Relay device

Abstract

The relay device comprises a relay unit and a bottom plate, the relay unit is provided with a high-voltage side and a low-voltage side, the high-voltage side of the relay unit is provided with a load leading-out structure, the low-voltage side of the relay unit is provided with a coil leading-out structure, and the bottom plate is provided with a first isolation groove penetrating in the thickness direction. The first isolation groove is located between the load leading-out structure and the coil leading-out structure and used for prolonging a creepage path between the load leading-out structure and the coil leading-out structure on the surface of the bottom plate. Through the design, a creepage path between the load leading-out structure and the coil leading-out structure on the surface of the bottom plate can be prolonged by using the first isolation groove, and the insulation performance between high voltage and low voltage of the relay device is improved.

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