Anti-interference aluminum substrate

CN222509813UActive Publication Date: 2025-02-18XIAMEN TOPSTAR LIGHTING
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Patent Information

Application Number
CN202421101598.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-20
Publication Date
2025-02-18
Estimated Expiration
2034-05-20

AI Technical Summary

Technical Problem

The existing aluminum substrates have shortcomings in their anti-interference ability, especially circuits that are susceptible to interference such as radio frequency lines, and the traditional arrangement of conductive parts increases component complexity and assembly difficulty.

Method used

By opening a through hole on the copper foil layer and setting a conductive layer on the inner wall of the through hole, the copper foil layer and the aluminum base are connected by the conductive layer to improve the anti-interference ability. The conductive layer is made of carbon oil material, which is adhered to the inner wall of the through hole by baking to ensure the reliability of the connection.

Benefits of technology

This design improves the anti-interference ability of interference-prone circuits such as radio frequency lines, simplifies the overall structure, reduces component complexity, and increases the heat dissipation area of ​​circuit components through the opening of through holes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of electronic equipment, in particular to an anti-interference aluminum substrate which comprises a copper foil layer and an aluminum base, the copper foil layer is arranged on the aluminum base, a through hole communicated with the aluminum base is formed in the copper foil layer, a conducting layer is arranged on the inner wall of the through hole, and the conducting layer is connected with the copper foil layer and the aluminum base. The conductive layer is used for connecting the copper foil layer and the aluminum base, so that the anti-interference capability of other circuits, such as a radio frequency circuit, which are susceptible to interference can be improved. Compared with the arrangement of the traditional conductive piece, the design of the conductive layer can simplify the overall structure and reduce the complexity of components; through the arrangement of the through holes, the arrangement of the conductive layer can be satisfied and the heat dissipation area of the circuit assembly can be improved.
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