Lamp bead based on front bonding pad and vehicle lamp

Abstract

The utility model discloses a lamp bead based on a front bonding pad and a vehicle lamp, and relates to the field of vehicle lamps. A flip chip capable of emitting light, wherein the flip chip is electrically connected with the substrate; a bonding pad is arranged on the front surface of the substrate, the flip chip and the substrate are packaged through the bonding pad, and the bonding pad is used for being connected with a power supply; and a heat dissipation plate, wherein the heat dissipation plate is attached to the substrate. According to the invention, the bonding pad is arranged on the front surface of the substrate, so that the flip chip can be directly welded on the front surface of the substrate, the flip chip can be directly and externally connected with a lead through the bonding pad without perforation conduction, the installation is more convenient, the heat dissipation plate is directly attached to the substrate for heat dissipation without being arranged in a circuit layer of the substrate, and the installation is simpler and more convenient. The contact area of the substrate and the heat dissipation plate is also increased, and the heat dissipation efficiency is higher.

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