LED lamp beads, LED display units and LED devices

Abstract

The utility model provides an LED lamp bead, an LED display unit and an LED device, wherein the LED lamp bead comprises: a carrier board; a chip, which is arranged on the carrier board; a first encapsulation layer, which is arranged on the upper surface of the carrier board, and the chip extends into the first encapsulation layer; a second encapsulation layer, which is covered on the first encapsulation layer, and the first encapsulation layer and the second encapsulation layer are both made of light-transmitting materials, and the light transmittance of the first encapsulation layer is greater than the light transmittance of the second encapsulation layer. The technical solution provided by the present application can solve the problem in the related art that the chip is separated and covered by a metal frame cover or an opaque plastic frame cover, which will cause the chip to be unable to realize side light emission, and then the consistency of each viewing angle of the chip cannot be guaranteed, and the user's use requirements cannot be met and the display effect is affected.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB, and in particular to an LED lamp bead, an LED display unit and an LED device. Background Art

[0002] Today, display products are widely used, for example, in the display of operating information of household appliances and in single-color, dual-color and full-color LED display screens. Among them, the PCB and the chip encapsulated on the PCB are matched, and the protective layer is used to completely wrap and seal the chip, thereby ensuring the display effect of the LED display screen when the screen is on.

[0003] In the related art, a multi-layer film is provided on the chip to ensure the brightness of the LED lamp bead.

[0004] However, the multilayer film in the related technology is set on the chip, which will cause the chip to radiate light along the multilayer film when emitting light. When the side of the chip emits light, the multilayer film is laid flat on the carrier board and the consistency of the chip at various viewing angles cannot be guaranteed, which cannot meet the user's usage needs and affects the display effect. Utility Model Content

[0005] The utility model provides an LED lamp bead, an LED display unit and an LED device to solve the problem in the related art that a chip is separated and covered by a metal frame cover or an opaque plastic frame cover, which makes it impossible for the chip to achieve side light emission, and further makes it impossible to ensure the consistency of each viewing angle of the chip, which cannot meet the user's usage needs and affects the display effect.

[0006] According to one aspect of the utility model, an LED lamp bead is provided, and the LED lamp bead includes: a carrier board; a chip, which is arranged on the carrier board; a first packaging layer, which is arranged on the upper surface of the carrier board, and the chip extends into the first packaging layer; a second packaging layer, which is covered on the first packaging layer, and the first packaging layer and the second packaging layer are both made of light-transmitting materials, and the light transmittance of the first packaging layer is greater than the light transmittance of the second packaging layer.

[0007] Furthermore, the top wall of the second packaging layer is covered on the top wall of the first packaging layer, and the side walls of the second packaging layer are attached to the side walls of the first packaging layer and the side walls of the carrier.

[0008] Furthermore, a mounting groove is provided on the outer edge of the carrier, and the mounting groove is an annular structure extending along the circumference of the carrier, and the side wall of the second packaging layer extends into the mounting groove, and the thickness of the side wall of the second packaging layer remains unchanged in the direction from top to bottom.

[0009] Furthermore, the lower surface of the mounting groove has a cutting bevel.

[0010] Further, the thickness of the top wall of the second encapsulation layer is equal to the thickness of the side wall of the second encapsulation layer.

[0011] Further, the thickness of the side wall of the second encapsulation layer is greater than the thickness of the top wall of the second encapsulation layer.

[0012] Furthermore, the first encapsulation layer is a transparent layer; and / or the first encapsulation layer is filled with diffusion powder.

[0013] Furthermore, the second packaging layer is filled with black glue; and / or the thickness of the first packaging layer is set between 100 microns and 200 microns.

[0014] According to another aspect of the utility model, an LED display unit is provided, the LED display unit comprising: a PCB board; a plurality of LED lamp beads arranged on the PCB board, the LED lamp beads being the LED lamp beads provided above.

[0015] According to another aspect of the utility model, an LED device is provided, comprising: a frame; and a plurality of LED display units arranged on the frame, wherein the plurality of LED display units are the LED display units provided above.

[0016] By applying the technical solution of the utility model, the LED lamp bead includes a carrier board, a chip, a first packaging layer and a second packaging layer. The chip is arranged on the carrier board, and the first packaging layer is arranged on the upper surface of the carrier board. Since the first packaging layer is made of a light-transmitting material, the brightness of the chip can be ensured under the action of the first packaging layer, and the light of the chip can be dispersed through the first packaging layer. The second packaging layer is covered on the first packaging layer, and the second packaging layer is made of a light-transmitting material. In this way, since the second packaging layer is covered on the first packaging layer, the chip can disperse light to the top wall and side wall of the second packaging layer, so that the light can ensure the consistency of each viewing angle of the side wall and the top wall of the first packaging layer when the chip is emitting light, which can meet the user's usage requirements, and the transmittance of the first packaging layer is greater than the transmittance of the second packaging layer, which can ensure that the LED lamp bead has a contrast and improve the practicality of the LED lamp bead. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings constituting part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0018] Figure 1 A schematic diagram of an LED lamp bead provided in an embodiment of the utility model is shown.

[0019] The above drawings include the following reference numerals:

[0020] 10. Carrier board; 11. Mounting groove;

[0021] 20. Chip;

[0022] 30. A first encapsulation layer;

[0023] 40. The second encapsulation layer. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the utility model and its application or use. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0025] like Figure 1 As shown, an embodiment of the utility model provides an LED lamp bead, which includes a carrier board 10, a chip 20, a first packaging layer 30 and a second packaging layer 40. The chip 20 is arranged on the carrier board 10, the first packaging layer 30 is arranged on the upper surface of the carrier board 10, the chip 20 extends into the first packaging layer 30, and the second packaging layer 40 is covered on the first packaging layer 30. The first packaging layer 30 and the second packaging layer 40 are both made of light-transmitting materials, and the light transmittance of the first packaging layer 30 is greater than the light transmittance of the second packaging layer 40.

[0026] The LED lamp bead provided by the present embodiment is applied, and the LED lamp bead includes a carrier board 10, a chip 20, a first packaging layer 30 and a second packaging layer 40. The chip 20 is arranged on the carrier board 10, and the first packaging layer 30 is arranged on the upper surface of the carrier board 10. Since the first packaging layer 30 is made of a light-transmitting material, it is convenient to ensure the brightness of the chip 20 under the action of the first packaging layer 30, and it is convenient to diverge the light of the chip 20 through the first packaging layer 30. The second packaging layer 40 is covered on the first packaging layer 30, and the second packaging layer 40 is made of a light-transmitting material. In this way, since the second packaging layer 40 is covered on the first packaging layer 30, under the action of the second packaging layer 40, the chip 20 can diverge light to the top wall and the side wall of the second packaging layer 40, so that the light can ensure the consistency of the side wall and the top wall of the first packaging layer 30 at various viewing angles when the chip 20 emits light, which can meet the user's usage requirements, and the transmittance of the first packaging layer 30 is greater than the transmittance of the second packaging layer 40, which can ensure that the LED lamp bead has a contrast and improve the practicality of the LED lamp bead.

[0027] like Figure 1As shown, the top wall of the second encapsulation layer 40 is covered on the top wall of the first encapsulation layer 30, and the side walls of the second encapsulation layer 40 are attached to the side walls of the first encapsulation layer 30 and the side walls of the carrier 10. With the above structure, by covering the top wall of the second encapsulation layer 40 on the top wall of the first encapsulation layer 30, and attaching the side walls of the second encapsulation layer 40 to the side walls of the first encapsulation layer 30 and the side walls of the carrier 10, it is easy to ensure that the second encapsulation layer 40 can wrap the first encapsulation layer 30, the carrier 10 and the chip 20. In this way, when the chip 20 emits light, the chip 20 can diverge the light from the side walls and top wall of the second encapsulation layer 40, ensuring the consistency of the brightness of the chip 20 at various viewing angles, avoiding the problem of low brightness at a certain viewing angle, and improving the user experience.

[0028] like Figure 1 As shown, the outer edge of the carrier 10 is provided with a mounting groove 11, which is an annular structure extending along the circumference of the carrier 10, and the side wall of the second encapsulation layer 40 extends into the mounting groove 11, and the thickness of the side wall of the second encapsulation layer 40 remains unchanged from top to bottom. With the above structure, by providing the mounting groove 11 on the carrier 10, the mounting groove 11 is an annular structure extending along the circumference of the carrier 10, so that it is convenient to extend the side wall of the second encapsulation layer 40 into the mounting groove 11, which is convenient for production and processing, and can ensure that the second encapsulation layer 40 can be covered on the carrier 10, and because the thickness of the side wall of the second encapsulation layer 40 remains unchanged from top to bottom, it can ensure the consistency of brightness at each viewing angle when the chip 20 radiates light to the outside through the second encapsulation layer 40.

[0029] In this embodiment, the lower surface of the mounting groove 11 has a cutting bevel. With the above structure, by having the cutting bevel on the lower surface of the mounting groove 11, it is convenient to assemble the second packaging layer 40 with the mounting groove 11.

[0030] In this embodiment, the thickness dimension of the top wall of the second encapsulation layer 40 is equal to the thickness dimension of the side wall of the second encapsulation layer 40. With the above structure, by making the thickness dimension of the top wall of the second encapsulation layer 40 equal to the thickness dimension of the side wall of the second encapsulation layer 40, when the chip 20 faces the top wall of the second encapsulation layer 40 and the side wall of the second encapsulation layer 40, since the thickness dimension of the top wall of the second encapsulation layer 40 is equal to the thickness dimension of the side wall of the second encapsulation layer 40, the brightness of the light emitted by the chip 20 through the top wall of the second encapsulation layer 40 is consistent with the brightness of the light emitted by the side wall of the second encapsulation layer 40, ensuring that the brightness of the chip 20 at each viewing angle toward the second encapsulation layer 40 can be kept consistent, meeting the customer's brightness consistency requirements.

[0031] In other embodiments, the thickness of the side wall of the second encapsulation layer 40 is greater than the thickness of the top wall of the second encapsulation layer 40. The second encapsulation layer 40 of the above structure is used, and the thickness of the side wall of the second encapsulation layer 40 is greater than the thickness of the top wall of the second encapsulation layer 40. In this way, when the chip 20 emits light, the brightness of the light emitted by the chip 20 through the top wall of the second encapsulation layer 40 is brighter than the brightness of the light emitted by the side wall of the second encapsulation layer 40. This can meet the user's requirement of only considering axial light emission without considering lateral light emission, thereby improving the practicality of the LED lamp bead.

[0032] It should be noted that the LED lamp beads in this embodiment are first formed on the carrier board 10 using a molding machine or a film. The transmittance of the first packaging layer 30 is greater than that of the second packaging layer 40, which can reduce light loss. Then, a suitable splitting knife is used to cut out space on the carrier board 10, and then a molding machine or a single-sided film is used to form a second packaging layer 40 on the carrier board 10. This layer is mainly used to add black glue to ensure contrast and static blackness. Finally, a suitable splitting knife is used to cut the product to form an LED lamp bead.

[0033] Among them, by using different sizes of cleavers for cutting, the thickness of the top wall and the thickness of the side wall of the second packaging layer can be adjusted at any time. According to different product requirements, it can be flexibly switched to meet the customer's usage needs.

[0034] In this embodiment, the first packaging layer 30 is a transparent layer. With the above structure, it is convenient for the light emitted by the chip 20 to pass through the first packaging layer 30, thereby improving the brightness of the LED lamp bead.

[0035] In this embodiment, diffusion powder is filled in the first packaging layer 30. The first packaging layer 30 with the above structure is convenient for diffusing the light emitted by the chip 20.

[0036] In this embodiment, black glue is filled in the second encapsulation layer 40. The second encapsulation layer 40 with the above structure is convenient for ensuring the contrast of the LED lamp beads and meeting the use requirements of customers.

[0037] It should be noted that the proportion of black glue filled in the second packaging layer 40 is added according to the required contrast of the LED lamp beads. If a higher contrast is required, more black glue is filled, and if a lower contrast is required, less black glue is filled.

[0038] In this embodiment, the thickness of the first encapsulation layer 30 is set between 100 micrometers and 200 micrometers. By setting the thickness of the first encapsulation layer 30 within the above range, the brightness of the chip 20 passing through the first encapsulation layer 30 is ensured.

[0039] It should be noted that the thickness of the first encapsulation layer 30 can be 100 micrometers, 120 micrometers, 140 micrometers, 160 micrometers, 180 micrometers, 200 micrometers, or any other value between 100 micrometers and 200 micrometers.

[0040] Another embodiment of the utility model provides an LED display unit, the LED display unit includes a PCB board and a plurality of LED lamp beads, the plurality of LED lamp beads are arranged on the PCB board, and the LED lamp beads are the LED lamp beads provided above. With the above structure, the plurality of LED lamp beads are arranged on the PCB board, so as to ensure the brightness of the LED display unit.

[0041] Another embodiment of the utility model provides an LED device, the LED device includes a frame and a plurality of LED display units, the plurality of LED display units are arranged on the frame, and the plurality of LED display units are the LED display units provided above. With the above structure, by arranging the plurality of LED display units on the frame, it is convenient to assemble and fix the plurality of LED display units.

[0042] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0043] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0044] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0045] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0046] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0047] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An LED lamp bead, characterized in that: The LED lamp beads include: A carrier plate (10); A chip (20) is arranged on the carrier board (10); A first packaging layer (30) is arranged on the upper surface of the carrier (10), and the chip (20) extends into the first packaging layer (30); The second encapsulation layer (40) is covered on the first encapsulation layer (30), the first encapsulation layer (30) and the second encapsulation layer (40) are both made of light-transmitting materials, and the light transmittance of the first encapsulation layer (30) is greater than the light transmittance of the second encapsulation layer (40).

2. The LED lamp bead according to claim 1, characterized in that: The top wall of the second encapsulation layer (40) is covered on the top wall of the first encapsulation layer (30), and the side walls of the second encapsulation layer (40) are attached to the side walls of the first encapsulation layer (30) and the side walls of the carrier (10).

3. The LED lamp bead according to claim 2, characterized in that: The outer edge of the carrier (10) is provided with a mounting groove (11), the mounting groove (11) is an annular structure extending along the circumference of the carrier (10), the side wall of the second packaging layer (40) extends into the mounting groove (11), and the thickness of the side wall of the second packaging layer (40) remains unchanged in a direction from top to bottom.

4. The LED lamp bead according to claim 3, characterized in that: The lower surface of the mounting groove (11) has a cutting bevel.

5. The LED lamp bead according to claim 2, characterized in that: The thickness dimension of the top wall of the second encapsulation layer (40) is equal to the thickness dimension of the side wall of the second encapsulation layer (40).

6. The LED lamp bead according to claim 2, characterized in that: The thickness of the side wall of the second encapsulation layer (40) is greater than the thickness of the top wall of the second encapsulation layer (40).

7. The LED lamp bead according to any one of claims 1 to 6, characterized in that: The first encapsulation layer (30) is a transparent layer.

8. The LED lamp bead according to any one of claims 1 to 6, characterized in that: The second packaging layer (40) is filled with black glue; and / or, The thickness of the first packaging layer (30) is set between 100 micrometers and 200 micrometers.

9. An LED display unit, characterized in that: The LED display unit comprises: PCB board; A plurality of LED lamp beads are arranged on the PCB board, and the LED lamp beads are the LED lamp beads according to any one of claims 1 to 8.

10. An LED device, characterized in that: The LED device comprises: frame; A plurality of LED display units are arranged on the frame, and the plurality of LED display units are the LED display units described in claim 9.

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