PCB (Printed Circuit Board) substrate heat dissipation device

Abstract

The utility model relates to the technical field of PCB (Printed Circuit Board) substrate processing, in particular to a PCB substrate heat dissipation device. According to the technical scheme, the conveying device comprises a fixing cover, a conveying frame and a conveying roller, the conveying roller is rotationally installed on the inner side of the conveying frame through a rotating shaft, an air outlet is formed in the surface of the conveying roller, rubber protruding particles are evenly distributed on the surface of the conveying roller adjacent to the air outlet, and conveying pipes are fixedly installed on the two sides of the conveying frame; a guide pipe communicating with the conveying rollers is fixedly installed on the inner side of the conveying pipe, and the guide pipe is rotationally connected with the conveying rollers through sealing bearings. According to the utility model, through the combination of various structures, the device can effectively reduce the contact area of the bottom of a PCB substrate, so that the blown air flow can uniformly perform heat dissipation and cooling operation on the bottom of the PCB substrate, the air blowing head is inclined, heat can be driven to move towards the air suction cover, the air flow with heat can be conveniently and quickly sucked out, and the service life of the PCB substrate is prolonged. And the heat is prevented from remaining in the fixed cover to influence the heat dissipation effect of the PCB substrate.

Images