Chip packaging module

Abstract

The utility model relates to the field of chip packaging technology, and provides a chip packaging module for packaging light-emitting chips, which includes: a substrate having a packaging position for packaging the light-emitting chip, the light-emitting chip is installed at the packaging position, the substrate is provided with supporting convex parts on the peripheral side of the packaging position, and the supporting convex parts are dispersedly arranged on the peripheral side of the packaging position; a dam is installed on the peripheral side of the packaging position and abuts against the supporting convex parts, and the supporting convex parts support the dam so that a gap between the dam and the substrate is set and an airflow channel is formed; a lens is covered on the side of the dam away from the substrate. The utility model supports the dam by using the supporting convex parts to form an airflow channel between the dam and the substrate, so that the internal air can be discharged outward through the airflow channel, thereby reducing the internal temperature of the packaging module and increasing the product life. At the same time, it can also effectively remove the pressure difference between the inside and the outside, and protect the lens from falling off and breaking.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a chip packaging module. Background Art

[0002] With the rapid development of science and technology, integrated circuit (IC) packaging technology is also constantly improving. Although traditional packaging methods, such as plastic packaging (POP) and ceramic packaging (CERPAC), meet the packaging needs of integrated circuits to a certain extent, they still face challenges in the pursuit of higher performance, smaller size, and better heat dissipation. Therefore, chip on glass (Chip On Board, referred to as COB) packaging technology came into being, and it has emerged in the field of integrated circuit packaging with its unique advantages.

[0003] COB packaging technology is a technology that directly sticks the bare chip on the printed circuit board (PCB) and encapsulates it through transparent insulating materials such as glass. Existing COB modules are encapsulated by fixing transparent glass or lens materials through the steps of the bracket itself, or using a secondary dam process with dam glue. This will cause the light source to form a relatively sealed state inside. When producing high-power COB modules, the internal temperature rises and the heat cannot be discharged, which affects the product life. In addition, the gas inside the light source expands due to heat, forming internal and external pressures, which can easily cause the lens to fall off or break. Utility Model Content

[0004] In view of the deficiencies in the prior art, the purpose of the utility model is to provide a chip packaging module with good heat dissipation effect and longer service life.

[0005] In order to solve the above problems, the utility model provides the following technical solutions:

[0006] A chip packaging module, used for packaging a light-emitting chip, comprising:

[0007] A substrate having a packaging position for packaging the light-emitting chip, the light-emitting chip is mounted on the packaging position, the substrate is provided with supporting convex parts on the surrounding side of the packaging position, and the supporting convex parts are dispersedly arranged on the surrounding side of the packaging position;

[0008] A dam is installed on the peripheral side of the packaging position and abuts against the supporting protrusion, and the supporting protrusion supports the dam so that a gap is set between the dam and the substrate to form an airflow channel;

[0009] The lens is covered on a side of the dam away from the substrate.

[0010] In one embodiment, a supporting stopper is protrudingly provided on one side of the dam facing the substrate, the number of the supporting stoppers corresponds to the supporting protrusions, and the supporting stoppers are arranged opposite to the supporting protrusions.

[0011] In one embodiment, the number of the supporting protrusions is at least six.

[0012] In one embodiment, the number of the supporting protrusions is six.

[0013] In one embodiment, the supporting protrusions are arranged on both sides of the mounting position along the first direction and the second direction, and the number of the supporting protrusions arranged on at least one side of the packaging position along the first direction is three, and the number of the supporting protrusions arranged on at least one side of the packaging position along the second direction is two;

[0014] The first direction is perpendicular to the second direction.

[0015] In one embodiment, the distance from any of the supporting protrusions to another adjacent supporting protrusion along the first direction is equal;

[0016] The distance from any supporting protrusion to another adjacent supporting protrusion along the second direction is equal.

[0017] In one embodiment, the distance from any of the support protrusions to another adjacent support protrusion along the first direction is smaller than the distance from any of the support protrusions to another adjacent support protrusion along the second direction.

[0018] In one embodiment, the support abutment is equal to the support protrusion in height.

[0019] In one embodiment, the height of the supporting protrusion ranges from 1 / 5 to 1 / 8 of the thickness of the light emitting chip.

[0020] In one embodiment, the peripheral side of the lens and the outer peripheral side of the dam are aligned with each other along the first direction and the second direction.

[0021] The beneficial effect of the utility model is that when the dam is installed into the substrate and is arranged around the light-emitting chip, the side of the dam close to the substrate abuts against the supporting protrusion protruding from the substrate, so that the dam is supported by the supporting protrusion so that a gap is set between the dam and the substrate, and an air flow channel is formed by the gap after the substrate and the dam are combined and installed, so that the closed space originally used to encapsulate the light-emitting chip is opened, so that air can flow between the air flow channels; the utility model supports the dam by using the supporting protrusion so that an air flow channel is formed between the dam and the substrate, so that the internal air can be discharged outwardly through the air flow channel, thereby reducing the internal temperature of the packaging module and increasing the product life. At the same time, it can also effectively eliminate the pressure difference between the inside and the outside, and protect the lens from falling off and breaking. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a three-dimensional diagram of one embodiment of a chip packaging module of the utility model;

[0023] Figure 2 This is an exploded schematic diagram of one embodiment of a chip packaging module of the utility model;

[0024] Figure 3 This is a schematic structural diagram of one embodiment of a chip packaging module of the utility model;

[0025] Figure 4 This is a side view of one embodiment of a chip packaging module of the utility model;

[0026] Figure 5 for Figure 4 A partial enlarged view of point A in the middle.

[0027] Reference numerals:

[0028] 100, chip packaging module; 200, light emitting chip; 110, substrate; 11a, packaging position; 121, supporting protrusion; 111, dam; 11b, air flow channel; 112, lens; 122, supporting stopper;

[0029] L1, the distance from any supporting protrusion to another adjacent supporting protrusion along the first direction;

[0030] L2, the distance from any supporting protrusion to another adjacent supporting protrusion along the second direction;

[0031] L3, height of the supporting convex part;

[0032] L4, height of the supporting member;

[0033] L5, light emitting chip thickness. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] For the convenience of describing the first direction and the second direction in the embodiment of the present application, the first direction is the left-right direction in the drawings, and the second direction is the front-back direction in the drawings. The x-axis arrow direction is referred to as the "right" direction in the following text, and the z-axis arrow direction is referred to as the "rear" direction in the following text, which is not limited to the actual application of the present application.

[0037] Please refer to Figure 1-5 As shown, this embodiment provides a chip packaging module 100, which solves the defect that the internal temperature of the traditional COB module light source is too high and the gas cannot be discharged after expanding due to heat by setting a lens 112 assembly process on the outer surface and combining the PCB substrate 110, the ceramic dam 111 and the lens 112.

[0038] According to the above scheme, preferably, the present embodiment provides a packaging module that adopts the COB packaging process to package the light-emitting chip 200, which includes: a substrate 110, a dam 111 installed on the peripheral side of the packaging position 11a and abutting against the supporting protrusion 121, and a lens 112 covering the side of the dam 111 away from the substrate 110; wherein, the PCB substrate 110 in the present embodiment adopts a metal substrate 110 or a ceramic board with an unfixed size, the dam 111 adopts a traditional ceramic dam 111, and the lens 112 adopts a quartz glass material.

[0039] In the above scheme, a packaging position 11a for packaging the light-emitting chip 200 is provided on the substrate 110, and the light-emitting chip 200 is installed on the packaging position 11a. The substrate 110 is provided with a supporting protrusion 121 on the surrounding side of the packaging position 11a, and the supporting protrusion 121 is dispersedly arranged on the surrounding side of the packaging position 11a; it can be understood that when the dam 111 is installed in the substrate 110 and is arranged around the surrounding side of the light-emitting chip 200, the side of the dam 111 close to the substrate 110 is in contact with the supporting protrusion 121 protruding from the substrate 110, so that the dam 111 is supported by the supporting protrusion 121 so that the dam 111 and the substrate 110 are spaced apart. The gap is set, and the air flow channel 11b is formed by the gap after the substrate 110 and the dam 111 are combined and installed, so that the closed space originally used to encapsulate the light-emitting chip 200 is opened, so that air can flow between the air flow channels 11b; the utility model supports the dam 111 by using the supporting protrusion 121 to form an air flow channel 11b between the dam 111 and the substrate 110, so that the internal air can be discharged outward through the air flow channel 11b, thereby reducing the internal temperature of the packaging module and improving the product life. At the same time, it can also effectively eliminate the pressure difference between the inside and the outside, and protect the lens 112 from falling off and breaking.

[0040] According to the above scheme, further, in this embodiment, a support abutment 122 is protruding from the side of the dam 111 facing the substrate 110, the number of the support abutments 122 corresponds to the support protrusions 121, and the support abutments 122 are arranged opposite to the support protrusions 121, and the support abutments 122 are generally used to abut the support protrusions 121, so that the airflow channel 11b formed between the dam 111 and the substrate 110 has a certain width, further accelerating the airflow flow speed between the airflow channels 11b, so as to enhance the heat dissipation effect on the light-emitting chip 200 on the substrate 110.

[0041] Preferably, at least six supporting protrusions 121 are provided; further, in this embodiment, six supporting protrusions 121 are provided.

[0042] According to the above scheme, specifically, the supporting protrusions 121 are arranged on both sides of the installation position along the first direction and the second direction, and the number of the supporting protrusions 121 arranged on at least one side of the packaging position 11a along the first direction is three, and the number of the supporting protrusions arranged on at least one side of the packaging position 11a along the second direction is two; it can be understood that a supporting protrusion 121 is respectively arranged on the outer sides of the four diagonals of the packaging position 11a, and a supporting protrusion 121 is arranged in the center of both sides of the packaging position 11a along the first direction; and in this embodiment, the distance L1 from any supporting protrusion 121 to another adjacent supporting protrusion 121 along the first direction is equal; the distance L2 from any supporting protrusion 121 to another adjacent supporting protrusion 121 along the second direction is equal; in addition, the distance L1 from any supporting protrusion 121 to another adjacent supporting protrusion 121 along the first direction is smaller than the distance L2 from any supporting protrusion 121 to another adjacent supporting protrusion 121 along the second direction. This structure is to balance each supporting protrusion The supporting force borne by the member 121 is such that the dam 111 can better support the lens 112, and can also promote the installation stability before the substrate 110; in addition, the height L4 of the support stopper 122 in this embodiment is equal to the height L3 of the support protrusion 121; the height L3 of the support protrusion 121 ranges from 1 / 5 to 1 / 8 of the thickness L5 of the light-emitting chip 200; optionally, the height L3 of the support protrusion 121 is 1 / 6 of the thickness L5 of the light-emitting chip 200. This structure is to limit the height L3 of the support protrusion 121 and the height L4 of the support stopper 122, thereby further limiting the width of the airflow channel 11b, so that the width of the airflow channel 11b is not too wide, resulting in poor packaging effect, and also avoiding the airflow channel 11b from being too narrow, resulting in heat accumulation and slow heat dissipation; in addition, the peripheral side of the lens 112 in this embodiment and the outer peripheral side of the dam 111 are aligned with each other along the first direction and the second direction.

[0043] In summary, the utility model provides a chip packaging module. When the dam is installed into the substrate and arranged around the light-emitting chip, the side of the dam close to the substrate abuts against the supporting protrusion protruding from the substrate, so that the dam is supported by the supporting protrusion so that a gap is set between the dam and the substrate. The air flow channel is formed by the gap after the substrate and the dam are combined and installed, so that the closed space originally used to package the light-emitting chip is opened, so that air can flow between the air flow channels. The utility model supports the dam by using the supporting protrusion so that an air flow channel is formed between the dam and the substrate, so that the internal air can be discharged outward through the air flow channel, thereby reducing the internal temperature of the packaging module and improving the product life. At the same time, it can also effectively eliminate the pressure difference between the inside and the outside, and protect the lens from falling off and breaking.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip packaging module for packaging a light-emitting chip, characterized in that: include: A substrate having a packaging position for packaging the light-emitting chip, the light-emitting chip is mounted on the packaging position, the substrate is provided with supporting convex parts on the surrounding side of the packaging position, and the supporting convex parts are dispersedly arranged on the surrounding side of the packaging position; A dam is installed on the peripheral side of the packaging position and abuts against the supporting protrusion, and the supporting protrusion supports the dam so that a gap is set between the dam and the substrate to form an airflow channel; The lens is covered on a side of the dam away from the substrate.

2. A chip packaging module according to claim 1, characterized in that: A supporting stopper is also protruded on one side of the dam facing the base plate. The number of the supporting stopper corresponds to the supporting protrusions, and the supporting stopper is arranged opposite to the supporting protrusions.

3. The chip packaging module according to claim 1, characterized in that: The number of the supporting protrusions is at least six.

4. The chip packaging module according to claim 3, characterized in that: The number of the supporting protrusions is six.

5. The chip packaging module according to claim 4, characterized in that: The supporting protrusions are arranged on both sides of the packaging position along the first direction and the second direction, and the number of the supporting protrusions arranged on at least one side of the packaging position along the first direction is three, and the number of the supporting protrusions arranged on at least one side of the packaging position along the second direction is two; The first direction is perpendicular to the second direction.

6. The chip packaging module according to claim 5, characterized in that: The distance from any supporting protrusion to another adjacent supporting protrusion along the first direction is equal; The distance from any supporting protrusion to another adjacent supporting protrusion along the second direction is equal.

7. The chip packaging module according to claim 5, characterized in that: The distance from any of the support protrusions to another adjacent support protrusion along the first direction is smaller than the distance from any of the support protrusions to another adjacent support protrusion along the second direction.

8. The chip packaging module according to claim 2, characterized in that: The support abutment is equal in height to the support protrusion.

9. The chip packaging module according to claim 1, characterized in that: The height of the supporting protrusion ranges from 1 / 5 to 1 / 8 of the thickness of the light emitting chip.

10. The chip packaging module according to claim 5, characterized in that: The peripheral side of the lens and the outer peripheral side of the dam are aligned with each other along the first direction and the second direction.

Images