Adjustable camera support and die bonder

CN222437526UActive Publication Date: 2025-02-07YOUGUANG INTELLIGENT SEMICON TECH (SHENZHEN) CO LTD
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Patent Information

Application Number
CN202323661344.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-29
Publication Date
2025-02-07
Estimated Expiration
2033-12-29

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    Figure CN222437526U_ABST
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Abstract

The utility model discloses an adjustable camera support and a die bonder, the adjustable camera support comprises a first installation body and a second installation body, the middle area of the first installation body is provided with a first long hole, the long axis direction of the first long hole is arranged along the X-axis direction, and the second installation body is located above the first installation body. A through groove communicated with the bottom face of the second installation body is formed in the top of the second installation body, arm parts are formed on the two opposite sides of the through groove respectively, second long holes are formed in the arm parts, the long axis direction of the second long holes is arranged in the Y-axis direction, first screw holes are formed in the positions, corresponding to the second long holes, of the top face of the first installation body, and second screw holes are formed in the positions, corresponding to the second long holes, of the top face of the second installation body. The first installation body and the second installation body are fixedly connected through first installation screws which penetrate through the second long holes and are connected with the first screw holes, and when the adjustable camera support is overlooked, the first long holes are located in the through grooves. The adjustable camera support is novel in structure, small in size, convenient to adjust by a user and good in structural stability.
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Citation Information

Patent Citations

  • Novel die bonding device of LED die bonder

    CN209929338U