Organic light emitting diode packaging structure, display panel and display device

Abstract

The utility model discloses an organic light emitting diode packaging structure, a display panel and a display device, comprising a transparent substrate, an organic light emitting diode and a packaging body, wherein the organic light emitting diode comprises a first electrode, a light emitting layer and a second electrode, wherein the first electrode is formed on the transparent substrate, the light emitting layer is formed on a side of the first electrode away from the transparent substrate, the second electrode is formed on a side of the light emitting layer away from the first electrode, and the packaging body is formed on a side of the second electrode away from the light emitting layer, wherein the packaging body comprises at least one packaging layer and at least one metal layer stacked in an interlaced manner, which can prevent external gas from penetrating into the light emitting layer through the gap at the contact point between the foreign matter and the second electrode, and prevent the light emitting layer from being oxidized and causing no light emission, thereby improving the display quality. In addition, the packaging body adopts a multi-layer stacking structure, and the contact surfaces of each layer can increase the diffusion interface during the diffusion process of external gas, slow down the diffusion speed, and improve the sealing performance.

Description

Technical Field

[0001] The utility model relates to display technology, in particular to a packaging structure of an organic light emitting diode, a display panel and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) display devices are self-luminous display devices that emit light by exciting organic compounds. OLED display devices do not require a backlight unit used in liquid crystal display devices, and thus have a thin profile and light weight as well as a simple manufacturing process. OLED display devices can also be manufactured at low temperatures and have a fast response time of 1ms or less, low power consumption, a wide viewing angle, and a high contrast ratio.

[0003] As the usage time increases, the pixels at the edges of the OLED display device will not emit light, reducing the display quality. Utility Model Content

[0004] The utility model provides a packaging structure of an organic light emitting diode, a display panel and a display device, which can improve the sealing performance, prevent external gas from penetrating into the light emitting layer through the gap at the contact point between the foreign matter and the second electrode, avoid the problem of the light emitting layer being oxidized and causing no light, and improve the display quality.

[0005] In a first aspect, the utility model provides a packaging structure of an organic light emitting diode, comprising:

[0006] Transparent substrate;

[0007] An organic light emitting diode, the organic light emitting diode comprising a first electrode, a light emitting layer, and a second electrode, the first electrode being formed on the transparent substrate, the light emitting layer being formed on a side of the first electrode away from the transparent substrate, and the second electrode being formed on a side of the light emitting layer away from the first electrode;

[0008] A packaging body is formed on a side of the second electrode away from the light-emitting layer, and the packaging body includes at least one packaging layer and at least one metal layer which are stacked alternately.

[0009] Optionally, the package body includes:

[0010] a first encapsulation layer, wherein the first encapsulation layer is formed on a side of the second electrode away from the light-emitting layer;

[0011] a metal layer, wherein the metal layer is formed on a side of the first encapsulation layer away from the second electrode;

[0012] A second packaging layer is formed on a side of the metal layer away from the first packaging layer.

[0013] Optionally, the metal layer is a metal aluminum layer.

[0014] Optionally, the organic light emitting diode further includes:

[0015] A filter film, wherein the filter film is formed on one side of the transparent substrate;

[0016] A protective layer, wherein the protective layer is formed on the transparent substrate and covers the filter film, and the first electrode is formed on a side of the protective layer away from the transparent substrate;

[0017] A light-shielding layer, wherein the light-shielding layer is formed on a side of the first electrode away from the protective layer, and the light-shielding layer is provided with a window at a position corresponding to the filter film, exposing a portion of the first electrode, and the light-emitting layer is provided on a side of the light-shielding layer away from the first electrode, and the light-emitting layer fills the window and contacts the first electrode.

[0018] Optionally, the filter film includes a red filter film, a green filter film and a blue filter film, and the red filter film, the green filter film and the blue filter film are formed at intervals on one side of the transparent substrate.

[0019] Optionally, the second electrode has a first extending portion extending toward a side wall of the light-emitting layer, and the first extending portion seals the side wall of the light-emitting layer.

[0020] Optionally, the package body has a second extending portion extending toward the side wall of the light emitting layer, the second extending portion is formed on a side of the first extending portion away from the light emitting layer, and the second extending portion seals the side wall of the light emitting layer.

[0021] Optionally, the packaging structure of the organic light emitting diode further includes:

[0022] an adhesive layer, the adhesive layer being disposed on a side of the package body away from the second electrode;

[0023] A metal back plate is arranged on a side of the adhesive layer away from the packaging body.

[0024] In a second aspect, the utility model further provides a display panel, comprising the packaging structure of the organic light emitting diode provided in the first aspect of the utility model.

[0025] In a third aspect, the present invention further provides a display device, comprising the display panel provided in the second aspect of the present invention.

[0026] The encapsulation structure of an organic light emitting diode provided by the utility model comprises a transparent substrate, an organic light emitting diode and an encapsulation body, wherein the organic light emitting diode comprises a first electrode, a light emitting layer and a second electrode, wherein the first electrode is formed on a transparent substrate, the light emitting layer is formed on a side of the first electrode away from the transparent substrate, the second electrode is formed on a side of the light emitting layer away from the first electrode, the encapsulation body is formed on a side of the second electrode away from the light emitting layer, and the encapsulation body comprises at least one encapsulation layer and at least one metal layer stacked in an interlaced manner, even if a foreign object falls onto the second electrode during the evaporation of the second electrode, causing a hole to appear in the second electrode, and cracks appear in the encapsulation layer subsequently evaporated on the second electrode at the foreign object, the metal layer subsequently evaporated can completely cover the foreign object to form a complete coating due to the good ductility of the metal layer. In this way, it is possible to prevent external gas from penetrating into the light emitting layer through the gap at the contact point between the foreign object and the second electrode, and to prevent the light emitting layer from being oxidized and causing no light emission, thereby improving the display quality. In addition, the encapsulation body adopts a multi-layer stacked structure, and the contact surfaces of each layer can increase the diffusion interface during the diffusion of external gas, slow down the diffusion rate, and improve the sealing performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The utility model is further described in detail below based on the drawings and embodiments.

[0028] Figure 1 Schematic diagram of the principle that the edge pixels will not emit light;

[0029] Figure 2 A schematic diagram of a packaging structure of an organic light emitting diode provided by an embodiment of the utility model;

[0030] Figure 3 A schematic diagram illustrating the packaging effect of the packaging structure of an organic light emitting diode provided by an embodiment of the utility model;

[0031] Figure 4 A schematic diagram of another packaging structure of an organic light emitting diode provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0032] In order to make the technical problems solved by the utility model, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the utility model will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0033] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present utility model, unless otherwise clearly stipulated and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature. In addition, the terms "first" and "second" are only used to distinguish in description and have no special meaning.

[0035] Figure 1 The schematic diagram of the principle that the edge pixels will not emit light is as follows: Figure 1 As shown, the existing packaging structure of the organic light-emitting diode includes a transparent substrate 11, an organic light-emitting diode (including an anode 12, a light-emitting layer 13 and a cathode 14), an encapsulation layer 15, an adhesive layer 16 and a backplane 17. Among them, the anode 12 is formed on the transparent substrate 11, the light-emitting layer 13 is formed on the side of the anode 12 away from the transparent substrate, and the cathode 14 is formed on the side of the light-emitting layer 13 away from the anode 12. The encapsulation layer 15 is formed on the side of the cathode 14 away from the light-emitting layer, and is used to seal the organic light-emitting diode. The adhesive layer 16 is formed on the side of the encapsulation layer 15 away from the cathode 14, and the backplane 17 is formed on the side of the adhesive layer 16 away from the encapsulation layer 15. Among them, the adhesive layer 16 is used to bond the encapsulation layer 15 and the backplane 17. As mentioned above, with the increase of the use time, the pixels at the edge of the OLED display device will not emit light. This is because during the evaporation process, foreign matter 21 falls onto the cathode 14 of the organic light-emitting diode, resulting in holes in the cathode 14, and cracks 18 appear in the subsequently evaporated encapsulation layer 15 at the foreign matter 21, failing to completely cover the foreign matter 21. A large amount of heat is generated during the use of the display device. As the use time increases, the adhesive layer 16 ages and the adhesion decreases. External gases (for example, oxygen and water vapor) penetrate into the light-emitting layer 13 through the cracks 18 of the encapsulation layer 15 and the gap at the contact between the foreign matter 21 and the cathode 14, causing the light-emitting layer 13 to be oxidized and no longer emit light.

[0036] In view of the above problems, the present invention provides a packaging structure of an organic light emitting diode. Figure 2 A schematic diagram of a packaging structure of an organic light emitting diode provided by an embodiment of the utility model is shown in FIG. Figure 2 As shown, the packaging structure of the organic light emitting diode includes:

[0037] The transparent substrate 110 , for example, may be a glass substrate, or a transparent flexible organic polymer substrate, which is not limited in the embodiment of the present utility model.

[0038] The organic light emitting diode 120 includes a first electrode 121, a light emitting layer 122 and a second electrode 123. The first electrode 121 is formed on a transparent substrate 110, the light emitting layer 122 is formed on a side of the first electrode 121 away from the transparent substrate 110, and the second electrode 123 is formed on a side of the light emitting layer 122 away from the first electrode 121. Exemplarily, in the embodiment of the utility model, the first electrode 121 is an anode, which can be an ultra-thin transparent indium tin oxide coating, a silver coating, etc., which is not limited in the embodiment of the utility model. The second electrode 123 is a cathode, which can be a metal coating such as aluminum, silver, copper, etc., which is not limited in the embodiment of the utility model. When the organic light emitting diode 120 is working, a voltage is applied to the first electrode 121 and the second electrode 123 to form a voltage difference, drive electrons and holes to migrate from the cathode and the anode to the light emitting layer 122 respectively, and meet in the light emitting layer 122 to form excitons and excite the light emitting molecules, which emit visible color light after radiation relaxation, for example, red light, blue light or green light.

[0039] The package body 130 is formed on a side of the second electrode 123 away from the light-emitting layer 122, and the package body 130 includes at least one package layer and at least one metal layer stacked alternately. Figure 2 As shown, the encapsulation body 130 includes a first encapsulation layer 131, a metal layer 132, and a second encapsulation layer 133. The first encapsulation layer 131 is formed on a side of the second electrode 123 away from the light-emitting layer 122, the metal layer 132 is formed on a side of the first encapsulation layer 131 away from the second electrode 123, and the second encapsulation layer 133 is formed on a side of the metal layer 132 away from the first encapsulation layer 131. Exemplarily, the encapsulation layer may be an organic encapsulation layer or an inorganic encapsulation layer, which is not limited in the embodiments of the present utility model.

[0040] Figure 3 A schematic diagram illustrating the packaging effect of an organic light emitting diode packaging structure provided by an embodiment of the utility model, as shown in FIG. Figure 3As shown, during the evaporation process, a foreign body 21 falls onto the second electrode 123 of the organic light-emitting diode, a hole appears in the second electrode 123, and a crack appears in the first packaging layer 131 subsequently evaporated at the foreign body 21. However, due to the good ductility of the metal layer 132, the subsequently evaporated metal layer 132 can completely cover the foreign body 21 to form a complete coating. Since the metal layer 132 is formed by evaporation after the first packaging layer 131, the metal layer 132 is relatively flatter, so the second packaging layer 133 formed on the metal layer 132 can also form a complete coating. In this way, it is possible to prevent external gas from penetrating into the light-emitting layer 122 through the gap at the contact point between the foreign body 21 and the second electrode 123, and to prevent the light-emitting layer 122 from being oxidized and causing no light, thereby improving the display quality. In addition, the packaging body 130 adopts a multi-layer stacked structure, and the contact surface of each layer can increase the diffusion interface during the diffusion process of external gas, slow down the diffusion rate, and improve the sealing performance.

[0041] The encapsulation structure of an organic light emitting diode provided by the embodiment of the utility model comprises a transparent substrate, an organic light emitting diode and an encapsulation body, wherein the organic light emitting diode comprises a first electrode, a light emitting layer and a second electrode, wherein the first electrode is formed on a transparent substrate, the light emitting layer is formed on a side of the first electrode away from the transparent substrate, the second electrode is formed on a side of the light emitting layer away from the first electrode, the encapsulation body is formed on a side of the second electrode away from the light emitting layer, and the encapsulation body comprises at least one encapsulation layer and at least one metal layer stacked in an interlaced manner, even if a foreign object falls onto the second electrode during the evaporation of the second electrode, causing a hole to appear in the second electrode, and a crack appears in the encapsulation layer subsequently evaporated on the second electrode at the foreign object, but due to the good ductility of the metal layer, the subsequently evaporated metal layer can completely cover the foreign object to form a complete coating. In this way, it is possible to prevent external gas from penetrating into the light emitting layer through the gap at the contact point between the foreign object and the second electrode, and to prevent the light emitting layer from being oxidized and causing no light emission, thereby improving the display quality. In addition, the encapsulation body adopts a multi-layer stacked structure, and the contact surfaces of each layer can increase the diffusion interface during the diffusion of external gas, slow down the diffusion rate, and improve the sealing performance.

[0042] In some embodiments of the present invention, the metal layer 132 is a metal aluminum layer. Metal aluminum can undergo an oxidation reaction with oxygen to form a dense aluminum oxide layer on the surface of the metal aluminum layer, thereby improving the sealing performance.

[0043] In some embodiments of the present invention, Figure 2 As shown, the second electrode 123 has a first extension portion 1231 extending toward the side wall of the light-emitting layer 122. The first extension portion 1231 seals the side wall of the light-emitting layer 122 to form an overall coating of the light-emitting layer 122, thereby improving the sealing performance. Exemplarily, the first extension portion 1231 is an extension of the second electrode 123, and the two are formed in the same process.

[0044] In some embodiments of the present invention, Figure 2 As shown, the package body 130 has a second extension portion 134 extending toward the side wall of the light emitting layer 122. The second extension portion 134 is formed on the side of the first extension portion 1231 away from the light emitting layer 122. The second extension portion 134 seals the side wall of the light emitting layer 122 to form an overall coating of the light emitting layer 122, thereby improving the sealing performance. Exemplarily, the second extension portion 134 is an extension of the package body 130, and the two are formed in the same process, that is, the second extension portion 134 includes an extension portion 1311 of the first encapsulation layer 131, an extension portion 1321 of the metal layer 132, and an extension portion 1331 of the second encapsulation layer 133.

[0045] In some embodiments of the present invention, Figure 2 As shown, the packaging structure of the organic light emitting diode also includes:

[0046] The adhesive layer 140 is disposed on a side of the package body 130 away from the second electrode 123 . The adhesive layer 140 may be a thermosetting adhesive.

[0047] The metal back plate 150 is disposed on the side of the adhesive layer 140 away from the package body 130. The adhesive layer 140 is used to bond the package body 130 and the metal back plate 150. The metal back plate 150 has a good heat dissipation effect and can dissipate the heat generated by the organic light emitting diode 120 in a timely manner during operation.

[0048] Figure 4 A schematic diagram of another packaging structure of an organic light emitting diode provided by an embodiment of the utility model is shown in FIG. Figure 4 As shown, the packaging structure of the organic light emitting diode includes:

[0049] The transparent substrate 210 , for example, may be a glass substrate, or a transparent flexible organic polymer substrate, which is not limited in the embodiment of the present utility model.

[0050] Organic light emitting diode 220, organic light emitting diode 220 includes a first electrode 221, a light emitting layer 222 and a second electrode 223. Exemplarily, in the embodiment of the utility model, the first electrode 221 is an anode, which can be an ultra-thin transparent indium tin oxide coating, a silver coating, etc., which is not limited in the embodiment of the utility model. The second electrode 223 is a cathode, which can be a metal coating such as aluminum, silver, copper, etc., which is not limited in the embodiment of the utility model. When the organic light emitting diode 220 is working, a voltage is applied to the first electrode 221 and the second electrode 223 to form a pressure difference, driving electrons and holes to migrate from the cathode and the anode to the light emitting layer 222 respectively, and meet in the light emitting layer 222 to form excitons and excite the light emitting molecules, which emit white light after radiation relaxation.

[0051] The filter film is formed on one side of the transparent substrate. Exemplarily, in the embodiment of the present invention, the filter film includes a red filter film 261, a green filter film 262 and a blue filter film 263, and the red filter film 261, the green filter film 262 and the blue filter film 263 are formed on one side of the transparent substrate 210 at intervals.

[0052] The protective layer 270 is formed on the transparent substrate 210 and covers the filter film. The protective layer 270 is a transparent organic film and does not affect the light emission of the organic light emitting diode 220. The first electrode 221 is formed on the side of the protective layer 270 away from the transparent substrate 210.

[0053] The light shielding layer 280 is formed on the side of the first electrode 221 away from the protective layer 270, and the light shielding layer 280 is provided with a window corresponding to the position of the filter film, exposing a portion of the first electrode 221. The light emitting layer 222 is provided on the side of the light shielding layer 280 away from the first electrode 221, and the light emitting layer 222 fills the window and contacts the first electrode 221. Exemplarily, the white light emitted by the light emitting layer 222 passes through the corresponding window, passes through the red filter film 261, the green filter film 262 and the blue filter film 263, respectively, to obtain red light, green light and blue light.

[0054] The package body 230 is formed on a side of the second electrode 223 away from the light-emitting layer 222, and the package body 230 includes at least one package layer and at least one metal layer stacked alternately. Figure 4 As shown, the encapsulation body 230 includes a first encapsulation layer 231, a metal layer 232, and a second encapsulation layer 233. The first encapsulation layer 231 is formed on a side of the second electrode 223 away from the light-emitting layer 222, the metal layer 232 is formed on a side of the first encapsulation layer 231 away from the second electrode 223, and the second encapsulation layer 233 is formed on a side of the metal layer 232 away from the first encapsulation layer 231. Exemplarily, the encapsulation layer may be an organic encapsulation layer or an inorganic encapsulation layer, which is not limited in the embodiments of the present utility model.

[0055] The packaging structure of the organic light emitting diode provided in this embodiment has the same effect as the packaging structure of the organic light emitting diode provided in the above-mentioned embodiment, and this embodiment will not be described in detail here.

[0056] In some embodiments of the present invention, the metal layer 232 is a metal aluminum layer. Metal aluminum can undergo an oxidation reaction with oxygen to form a dense aluminum oxide layer on the surface of the metal aluminum layer, thereby improving the sealing performance.

[0057] In some embodiments of the present invention, Figure 4As shown, the second electrode 223 has a first extension portion 2231 extending toward the side wall of the light-emitting layer 222. The first extension portion 2231 seals the side wall of the light-emitting layer 222 to form an overall coating of the light-emitting layer 222, thereby improving the sealing performance. Exemplarily, the first extension portion 2231 is an extension of the second electrode 223, and the two are formed in the same process.

[0058] In some embodiments of the present invention, Figure 4 As shown, the package body 230 has a second extension portion 234 extending toward the side wall of the light emitting layer 222. The second extension portion 234 is formed on the side of the first extension portion 2231 away from the light emitting layer 222. The second extension portion 234 seals the side wall of the light emitting layer 222 to form an overall coating of the light emitting layer 222, thereby improving the sealing performance. Exemplarily, the second extension portion 234 is an extension of the package body 230, and the two are formed in the same process, that is, the second extension portion 234 includes the extension portion 2311 of the first package layer 231, the extension portion 2321 of the metal layer 232, and the extension portion 2331 of the second package layer 233.

[0059] In some embodiments of the present invention, Figure 4 As shown, the packaging structure of the organic light emitting diode also includes:

[0060] The adhesive layer 240 is disposed on a side of the package body 230 away from the second electrode 223 . The adhesive layer 240 may be a thermosetting adhesive.

[0061] The metal back plate 250 is disposed on the side of the adhesive layer 240 away from the package body 230. The adhesive layer 240 is used to bond the package body 230 and the metal back plate 250. The metal back plate 250 has a good heat dissipation effect and can dissipate the heat generated by the organic light emitting diode 220 in a timely manner during operation.

[0062] It should be noted that, since the organic light emitting diodes in the middle area of ​​the display panel are far from the edge, the problem of the organic light emitting diodes not emitting light due to external gas entering through the side wall will not occur. Therefore, the solution without the first extension part and the second extension part in the above embodiment can be adopted. For the organic light emitting diodes in the edge area of ​​the display panel, the solution of providing the first extension part and the second extension part in the above embodiment can be adopted to further improve the sealing performance of the organic light emitting diodes in the edge area.

[0063] An embodiment of the present invention further provides a display panel, comprising a plurality of packaging structures of organic light emitting diodes provided by any of the foregoing embodiments of the present invention.

[0064] The embodiment of the present invention further provides a display device, including the display panel of the present invention. The display device may be an electronic device such as a television, a monitor, a smart phone, a tablet computer, etc., and the embodiment of the present invention is not limited thereto.

[0065] In the description of this article, it is necessary to understand that the terms "up", "down", "left", "right", and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0066] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0067] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0068] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. An organic light emitting diode packaging structure, characterized in that: include: Transparent substrate; An organic light emitting diode, the organic light emitting diode comprising a first electrode, a light emitting layer, and a second electrode, the first electrode being formed on the transparent substrate, the light emitting layer being formed on a side of the first electrode away from the transparent substrate, and the second electrode being formed on a side of the light emitting layer away from the first electrode; A packaging body is formed on a side of the second electrode away from the light-emitting layer, and the packaging body includes at least one packaging layer and at least one metal layer which are stacked alternately.

2. The packaging structure of an organic light emitting diode according to claim 1, characterized in that: The package comprises: a first encapsulation layer, wherein the first encapsulation layer is formed on a side of the second electrode away from the light-emitting layer; a metal layer, wherein the metal layer is formed on a side of the first encapsulation layer away from the second electrode; A second packaging layer is formed on a side of the metal layer away from the first packaging layer.

3. The packaging structure of an organic light emitting diode according to claim 1, characterized in that: The metal layer is a metal aluminum layer.

4. The packaging structure of an organic light emitting diode according to any one of claims 1 to 3, characterized in that: The organic light emitting diode further comprises: A filter film, wherein the filter film is formed on one side of the transparent substrate; A protective layer, wherein the protective layer is formed on the transparent substrate and covers the filter film, and the first electrode is formed on a side of the protective layer away from the transparent substrate; A light-shielding layer is formed on a side of the first electrode away from the protective layer, and a window is provided on the light-shielding layer corresponding to a position of the filter film to expose a portion of the first electrode, and the light-emitting layer is provided on a side of the light-shielding layer away from the first electrode, and the light-emitting layer fills the window.

5. The packaging structure of an organic light emitting diode according to claim 4, characterized in that: The filter films include a red filter film, a green filter film and a blue filter film, and the red filter film, the green filter film and the blue filter film are formed at intervals on one side of the transparent substrate.

6. The packaging structure of an organic light emitting diode according to any one of claims 1 to 3, characterized in that: The second electrode has a first extension portion extending toward a side wall of the light emitting layer, and the first extension portion seals the side wall of the light emitting layer.

7. The packaging structure of an organic light emitting diode according to claim 6, characterized in that: The package body has a second extension portion extending toward the side wall of the light emitting layer, the second extension portion is formed on a side of the first extension portion away from the light emitting layer, and the second extension portion seals the side wall of the light emitting layer.

8. The packaging structure of an organic light emitting diode according to any one of claims 1 to 3, characterized in that: Also includes: an adhesive layer, the adhesive layer being disposed on a side of the package body away from the second electrode; A metal back plate is arranged on a side of the adhesive layer away from the packaging body.

9. A display panel, characterized in that: A packaging structure comprising an organic light emitting diode as claimed in any one of claims 1 to 8.

10. A display device, characterized in that: Comprising the display panel as claimed in claim 9.

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