A semiconductor discharge tube shaping device

Abstract

The utility model discloses a semiconductor discharge tube shaping device, including a mounting box, a polishing cap is arranged on the top of the mounting box, a mounting tube is arranged on the bottom of the polishing cap, a driving assembly for driving the mounting tube to rotate is arranged inside the mounting box, a guide assembly is arranged on the top of the mounting box, a dust collecting assembly is arranged inside the mounting box, a connecting cap is installed inside the mounting box, the connecting cap is rotatably sleeved on the bottom of the outer wall of the mounting tube, through holes are provided at the bottom of the connecting cap and the bottom of the polishing cap, and a dust collecting pipe is installed at the bottom of the connecting cap. The utility model utilizes the coordinated use of the mounting box, the polishing cap, the mounting tube, the dust collecting assembly and the driving assembly, the dust collecting pipe is connected to an external dust collector, so that when the driving assembly drives the mounting tube and the polishing cap to rotate to grind the end of the semiconductor discharge tube, the dust collecting pipe can absorb the dust generated by the grinding of the polishing cap through the connecting cap and the mounting tube.

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