Chip module, camera device and electronic equipment

Abstract

The utility model discloses a chip module, a camera device and an electronic device, wherein the chip module comprises a reinforcement plate, a circuit board and a photosensitive chip, wherein the reinforcement plate is provided with a first mounting groove and a second mounting groove, wherein the first mounting groove surrounds the periphery of the second mounting groove, wherein the circuit board is at least partially installed in the first mounting groove, and the circuit board has a top surface and a bottom surface in the depth direction of the first mounting groove, wherein the circuit board is provided with a hollow portion penetrating the top surface and the bottom surface to expose the second mounting groove, wherein the photosensitive chip is at least partially installed in the second mounting groove, and wherein the photosensitive chip is electrically connected to the circuit board. The chip module, the camera device and the electronic device provided by the embodiments of the utility model can reduce the overall thickness of the chip module while ensuring the structural strength of the circuit board, so as to meet the design requirements of the camera device to be light and thin.

Description

Technical Field

[0001] The utility model relates to the technical field of imaging devices, and in particular to a chip module, a camera device and an electronic device. Background Art

[0002] Electronic devices in the related art (such as smart phones, tablet computers or laptops, etc.) generally have a camera device to have a photo taking function. The camera device of such electronic devices generally includes a lens structure and a chip module, wherein the chip module usually includes a printed circuit board (PCB) and a photosensitive chip arranged on the circuit board, so that the photosensitive chip can collect the light signal of the lens structure for imaging.

[0003] Since most circuit boards are relatively soft and easy to deform, in order to ensure the rigidity of the circuit board, the related technology usually adds a reinforcement plate on the side of the circuit board away from the photosensitive chip, so as to use the reinforcement plate to enhance the structural strength of the circuit board. At this time, the overall thickness of the chip module is the sum of the thicknesses of the reinforcement plate, the circuit board and the photosensitive chip, which makes the overall thickness of the chip module relatively thick, thereby causing the overall thickness of the camera device to be relatively thick, which is not conducive to the lightweight design of the camera device. Utility Model Content

[0004] The embodiments of the utility model disclose a chip module, a camera device and an electronic device, which can reduce the overall thickness of the chip module while ensuring the structural strength of the circuit board, so as to meet the design requirements of the camera device to be lightweight and thin.

[0005] In order to achieve the above objectives, in a first aspect, the utility model discloses a chip module, the chip module comprising:

[0006] A reinforcing plate, wherein the reinforcing plate is provided with a first mounting groove and a second mounting groove, wherein the first mounting groove surrounds a circumference of the second mounting groove;

[0007] A circuit board, the circuit board is at least partially installed in the first installation groove, and the circuit board has a top surface and a bottom surface in the depth direction of the first installation groove, and the circuit board is provided with a hollow portion penetrating the top surface and the bottom surface to leak out of the groove bottom surface of the second installation groove; and

[0008] A photosensitive chip is at least partially installed in the second installation groove, and the photosensitive chip is electrically connected to the circuit board.

[0009] In the chip module provided in the present application, a reinforcing plate is added, and a first mounting groove is opened on the reinforcing plate to accommodate the circuit board, and a second mounting groove is also opened on the reinforcing plate, and a hollow portion is also opened on the circuit board to leak the second mounting groove, so that the photosensitive chip can be accommodated in the second mounting groove. In this way, on the one hand, the structural strength of the circuit board can be increased by utilizing the reinforcing plate, while the circuit board and the photosensitive chip occupy the internal space of the reinforcing plate, and the thickness of the circuit board and the photosensitive chip is omitted, so that the overall thickness of the chip module can be reduced while ensuring the structural strength of the circuit board, thereby realizing a lightweight design of the chip module; on the other hand, since the photosensitive chip can contact the reinforcing plate, the contact area between the photosensitive chip and the reinforcing plate can be increased with the help of the raised portion, which is beneficial for the heat generated by the photosensitive chip to be transferred to the reinforcing plate, so that the heat can be diffused through the reinforcing plate, thereby helping to improve the heat dissipation efficiency of the photosensitive chip and ensure that the chip module has a better heat dissipation effect.

[0010] At the same time, the first mounting groove can also be used to circle the installation position of the circuit board, that is, the first mounting groove can play a role in positioning and limiting the installation of the circuit board, thereby facilitating the installation of the circuit board on the reinforcement plate; similarly, the second mounting groove can be used to circle the installation position of the photosensitive chip, that is, the second mounting groove can play a role in positioning and limiting the installation of the photosensitive chip, thereby facilitating the installation of the photosensitive chip on the circuit board.

[0011] As an optional implementation, in the embodiment of the first aspect of the utility model, the first mounting groove passes through the outer peripheral surface of the reinforcement plate in the radial direction, and in the radial direction of the reinforcement plate, the outer peripheral surface of the circuit board protrudes from the outer peripheral surface of the reinforcement plate. In this way, the radial size of the reinforcement plate can be smaller than the size of the circuit board, so as to avoid offset during installation, resulting in the chip module exceeding the size specification and affecting the assembly of the camera device.

[0012] As an optional implementation, in the embodiment of the first aspect of the utility model, the photosensitive chip is bonded to the groove wall of the second mounting groove by means of a thermally conductive adhesive. By bonding the photosensitive chip to the reinforcement plate by means of a thermally conductive adhesive, the photosensitive chip can be installed close to the reinforcement plate, which can increase the heat dissipation area, thereby facilitating the improvement of the heat dissipation effect. At the same time, in addition to being able to improve the heat dissipation effect by means of the good thermal conductivity of the thermally conductive adhesive, the photosensitive chip can also be bonded to the reinforcement plate by means of the good bonding performance of the thermally conductive adhesive, thereby facilitating the improvement of the overall rigidity of the chip module, and at the same time, there is no need to additionally add a limiter or a fixing member to fix the photosensitive chip on the reinforcement plate, thereby facilitating the simplification of the structure of the chip module and reducing the cost of the chip module.

[0013] As an optional implementation, in an embodiment of the first aspect of the utility model, the chip module also includes electronic components and a packaging structure, the electronic components are fixed to the surface of the circuit board facing away from the reinforcement plate, and the electronic components are electrically connected to the circuit board, the packaging structure is arranged on the circuit board, and the packaging structure covers the electronic components.

[0014] On the one hand, the electronic components can be used to assist the photosensitive chip in performing signal processing on the collected ambient light; on the other hand, by wrapping the electronic components inside the packaging structure, there is no need to reserve space on the lens structure to avoid the electronic components, thereby ensuring the strength of the lens structure while reducing the shoulder height and the length and width of the head of the camera device, that is, reducing the overall thickness of the camera device and the length and width in the direction perpendicular to the optical axis, thereby achieving a lightweight and miniaturized design of the camera device.

[0015] As an optional implementation, in the embodiment of the first aspect of the utility model, the chip module also includes an electrical connection wire and a packaging structure, one end of the electrical connection wire is electrically connected to the circuit board, the other end of the electrical connection wire is electrically connected to the photosensitive chip, the packaging structure is arranged on the circuit board, and the packaging structure covers the electrical connection wire. By wrapping the electrical connection wire inside the packaging structure, there is no need to reserve space on the lens structure to avoid the electrical connection wire, so that while ensuring the strength of the lens structure, the shoulder height and the length and width of the head shape of the camera device can be reduced, that is, the overall thickness of the camera device and the length and width dimensions in the direction perpendicular to the optical axis are reduced, thereby realizing a lightweight and miniaturized design of the camera device.

[0016] As an optional implementation, in an embodiment of the first aspect of the utility model, the surface of the photosensitive chip away from the reinforcement plate includes a photosensitive area and a non-photosensitive area, the non-photosensitive area is connected to the periphery of the photosensitive area, one end of the electrical connection line is electrically connected to the non-photosensitive area, and the packaging structure covers the non-photosensitive area. In this way, the packaging structure can package the circuit board, the photosensitive chip, the electronic components and the electrical connection line into one, so that the integrity of the chip module is better, and the connection firmness between the circuit board, the photosensitive chip, the electrical connection line and the electronic components is also better.

[0017] As an optional implementation, in the embodiment of the first aspect of the utility model, the packaging structure includes a first packaging part and a second packaging part connected to each other, the first packaging part is arranged on the circuit board, and the first packaging part covers the electrical connection line, the second packaging part is connected between the photosensitive chip and the inner wall surface of the second mounting groove, and the second packaging part is connected to the bottom surface of the second mounting groove. Through the above design, while ensuring the stability of the connection between the electrical connection line and the circuit board and the photosensitive chip, the installation stability of the photosensitive chip in the second mounting groove can be improved.

[0018] As an optional implementation, in the embodiment of the first aspect of the utility model, the chip module also includes a filter, and a third mounting groove is provided on the top of the packaging structure facing away from the circuit board, and the filter is installed in the third mounting groove and is located on the photosensitive path of the photosensitive chip. In this way, the filter can be used to filter the stray light of the ambient light passing through the lens structure to ensure that the image taken by the camera device has better clarity. At the same time, since the filter is installed in the third mounting groove of the packaging structure, sufficient installation space can be provided for the filter, so that the filter will not protrude from the surface of the packaging structure facing away from the circuit board, thereby omitting the thickness of the filter, and further reducing the overall thickness of the chip module, so as to realize the light and thin design of the chip module.

[0019] In a second aspect, the utility model discloses a camera device, the camera device comprising a lens structure and a chip module as described in the first aspect, the lens structure being connected to the reinforcement plate and / or the circuit board, and the lens structure being located on the photosensitive path of the photosensitive chip. It is understandable that the camera device having the chip module described in the first aspect also has all the beneficial effects of the chip module described in the first aspect, that is, the camera device having the chip module described in the first aspect can also reduce the overall thickness of the chip module while ensuring the structural strength of the circuit board, so as to meet the design requirements of the camera device to be lightweight.

[0020] In a third aspect, the utility model discloses an electronic device, the electronic device having the camera device as described in the second aspect. It is understandable that, since the camera device has all the beneficial effects of the chip module described in the first aspect, the electronic device also has all the beneficial effects of the chip module described in the first aspect, that is, the electronic device having the camera device described in the second aspect can also reduce the overall thickness of the chip module while ensuring the structural strength of the circuit board, so as to meet the design requirements of the camera device to be thin and light.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] The chip module, camera device and electronic device provided by the embodiments of the utility model are provided by adding a reinforcing plate, and a first mounting groove is opened on the reinforcing plate to accommodate the circuit board, and a second mounting groove is also opened on the reinforcing plate, and a hollow part is also opened on the circuit board to leak the second mounting groove, so that the photosensitive chip can be accommodated in the second mounting groove. In this way, on the one hand, the structural strength of the circuit board can be increased by utilizing the reinforcing plate, while the circuit board and the photosensitive chip occupy the internal space of the reinforcing plate, and the thickness of the circuit board and the photosensitive chip is omitted, so that the overall thickness of the chip module can be reduced while ensuring the structural strength of the circuit board, thereby realizing a light and thin design of the chip module; on the other hand, since the photosensitive chip can contact the reinforcing plate, the contact area between the photosensitive chip and the reinforcing plate can be increased by means of the raised part, which is beneficial to the heat generated by the photosensitive chip being transmitted to the reinforcing plate, so that the heat is diffused through the reinforcing plate, thereby helping to improve the heat dissipation efficiency of the photosensitive chip, and ensuring that the chip module has a better heat dissipation effect.

[0023] At the same time, the first mounting groove can also be used to circle the installation position of the circuit board, that is, the first mounting groove can play a role in positioning and limiting the installation of the circuit board, thereby facilitating the installation of the circuit board on the reinforcement plate; similarly, the second mounting groove can be used to circle the installation position of the photosensitive chip, that is, the second mounting groove can play a role in positioning and limiting the installation of the photosensitive chip, thereby facilitating the installation of the photosensitive chip on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 It is a schematic diagram of the structure of an electronic device disclosed in an embodiment of the utility model;

[0026] Figure 2 It is a structural schematic diagram of a camera device disclosed in an embodiment of the utility model;

[0027] Figure 3 yes Figure 2 A cross-sectional view of the camera device along the AA direction;

[0028] Figure 4 It is a schematic diagram of the structure of the chip module disclosed in the embodiment of the utility model;

[0029] Figure 5 The chip module disclosed in the embodiment of the utility model is along Figure 4 The first cross-sectional view in the BB direction;

[0030] Figure 6 yes Figure 5 Exploded diagram of

[0031] Figure 7 The chip module disclosed in the embodiment of the utility model is along Figure 4 The second cross-sectional view in the BB direction;

[0032] Figure 8 yes Figure 7 Exploded diagram of

[0033] Fig. 9 The chip module disclosed in the embodiment of the utility model is along Figure 4 The third cross-sectional view in the BB direction;

[0034] Fig.10 yes Fig. 9 Exploded diagram of

[0035] Fig.11 The chip module disclosed in the embodiment of the utility model is along Figure 4 The fourth cross-sectional view in the BB direction.

[0036] Description of main reference numerals

[0037] 100-electronic device; 10-camera device; 11-chip module; 111-reinforcement plate; 111a-first surface; 111b-second surface; 1111-first mounting groove; 1112-second mounting groove; 112-circuit board; 112a-top surface; 112b-bottom surface; 1121-hollow part; 113-photosensitive chip; 113a-photosensitive surface; 113a1-photosensitive area; 113a2-non-photosensitive area; 113b-non-photosensitive surface; 114-thermal conductive adhesive; 115-electronic components; 116-packaging structure; 1161-third mounting groove; 117-electrical connecting wire; 118-filter; 12-lens structure; 20-equipment housing. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0040] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first mounting slot may be referred to as a second mounting slot, and similarly, a second mounting slot may be referred to as a first mounting slot. Both the first mounting slot and the second mounting slot are mounting slots, but they are not the same mounting slot.

[0041] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0042] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0043] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of an electronic device 100 provided in an embodiment of the present application. The electronic device 100 may be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device, an augmented reality (AR) glasses, an AR helmet, a virtual reality (VR) glasses or a VR helmet, etc., which have a camera device. Figure 1 The electronic device 100 in the illustrated embodiment is described by taking a mobile phone as an example.

[0044] Specifically, the electronic device 100 includes a camera device 10 and a device housing 20 . The camera device 10 is fixedly installed inside the device housing 20 , and the camera device 10 can be a front camera device or a rear camera device.

[0045] See also Figure 2 and Figure 3The camera device 10 in the present application includes a chip module 11 and a lens structure 12. The lens structure 12 is arranged on the photosensitive path of the chip module 11, so that the lens structure 12 can be used to collect ambient light. The chip module 11 can receive the ambient light collected by the lens structure 12 to form an image, thereby realizing the imaging function of the camera device 10.

[0046] See also Figures 3 to 6 The chip module 11 in the present application includes a reinforcing plate 111, a circuit board 112 and a photosensitive chip 113. The reinforcing plate 111 is provided with a first mounting groove 1111. The circuit board 112 is at least partially mounted in the first mounting groove 1111. The circuit board 112 is provided with a hollow portion 1121. The axial direction of the hollow portion 1121 and the depth direction of the first mounting groove 1111 are parallel to each other. The photosensitive chip 113 is at least partially mounted in the hollow portion 1121, and the photosensitive chip 113 is electrically connected to the circuit board 112. The above design can increase the structural strength of the circuit board 112 by using the reinforcing plate 111, while making the circuit board 112 occupy the internal space of the reinforcing plate 111 and the photosensitive chip 113 occupy the internal space of the circuit board 112. The thickness of the circuit board 112 and the photosensitive chip 113 is omitted, so that the overall thickness of the chip module 11 can be reduced while ensuring the structural strength of the circuit board 112, thereby realizing a light and thin design of the chip module 11.

[0047] At the same time, the first installation groove 1111 can also be used to circle the installation position of the circuit board 112, that is, the first installation groove 1111 can play a positioning and limiting effect on the installation of the circuit board 112, thereby facilitating the installation of the circuit board 112 on the reinforcement plate 111; similarly, the hollow portion 1121 can be used to circle the installation position of the photosensitive chip 113, that is, the hollow portion 1121 can play a positioning and limiting effect on the installation of the photosensitive chip 113, thereby facilitating the installation of the photosensitive chip 113 on the circuit board 112.

[0048] In the present application, the reinforcing plate 111 may be, but is not limited to, a material with relatively high hardness such as a steel sheet, a copper sheet, a ceramic sheet, or a copper alloy sheet. Since the reinforcing plate 111 has relatively high hardness, the reinforcing plate 111 can greatly improve the overall strength of the circuit board 112, thereby facilitating that the circuit board 112 is not easily broken. Moreover, in the present embodiment, the circuit board 112 can be fixed to the reinforcing plate 111 by means of tape or glue. In other embodiments, the circuit board 112 can also be fixed to the reinforcing plate 111 by means of welding or threaded connection.

[0049] For ease of description, Figure 5 and Figure 6 As shown, the depth direction of the first installation groove 1111 is defined as a downward direction, and the opposite direction of the first installation groove 1111 is defined as an upward direction.

[0050] In the present application, the reinforcement plate 111 has a first surface 111a and a second surface 111b along the depth direction of the first mounting groove 1111, the circuit board 112 has a top surface 112a and a bottom surface 112b in the depth direction of the first mounting groove 1111, and the photosensitive chip 113 has a photosensitive surface 113a and a non-photosensitive surface 113b along the depth direction of the first mounting groove 1111, wherein the first surface 111a, the top surface 112a and the photosensitive surface 113a are located on the same side of the chip module 11, the second surface 111b, the bottom surface 112b and the non-photosensitive surface 113b are located on the other same side of the chip module 11, and the first mounting groove 1111 is set on the first surface 111a.

[0051] Furthermore, “the circuit board 112 is at least partially installed in the first installation groove 1111” can be understood as: the circuit board 112 can be entirely located in the first installation groove 1111, that is, in the upward direction, the top surface 112a of the circuit board 112 is lower than the first surface 111a of the reinforcement plate 111, or is flush with the first surface 111a of the reinforcement plate 111; the circuit board 112 can also protrude upward and be partially located outside the first installation groove 1111, that is, the circuit board 112 can be partially located in the first installation groove 1111, and the other part is located outside the first installation groove 1111. “The photosensitive chip 113 is at least partially installed in the hollow portion 1121” can be understood as: the photosensitive chip 113 can be entirely located in the hollow portion 1121, that is, in the upward direction, the photosensitive surface 113a of the photosensitive chip 113 is lower than the top surface 112a of the circuit board 112, or is flush with the top surface 112a of the circuit board 112; the photosensitive chip 113 can also protrude upward and have a portion located outside the hollow portion 1121, that is, the photosensitive chip 113 can have a portion located in the hollow portion 1121, and the other portion located outside the hollow portion 1121.

[0052] In some optional embodiments, such as Figure 7 and Figure 8As shown, the hollow portion 1121 penetrates the top surface 112a and the bottom surface 112b to expose the bottom surface of the first mounting groove 1111, and the photosensitive chip 113 is bonded to the bottom surface of the first mounting groove 1111 through the thermal conductive adhesive 114. At this time, the photosensitive chip 113 is in contact with the reinforcing plate 111 through the thermal conductive adhesive 114. By bonding the photosensitive chip 113 to the reinforcing plate 111 through the thermal conductive adhesive 114, the photosensitive chip 113 can be installed close to the reinforcing plate 111, which can increase the heat dissipation area, thereby facilitating the improvement of the heat dissipation effect. At the same time, in addition to improving the heat dissipation effect by virtue of the good thermal conductivity of the thermal conductive adhesive 114, the good bonding performance of the thermal conductive adhesive 114 can also be used to bond the photosensitive chip 113 to the reinforcing plate 111, thereby facilitating the improvement of the overall rigidity of the chip module 11, and at the same time, no additional limiter or fixing member is required to fix the photosensitive chip 113 on the reinforcing plate 111, thereby facilitating the simplification of the structure of the chip module 11 and reducing the cost of the chip module 11. In addition, since the hollow portion 1121 is a through groove that penetrates the top surface 112a and the bottom surface 112b of the circuit board 112, the overall thickness of the chip module 11 can be further reduced.

[0053] In some other optional embodiments, such as Fig. 9 and Fig.10 As shown, the reinforcement plate 111 is also provided with a second mounting groove 1112, and the second mounting groove 1112 surrounds the periphery of the first mounting groove 1111, and the hollow portion 1121 passes through the top surface 112a and the bottom surface 112b to expose the second mounting groove 1112, and the photosensitive chip 113 is installed in the second mounting groove 1112. At this time, the photosensitive chip 113 is in contact with the reinforcement plate 111, and the photosensitive chip 113 and the circuit board 112 are separated by the portion of the reinforcement plate located between the first mounting groove 1111 and the second mounting groove 1112. Through the above design, on the one hand, the circuit board and the photosensitive chip can occupy the internal space of the reinforcement plate, thereby further reducing the overall thickness of the chip module 11 to achieve a lightweight design; on the other hand, the peripheral side surfaces and the non-photosensitive surface 113b of the photosensitive chip 113 can be in contact with the reinforcement plate 111, which is beneficial to increase the contact area between the photosensitive chip 113 and the reinforcement plate 111, and further beneficial to transfer the heat generated by the photosensitive chip 113 to the reinforcement plate 111, so as to diffuse the heat through the reinforcement plate 111, thereby improving the heat dissipation efficiency of the photosensitive chip 113 and ensuring that the chip module 11 has a better heat dissipation effect.

[0054] Furthermore, the photosensitive chip 113 is bonded to the groove wall of the second installation groove 1112 by means of the thermal conductive adhesive 114, so that the photosensitive chip 113 is fixedly installed in the second installation groove 1112 by means of the thermal conductive adhesive 114. By bonding the photosensitive chip 113 to the reinforcing plate 111 by means of the thermal conductive adhesive 114, the photosensitive chip 113 can be installed close to the reinforcing plate 111, so that the heat dissipation area can be increased, thereby facilitating the improvement of the heat dissipation effect. At the same time, in addition to being able to improve the heat dissipation effect by means of the good thermal conductivity of the thermal conductive adhesive 114, the photosensitive chip 113 can also be bonded and connected to the reinforcing plate 111 by means of the good bonding performance of the thermal conductive adhesive 114, thereby facilitating the improvement of the overall rigidity of the chip module 11, and at the same time, there is no need to additionally set a limiter or a fixing member to fix the photosensitive chip 113 on the reinforcing plate 111, thereby facilitating the simplification of the structure of the chip module 11 and reducing the cost of the chip module 11.

[0055] In the present application, the non-photosensitive surface 113b of the photosensitive chip 113 can be bonded to the bottom surface of the second mounting groove 1112 through the thermal conductive adhesive 114, or the outer peripheral surface of the photosensitive chip 113 can be bonded to the side wall of the second mounting groove 1112 through the thermal conductive adhesive 114, or the non-photosensitive surface 113b of the photosensitive chip 113 can be bonded to the bottom surface of the second mounting groove 1112 through the thermal conductive adhesive 114, and at the same time, the outer peripheral surface of the photosensitive chip 113 can also be bonded to the side wall of the second mounting groove 1112 through the thermal conductive adhesive 114.

[0056] In some optional embodiments, such as Fig.11 As shown, the first mounting groove 1111 penetrates the outer peripheral surface of the reinforcement plate 111 in the radial direction, and the outer peripheral surface of the circuit board 112 protrudes from the outer peripheral surface of the reinforcement plate 111 in the radial direction of the reinforcement plate 111, so that the radial size of the reinforcement plate 111 can be smaller than the size of the circuit board 112, so as to avoid displacement during installation, resulting in the size of the chip module 11 exceeding the specification and affecting the assembly of the camera device 10.

[0057] In some optional embodiments, such as Fig.10 and Fig.11 As shown, the chip module 11 also includes an electronic component 115, and the electronic component 115 is fixed on the surface of the circuit board 112 away from the reinforcement plate 111, that is, the electronic component 115 is fixed on the top surface 112a of the circuit board 112, and the electronic component 115 is electrically connected to the circuit board 112, wherein the electronic component 115 can be a capacitor, an inductor, a resistor or a driving chip, etc., so that the electronic component 115 can be used to assist the photosensitive chip 113 in performing signal processing on the collected ambient light.

[0058] Furthermore, the chip module 11 also includes a packaging structure 116, which is disposed on the circuit board 112 and covers the electronic components 115. By wrapping the electronic components 115 inside the packaging structure 116, there is no need to reserve space on the lens structure 12 to avoid the electronic components 115, so that the shoulder height and the length and width of the head shape of the camera device 10 can be reduced while ensuring the strength of the lens structure 12, that is, the overall thickness of the camera device 10 and the length and width in the direction perpendicular to the optical axis can be reduced, thereby achieving a light and thin design and a miniaturized design of the camera device 10.

[0059] In some optional embodiments, the chip module 11 further includes an electrical connection line 117, one end of which is electrically connected to the circuit board 112, and the other end of which is electrically connected to the photosensitive chip 113, and the packaging structure 116 is disposed on the circuit board 112, and the packaging structure 116 covers the electrical connection line 117. By wrapping the electrical connection line 117 inside the packaging structure 116, there is no need to reserve space on the lens structure 12 to avoid the electrical connection line 117, so that the shoulder height and the length and width of the head shape of the camera device 10 can be reduced while ensuring the strength of the lens structure 12, that is, the overall thickness of the camera device 10 and the length and width in the direction perpendicular to the optical axis are reduced, thereby realizing a lightweight and miniaturized design of the camera device 10.

[0060] Optionally, the electrical connection wire 117 may be, but is not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, etc. Exemplarily, the electrical connection wire 117 may connect the photosensitive chip 113 and the circuit board 112 in an arc shape.

[0061] Furthermore, the surface of the photosensitive chip 113 away from the reinforcement plate 111 includes a photosensitive area 113a1 and a non-photosensitive area 113a2, that is, the photosensitive surface 113a of the photosensitive chip 113 includes the photosensitive area 113a1 and the non-photosensitive area 113a2, the non-photosensitive area 113a2 is connected to the periphery of the photosensitive area 113a1, and one end of the electrical connection line 117 is electrically connected to the non-photosensitive area 113a2, that is, the photosensitive area 113a1 can be used to receive the ambient light collected by the lens structure 12, and the non-photosensitive area 113a2 can be used for wiring arrangement; and the packaging structure 116 covers the non-photosensitive area 113a2. In this way, the packaging structure 116 can package the circuit board 112, the photosensitive chip 113, the electronic components 115 and the electrical connection wires 117 into one, so that the integrity of the chip module 11 is better, and the connection strength between the circuit board 112, the photosensitive chip 113, the electrical connection wires 117 and the electronic components 115 is also better.

[0062] Optionally, the material of the packaging structure 116 is epoxy molding compound (EMC for short). The epoxy molding compound is also called epoxy plastic encapsulation compound. It is understandable that EMC is a powdered molding compound made of epoxy resin as a base resin, high-performance phenolic resin as a curing agent, fillers such as alumina powder, and a variety of additives. In other embodiments, the material of the packaging structure 116 can also be other packaging materials.

[0063] In some optional embodiments, the packaging structure 116 can be formed into an integrated structure with the circuit board 112, which can simplify the assembly process of the chip module 11 and facilitate the assembly of the chip module 11; at the same time, it can also improve the flatness of the surface of the chip module 11, which is beneficial to reduce the assembly tolerance of the camera device 10 and reduce the overall thickness of the camera device 10.

[0064] Exemplarily, the packaging structure 116 can be formed by a chip molding process (molding on chip, MOC for short). Specifically, the fixed circuit board 112, the reinforcement plate 111, the photosensitive chip 113, the electrical connection line 117 and the electronic components 115 are first placed in the mold cavity, and then the packaging material is squeezed into the mold cavity, so that the packaging material is located on the top surface 112a of the circuit board 112, and covers the electronic components 115 and the electrical connection line 117, and covers the non-photosensitive area 113a2 of the photosensitive chip 113, so that after the packaging material is cross-linked and cured, the packaging material forms a packaging structure 116 of an integrated molding structure.

[0065] In some optional embodiments, the packaging structure 116 may include a first packaging part 116a and a second packaging part 116b connected to each other, and the first packaging part 116a is arranged on the circuit board 112, wherein the first packaging part 116a covers the electronic components 115, and the first packaging part 116a also covers the electrical connection line 117, so that the first packaging part 116a can encapsulate and reinforce the connection points of the electrical connection line 117 on the circuit board 112 and the photosensitive chip 113, that is, it can effectively ensure the stability of the connection between the electrical connection line 117 and the circuit board 112 and the photosensitive chip 113, so as to prevent the connection between the electrical connection line 117 and the circuit board 112 and the connection between the electrical connection line 117 and the photosensitive chip 113 from loosening and falling off, resulting in interruption of signal transmission between the circuit board 112 and the photosensitive chip 113, thereby ensuring the stability of signal transmission between the circuit board 112 and the photosensitive chip 113. The second packaging part 116b is connected between the photosensitive chip 113 and the inner wall surface of the second mounting groove 1112, and the second packaging part 116b is also connected to the bottom surface of the second mounting groove 1112. Therefore, the existence of the second packaging part 116b can improve the installation stability of the photosensitive chip 113 in the second mounting groove 1112.

[0066] In some optional embodiments, such as Fig.11 As shown, the chip module 11 may also include a filter 118, which is mounted on the top of the packaging structure 116 facing away from the circuit board 112, and the filter 118 is located on the photosensitive path of the photosensitive chip 113, so that the filter 118 can be used to filter the stray light of the ambient light passing through the lens structure, thereby ensuring that the image captured by the camera device has better clarity. The filter 118 may be, but is not limited to, a blue glass filter. For example, the filter 118 may also be a reflective infrared filter, or a double-pass filter (a double-pass filter can allow visible light and infrared light in the ambient light to pass through at the same time, or allow visible light and other specific wavelengths of light (such as ultraviolet light) in the ambient light to pass through at the same time, or allow infrared light and other specific wavelengths of light (such as ultraviolet light) to pass through at the same time).

[0067] Through the above design, the packaging structure 116 can have the function of a traditional mounting bracket without the need to provide an additional mounting bracket for the filter 118; at the same time, based on the advantages of the molding process, the top of the packaging structure 116 facing away from the circuit board 112 can be made to have good flatness by means of a molding process, so that the filter 118 can be installed flatly to ensure the filtering effect of the filter 118.

[0068] Furthermore, a third mounting groove 1161 is provided on the top of the packaging structure 116 facing away from the circuit board 112, and the filter 118 is installed in the third mounting groove 1161. For example, the filter 118 can be fixed to the hole wall of the third mounting groove 1161 by glue or tape. In this way, sufficient installation space can be provided for the filter 118, so that the filter 118 will not protrude from the surface of the packaging structure 116 facing away from the circuit board 112, thereby omitting the thickness of the filter 118, and further reducing the overall thickness of the chip module 11, so as to realize a lightweight design of the chip module 11.

[0069] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] In addition, the above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the content of this specification should not be understood as limiting the present application, and the protection scope of the present application shall be subject to the attached claims.

Claims

1. A chip module, characterized in that: The chip module comprises: A reinforcing plate, wherein the reinforcing plate is provided with a first mounting groove and a second mounting groove, wherein the first mounting groove surrounds a circumference of the second mounting groove; A circuit board, the circuit board is at least partially installed in the first installation groove, and the circuit board has a top surface and a bottom surface in the depth direction of the first installation groove, and the circuit board is provided with a hollow portion penetrating the top surface and the bottom surface to leak out of the groove bottom surface of the second installation groove; and A photosensitive chip is at least partially installed in the second installation groove, and the photosensitive chip is electrically connected to the circuit board.

2. The chip module according to claim 1, characterized in that: The first mounting groove penetrates through the outer peripheral surface of the reinforcing plate in the radial direction, and in the radial direction of the reinforcing plate, the outer peripheral surface of the circuit board protrudes from the outer peripheral surface of the reinforcing plate.

3. The chip module according to claim 1, characterized in that: The photosensitive chip is bonded to the groove wall surface of the second mounting groove by means of a thermally conductive adhesive.

4. The chip module according to any one of claims 1 to 3, characterized in that: The chip module also includes electronic components and a packaging structure. The electronic components are fixed to a surface of the circuit board facing away from the reinforcement plate and are electrically connected to the circuit board. The packaging structure is disposed on the circuit board and covers the electronic components.

5. The chip module according to any one of claims 1 to 3, characterized in that: The chip module also includes an electrical connection line and a packaging structure, one end of the electrical connection line is electrically connected to the circuit board, and the other end of the electrical connection line is electrically connected to the photosensitive chip. The packaging structure is arranged on the circuit board, and the packaging structure covers the electrical connection line.

6. The chip module according to claim 5, characterized in that: The surface of the photosensitive chip facing away from the reinforcement plate includes a photosensitive area and a non-photosensitive area, the non-photosensitive area is connected to the periphery of the photosensitive area, one end of the electrical connection line is electrically connected to the non-photosensitive area, and the packaging structure covers the non-photosensitive area.

7. The chip module according to claim 5, characterized in that: The packaging structure includes a first packaging part and a second packaging part which are connected to each other, the first packaging part is arranged on a circuit board, and the first packaging part covers the electrical connection line, the second packaging part is connected between the photosensitive chip and the inner wall surface of the second mounting groove, and the second packaging part is connected to the bottom surface of the second mounting groove.

8. The chip module according to claim 5, characterized in that: The chip module also includes a filter. A third mounting groove is provided on the top of the packaging structure facing away from the circuit board. The filter is installed in the third mounting groove and is located on the photosensitive path of the photosensitive chip.

9. A camera device, characterized in that: The camera device includes a lens structure and a chip module as described in any one of claims 1 to 8, the lens structure is connected to the reinforcement plate and / or the circuit board, and the lens structure is located on the photosensitive path of the photosensitive chip.

10. An electronic device, characterized in that: The electronic device includes the imaging device according to claim 9.

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