LED chip packaging structure with white reflective wall

Abstract

The utility model relates to an LED chip packaging structure with a white reflective wall, which is arranged below a cutting piece. The cutting piece can move close to or away from the LED chip packaging structure, and includes a fluorescent sheet and an LED chip. The fluorescent sheet is provided with a plurality of mounting grooves and reflective grooves, and the plurality of mounting grooves and reflective grooves are arranged at intervals. Fluorescent glue is dotted in the mounting grooves, and the LED chip is fixed in the mounting grooves by the fluorescent glue. The reflective grooves are filled with white colloid to form reflective walls. The center line of the bottom of the reflective groove is used as the cutting position, and the cutting piece is used to cut the cutting position. The utility model separates the white reflective wall from the LED chip by arranging the mounting grooves and the reflective grooves, so that the side of the LED chip will not directly contact the white reflective wall, and the side light of the LED chip will not be blocked. The reflective wall can reflect the side light of the LED chip upward, thereby improving the overall brightness of the LED chip.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lighting, in particular to an LED chip packaging structure with a white reflection wall. Background Art

[0002] In the development and application of LED lighting technology, chip-scale packaged LEDs have attracted widespread attention for their compact size and high energy-saving performance. However, current chip-scale packaged LEDs generally have the problem of insufficient brightness. This is mainly because the side of the LED chip is in direct contact with the encapsulated white colloid over a large area, resulting in the side light of the LED chip being blocked by the white colloid and unable to be fully emitted, thereby reducing the overall brightness of the LED.

[0003] Therefore, there is an urgent need to provide an LED chip packaging structure with a white reflective wall to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings and defects of the prior art and provide an LED chip packaging structure with a white reflective wall to solve the problem that the side lines of the LED chip are blocked, resulting in low brightness of the LED chip.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] An LED chip packaging structure with a white reflective wall is arranged below a cutting piece. The cutting piece can move close to or away from the LED chip packaging structure. The structure comprises a fluorescent sheet and an LED chip. The fluorescent sheet is provided with a plurality of mounting grooves and reflective grooves. The plurality of mounting grooves and reflective grooves are arranged at intervals. Fluorescent glue is dotted in the mounting grooves. The LED chip is fixed in the mounting grooves by the fluorescent glue. The reflective grooves are filled with white colloid to form a reflective wall. The center line of the bottom of the reflective groove is the cutting position. The cutting piece is used to cut the cutting position.

[0007] As a preferred technical solution of the utility model, the depth of the reflecting groove is greater than the depth of the mounting groove, the bottom width of the reflecting groove is less than the width of the reflecting groove opening, and the two side walls of the reflecting groove are inclined inwards.

[0008] As a preferred technical solution of the utility model, the width of the mounting groove is greater than the width of the LED chip.

[0009] As a preferred technical solution of the utility model, the depth of the mounting groove is less than the thickness of the LED chip and greater than 1 / 2 LED chip thickness.

[0010] As a preferred technical solution of the utility model, the height of the reflective groove is flush with the plane height of the LED chip.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] The utility model provides a mounting groove and a reflection groove on a fluorescent sheet, applies fluorescent glue in the mounting groove, and packages and fixes the LED chip in the mounting groove; fills the reflection groove with white colloid, and forms a reflection wall after solidification; and then uses the center line of the bottom of the reflection groove as the cutting position, and the cutting piece cuts the cutting position to obtain a single LED chip packaging structure with a white reflection wall, and the white reflection wall surrounds the LED chip. Since there is a gap between the mounting groove and the reflection groove, the white reflection wall can be separated from the LED chip, so that the side of the LED chip will not directly contact the white reflection wall, and the side light of the LED chip will not be blocked, and the reflection wall can reflect the side light of the LED chip upward, thereby improving the overall brightness of the LED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of a single LED chip packaging structure with a white reflective wall according to the present invention.

[0014] Figure 2 It is a schematic diagram of the fluorescent sheet of the utility model.

[0015] Figure 3 This is a schematic diagram of applying fluorescent glue to the fluorescent sheet of the utility model.

[0016] Figure 4 It is a schematic diagram of the overall structure in which the cutting piece is arranged on the top of the utility model.

[0017] Figure 5 This is a schematic diagram of a single LED chip packaging structure with a white reflective wall after being flipped 180 degrees in the utility model.

[0018] The above drawings include the following reference numerals:

[0019] 1. Fluorescent sheet, 2. Mounting groove, 3. Reflection groove, 4. Fluorescent glue, 5. LED chip, 6. White colloid, 7. Cutting piece. DETAILED DESCRIPTION

[0020] The present invention is further described in detail below in conjunction with embodiments and drawings, but the implementation manner of the present invention is not limited thereto.

[0021] The specific implementation process of the utility model is as follows:

[0022] like Figures 1 to 5As shown, an LED chip packaging structure with a white reflective wall is arranged below a cutting piece 7, and the cutting piece 7 can move close to or away from the LED chip packaging structure, including a fluorescent sheet 1, an LED chip 5, a plurality of mounting grooves 2 and reflective grooves 3 are arranged on the fluorescent sheet 1, and the plurality of mounting grooves 2 and reflective grooves 3 are arranged at intervals, and a fluorescent glue 4 is dotted in the mounting groove 2, and the LED chip 5 is fixed in the mounting groove 2 by the fluorescent glue 4, and the reflective groove 3 is filled with a white colloid 6 to form a reflective wall, and the center line of the bottom of the reflective groove 3 is the cutting position, and the cutting piece 7 is used to cut the cutting position. For details, refer to Figures 2 to 3 The fluorescent sheet 1 is integrally formed with a plurality of mounting grooves 2 and reflecting grooves 3. The mounting groove 2 is used to place the LED chip 5. The depth of the mounting groove is less than the thickness of the LED chip and greater than 1 / 2 The thickness of the LED chip. By applying fluorescent glue 4 in the mounting groove 2, the LED chip 5 is packaged and fixed in the mounting groove 2. Figure 4 , place the positive and negative poles of the LED chip 5 facing upwards, and then press it into the mounting groove 2. The fluorescent glue 4 will be squeezed to fill the mounting groove 2 and wrap the four sides of the LED chip 5. By controlling the amount of fluorescent glue 4 applied, the fluorescent glue 4 can climb to a height that is level with the plane of the LED chip 5 under the action of tension, ensuring the light conversion efficiency and uniformity of light distribution. It should be noted that after the fluorescent glue 4 is squeezed by the LED chip 5, a small amount of fluorescent glue 4 may overflow from the mounting groove 2 and flow into the reflective groove 3, which is a normal phenomenon. The reflective groove 3 is used to fill the white colloid 6 to form a reflective wall after solidification. The depth of the reflective groove 3 is greater than the depth of the mounting groove 2, the bottom width of the reflective groove 3 is less than the width of the notch of the reflective groove 3, and the two side walls of the reflective groove 3 are inclined inward. Taking the center line of the bottom of the reflective groove 3 as the cutting position, the cutting piece 7 cuts the cutting position perpendicular to the notch of the reflective groove 3 to obtain a single LED chip packaging structure with a white reflective wall, refer to Figure 1 The white reflective wall surrounds the LED chip 5. Since there is a gap between the mounting groove 2 and the reflective groove 3, the white reflective wall can be separated from the LED chip 5, so that the side of the LED chip 5 will not directly contact the white reflective wall, and the side light of the LED chip 5 will not be blocked. Figure 5 This is a schematic diagram of a single LED chip packaging structure with a white reflective wall after being cut and flipped 180 degrees. The reflective wall can reflect the side light of the LED chip 5 upward, thereby improving the overall brightness of the LED chip 5 to meet the application requirements of LED chip-level packaging in the fields of lighting and backlighting.

[0023] In the embodiment of the utility model, the width of the mounting groove 2 is greater than the width of the LED chip, so as to ensure that the filled fluorescent glue 4 can be evenly distributed between the LED chip and the mounting groove 2 .

[0024] In the embodiment of the utility model, the height of the reflective groove is level with the plane height of the LED chip, which can ensure that the light emitted from the side of the LED chip 5 is completely reflected, minimize light loss, and improve the brightness of the LED chip 5.

[0025] The above-mentioned embodiments only express the implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An LED chip packaging structure with a white reflective wall, arranged below a cutting member (7), wherein the cutting member (7) can move closer to or farther from the LED chip packaging structure, characterized in that: The invention comprises a fluorescent sheet (1) and an LED chip (5); the fluorescent sheet (1) is provided with a plurality of mounting grooves (2) and reflecting grooves (3); the plurality of mounting grooves (2) and reflecting grooves (3) are arranged at intervals; a fluorescent glue (4) is dotted in the mounting groove (2); the LED chip (5) is fixed in the mounting groove (2) by the fluorescent glue (4); the reflecting groove (3) is filled with a white colloid (6) to form a reflecting wall; the center line of the bottom of the reflecting groove (3) is used as a cutting position; and the cutting piece (7) is used to cut the cutting position.

2. The LED chip packaging structure with a white reflective wall according to claim 1, characterized in that: The depth of the reflecting groove (3) is greater than the depth of the mounting groove (2), the bottom width of the reflecting groove (3) is less than the width of the groove opening of the reflecting groove (3), and the two side walls of the reflecting groove (3) are inclined inwards.

3. The LED chip packaging structure with a white reflective wall according to claim 1, characterized in that: The width of the mounting groove (2) is greater than the width of the LED chip (5).

4. The LED chip packaging structure with a white reflective wall according to claim 1, characterized in that: The depth of the mounting groove (2) is less than the thickness of the LED chip (5) and greater than 1 / 2 of the thickness of the LED chip (5).

5. The LED chip packaging structure with a white reflective wall according to claim 1, characterized in that: The height of the reflection groove (3) is flush with the plane height of the LED chip (5).

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