Wafer vacuum adsorption carrying disc suitable for wafers of multiple sizes

Abstract

The utility model discloses a wafer vacuum adsorption rotating carrier plate suitable for wafers of multiple sizes. The wafer vacuum adsorption rotating carrier plate comprises a rotating base and a carrier plate assembly. The rotating base is provided with a rotating central axis and a bearing end surface which is coaxially arranged with the rotating central axis; an air suction structure is distributed on the bearing end face; a gas channel communicated with the gas suction structure is arranged on the rotary base; the vacuumizing device is used for vacuumizing the gas channel; the carrying disc assembly comprises a plurality of annular positioning discs which are mutually sleeved inside and outside; the inner circumferential surface of each annular positioning disc is enclosed to form a wafer positioning space for accommodating a wafer; a limiting structure used for enabling the annular positioning disc and the rotary base to be coaxially arranged is arranged between the annular positioning disc on the outermost layer and the rotary base. And in two adjacent annular positioning discs, the annular positioning disc on the inner layer is inserted and positioned in the wafer positioning space of the annular positioning disc on the outer layer. According to the utility model, the positioning and fixing requirements during manual feeding of wafers can be met, and the positioning and fixing requirements of wafers with different sizes can be met.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer vacuum adsorption carrier suitable for wafers of multiple sizes. Background Art

[0002] During the manufacturing and testing process of the wafer, the wafer needs to be fixed. Conventionally, the wafer is fixed on the carrying platform by vacuum adsorption. At present, the way of loading the wafer to the carrying platform is divided into two ways: automatic loading by a robotic arm and manual loading. The robotic arm can accurately transfer the wafer to the predetermined position on the carrying platform, which has the advantages of fast and accurate positioning, time saving and labor saving. When loading manually, the wafer also needs to be positioned at the predetermined position on the carrying platform. At present, the wafer is manually positioned by instruments and equipment, and the position of the wafer needs to be adjusted frequently, and it is difficult to accurately position it on the carrying platform, which is time-consuming and laborious. In addition, conventionally, the wafer has specifications such as 4 inches, 5 inches, 6 inches, 8 inches, and 12 inches. The existing carrying platform is difficult to adapt to the positioning and fixing requirements of wafers of various specifications and sizes. Therefore, it is urgent to design a wafer vacuum adsorption carrier to meet the positioning requirements when the wafer is manually loaded, and to meet the positioning requirements of wafers of different sizes. Utility Model Content

[0003] In view of the above-mentioned technical problems, the purpose of the utility model is to propose a wafer vacuum adsorption carrier suitable for wafers of multiple sizes, which can meet the positioning and fixation requirements during manual wafer loading and can meet the positioning and fixation requirements of wafers of different sizes and has strong practicality.

[0004] The technical solution of the utility model is achieved as follows: a wafer vacuum adsorption rotating carrier suitable for wafers of multiple sizes, comprising a rotating base, a carrier assembly, and a vacuum pumping device;

[0005] The rotating base has a rotating central axis and a bearing end surface coaxially arranged with the rotating central axis; a plurality of air suction structures are distributed on the bearing end surface; and a gas channel connected with the air suction structure is provided on the rotating base;

[0006] The vacuum pumping device is used to vacuum the gas channel;

[0007] The carrier plate assembly is detachably arranged on the bearing end surface, and includes a plurality of annular positioning plates which are mutually sleeved inside and outside; the inner circumference of each annular positioning plate encloses a wafer positioning space for accommodating a wafer;

[0008] A limiting structure is provided between the outermost annular positioning disk and the rotating base to enable the two to be coaxially arranged;

[0009] In two adjacent annular positioning plates, the inner annular positioning plate is inserted and positioned in the wafer positioning space of the outer annular positioning plate.

[0010] Furthermore, the air intake structure is a groove extending on the bearing end surface.

[0011] Furthermore, the limiting structure includes a positioning cylinder arranged on the rotating base and a positioning notch arranged on the outermost annular positioning plate; a plurality of the positioning cylinders are arranged at intervals along the circumferential direction of the rotating base; the positioning notch and the positioning cylinder are arranged correspondingly, and the two are plugged in and matched in the direction of the rotation center axis.

[0012] Furthermore, the bearing end surface has a central area and an annular area which is sequentially sleeved from the central area to the outside; the air suction structure is distributed in the central area and the annular area;

[0013] The annular positioning plates are arranged in sequence in a plurality of annular areas starting from the outermost annular area.

[0014] Furthermore, each of the annular positioning plates has a matching position for covering the air suction structure on the corresponding annular area.

[0015] Further, the wafer vacuum adsorption rotating carrier includes a lifting mechanism; the lifting mechanism includes a lifting seat and a driving mechanism; the lifting seat is arranged on a rotating base and is movably arranged along the direction of the rotation center axis; a plurality of ejector pins are arranged on the lifting seat; a first avoidance hole is arranged on the central area and a plurality of annular areas of the bearing end surface; the ejector pin is movably inserted into the first avoidance hole; a second avoidance hole is arranged on the annular positioning plate corresponding to the first avoidance hole;

[0016] The driving mechanism is in transmission connection with the lifting seat, and has a transmission connection state of driving the lifting seat to move along the direction of the rotation center axis and allowing the lifting seat to rotate along with the rotating base.

[0017] Furthermore, the driving mechanism includes an annular structure and a driving assembly for driving the annular structure to move along the direction of the rotation center axis; the annular structure is coaxially arranged with the rotating base; the lifting seat has a movable end abutting against the annular structure in the direction of the rotation center axis.

[0018] Furthermore, the lifting mechanism includes an elastic component between the lifting seat and the rotating base.

[0019] Furthermore, the air intake structure in the central area and the air intake structures in each annular area are arranged independently of each other; a gas channel connected to the air intake structure in the central area is provided corresponding to the central area, and a gas channel connected to the air intake structure in the annular area is provided corresponding to each annular area.

[0020] Furthermore, the vacuum extraction device includes a pneumatic rotary joint, a control valve body, and a vacuum generator; the pneumatic rotary joint is coaxially arranged with the rotating base; the first end of the pneumatic rotary joint is connected to each gas channel, and the control valve body is provided on the second end of the pneumatic rotary joint corresponding to each gas channel; the vacuum generator is connected to each control valve body.

[0021] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0022] 1. The utility model cooperates with a rotating base and a carrier assembly. After the outermost annular positioning disk is positioned on the rotating base, each annular positioning disk is inserted into the wafer positioning space of the outer annular positioning disk from the outer layer to the inner layer in sequence, so that each annular positioning disk can be positioned and fixed in sequence, and the wafer is placed in the wafer positioning space of the innermost annular positioning disk, thereby positioning the wafer on the rotating base. The wafer is fixed on the rotating base by vacuum adsorption through the suction structure. By increasing or decreasing the number of annular positioning disks, the size of the wafer positioning space can be changed, so that wafers of different sizes can be placed. Through the combination of the above methods, the positioning and fixing requirements of wafers when manually loading can be met, and the positioning and fixing requirements of wafers of different sizes can be met, and the practicality is strong.

[0023] 2. In the present invention, the bearing end face is divided into several annular areas, and the air suction structures in each annular area and the air suction structure in the central area are independently arranged and not connected to each other. By independently controlling the opening and closing of each gas channel, the range of the vacuum adsorption area on the bearing end face can be controlled, so as to adapt to the vacuum adsorption positioning requirements of wafers of different sizes.

[0024] 3. Through the use of the lifting mechanism, the utility model can lift the wafer to a position away from the bearing end surface, so that the robot arm can freely enter and exit under the wafer, so as to facilitate the robot arm to enter and exit to take and place the wafer, effectively meeting the needs of automatic wafer loading. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The technical solution of the utility model is further described below in conjunction with the accompanying drawings:

[0026] Figure 1 It is a three-dimensional structural schematic diagram of the overall structure of the utility model;

[0027] Figure 2 for Figure 1 Exploded view of;

[0028] Figure 3 for Figure 2 The enlarged view of D in the figure;

[0029] Figure 4 for Figure 1 A cross-sectional structural diagram of ;

[0030] Figure 5 It is a schematic diagram of the three-dimensional structure of the rotating base of the utility model;

[0031] Figure 6 for Figure 5 A schematic diagram of a top view structure of FIG.

[0032] Figure 7 for Figure 6 Sectional view at AA in the figure;

[0033] Figure 8 for Figure 6 The cross-sectional view at BB in FIG.

[0034] Fig. 9 It is a schematic diagram of the assembly of the rotary base and the pneumatic rotary joint of the utility model;

[0035] Fig.10 It is a three-dimensional structural schematic diagram of the lifting seat of the utility model;

[0036] Fig.11 It is a schematic diagram of the assembly of the driving mechanism and the lifting seat of the utility model;

[0037] Fig.12 for Fig.11 A side view structural schematic diagram of

[0038] Fig.13 It is a structural schematic diagram of the drive assembly of the utility model;

[0039] Among them: 1. Rotating base; 11. Bearing end face; 111. Annular area; 112. Central area; 12. Air suction structure; 13. Gas channel; 14. Connecting channel; 15. First avoidance hole; 2. Annular positioning plate; 21. Wafer positioning space; 211. Positioning notch; 22. Second avoidance hole; 3. Lifting seat; 31. Push rod; 32. Positioning column; 33. Elastic component; 34. Guide member; 35. Abutting column; 4. Annular structural member; 41. Lifting block; 411. Oblique channel; 42. Slider; 43. Roller; 5. Pneumatic rotary joint; 51. Air nozzle; 6. Fixed base. DETAILED DESCRIPTION

[0040] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0041] like Figure 1-13The present embodiment shows a wafer vacuum adsorption rotating carrier for wafers of multiple sizes, which is suitable for the positioning and fixing requirements of wafers in the prior art, and the manual and automatic loading requirements of wafers. The wafer vacuum adsorption device includes a fixed base 6, a rotating base 1, a carrier assembly, and a vacuum pump. Among them, the rotating base 1 has a rotation center axis, and the rotating base 1 is installed on the fixed base 6 so as to be able to rotate around the rotation center axis. Corresponding to the rotating base 1, a rotating drive mechanism for driving the rotating base 1 to rotate is also configured, and the rotating drive mechanism is preferably a gear transmission mechanism in the prior art. The top of the rotating base 1 forms a bearing end face 11 coaxially arranged with the rotation center axis. The bearing end face 11 has a central area 112 formed at the center position of the bearing end face 11 and an annular area 111 that is sequentially sleeved from the central area 112 to the outside. On the bearing end face 11, a plurality of suction structures 12 are distributed and processed in the central area 112 and the annular area 111.

[0042] In this embodiment, the suction structures 12 in each annular area 111 and the suction structures 12 in the central area 112 are arranged independently and are not connected to each other. Several gas channels 13 are processed inside the rotating base 1, wherein the gas channel 13 connected to the suction structure 12 in the central area 112 is processed corresponding to the central area 112, and the gas channel 13 connected to the suction structure 12 in the annular area 111 is processed corresponding to each annular area 111. The aforementioned vacuum pumping device is arranged outside the rotating base 1 to vacuum the gas channel 13. During the vacuum pumping process, negative pressure is synchronously formed inside the suction structure 12. The wafer can be fixed on the bearing end surface 11 by vacuum adsorption. The vacuum pumping device includes a pneumatic rotary joint 5, a control valve body, and a vacuum generator. The pneumatic rotary joint 5 is arranged below the bottom of the rotating base 1, and the pneumatic rotary joint 5 is coaxially arranged with the rotating base 1. The rotating end of the pneumatic rotary joint 5 is connected by a rigid connector so that it can rotate synchronously with the rotating base 1. On the bottom surface of the rotating base 1, a gas nozzle 51 connected to the gas channel 13 is installed corresponding to each gas channel 13. The bottom surface of the rotating base 1 is an end surface arranged opposite to the bearing end surface 11. The above-mentioned pneumatic rotary joint 5 is a multi-way pneumatic rotary joint device in the prior art, and interfaces are arranged on the first end (rotating end) and the second end (fixed end) corresponding to each gas channel 13. Each gas nozzle 51 and the interface on the rotating end of the pneumatic rotary joint 5 are connected by an air pipe. The control valve body is connected to the corresponding interface on the fixed end of the pneumatic rotary joint 5. The above-mentioned control valve body is a solenoid valve in the prior art, and a vacuum generator is connected to each control valve body to perform a vacuum operation. Through the control valve body, the opening and closing of each gas channel 13 can be independently controlled, and then a vacuum adsorption area can be formed in the corresponding annular area 111 or the central area 112. In this embodiment, by controlling the opening and closing of the corresponding gas channels 13 , the range of the vacuum adsorption area can be expanded from the central area 112 to the outside on the carrying end surface 11 , thereby meeting the vacuum adsorption requirements of wafers of different sizes.

[0043] In this embodiment, the air intake structure 12 is a groove formed on the bearing end surface 11 and extending in the annular area 111 and the central area 112. Air holes are processed on the bottom surface of the groove in the annular area 111 and the central area 112. The air holes and the corresponding gas channels 13 are connected through the connecting channel 14.

[0044] The aforementioned carrier assembly is detachably mounted on the bearing end surface 11, and the carrier assembly includes a plurality of annular positioning disks 2 that are mutually sleeved inside and outside. Each annular positioning disk 2 has different outer dimensions. The inner circumference of each annular positioning disk 2 encloses a wafer positioning space 21 for accommodating a wafer. The shape of the wafer positioning space 21 is compatible with the wafer in the prior art, and the wafer can be placed in the wafer positioning space 21 and is restricted from moving. The wafer positioning space 21 of the plurality of annular positioning disks 2 gradually decreases from the outer layer to the inner layer, so that wafers of different specifications and sizes such as 12 inches, 8 inches, and 6 inches can be adapted. In two adjacent annular positioning disks 2, the outer circumference of the inner annular positioning disk 2 is compatible with the inner circumference of the outer annular positioning disk 2, so that the inner annular positioning disk 2 is inserted and positioned in the wafer positioning space 21 of the outer annular positioning disk 2, and the annular positioning disks 2 are assembled sequentially from the outer layer to the inner layer, so that the annular positioning disks 2 can be mutually positioned. Through the above structural design, by increasing or decreasing the number of annular positioning disks 2 and positioning the annular positioning disks 2 one after another, the size of the wafer positioning space 21 of the innermost annular positioning disk 2 can be changed, so that wafers of different sizes can be placed.

[0045] Among them, the annular positioning disk 2 is arranged in pairs with the aforementioned annular area 111. The above-mentioned annular positioning disks 2 are arranged in sequence in several annular areas 111 starting from the outermost annular area 111. Each annular positioning disk 2 has a matching position for covering the suction structure 12 on the corresponding annular area 111. In this matching position, the annular positioning disk 2 cooperates with the suction structure 12 and can be fixed on the bearing end face 11 by vacuum adsorption. When the wafer is placed in the wafer positioning space 21 of the innermost annular positioning disk 2, the wafer can be supported by the bearing end face 11 and adsorbed on the bearing end face 11 at least by the suction structure 12 located in the central area 112. The above-mentioned annular positioning disks 2 can be fixed on the rotating base 1 by vacuum adsorption through the suction structure 12, so that each annular positioning disk 2 can be placed stably and reliably.

[0046] The wafer vacuum adsorption rotating carrier of this embodiment includes a lifting mechanism. The lifting mechanism includes a lifting seat 3, a driving mechanism, and an elastic component 33. Several groups of lifting seats 3 are distributed on the rotating base 1 at intervals along the circumferential direction of the rotating base 1. The lifting seat 3 is installed in a slide groove on the rotating base so that it can be movably arranged on the rotating base 1 along the direction of the rotation center axis. Among them, a guide member 34 is installed on the lifting seat 3 to guide the lifting and lowering of the lifting seat 3 and improve the stability of the lifting and lowering of the lifting seat 3. Several ejector pins 31 are arranged on the lifting seat 3. A first avoidance hole 15 is processed in the central area 112 and several annular areas 111 on the bearing end surface 11. The ejector pin 31 is adapted to the first avoidance hole 15 and is movably inserted into the first avoidance hole 15. Among them, a second avoidance hole 22 is processed on the annular positioning plate corresponding to the first avoidance hole 15. By lifting the lifting base 3 , the push rod 31 can extend above the bearing end surface 11 through the first avoidance hole 15 , so as to lift the wafer placed on the bearing end surface 11 , or lift the wafer at a position away from the bearing end surface 11 .

[0047] The elastic component 33 is installed between the lifting seat 3 and the rotating base 1. The elastic component 33 has an elastic force to drive the lifting seat 3 to move toward the bottom of the rotating base 1 to improve the stability of the lifting seat 3 during the descent process. The elastic component 33 is preferably a coil spring.

[0048] The aforementioned driving mechanism is connected to the lifting seat 3 in a transmission connection state, and has a driving connection state that drives the lifting seat 3 to move along the direction of the rotation center axis and allows the lifting seat 3 to rotate with the rotating base 1. In this transmission connection state, when the rotating base 1 rotates around the rotation center axis, the lifting seat 3 can synchronously follow the rotation without being disturbed by the driving mechanism. Specifically, the above-mentioned driving mechanism includes an annular structure 4 and a driving assembly for driving the annular structure 4 to move along the rotation center axis. The annular structure 4 is coaxially arranged with the rotating base 1, and is installed on the fixed base 6 through a sliding assembly so as to be able to move back and forth along the rotation center axis. An abutment column 35 is installed on the aforementioned lifting seat 3. When the abutment column 35 is assembled, its lower end abuts against the end face of the annular structure 4, so that the lifting seat 3 has a movable end abutting against the annular structure 4 in the direction of the rotation center axis. When the rotating base 1 rotates, the abutment column 35 abuts against the annular structure 4 and moves relatively, so that the lifting seat 3 can rotate with the rotating base 1. In this embodiment, the above-mentioned driving assembly includes a slider 42, a lifting block 41, a roller 43, and a linear driver. The lifting block 41 is fixedly mounted on the annular structure 4, and an oblique channel 411 is processed inside the lifting block 41. The oblique channel 411 has an inclined upper end close to the annular structure 4 and an inclined lower end away from the annular structure 4. The slider 42 is mounted on the fixed base 6 through a track sliding fit. The roller 43 is fixedly mounted on the slider 42, and its wheel surface extends into the interior of the oblique channel 411 to be slidably connected with the oblique channel 411. The linear driver is fixedly mounted on the fixed base 6, and its linear driving end is connected to the slider 42 to drive the slider 42 to move back and forth in a preset direction. During the back and forth movement of the slider 42, the roller 43 moves in the oblique channel 411 to be able to drive the lifting block 41 to move up and down, and then drive the annular structure 4 to move up and down. In this embodiment, according to the actual structural design, the above-mentioned driving assembly can also use an electric push rod.

[0049] Among them, there is a limiting structure between the outermost annular positioning disk 2 and the rotating base 1 for making the two coaxially arranged. Through the limiting structure, the outermost annular positioning disk 2 is positioned at a predetermined position on the bearing end face 11. In this embodiment, the wafer positioning space 21 of the outermost annular positioning disk 2 can adapt to the positioning of a 12-inch wafer. Specifically, the aforementioned limiting structure includes a positioning column and a positioning notch 211. The positioning column is installed on the rotating base 1 or the lifting base 3. A plurality of positioning columns 32 are arranged at intervals along the circumferential direction of the rotating base 1. The positioning notch 211 is arranged on the outer edge of the outermost annular positioning disk 2. The positioning notch 211 is arranged corresponding to the positioning column 32, and the two are plugged in and matched in the direction of the rotation center axis, so that the outermost annular positioning disk 2 can be positioned at a predetermined position on the bearing end face 11.

[0050] In specific use, when manually loading, select the appropriate number of annular positioning disks 2 according to the size specifications of the wafer. The outermost annular positioning disk 2 is plugged into the positioning cylinder 32 through the positioning notch 211 to position the outermost annular positioning disk 2 on the bearing end face 11 of the rotating base 1. Then, from the outer layer to the inner layer, each annular positioning disk 2 is sequentially plugged into the wafer positioning space 21 of the outer annular positioning disk 2, so that each annular positioning disk 2 can be positioned and fixed in turn. The wafer is placed in the wafer positioning space 21 of the innermost annular positioning disk 2, so that the wafer is positioned and fixed at a predetermined position on the bearing end face 11. Then, the opening and closing of the corresponding gas channel 13 is independently controlled so that the suction structure 12 in the corresponding area of ​​the wafer generates a vacuum adsorption force and adsorbs and fixes the wafer. In the above method, the positioning and fixing requirements when manually loading wafers can be met. By independently controlling the opening and closing of each gas channel 13, the range of the vacuum adsorption area on the supporting end surface 11 can be controlled, thereby adapting to the vacuum adsorption and positioning requirements of wafers of different sizes.

[0051] When the wafer is loaded by the robot, each annular positioning plate 2 is removed. Through the action of the lifting mechanism, the ejector pin 31 can be exposed above the bearing end surface 11, and the ejector pin 31 can lift the wafer to a position away from the bearing end surface 11. The robot can freely enter and exit the bottom of the wafer to load the wafer onto the ejector pin 31 or remove it from the ejector pin 31. This facilitates the robot to enter and exit to pick up and place the wafer, effectively meeting the needs of automatic wafer loading.

[0052] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A wafer vacuum adsorption rotating carrier suitable for wafers of multiple sizes, comprising a rotating base, a carrier assembly, and a vacuum pumping device; characterized in that: The rotating base has a rotating central axis and a bearing end surface coaxially arranged with the rotating central axis; a plurality of air suction structures are distributed on the bearing end surface; and a gas channel connected with the air suction structure is provided on the rotating base; The vacuum pumping device is used to vacuum the gas channel; The carrier plate assembly is detachably arranged on the bearing end surface, and includes a plurality of annular positioning plates which are mutually sleeved inside and outside; the inner circumference of each annular positioning plate encloses a wafer positioning space for accommodating a wafer; A limiting structure is provided between the outermost annular positioning disk and the rotating base to enable the two to be coaxially arranged; In two adjacent annular positioning plates, the inner annular positioning plate is inserted and positioned in the wafer positioning space of the outer annular positioning plate.

2. The wafer vacuum adsorption rotating carrier applicable to wafers of multiple sizes according to claim 1, characterized in that: The air suction structure is a groove extending on the bearing end surface.

3. The wafer vacuum adsorption rotating carrier applicable to wafers of multiple sizes according to claim 1, characterized in that: The limiting structure includes a positioning column arranged on the rotating base and a positioning notch arranged on the outermost annular positioning disk; a plurality of the positioning columns are arranged at intervals along the circumferential direction of the rotating base; the positioning notch and the positioning column are arranged correspondingly, and the two are plugged in and matched in the direction of the rotation center axis.

4. The wafer vacuum adsorption rotating carrier applicable to wafers of multiple sizes according to claim 1, characterized in that: The bearing end surface has a central area and an annular area which is sequentially sleeved from the central area to the outside; the air suction structure is distributed in the central area and the annular area; The annular positioning plates are arranged in sequence in a plurality of annular areas starting from the outermost annular area.

5. The wafer vacuum adsorption rotating carrier applicable to wafers of multiple sizes according to claim 4, characterized in that: Each of the annular positioning plates has a mating position for covering the air suction structure on the corresponding annular area.

6. The wafer vacuum adsorption rotating carrier applicable to wafers of multiple sizes according to claim 4, characterized in that: The wafer vacuum adsorption rotating carrier includes a lifting mechanism; the lifting mechanism includes a lifting seat and a driving mechanism; the lifting seat is arranged on a rotating base and is movably arranged along the direction of the rotation center axis; a plurality of ejector pins are arranged on the lifting seat; a first avoidance hole is arranged on the central area and a plurality of annular areas of the bearing end surface; the ejector pin is movably inserted into the first avoidance hole; a second avoidance hole is arranged on the annular positioning plate corresponding to the first avoidance hole; The driving mechanism is in transmission connection with the lifting seat, and has a transmission connection state of driving the lifting seat to move along the direction of the rotation center axis and allowing the lifting seat to rotate along with the rotating base.

7. The wafer vacuum adsorption rotating carrier applicable to wafers of multiple sizes according to claim 6, characterized in that: The driving mechanism comprises an annular structure and a driving assembly for driving the annular structure to move along the direction of the rotation center axis; the annular structure is coaxially arranged with the rotating base; the lifting seat has a movable end abutting against the annular structure in the direction of the rotation center axis.

8. The wafer vacuum adsorption rotating carrier applicable to wafers of multiple sizes according to claim 6, characterized in that: The lifting mechanism comprises an elastic component between a lifting seat and a rotating base.

9. The wafer vacuum adsorption rotating carrier applicable to wafers of multiple sizes according to claim 4, characterized in that: The air intake structure in the central area and the air intake structures in each annular area are arranged independently of each other; a gas channel connected to the air intake structure in the central area is provided corresponding to the central area, and a gas channel connected to the air intake structure in the annular area is provided corresponding to each annular area.

10. The wafer vacuum adsorption rotating carrier applicable to wafers of multiple sizes according to claim 9, characterized in that: The vacuum extraction device includes a pneumatic rotary joint, a control valve body, and a vacuum generator; the pneumatic rotary joint is coaxially arranged with a rotating base; the first end of the pneumatic rotary joint is connected to each gas channel, and the control valve body is provided on the second end of the pneumatic rotary joint corresponding to each gas channel; the vacuum generator is connected to each control valve body.

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