, the WiFi module and the communication module.

[0006] Preferably, a SIM card slot is provided at the bottom of the aluminum alloy housing, and the SIM card slot is electrically connected to the communication module.

[0007] Preferably, screw holes are opened on the plurality of positioning columns, a plurality of positioning screws are arranged on the circuit board, the plurality of positioning screws are respectively threadedly connected with the inner walls of the plurality of screw holes, and a plurality of annular buffer pads are slidably sleeved on the plurality of positioning screws.

[0008] Preferably, the aluminum alloy housing is provided with a plurality of audio input terminals, audio output terminals and adjusting knobs, and the plurality of audio input terminals, audio output terminals and adjusting knobs are all electrically connected to the circuit board.

[0009] Preferably, a touch screen and a switch are provided on the aluminum alloy housing, and both the touch screen and the switch are electrically connected to the circuit board.

[0010] Preferably, a lithium battery is arranged on the inner wall of the aluminum alloy shell, a USB-C charging interface is arranged on one side of the aluminum alloy shell, and the lithium battery is electrically connected to the circuit board and the USB-C charging interface.

[0011] Preferably, the active heat dissipation mechanism includes: a thermal pad arranged on the circuit board; a heat sink arranged on the thermal pad; an air inlet opened on the aluminum alloy shell; a dust screen and a fan arranged on the air inlet, the fan being electrically connected to the circuit board; and a plurality of air outlets opened on the aluminum alloy shell.

[0012] Preferably, a temperature sensor is provided on the heat sink, and the temperature sensor is electrically connected to the circuit board.

[0013] Compared with the related art, the headphone amplifier for facilitating audio adjustment provided by the utility model has the following beneficial effects:

[0014] Compared with the prior art, the aluminum alloy shell in the ear amplifier for easy audio adjustment provided by the present invention serves as the basic structure of the ear amplifier, which not only provides solid protection for the internal components, but also has excellent heat dissipation performance, which helps the ear amplifier to work stably for a long time. The multiple positioning columns fixedly installed on the inner wall of the bottom ensure that the circuit board is stably installed inside the aluminum alloy shell, prevent circuit connection problems caused by vibration or movement, and improve the reliability and durability of the ear amplifier. The circuit board is the core component of the ear amplifier. The circuit board integrates an analog signal processing module, a Bluetooth module, a WiFi module and a communication module, so that the ear amplifier not only has the ability to process audio signals, but also can be connected to other devices through Bluetooth, WiFi and other methods to achieve wireless transmission and control of audio. The analog signal processing module is responsible for necessary processing of the audio signal, such as amplification, filtering, etc., to improve the sound quality and listening experience, and can perfectly integrate audio signals of different channels. The Bluetooth module enables the ear amplifier to quickly connect to Bluetooth devices such as mobile phones and tablets, which is convenient for users to perform wireless audio transmission. The WiFi module further expands the connection capability of the ear amplifier, so that it can be connected to the Wi F i network, to achieve more extensive audio sharing and control. The communication module is responsible for communicating with other devices or systems to ensure that the headphone amplifier can work stably in complex environments. Since the headphone amplifier integrates multiple functional modules, it will generate a certain amount of heat when working. The existence of the active heat dissipation mechanism can effectively dissipate heat and cool down the analog signal processing module, Bluetooth module, WiFi module and communication module to prevent performance degradation or damage caused by overheating, and ensure long-term stable operation of the headphone amplifier;

[0015] To sum up, the patented easy-to-adjust audio headphone amplifier not only provides high-quality audio processing effects through its carefully designed structure and functional modules, but also has powerful connection capabilities and excellent heat dissipation performance, bringing users a more convenient and comfortable audio experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main structure of an earphone amplifier that is convenient for adjusting audio provided by the utility model;

[0017] Figure 2 for Figure 1 A schematic diagram of a front cross-sectional structure;

[0018] Figure 3 for Figure 2 Schematic diagram of the enlarged structure of part A shown in FIG.

[0019] Figure numerals: 1. aluminum alloy shell; 2. positioning column; 3. circuit board; 4. analog signal processing module; 5. Bluetooth module; 6. WiFi module; 7. communication module; 8. SIM card slot; 9. screw hole; 10. positioning screw; 11. annular buffer pad; 12. audio input terminal; 13. audio output terminal; 14. adjustment knob; 15. touch screen; 16. switch; 17. lithium battery; 18. USB-C charging port; 19. thermal pad; 20. heat sink; 21. air inlet; 22. dust net; 23. fan; 24. air outlet. DETAILED DESCRIPTION

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "including" and "having" in the specification and claims of the present application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of the present application or the above-mentioned figures are used to distinguish different objects, rather than to describe a specific order; the terms "inside", "outside", "left", and "right" indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0021] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0022] The present invention provides an earphone amplifier that is convenient for adjusting audio. Figure 1-3 As shown, the headphone amplifier for adjusting audio frequency includes: an aluminum alloy shell 1 with a plurality of positioning posts 2 fixedly mounted on the bottom inner wall; a circuit board 3 arranged on the plurality of positioning posts 2 and having an analog signal processing module 4, a Bluetooth module 5, a Wi F i module 6 and a communication module 7; an active heat dissipation mechanism arranged on the aluminum alloy shell 1, and the active heat dissipation mechanism is used to dissipate heat and cool the analog signal processing module 4, the Bluetooth module 5, the Wi F i module 6 and the communication module 7.

[0023] In this embodiment, the aluminum alloy shell 1 serves as the basic structure of the headphone amplifier, which not only provides solid protection for the internal components, but also has excellent heat dissipation performance, which helps the headphone amplifier to work stably for a long time. The multiple positioning columns fixedly installed on the bottom inner wall ensure that the circuit board 3 is stably installed inside the aluminum alloy shell 1 to prevent circuit connection problems caused by vibration or movement, thereby improving the reliability and durability of the headphone amplifier. The circuit board 3 serves as the core component of the headphone amplifier. The circuit board 3 integrates the analog signal processing module 4, the Bluetooth module 5, the WiFi module 6 and the communication module 7, so that the headphone amplifier not only has the audio signal processing capability, but also can be connected to other devices through Bluetooth, WiFi and other methods to realize wireless transmission and control of audio. The analog signal processing module 4 is responsible for necessary processing of the audio signal, such as amplification, filtering, etc. Waves, etc., to improve the sound quality and listening experience, and at the same time can perfectly integrate the audio signals of different channels. The Bluetooth module 5 allows the headphone amplifier to quickly connect to Bluetooth devices such as mobile phones and tablets, which is convenient for users to perform wireless audio transmission. The WiFi module 6 further expands the connection capability of the headphone amplifier, allowing it to access the WiFi network of the home or office to achieve more extensive audio sharing and control. The communication module 7 is responsible for communicating with other devices or systems to ensure that the headphone amplifier can work stably in complex environments. In view of the fact that multiple functional modules are integrated inside the headphone amplifier, it will generate a certain amount of heat when it works. The existence of the active heat dissipation mechanism can effectively dissipate heat and cool down the analog signal processing module 4, the Bluetooth module 5, the WiFi module 6 and the communication module 7 to prevent performance degradation or damage caused by overheating, and ensure that the headphone amplifier can operate stably for a long time;

[0024] To sum up, the patented easy-to-adjust audio headphone amplifier not only provides high-quality audio processing effects through its carefully designed structure and functional modules, but also has powerful connection capabilities and excellent heat dissipation performance, bringing users a more convenient and comfortable audio experience.

[0025] In a further preferred embodiment of the present invention, a SIM card slot 8 is provided at the bottom of the aluminum alloy housing 1 , and the SIM card slot 8 is electrically connected to the communication module 7 .

[0026] In this embodiment, a SIM card can be inserted through the SIM card slot 8, so that the communication module 7 is connected to the communication network.

[0027] In a further preferred embodiment of the utility model, multiple positioning columns 2 are provided with screw holes 9, and multiple positioning screws 10 are provided on the circuit board 3. The multiple positioning screws 10 are respectively threadedly connected to the inner walls of the multiple screw holes 9, and multiple annular buffer pads 11 are slidably sleeved on the multiple positioning screws 10.

[0028] In this embodiment, the circuit board 3 can be fixed on the plurality of positioning posts 2 by means of a plurality of positioning screws 10 , and a plurality of annular buffer pads 11 can play a role of buffering and shock absorption.

[0029] In a further preferred embodiment of the utility model, the aluminum alloy housing 1 is provided with a plurality of audio input terminals 12 , audio output terminals 13 and adjustment knobs 14 , and the plurality of audio input terminals 12 , audio output terminals 13 and adjustment knobs 14 are all electrically connected to the circuit board 3 .

[0030] In this embodiment, multiple channels of analog audio signals can be input through the multiple audio input terminals 12 , analog audio signals can be output through the audio output terminal 13 , and the volume can be adjusted through the adjustment knob 14 .

[0031] In a further preferred embodiment of the present invention, a touch screen 15 and a switch 16 are disposed on the aluminum alloy housing 1 , and both the touch screen 15 and the switch 16 are electrically connected to the circuit board 3 .

[0032] In this embodiment, the working status of the device can be displayed and the device can be operated and controlled by the touch screen 15, and the switch 16 can be used to switch between the wired mode and the Bluetooth mode.

[0033] In a further preferred embodiment of the utility model, a lithium battery 17 is arranged on the inner wall of the aluminum alloy shell 1, and a USB-C charging interface 18 is arranged on one side of the aluminum alloy shell 1, and the lithium battery 17 is electrically connected to the circuit board 3 and the USB-C charging interface 18.

[0034] In this embodiment, the device can be powered by a lithium battery 17. The capacity of the lithium battery 17 is 1100 mAh, which can meet 12 hours of wired use or 6 hours of Bluetooth use. The lithium battery 17 can be charged by an external charging cable through the USB-C charging interface 18.

[0035] In a further preferred embodiment of the utility model, the active heat dissipation mechanism includes: a thermal pad 19 arranged on the circuit board 3; a heat sink 20 arranged on the thermal pad 19; an air inlet 21 opened on the aluminum alloy shell 1; a dust screen 22 and a fan 23 arranged on the air inlet 21, and the fan 23 is electrically connected to the circuit board 3; and a plurality of air outlet holes 24 opened on the aluminum alloy shell 1.

[0036] In this embodiment, the fan 23 blows the air flow toward the heat sink 20 through the air inlet 21, thereby dissipating heat and cooling the analog signal processing module 4, the Bluetooth module 5, the Wi F i module 6 and the communication module 7. The heated air flow is discharged to the outside of the aluminum alloy shell 1 along the multiple air outlets 24, and the dust-proof net 22 can reduce the entry of dust into the interior of the aluminum alloy shell 1.

[0037] In a further preferred embodiment of the present invention, a temperature sensor is disposed on the heat sink 20 , and the temperature sensor is electrically connected to the circuit board 3 .

[0038] In this embodiment, the temperature of the heat sink 20 can be monitored by a temperature sensor, and the circuit board 3 controls the start and stop of the fan 23 according to the temperature of the heat sink 20, thereby realizing an active heat dissipation function.

[0039] In summary, compared with related technologies, this device can not only perfectly integrate audio signals of different channels, allowing the volume ratio of mid-high and low bass sources to be adjusted at will, bringing you an unprecedented auditory feast, but also facilitates switching between wired and Bluetooth modes, and has an active heat dissipation function, thereby ensuring the stability of the device in hot weather.

[0040] In the several embodiments provided in this application, it should be understood that the disclosed device can be implemented in other ways.

[0041] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit the protection scope of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Although the utility model has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the utility model according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the utility model in essence, and these technical solutions also belong to the scope of protection of the utility model.

Claims

1. An earphone amplifier for facilitating audio adjustment, characterized in that: include: An aluminum alloy housing with a plurality of positioning columns fixedly mounted on the inner wall of the bottom; A circuit board provided on the plurality of positioning posts and having an analog signal processing module, a Bluetooth module, a WiFi module and a communication module; An active heat dissipation mechanism is arranged on the aluminum alloy housing, and the active heat dissipation mechanism is used to dissipate heat and cool down the analog signal processing module, the Bluetooth module, the WiFi module and the communication module.

2. The headphone amplifier for facilitating audio adjustment as claimed in claim 1, characterized in that: A SIM card slot is provided at the bottom of the aluminum alloy housing, and the SIM card slot is electrically connected to the communication module.

3. The headphone amplifier for facilitating audio adjustment as claimed in claim 1, characterized in that: Screw holes are provided on the plurality of positioning posts, a plurality of positioning screws are arranged on the circuit board, the plurality of positioning screws are respectively threadedly connected with the inner walls of the plurality of screw holes, and a plurality of annular buffer pads are slidably sleeved on the plurality of positioning screws.

4. The headphone amplifier for facilitating audio adjustment as claimed in claim 1, characterized in that: The aluminum alloy housing is provided with a plurality of audio input terminals, audio output terminals and adjusting knobs, and the plurality of audio input terminals, audio output terminals and adjusting knobs are all electrically connected to the circuit board.

5. The headphone amplifier for facilitating audio adjustment as claimed in claim 1, characterized in that: The aluminum alloy housing is provided with a touch screen and a switch, and both the touch screen and the switch are electrically connected to the circuit board.

6. The headphone amplifier for facilitating audio adjustment as claimed in claim 1, characterized in that: A lithium battery is arranged on the inner wall of the aluminum alloy shell, a USB-C charging interface is arranged on one side of the aluminum alloy shell, and the lithium battery is electrically connected to the circuit board and the USB-C charging interface.

7. The headphone amplifier for facilitating audio adjustment as claimed in claim 1, characterized in that: The active heat dissipation mechanism comprises: A thermal pad disposed on the circuit board; A heat sink disposed on the thermal pad; An air inlet is provided on the aluminum alloy housing; A dust screen and a fan are arranged on the air inlet, and the fan is electrically connected to the circuit board; A plurality of air outlet holes are provided on the aluminum alloy housing.

8. The headphone amplifier for facilitating audio adjustment as claimed in claim 7, characterized in that: A temperature sensor is arranged on the heat sink, and the temperature sensor is electrically connected to the circuit board.

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