Butyl film forming device

Abstract

The embodiment of the present application provides a butyl rubber sheet forming device, comprising: a base, a press and a heating device; the base is provided with a mounting plate and a column, the mounting plate is used to install a lower mold with a mold cavity; the press installed on the column includes a sliding mechanism, the sliding mechanism can move up and down along the axial direction of the column, and the lower end of the sliding mechanism is used to connect the upper mold; the heating device is located in the mounting plate. Using the butyl rubber sheet forming device provided by the embodiment of the present application, solid butyl rubber can be heated to become gel butyl rubber, and the gel butyl rubber has a small hardness and high fluidity, and is easily controlled by the shape of the mold cavity, thereby improving the accuracy of the butyl rubber sheet size.

Description

Technical Field

[0001] The present application relates to the technical field of butyl film production, and in particular to a butyl film forming device. Background Art

[0002] Compared with conventional photovoltaic modules, heterojunction photovoltaic modules require higher water resistance and air tightness. Butyl rubber has good chemical stability and thermal stability, as well as good air tightness and water tightness. Therefore, butyl rubber can be used in heterojunction photovoltaic modules. The butyl rubber used in heterojunction photovoltaic modules is a designed butyl rubber sheet (i.e., butyl film). The butyl film can pass through the drainage line, and the thickness and size of the butyl film need to be strictly controlled. The existing butyl film of photovoltaic modules is generally completed manually. Due to the high viscosity and hardness of butyl rubber, it has the problems of low cutting efficiency and unstable cutting. Therefore, in production, the size of the butyl film cannot be accurately controlled, which affects the stability of the butyl film.

[0003] It should be noted that the above content is not necessarily prior art, nor is it intended to limit the scope of patent protection of this application. Utility Model Content

[0004] The embodiment of the present application provides a butyl film forming device to solve or alleviate one or more of the technical problems mentioned above.

[0005] In a first aspect, an embodiment of the present application provides a butyl film forming device, comprising:

[0006] A base, wherein the base is provided with a mounting plate and a column, the mounting plate is used to mount a lower mold, and the lower mold has a mold cavity;

[0007] A press machine is installed on the column; the press machine includes a sliding mechanism, the sliding mechanism can move up and down along the axial direction of the column, and the lower end of the sliding mechanism is used to connect the upper mold;

[0008] A heating device is located in the mounting plate.

[0009] Optionally, the lower mold and the upper mold are positioned correspondingly; when the solid butyl rubber is placed in the model cavity, the sliding mechanism drives the upper mold to move downward until the upper mold and the lower mold are closed; the heating device is used to heat the model cavity so that the solid butyl rubber is heated to become gel-state butyl rubber.

[0010] Optionally, the press further comprises a body and a rocker; wherein:

[0011] The fuselage is fixed on the column, and the fuselage is provided with a through hole running through the upper and lower parts of the fuselage;

[0012] The sliding mechanism comprises a sliding pressure rod, and the sliding pressure rod passes through the fuselage through the through hole;

[0013] The rocker is located on one side of the fuselage and is linked with the sliding pressure rod through an engagement structure;

[0014] Wherein, the rocker is used to control the sliding pressure rod to move upward or downward along the through hole.

[0015] Optionally, the sliding mechanism and the upper mold are detachably connected, and the lower mold is detachably mounted on the mounting plate.

[0016] Optionally, the lower end of the sliding mechanism has a mounting groove, and a fastener is provided on the side wall of the mounting groove;

[0017] The upper end of the upper mold is provided with a mounting column;

[0018] The mounting column is detachably mounted in the mounting groove, and the outer surface of the mounting column has a milled flat surface; the fastener is in close contact with the milled flat surface to fix the mounting column in the mounting groove.

[0019] Optionally, the lower mold has an overflow groove, and the overflow groove connects the side wall of the model cavity and the outer edge of the lower mold.

[0020] Optionally, a punching boss is provided in the mold cavity.

[0021] Optionally, the lower mold has a threaded hole, and a screw matching the threaded hole is passed through the threaded hole to detachably mount the lower mold on the mounting plate.

[0022] Optionally, the lower surface of the upper mold and the surface of the mold cavity have an anti-stick coating.

[0023] Optionally, a heat insulation plate is provided between the mounting plate and the base.

[0024] Optionally, the butyl film forming device further comprises: a temperature sensor and a temperature controller;

[0025] The temperature sensor is located in the mounting plate;

[0026] The temperature controller is electrically connected to the heating tube and the temperature sensor respectively;

[0027] Wherein, the setting temperature of the temperature controller is 50-60°C;

[0028] The temperature controller detects the temperature of the mold cavity through the temperature sensor, and controls the heating device to maintain the mold cavity at the set temperature.

[0029] Optionally, the material of the upper mold is mold steel; and / or the material of the lower mold is carbon steel.

[0030] The above technical solution adopted in the embodiment of the present application may have the following advantages:

[0031] The butyl rubber sheet forming device of the embodiment of the present application includes a base for installing a lower mold, a press for driving the upper mold to move up and down, and a heating device located below the lower mold, wherein the lower mold has a mold cavity for placing butyl rubber. When the upper mold and the lower mold are closed, the heating device is started to heat the solid butyl rubber in the mold cavity, so that the solid butyl rubber is heated to become gel butyl rubber, and the gel butyl rubber has low hardness and high fluidity, and is easily controlled by the shape of the mold cavity; after the heating device is turned off, the gel butyl rubber becomes a solid butyl rubber sheet, and the size of the butyl rubber sheet is consistent with the mold cavity, thereby improving the accuracy of the size of the butyl rubber sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0033] Figure 1 It is a structural schematic diagram of a butyl film forming device provided in an embodiment of the present application;

[0034] Figure 2 It is a structural schematic diagram of a lower mold and a mounting plate provided in an embodiment of the present application;

[0035] Figure 3 It is a structural schematic diagram of a lower mold provided in an embodiment of the present application;

[0036] Figure 4 It is a structural schematic diagram of an upper mold provided in an embodiment of the present application;

[0037] Figure 5 It is a schematic diagram of the structure of a butyl film prepared by using the butyl film forming device provided in an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 100. Butyl film forming device; 10. Base; 11. Mounting plate; 12. Column; 20. Press; 21. Sliding mechanism; 22. Body; 23. Rocker; 30. Heating device; 40. Upper die; 41. Mounting column; 50. Lower die; 51. Model cavity; 52. Overflow groove; 53. Punching boss; 54. Threaded hole; 60. Heat insulation board; 70. Temperature sensor; 80. Temperature controller; 200. Butyl film. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other in the absence of conflict. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

[0041] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0042] Hereinafter, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. It should be noted that these exemplary embodiments can be implemented in many different forms and should not be construed as being limited to the embodiments described herein.

[0043] like Figures 1 to 4 As shown, an embodiment of the present application provides a butyl film forming device 100, including: a base 10, a press 20 and a heating device 30.

[0044] The respective structures and coordination relationships of the base 10, the press machine 20 and the heating device 30 are introduced below.

[0045] The material of the base 10 can be metal or hard plastic, etc., to ensure that the base 10 remains flat and has no deformation during long-term use. The base 10 is provided with a mounting plate 11 and a column 12. The column 12 or the mounting plate 11 can be mounted on the base 10 by welding, or the mounting plate 11 or the column 12 can be mounted on the base 10 in a detachable manner. The mounting plate 11 is used to mount the lower mold 50, and the lower mold 50 has a mold cavity 51. The length and width of the base 10 can be not less than the length and width of the mounting plate 11, and the length and width of the mounting plate 11 can be not less than the length and width of the lower mold 50, to ensure that the mounting plate 11 can be firmly mounted on the base 10, and the lower mold 50 can be firmly mounted on the mounting plate 11.

[0046] The press 20 is mounted on the column 12, and the press 20 can be fixedly mounted on the column 12 in a detachable manner. The press 20 includes a sliding mechanism 21, which can move up and down along the axial direction of the column 12, and the lower end of the sliding mechanism 21 is used to connect the upper mold 40. The lower mold 50 corresponds to the upper mold 40. When the solid butyl rubber is placed in the mold cavity 51, the sliding mechanism 21 drives the upper mold 40 to move down until the upper mold 40 and the lower mold 50 are molded. After the butyl rubber sheet 200 is formed, the sliding mechanism 21 drives the upper mold 40 to move up until it is reset.

[0047] The heating device 30 is located in the mounting plate 11 and is used to heat the mold cavity 51 so that the solid butyl rubber is heated to become a gel butyl rubber. The lower mold 50 is a heat-conducting material, so that the heating device 30 transfers heat to the butyl rubber in the mold cavity 51 through the lower mold 50.

[0048] like Figure 2 As shown, in some embodiments, the heating device 30 can be a heating tube, and the number of the heating tubes is at least 2, which can increase the heating speed. For example, the number of the heating tubes is 2, 3, 4 or other numbers.

[0049] In the process of preparing the butyl rubber sheet 200, the upper mold 40 and the lower mold 50 are first separated, and the solid butyl rubber is placed in the mold cavity 51 of the lower mold 50. Then, the press machine 20 is started to move the sliding mechanism 21 of the press machine 20 downward along the axial direction of the column 12, and the sliding mechanism 21 drives the upper mold 40 to move downward until the upper mold 40 and the lower mold 50 are closed. Before or during the closing of the mold, the heating device 30 is started to heat the solid butyl rubber in the mold cavity 51, so that the solid butyl rubber is heated. The base rubber is heated to become gel-state butyl rubber; when the mold is closed, the gel-state butyl rubber flows according to the shape of the mold cavity 51 through the extrusion of the upper mold 40, and the excess butyl rubber is squeezed out; then the heating device 30 is turned off to cool the gel-state butyl rubber to form a butyl rubber sheet 200 of a predetermined size; after the butyl rubber sheet 200 is formed, the press machine 20 is started again to drive the upper mold 40 to move upward by the sliding mechanism 21, separate the upper mold 40 and the lower mold 50, and take out the butyl rubber sheet 200. Since the gel-state butyl rubber has a small hardness and high fluidity, it is easily controlled by the shape of the mold cavity 51, and the size of the butyl rubber sheet 200 is consistent with the size of the mold cavity 51, thereby improving the size accuracy of the butyl rubber sheet 200.

[0050] like Figure 1As shown, in an optional embodiment, the press 20 further includes: a body 22 and a rocker 23. The body 22 is fixed on the column 12, and the body 22 is provided with a through hole that penetrates the body 22 from top to bottom. The sliding mechanism 21 includes a sliding pressure rod, which penetrates the body 22 through the through hole; the rocker 23 is located on one side of the body 22, and is linked to the sliding pressure rod through a meshing structure; wherein the rocker 23 is used to control the sliding pressure rod to move upward or downward along the through hole.

[0051] In some embodiments, one end of the rocker arm 23 passes through and extends into the interior of the fuselage 22, and a gear is fixedly sleeved on the outer wall of this end of the rocker arm 23. The gear is located inside the fuselage 22, and a rack meshing with the gear is provided on the side wall of the sliding pressure rod. The rocker arm 23 drives the sliding pressure rod to move upward or downward through the meshing structure (such as the gear and the rack).

[0052] In an optional embodiment, the sliding mechanism 21 and the upper mold 40 are detachably connected, and the lower mold 50 is detachably mounted on the mounting plate 11. Since both the upper mold 40 and the lower mold 50 are detachable, when butyl rubber sheets 200 of different sizes need to be prepared, it is only necessary to replace the upper mold 40 and the lower mold 50 that are adapted thereto, wherein the size of the mold cavity 51 of the replaced lower mold 50 is consistent with the size of the prepared butyl rubber sheet 200. Therefore, the butyl rubber sheet forming device 100 of the embodiment of the present application can not only improve the size accuracy of the butyl rubber sheet 200, but also can conveniently and quickly prepare butyl rubber sheets 200 of different requirements.

[0053] like Figure 1 and Figure 4 As shown, in an optional embodiment, the lower end of the sliding mechanism 21 has a mounting groove (not shown), and a fastener (not shown) is provided on the side wall of the mounting groove; the upper end of the upper mold 40 is provided with a mounting column 41; wherein, the mounting column 41 is detachably installed in the mounting groove, and the outer surface of the mounting column 41 has a milled flat surface; the fastener is in close contact with the milled flat surface, so that the mounting column 41 is fixed in the mounting groove.

[0054] The mounting column 41 is detachably mounted in the mounting groove, so that the mounting column 41 is easy to assemble and disassemble, which greatly improves the maintenance and replacement efficiency and replacement cost of the equipment. By closely contacting the fastener with the milled flat surface on the outer surface of the mounting column 41, the fixing stability of the mounting column 41 in the mounting groove is ensured, and the mounting column 41 is prevented from loosening during the up and down movement of the sliding mechanism 21. In some embodiments, the fastener can be a screw fastener; a threaded through hole and a screw matching the threaded through hole are provided on the side wall of the mounting groove, and the screw is tightened to make the screw closely contact with the milled flat surface, so that the mounting column 41 is fixed in the mounting groove.

[0055] like Figure 3As shown, in an optional embodiment, the lower mold 50 has an overflow groove 52, and the overflow groove 52 communicates with the side wall of the mold cavity 51 and the outer edge of the lower mold 50. When the upper mold 40 and the lower mold 50 are molded together, since the butyl rubber is in a gel state after being heated, the excess butyl rubber flows out through the overflow groove 52 after being squeezed by the upper mold 40. The design of the overflow groove 52 can reduce the irregularity on the surface of the butyl rubber sheet 200 product caused by the overflow of excess material, thereby improving the appearance quality of the butyl rubber sheet 200.

[0056] like Figure 3 As shown, in some embodiments, the bottom surface of the overflow groove 52 is flush with the bottom surface of the mold cavity 51. If the bottom surface of the overflow groove 52 is flush with the bottom surface of the mold cavity 51, when the upper mold 40 squeezes the butyl rubber, the excess butyl rubber can flow out through the overflow groove 52 more smoothly.

[0057] like Figure 3 and Figure 5 As shown, in an optional embodiment, a punching boss 53 is provided in the mold cavity 51. The punching boss 53 is used to form a punching hole on the butyl film 200. The punching holes in the butyl film 200 can be used as a fixing or auxiliary positioning means to facilitate the installation and fixing of the photovoltaic module, ensure the accurate alignment of the module, and improve the installation efficiency. The shape of the punching boss 53 can be a triangle, a rectangle, a square, a circle or a pentagon, which is not specifically limited here. The shape of the punching hole formed is consistent with the shape of the punching boss 53, which is not specifically limited here.

[0058] like Figure 3 As shown, in an optional embodiment, the lower mold 50 has a threaded hole 54 , and a screw matching the threaded hole 54 is used to detachably mount the lower mold 50 on the mounting plate 11 through the threaded hole 54 .

[0059] The lower mold 50 has threaded holes 54 around it and can be detachably mounted on the mounting plate 11 by screws. In order to firmly mount the lower mold 50 on the mounting plate 11, at least four threaded holes 54 are provided on the lower mold 50, and one threaded hole 54 is provided at each corner position. The lower mold 50 is mounted on the mounting plate 11 by screws, and butyl films 200 of different sizes can be prepared by replacing the lower mold 50 with a mold cavity 51 of different sizes according to production needs.

[0060] In an optional embodiment, the lower surface of the upper mold 40 and the surface of the mold cavity 51 have an anti-stick coating.

[0061] An anti-stick coating is provided on the lower surface of the upper mold 40 and the surface of the mold cavity 51 to prevent the butyl rubber from adhering to the upper mold 40 or the mold cavity 51, thereby avoiding affecting the molding quality of the butyl rubber sheet 200. The anti-stick coating may be a metal composite anti-stick coating or a wear-resistant ceramic composite anti-stick coating, which is not specifically limited here.

[0062] like Figure 1 and Figure 2 As shown, in an optional embodiment, a heat insulation board 60 is provided between the mounting plate 11 and the base 10 .

[0063] When the heating device 30 heats the butyl rubber in the mold cavity 51, a heat insulation plate 60 is provided between the mounting plate 11 and the base 10 to prevent the heat provided by the heating device 30 from being transferred to the base 10 and the press 20, thereby reducing heat loss.

[0064] like Figure 1 and Figure 2 As shown, in an optional embodiment, the butyl film molding device 100 may further include: a temperature sensor 70 and a temperature controller 80. The temperature sensor 70 is located in the mounting plate 11, wherein the temperature sensor 70 and the heating device 30 are not in contact with each other. The temperature controller 80 is electrically connected to the heating device 30 and the temperature sensor 70 respectively; wherein the set temperature of the temperature controller 80 is 50-60°C; the temperature controller 80 detects the temperature of the mold cavity 51 through the temperature sensor 70, and maintains the mold cavity 51 at the set temperature by controlling the heating device 30.

[0065] The temperature controller 80 detects the temperature of the butyl rubber in the mold cavity 51 through the temperature sensor 70, and adjusts the temperature of the butyl rubber in the mold cavity 51 by controlling the start and stop of the heating device 30. When the temperature sensor 70 detects that the temperature of the butyl rubber is higher than the set value of the temperature controller 80, the heating device 30 is stopped for heating. When the temperature sensor 70 detects that the temperature of the butyl rubber is lower than the set value of the temperature controller 80, the heating device 30 is started for heating. In the embodiment of the present application, the set value of the temperature controller 80 is 50-60°C, specifically 50°C, 53°C, 55°C, 58°C or 60°C. Within this temperature range, the butyl rubber is in a gel state.

[0066] In an optional embodiment, the material of the upper mold 40 is mold steel. Model steel has high hardness and smoothness. When the material of the upper mold 40 is mold steel, the surface of the formed butyl film 200 can be flat and smooth, thereby improving product quality.

[0067] In an optional embodiment, the material of the lower mold 50 is carbon steel. Carbon steel has good heat transfer performance. When the material of the lower mold 50 is carbon steel, the heating device 30 can quickly transfer heat to the butyl rubber in the mold cavity 51, thereby improving work efficiency.

[0068] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0069] For the convenience of description, the orientation or position relationship indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, vertical, horizontal" and "top, bottom" is usually based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Therefore, the exemplary term "above..." can include both "above..." and "below..." orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used here are interpreted accordingly.

[0070] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0071] Unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is lower in level than the second feature.

[0072] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to those of ordinary skill in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be considered as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so that once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0073] It should also be noted that "one embodiment", "another embodiment", "embodiment", etc. mentioned in this specification refer to the specific features, structures or characteristics described in conjunction with the embodiment included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when describing a specific feature, structure or characteristic in conjunction with any embodiment, it is claimed that the realization of such feature, structure or characteristic in conjunction with other embodiments also falls within the scope of this application.

[0074] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0075] It should also be noted that the above are only preferred embodiments of the present application, and the patent protection scope of the present application is not limited thereto. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A butyl film forming device, characterized in that: include: A base, wherein the base is provided with a mounting plate and a column, the mounting plate is used to mount a lower mold, and the lower mold has a mold cavity; A press machine is installed on the column; the press machine includes a sliding mechanism, the sliding mechanism can move up and down along the axial direction of the column, and the lower end of the sliding mechanism is used to connect the upper mold; A heating device is located in the mounting plate.

2. The butyl film forming device according to claim 1, characterized in that: The lower mold and the upper mold are in corresponding positions; when the solid butyl rubber is placed in the mold cavity, the sliding mechanism drives the upper mold to move downward until the upper mold and the lower mold are closed; the heating device is used to heat the mold cavity so that the solid butyl rubber is heated to become gel-state butyl rubber.

3. The butyl film forming device according to claim 1, characterized in that: The press also includes a body and a rocker; wherein: The fuselage is fixed on the column, and the fuselage is provided with a through hole running through the upper and lower parts of the fuselage; The sliding mechanism comprises a sliding pressure rod, and the sliding pressure rod passes through the fuselage through the through hole; The rocker is located on one side of the fuselage and is linked with the sliding pressure rod through an engagement structure; Wherein, the rocker is used to control the sliding pressure rod to move upward or downward along the through hole.

4. The butyl film forming device according to claim 1, characterized in that: The sliding mechanism is detachably connected to the upper mold, and the lower mold is detachably mounted on the mounting plate.

5. The butyl film forming device according to claim 4, characterized in that: The lower end of the sliding mechanism is provided with a mounting groove, and a fastener is arranged on the side wall of the mounting groove; The upper end of the upper mold is provided with a mounting column; The mounting column is detachably mounted in the mounting groove, and the outer surface of the mounting column has a milled flat surface; the fastener is in close contact with the milled flat surface to fix the mounting column in the mounting groove.

6. The butyl film forming device according to claim 1, characterized in that: The lower mold has an overflow groove, and the overflow groove communicates with the side wall of the mold cavity and the outer edge of the lower mold.

7. The butyl film forming device according to claim 1, characterized in that: A punching boss is provided in the mold cavity.

8. The butyl film forming device according to claim 1, characterized in that: The lower die is provided with a threaded hole, and a screw matching the threaded hole is passed through the threaded hole to detachably mount the lower die on the mounting plate.

9. The butyl film forming device according to claim 1, characterized in that: The lower surface of the upper mold and the surface of the mold cavity have an anti-stick coating.

10. The butyl film forming device according to claim 1, characterized in that: A heat insulation board is arranged between the mounting plate and the base.

11. The butyl film forming device according to any one of claims 1 to 10, characterized in that: Also includes: Temperature sensors and temperature controllers; The temperature sensor is located in the mounting plate; The temperature controller is electrically connected to the heating tube and the temperature sensor respectively; Wherein, the setting temperature of the temperature controller is 50-60°C; The temperature controller detects the temperature of the mold cavity through the temperature sensor, and controls the heating device to maintain the mold cavity at the set temperature.

12. The butyl film forming device according to any one of claims 1 to 10, characterized in that: The material of the upper mold is mold steel; and / or The material of the lower die is carbon steel.

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