A semiconductor lead frame processing injection molding device

Abstract

The utility model discloses a semiconductor lead frame processing injection molding device, which belongs to the field of semiconductor lead frame processing technology, and includes a workbench, and the upper end surface of the workbench is equipped with an adjustment component. The semiconductor lead frame processing injection molding device of the utility model has the advantages of improving production efficiency and reducing defective rate. When the injection molding is completed, the first guide rod cylinder is controlled to drive the guide rod at the output end to retract upward, so that the set connection block is driven to move upward, and the mounting block drives the second mold to move to one side, so that the semiconductor lead frame after the injection molding is quickly demoulded, thereby shortening the production cycle and improving production efficiency. Through the limitation of the mounting block by the two sliding rods, and the auxiliary cooperation of the slide rail and the slider, the alignment degree of the first mold and the second mold is improved, thereby avoiding the problem of poor matching clearance between the first mold and the second mold, reducing the defective rate of the product and reducing unnecessary economic losses.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor lead frame processing, and in particular relates to a semiconductor lead frame processing injection molding device. Background Art

[0002] The semiconductor lead frame is a structure used when packaging semiconductor chips to connect the pins of the chip to the external circuit. It is made of metal and has good conductivity and plasticity. The main functions of the lead frame include achieving electrical connections, providing mechanical support, and assisting in thermal management. In the packaging process, the lead frame plays a key role in ensuring that the chip can work properly and connect to the external system.

[0003] In the existing technology, when performing injection molding processing on semiconductor lead frames, the existing injection molding device has the problem of slow material removal, which can easily lead to an extension of the production cycle and reduce production efficiency. At the same time, the matching clearance between the upper mold and the lower mold is poor, which can easily lead to an increase in the defective rate of the product and cause unnecessary economic losses. Therefore, a semiconductor lead frame processing injection molding device is proposed to solve the above problems. Utility Model Content

[0004] In view of one or more of the above defects or improvement needs in the prior art, the utility model provides a semiconductor lead frame processing injection molding device, which has the advantages of improving production efficiency and reducing defective rate.

[0005] To achieve the above-mentioned purpose, the utility model provides a semiconductor lead frame processing injection molding device, comprising a workbench, the upper end surface of the workbench is equipped with two positioning plates and the two positioning plates are arranged in parallel, the upper end surfaces of the two positioning plates are jointly equipped with two connecting plates, and the upper end surface of the workbench is also equipped with an adjustment component;

[0006] The adjusting assembly includes a first mounting frame mounted on the upper end surface of the workbench, a first guide rod cylinder is mounted on the upper end surface of the first mounting frame, a guide rod is connected to the output end of the first guide rod cylinder, and the guide rod passes through the upper end surface of the first mounting frame and is connected to a connecting block, a groove is provided at the lower end of the connecting block, and a traction rod and a push rod are rotatably connected in the groove via a rotating shaft, a first connecting piece is mounted on one side of one of the positioning plates, one end of the traction rod is rotatably connected to the first connecting piece via a rotating shaft, and one end of the push rod is rotatably connected to the second connecting piece via a rotating shaft, a mounting block is mounted on one side of the second connecting piece, and a second mold is mounted on one side of the mounting block.

[0007] As a further improvement of the utility model, a second mounting frame is commonly installed on one side of the upper end surfaces of the two connecting plates, a second guide rod cylinder is installed on the upper end surface of the second mounting frame, a cylinder guide rod is connected to the output end of the second guide rod cylinder and the cylinder guide rod passes through the upper end surface of the second mounting frame, the cylinder guide rod is vertically arranged and an injection molding head is installed at the lower end, and the lower end of the injection molding head passes through the lower end surface of the second mounting frame.

[0008] As a further improvement of the utility model, two sliding rods are provided between the two positioning plates, and the two sliding rods both pass through the mounting block. A first mold is slidably provided outside the two sliding rods, and the first mold and the second mold are arranged oppositely and parallelly.

[0009] As a further improvement of the utility model, the upper end surface of the workbench is equipped with two slide rails and the two slide rails are arranged in parallel. Two sliders are slidably embedded on the two slide rails, and the mounting block and the lower end of the first mold are respectively connected to the two adjacent sliders.

[0010] As a further improvement of the utility model, a limiting rod is penetrated on one side of one of the positioning plates, one end of which extends through the mounting block, and a fixing rod is penetrated on one side of the other positioning plate, one end of which is connected to the first mold.

[0011] As a further improvement of the utility model, a rectangular groove is provided on the workbench and is located at the lower ends of the first mold and the second mold, and a discharge hopper is installed on the lower end surface of the workbench and is located at the lower end of the rectangular groove.

[0012] In general, compared with the prior art, the above technical solutions conceived by the utility model have the following beneficial effects:

[0013] The semiconductor lead frame processing injection molding device of the utility model cooperates with each other among the components in the arranged adjustment assembly. After the injection molding is completed, the first guide rod cylinder is controlled to drive the guide rod at the output end to retract upward, so that the arranged connection block is driven to move upward. Through the traction and cooperation of the arranged traction rod and the ejector rod, the mounting block drives the second mold to move to one side, so that the semiconductor lead frame after the injection molding is completed can be quickly demolded, thereby shortening the production cycle and improving the production efficiency. Through the limitation of the mounting block by the arranged two slide bars and the auxiliary cooperation of the slide rail and the slide block, the alignment degree of the first mold and the second mold is improved, thereby avoiding the problem of poor matching gap between the first mold and the second mold, reducing the defective rate of the product and reducing unnecessary economic losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall installation structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the overall installation structure of the utility model;

[0016] Figure 3 This is a schematic diagram of the installation structure of the adjustment component of the utility model.

[0017] In all the drawings, the same figure marks represent the same technical features, specifically: 1. workbench; 11. positioning plate; 111. first connecting member; 12. connecting plate; 13. sliding rod; 14. sliding rail; 141. sliding block; 15. limiting rod; 16. fixing rod; 2. adjustment assembly; 20. first mounting bracket; 21. first guide rod cylinder; 22. connecting block; 23. pulling rod; 24. push rod; 25. second connecting member; 26. mounting block; 3. second mounting bracket; 31. second guide rod cylinder; 32. cylinder guide rod; 33. injection head; 4. first mold; 5. second mold; 6. discharge hopper. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] Example

[0020] Depend on Figure 1-3 A semiconductor lead frame processing injection molding device is provided, comprising a workbench 1, the upper end surface of the workbench 1 is equipped with two positioning plates 11 and the two positioning plates 11 are arranged in parallel, the upper end surfaces of the two positioning plates 11 are jointly equipped with two connecting plates 12, and the upper end surface of the workbench 1 is also equipped with an adjustment component 2;

[0021] The adjusting assembly 2 includes a first mounting frame 20 mounted on the upper end surface of the workbench 1, and a first guide rod cylinder 21 is mounted on the upper end surface of the first mounting frame 20. A guide rod is connected to the output end of the first guide rod cylinder 21, and the guide rod passes through the upper end surface of the first mounting frame 20 and is connected to a connecting block 22. A groove is provided at the lower end of the connecting block 22, and a traction rod 23 and a push rod 24 are rotatably connected in the groove through a rotating shaft. A first connecting member 111 is mounted on one side of one of the positioning plates 11, and one end of the traction rod 23 is rotatably connected to the first connecting member 111 through a rotating shaft, and one end of the push rod 24 is rotatably connected to the second connecting member 25 through a rotating shaft, and a mounting block 26 is mounted on one side of the second connecting member 25, and a second mold 5 is mounted on one side of the mounting block 26.

[0022] In this embodiment, through the mutual cooperation between the components in the set adjustment component 2, when the injection molding is completed, the first guide rod cylinder 21 is controlled to drive the guide rod at the output end to retract upward, so that the set connecting block 22 is driven to move upward, and through the traction and cooperation of the set traction rod 23 and the push rod 24, the mounting block 26 drives the second mold 5 to move to one side, so that the semiconductor lead frame can be quickly demolded after the injection molding is completed, thereby shortening the production cycle and improving production efficiency. Through the limitation of the mounting block 26 by the two sliding bars 13 and the auxiliary cooperation of the slide rail 14 and the slider 141, the alignment of the first mold 4 and the second mold 5 is improved, thereby avoiding the problem of poor matching clearance between the first mold 4 and the second mold 5, reducing the defective rate of the product and reducing unnecessary economic losses.

[0023] Specifically, refer to Figure 1-2 A second mounting frame 3 is commonly assembled on one side of the upper end surfaces of the two connecting plates 12, and a second guide rod cylinder 31 is assembled on the upper end surface of the second mounting frame 3. A cylinder guide rod 32 is connected to the output end of the second guide rod cylinder 31 and the cylinder guide rod 32 passes through the upper end surface of the second mounting frame 3. The cylinder guide rod 32 is vertically arranged and an injection head 33 is assembled on the lower end, and the lower end of the injection head 33 passes through the lower end surface of the second mounting frame 3.

[0024] In this embodiment, the injection head 33 is located at the upper end of the first mold 4. By controlling the second guide rod cylinder 31, the second guide rod cylinder 31 drives the cylinder guide rod 32 connected to the output end downward, so that the cylinder guide rod 32 pushes the injection head 33 downward, and the injection molding operation can be performed.

[0025] Specifically, refer to Figure 1-3 Two slide bars 13 are provided between the two positioning plates 11 , and the two slide bars 13 both pass through the mounting block 26 . A first mold 4 is provided outside the two slide bars 13 for sliding movement, and the first mold 4 and the second mold 5 are provided in opposite parallel directions.

[0026] In this embodiment, the two slide bars 13 are used to limit the mounting block 26 and the first mold 4, so that the mounting block 26 can be more stable when moving, and the alignment between the second mold 5 and the first mold 4 can be improved.

[0027] Specifically, refer to Figure 1-3 The upper end surface of the workbench 1 is equipped with two slide rails 14 and the two slide rails 14 are arranged in parallel. Two sliders 141 are slidably engaged on the two slide rails 14. The mounting block 26 and the lower end of the first mold 4 are respectively connected to the two adjacent sliders 141.

[0028] In this embodiment, the lower end of the mounting block 26 is connected to the two sliding blocks 141. When the mounting block 26 moves, it slides within the travel range of the two slide rails 14, which can improve stability.

[0029] Specifically, refer to Figure 3 A limiting rod 15 is provided on one side of one positioning plate 11 , and one end of the limiting rod 15 extends through the mounting block 26 ; a fixing rod 16 is provided on one side of the other positioning plate 11 , and one end of the fixing rod 16 is connected to the first mold 4 .

[0030] In this embodiment, the limiting rod 15 passes through the mounting block 26 and limits the mounting block 26, so that the mounting block 26 can be more stable when moving. The fixed rod 16 is used to limit the first mold 4.

[0031] Specifically, refer to Figure 1-3 A rectangular groove is provided on the workbench 1 and is located at the lower ends of the first mold 4 and the second mold 5. A discharge hopper 6 is provided on the lower end surface of the workbench 1 and is located at the lower end of the rectangular groove.

[0032] In this embodiment, after the injection molding is completed, the demoulded semiconductor lead frame product falls from the rectangular groove provided on the workbench 1 to the discharge hopper 6, and the injection molding process of the semiconductor lead frame can be completed after being collected.

[0033] The semiconductor lead frame processing injection molding device of the utility model:

[0034] In actual use, before using the device, the staff first connects the second guide rod cylinder 31 and the first guide rod cylinder 21 to an external air source and gives the cylinder an output value, and then controls the first guide rod cylinder 21 so that the first guide rod cylinder 21 drives the guide rod at the output end downward and squeezes the connecting block 22 connected to the guide rod. When the connecting block 22 moves downward, the traction rod 23 is limited so that the traction rod 23 drives the top rod 24 connected to the other side to move, so that the top rod 24 pushes the mounting block 26 connected at one end through the second connecting piece 25 to move. The lower end of the mounting block 26 is connected to two sliders 141. When the mounting block 26 is driven, it slides within the travel range of the slide rail 14. , and moves to one side of the first mold 4, finally making the second mold 5 approach and merge with the first mold 4, then controlling the second guide rod cylinder 31, so that the second guide rod cylinder 31 drives the cylinder guide rod 32 connected to the output end downward, so that the cylinder guide rod 32 pushes the injection head 33 downward and performs injection molding, after the injection molding is completed, controlling the second guide rod cylinder 31 to drive the injection head 33 to rise, then controlling the first guide rod cylinder 21 to drive the guide rod to retract, so that the connecting block 22 is driven to rise, and finally making the second mold 5 move to one side and demolding, and the semiconductor lead frame product after demolding falls from the rectangular groove set on the workbench 1 to the discharge hopper 6, and the injection molding process of the semiconductor lead frame can be completed after collection.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor lead frame processing injection molding device, characterized in that: The workbench (1) comprises two positioning plates (11) mounted on the upper end surface of the workbench (1), and the two positioning plates (11) are arranged in parallel, the upper end surfaces of the two positioning plates (11) are jointly mounted with two connecting plates (12), and the upper end surface of the workbench (1) is also mounted with an adjustment component (2); The adjustment assembly (2) comprises a first mounting frame (20) mounted on the upper end surface of the workbench (1); the upper end surface of the first mounting frame (20) is mounted with a first guide rod cylinder (21); the output end of the first guide rod cylinder (21) is connected with a guide rod, and the guide rod passes through the upper end surface of the first mounting frame (20) and is connected with a connecting block (22); the lower end of the connecting block (22) is provided with a groove, and a traction rod (23) and a push rod (24) are rotatably connected in the groove via a rotating shaft; one side of one of the positioning plates (11) is mounted with a first connecting member (111); one end of the traction rod (23) is rotatably connected to the first connecting member (111) via a rotating shaft; one end of the push rod (24) is rotatably connected to a second connecting member (25) via a rotating shaft; one side of the second connecting member (25) is mounted with a mounting block (26); one side of the mounting block (26) is mounted with a second mold (5).

2. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: A second mounting frame (3) is commonly mounted on one side of the upper end surfaces of the two connecting plates (12); a second guide rod cylinder (31) is mounted on the upper end surface of the second mounting frame (3); a cylinder guide rod (32) is connected to the output end of the second guide rod cylinder (31), and the cylinder guide rod (32) passes through the upper end surface of the second mounting frame (3); the cylinder guide rod (32) is vertically arranged and an injection head (33) is mounted on the lower end; the lower end of the injection head (33) passes through the lower end surface of the second mounting frame (3).

3. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: Two sliding rods (13) are provided between the two positioning plates (11), and the two sliding rods (13) both pass through the mounting block (26). A first mold (4) is slidably provided outside the two sliding rods (13), and the first mold (4) and the second mold (5) are arranged in parallel and opposite to each other.

4. The semiconductor lead frame processing injection molding device according to claim 3, characterized in that: The upper end surface of the workbench (1) is equipped with two slide rails (14) which are arranged in parallel. Two sliding blocks (141) are slidably engaged on the two slide rails (14). The mounting block (26) and the lower end of the first mold (4) are respectively connected to two adjacent sliding blocks (141).

5. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: A limiting rod (15) is provided through one side of one of the positioning plates (11), one end of which extends through the mounting block (26); a fixing rod (16) is provided through one side of the other positioning plate (11), one end of which is connected to the first mold (4).

6. The semiconductor lead frame processing injection molding device according to claim 1, characterized in that: The workbench (1) is provided with a rectangular groove, and the rectangular groove is located at the lower end of the first mold (4) and the second mold (5); the lower end surface of the workbench (1) is equipped with a discharge hopper (6), and the discharge hopper (6) is located at the lower end of the rectangular groove.

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