High-temperature adhesive tape cooling device
Patent Information
- Application Number
- CN202420157156.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-23
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-01-23
AI Technical Summary
The existing high-temperature tape cooling device is costly and has poor expansion, making it difficult to achieve efficient cooling and shaping, resulting in deformation and distortion of the tape in the later stage of production and manufacturing.
The expandable cooling chamber device is adopted, which includes an extended blower bracket and an air inlet duct. The cooling chamber is designed to be connected by a telescopic plate to expand the expansion blower bracket inside, and the nozzle blows the air toward the front and back of the tape to improve cooling efficiency.
Low-cost and efficient tape cooling is achieved, avoiding deformation and distortion of tape in the later stage of production and manufacturing, and reducing construction and maintenance costs.
Smart Images

Figure CN222317453U_ABST