LED lamp and heat dissipation device thereof

Abstract

The utility model relates to a light-emitting diode (LED) lamp and a heat dissipation device thereof. The LED lamp comprises at least one LED lamp bead arranged on the heat dissipation device. The radiating device comprises a circuit board and a radiator. The circuit board is provided with a first metal layer and a second metal layer which are located on two opposite sides respectively, the LED lamp beads are welded to the first metal layer, the second metal layer is welded to the radiator, and the circuit board is provided with a plurality of heat conduction holes so that heat energy generated by the LED lamp beads can be transmitted to the radiator through the heat conduction holes. In addition, part of the heat conduction holes are selectively filled with heat conduction material columns, so that heat energy generated by the LED lamp beads can be conducted to the radiator through the heat conduction material columns in the heat conduction holes.

Description

Technical Field

[0001] The utility model relates to a lamp and a heat dissipation device thereof, in particular to a high heat dissipation light emitting diode (LED) lamp and a heat dissipation device thereof. Background Art

[0002] Light-emitting diode (LED) is a semiconductor component. The wavelength of light emitted by LED varies depending on the materials used. Currently, the photoelectric conversion efficiency of high-power LED is generally about 15% to 25% of the input power into light, and the rest is converted into heat energy. Since the LED chip area is very small, the heat density per unit area of ​​high-power LED is very high, even more serious than that of ordinary IC components, and the junction temperature of the LED chip is greatly increased, which can easily cause overheating problems. Excessive chip junction temperature will reduce the brightness of the LED, and will also cause the wavelength of the LED to shift, affecting the quality and specifications, and causing a significant reduction in the life of the LED. Therefore, the heat dissipation design of LED-related products is very important.

[0003] The common welding method for high-power LEDs is to first weld the LED on an aluminum or copper substrate, and then connect the aluminum or copper substrate to a heat sink with heat dissipation adhesive. However, this traditional connection method passes through the insulating layer on the substrate, making it impossible to achieve good thermal conductivity and heat dissipation effects.

[0004] PCT patent case No. WO2014166113A1 (patent name: High thermal conductivity LED welding method) discloses a high thermal conductivity LED welding method, which includes the following steps: soldering the LED electrode to the circuit board with high temperature solder; directly soldering the LED heat dissipation plate to the heat dissipation device with low temperature solder; the LED heat dissipation plate is directly in contact with the heat dissipation device, so that the LED has better thermal conductivity and heat dissipation effect. However, the method disclosed in this patent case will greatly increase the difficulty and process cost of circuit board production.

[0005] In addition, Taiwan Patent Case No. TW201248947A (Patent Name: Heat Dissipation Device for Light Emitting Diode Device) discloses that a plurality of heat conduction lines are arranged on the circuit board, and the heat conduction lines are connected to the heat conduction area of ​​the LED, and the circuit board and the heat dissipation plate are locked together with screws, and the screws are in contact with the heat dissipation line of the LED. The heat conduction path of this patent is: the heat conduction area of ​​the LED, the circuit board line, the screws and the heat dissipation plate. However, this heat conduction method is limited by the small area of ​​the heat dissipation line and the screw area, so that the heat dissipation effect is limited. Utility Model Content

[0006] In view of this, in order to solve the problem of excessive heat generation of LEDs leading to reduced specifications, quality and shortened lifespan, the purpose of this utility model is to provide an LED lamp and its heat dissipation device. This utility model uses materials with high thermal conductivity such as solder or silver glue and is equipped with thermal conductive holes to replace traditional heat dissipation glue and screws, so that the solder / silver glue is directly connected to the heat sink to achieve effective heat dissipation. Compared with the previous technology, the circuit board of this utility model can achieve good heat dissipation effect with commercially available circuit boards, without the need for complex circuit design and excessively high process costs.

[0007] To achieve the aforementioned purpose, the utility model provides an LED lamp comprising at least one LED lamp bead; and a heat dissipation device, wherein the LED lamp bead is disposed on the heat dissipation device to remove heat energy generated by the LED lamp bead through the heat dissipation device.

[0008] To achieve the aforementioned purpose, the utility model further proposes a heat dissipation device, which is suitable for removing heat energy generated by at least one LED lamp bead, comprising: a circuit board, having at least one first metal layer and at least one second metal layer respectively located on two opposite sides, the circuit board having at least one heat-conducting hole, wherein the first metal layer of the circuit board is connected to a heat dissipation base of the LED lamp bead via a first heat-conducting material layer, so that the heat energy generated by the LED lamp bead is transferred from the heat dissipation base via the first heat-conducting material layer, the first metal layer and the heat-conducting hole to the second metal layer of the circuit board; and a heat sink, wherein the second metal layer of the circuit board is connected to the heat sink via a second heat-conducting material layer, so that the heat energy of the LED lamp bead is conducted from the second metal layer via the second heat-conducting material layer to the heat sink.

[0009] Wherein, an area of ​​the second metal layer of the circuit board is at least larger than an area of ​​the second metal layer of the heat sink connected to the circuit board via the second thermal conductive material layer.

[0010] The position where the heat-conducting hole is formed on the circuit board is located in the area where the heat dissipation base of the LED lamp bead is connected to the first metal layer of the circuit board via the first heat-conducting material layer.

[0011] The heat-conducting hole is filled with at least one heat-conducting material column connecting the first heat-conducting material layer and the second heat-conducting material layer, so as to conduct the heat energy generated by the LED lamp bead from the first heat-conducting material layer to the second heat-conducting material layer through the heat-conducting material column.

[0012] The first thermally conductive material layer, the second thermally conductive material layer and / or the thermally conductive material column are respectively selected from a group consisting of solder and silver paste.

[0013] The first thermally conductive material layer, the second thermally conductive material layer and / or the thermally conductive material column are respectively adhesives with thermal conductivity.

[0014] Among them, the thermal conductive hole is formed on the inner wall of the circuit board with a third metal layer connecting the first metal layer and the second metal layer, and the heat energy generated by the LED lamp bead is conducted from the heat dissipation base through the first thermal conductive material layer, the first metal layer, the thermal conductive hole and the third metal layer in the thermal conductive hole to the second metal layer of the circuit board.

[0015] Wherein, the circuit board is a copper foil circuit board, and the first metal layer and / or the second metal layer are / is a copper foil.

[0016] Wherein, the heat sink is made of pure copper metal.

[0017] The radiator is a copper column radiator, a water-cooled radiator, a fan-assisted copper column radiator or a fan-assisted water-cooled radiator.

[0018] There are a plurality of heat-conducting holes, a plurality of first heat-conducting holes among the heat-conducting holes are respectively filled with a heat-conducting material column, and a plurality of second heat-conducting holes among the heat-conducting holes are hollow.

[0019] Among them, the positions where the first thermal conductive holes are formed on the circuit board are located in an area where the heat dissipation base of the LED lamp bead is connected to the first metal layer of the circuit board via the first thermal conductive material layer, and the positions where the second thermal conductive holes are formed on the circuit board are located outside the area where the heat dissipation base of the LED lamp bead is connected to the first metal layer of the circuit board via the first thermal conductive material layer.

[0020] Wherein, the circuit board is a double-layer board or a multi-layer board.

[0021] To achieve the aforementioned purpose, the utility model further proposes a heat dissipation device, which is suitable for removing heat energy generated by at least one LED lamp bead, comprising: a copper foil circuit board, having at least one first copper foil and at least one second copper foil respectively located on two opposite sides, and the LED lamp bead is soldered to the first copper foil; and a heat sink, which is soldered to the second copper foil, and the copper foil circuit board has at least one copper-plated thermal conductive hole, so that the heat energy generated by the LED lamp bead is transferred to the heat sink through the copper-plated thermal conductive hole.

[0022] The area of ​​the second copper foil is larger than the area of ​​the heat sink to which the second copper foil is welded.

[0023] There are a plurality of the at least one copper-plated thermal conductive vias, and only at least one first copper-plated thermal conductive via located in the welding area between the heat sink and the second copper foil among the plurality of copper-plated thermal conductive vias is filled with solder or silver paste.

[0024] Among the plurality of copper-plated heat-conducting holes, at least one second copper-plated heat-conducting hole located outside the welding area between the heat sink and the second copper foil is not filled with solder or silver paste.

[0025] As mentioned above, the LED lamp and the heat dissipation device of the present invention have the following effects:

[0026] (1) The present invention adopts materials with high thermal conductivity such as solder or silver glue and is equipped with thermal conductive holes to replace traditional heat dissipation glue and screws, so that the solder / silver glue is directly connected to the heat sink to achieve effective heat dissipation, thereby improving the heat dissipation effect.

[0027] (2) Compared with the prior art, the circuit board of the present invention can achieve good heat dissipation effect with commercially available circuit boards without the need for complex circuit design and excessively high process costs.

[0028] (3) The copper foil circuit board of the heat dissipation device of the present invention may have copper-plated thermal conductive holes, some of which are filled with thermal conductive material columns for connecting LED lamp beads and heat sinks, and some of which are not filled with thermal conductive material columns. The present invention can provide a first type of heat conduction path and a second type of heat conduction path, so that the LED lamp becomes a high heat dissipation LED lamp.

[0029] (4) The order of the first type of heat conduction path provided by the utility model is (a) the heat dissipation base of the LED lamp bead, (b) the first thermal conductive material layer / first metal layer / third metal layer in the thermal hole under the heat dissipation base / thermal conductive material column, (c) the second thermal conductive material layer / second metal layer on the other side of the circuit board, and (d) the heat sink. The order of the second type of heat conduction path is (a) the heat dissipation base, (b) the first thermal conductive material layer / first metal layer under the heat dissipation base, (c) the thermal holes around the heat dissipation base / third metal layer in the thermal holes, (d) the second thermal conductive material layer / second metal layer on the other side of the circuit board, and (e) the heat sink.

[0030] (5) The heat dissipation device of the present invention allows the first heat conductive material layer and the second heat conductive material layer to directly connect the LED lamp bead and the heat sink respectively, and the first heat conductive material layer and the second heat conductive material layer can be connected to each other through the heat conductive material column and / or the first metal layer, the second metal layer and the third metal layer of the circuit board. The LED lamp of the present invention can achieve effective heat dissipation and improve the heat dissipation effect by directly connecting the LED lamp bead and the heat sink, for example, with solder / silver glue.

[0031] (6) The area of ​​the second metal layer of the circuit board is larger than the area of ​​the second metal layer of the circuit board connected to the heat sink via the second thermal conductive material layer, thereby improving the heat dissipation effect.

[0032] (7) The heat conductive material column is disposed at the connection area (e.g., welding area) between the LED lamp bead and the circuit board and at the connection area (e.g., welding area) between the heat sink and the circuit board, thereby improving the heat dissipation effect.

[0033] (8) The LED lamp of the present invention can be a high-power LED lamp.

[0034] In order to enable you to have a further understanding and recognition of the technical features and technical effects of the utility model, a preferred embodiment and a detailed description are provided as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a cross-sectional schematic diagram of the LED lamp bead of the LED lamp of the present invention being arranged on the heat dissipation device.

[0036] Figure 2 It is a schematic diagram of heat conduction of the LED lamp bead of the LED lamp of the present invention arranged on the heat dissipation device.

[0037] Figure 3 It is a cross-sectional schematic diagram of an LED lamp bead of the LED lamp of the present invention disposed on a heat dissipation device, wherein the heat dissipation device has a water-cooled radiator.

[0038] Figure 4 It is a three-dimensional schematic diagram of the LED lamp bead of the LED lamp of the present invention being arranged on the heat dissipation device.

[0039] Figure 5 It is a three-dimensional schematic diagram of the heat dissipation device of the LED lamp of the present invention.

[0040] Description of reference numerals:

[0041] 10: LED light

[0042] 20: LED lamp beads

[0043] 22: LED chips

[0044] 24: hood

[0045] 26: Heat dissipation base

[0046] 30: Heat dissipation device

[0047] 40: Circuit Board

[0048] 41: Substrate

[0049] 42: First metal layer

[0050] 43: Screw hole

[0051] 44: Second metal layer

[0052] 46: Thermal vias

[0053] 46a: First thermal via

[0054] 46b: Second thermal via

[0055] 48: The third metal layer

[0056] 50: Thermal conductive material column

[0057] 60: Radiator

[0058] 62: Water cooling head

[0059] 64: Channel tube

[0060] 66: Heat Suppressor

[0061] 70: First thermal conductive material layer

[0062] 80: Second thermal conductive material layer

[0063] P1: The first type of heat conduction path

[0064] P2: The second heat conduction path DETAILED DESCRIPTION

[0065] In order to facilitate understanding of the technical features, contents and advantages of the present invention and the effects that can be achieved, the present invention is hereby described in detail in the form of embodiments in conjunction with the drawings. The drawings used therein are only for illustration and auxiliary description purposes and may not be the actual proportions and precise configurations after the implementation of the present invention. Therefore, the proportions and configurations of the attached drawings should not be interpreted or limited to the scope of rights of the present invention in actual implementation. In addition, for ease of understanding, the same elements in the following embodiments are described with the same symbols.

[0066] In addition, the words used throughout the specification and claims generally have the ordinary meaning of each word used in the field, in the content disclosed herein, and in the specific content, unless otherwise noted. Certain words used to describe the utility model will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the utility model.

[0067] The use of “first”, “second”, “third”, etc. in this document does not specifically refer to the order or sequence, nor is it used to limit the present invention. It is only used to distinguish components or operations described with the same technical terms.

[0068] Secondly, the words "include", "including", "have", "contain" and the like used in this article are open terms, which mean including but not limited to.

[0069] Figure 1 It is a cross-sectional schematic diagram of the LED lamp bead of the LED lamp of the present invention being arranged on the heat dissipation device. Figure 2 It is a schematic diagram of heat conduction of the LED lamp bead of the LED lamp of the present invention arranged on the heat dissipation device. Figure 3 It is a cross-sectional schematic diagram of an LED lamp bead of the LED lamp of the present invention disposed on a heat dissipation device, wherein the heat dissipation device has a water-cooled radiator. Figure 4 It is a three-dimensional schematic diagram of the LED lamp bead of the LED lamp of the present invention being arranged on the heat dissipation device. Figure 5 It is a three-dimensional schematic diagram of the heat dissipation device of the LED lamp of the present invention.

[0070] See also Figures 1 to 5 , an LED lamp 10 of the present invention comprises an LED lamp bead 20 and a heat sink 30, and the LED lamp bead 20 is arranged on the heat sink 30. The heat sink 30 comprises a circuit board 40 and a heat sink 60. The heat sink 30 is suitable for discharging the heat energy generated by at least one LED lamp bead 20 to the external environment through the circuit board 40 and the heat sink 60, so that the LED lamp 10 can be a high heat dissipation LED lamp. The number of LED lamp beads 20 can be one or more. For the convenience of explaining the operation of the present invention, the present invention takes the LED lamp bead 20 in which the LED chip 22 is arranged on the heat sink 26 and covered with the cover 24 as an example, but it is not limited to this. The LED lamp bead 20 of the LED lamp 10 used in the present invention is not limited to a specific type, structure and circuit configuration, and it can be appropriately modified or replaced according to actual needs, for example, the cover 24 and / or the heat sink 26 are omitted or replaced with other structures, and it can also be selected as LED lamp beads 20 of various types, structures and circuit configurations available on the market.

[0071] The circuit board 40 of the heat dissipation device 30 of the present invention has at least one first metal layer 42 and at least one second metal layer 44 respectively located on two opposite sides, for example, the first metal layer 42 and the second metal layer 44 are located on two opposite sides of the substrate 41 of the circuit board 40. The circuit board 40 of the heat dissipation device 30 of the present invention has at least one heat conducting hole 46, for example, one or more heat conducting holes 46, and the heat conducting hole 46, for example, penetrates the above-mentioned substrate 41, and selectively penetrates the above-mentioned first metal layer 42 and second metal layer 44. The heat conducting hole 46 can selectively form a third metal layer 48 on the inner wall of the circuit board 40 to connect the first metal layer 42 and the second metal layer 44, so that the heat conducting hole 46 becomes a metal-plated heat conducting hole. The circuit board 40 is, for example, a copper foil circuit board, the first metal layer 42 and / or the second metal layer 44 are, for example, copper foils respectively, and the third metal layer 48 is copper foil, so that the thermal conductive holes 46 become copper-plated thermal conductive holes, and the thermal conductive holes 46 can be selectively arranged in an array, but are not limited to this. As long as the heat dissipation effect of this utility model can be achieved, any material or structure belongs to the scope of protection requested by this utility model. In addition, the circuit board 40, the first metal layer 42, the second metal layer 44 and the third metal layer 48 of the utility model are not limited to specific sizes or thicknesses. Similarly, the aperture of the thermal conductive hole 46 of the utility model or the distance between the two thermal conductive holes 46 is not particularly limited. As long as the heat dissipation effect of this utility model can be achieved, any size or aperture belongs to the scope of protection requested by this utility model.

[0072] The circuit board 40 of the heat dissipation device 30 of the utility model can be, for example, a commercially available printed circuit board, and can be, for example, a double-layer board or a multi-layer board, so the shape of the substrate 41 of the circuit board 40 can be changed accordingly according to the shape of the circuit board 40. Taking a commercially available double-layer board as an example, two metal layers (such as copper foil) are covered on two opposite sides of the substrate 41, and the substrate 41 is, for example, a dielectric material layer such as a fiberglass board, an epoxy resin board or a composite board thereof. Taking a commercially available multi-layer board as an example, two metal layers (such as copper foil) are covered on two opposite sides of the substrate 41, and its substrate 41 includes a plurality of intermediate layers, such as a stacking structure of the above-mentioned plurality of dielectric material layers and a plurality of metal layers, and has a plurality of metal-plated heat-conducting holes respectively located between the same or different stacking layers. Since a person with ordinary knowledge in the technical field to which the utility model belongs should understand how to implement a commercially available circuit board and / or a commercially available LED lamp bead to achieve the technical effect of the utility model based on the disclosure of the utility model, it will not be repeated here. In addition, the circuit board 40 may also selectively have other structures, such as screw holes 43, etc., so as to, for example, fasten the circuit board 40 to other objects (not shown).

[0073] One of the features of the present invention is that at least one heat-conducting hole 46 is formed on the circuit board 40 to improve the heat dissipation effect. In one embodiment, the position where the heat-conducting hole 46 is formed on the circuit board 40 can be, for example, located in the area where the heat dissipation base 26 of the LED lamp bead 20 is connected to the first metal layer 42 of the circuit board 40 via the first heat-conducting material layer 70. For example, taking the material of the first heat-conducting material layer 70 as solder, the position of the heat-conducting hole 46 of the circuit board 40 can be, for example, located in the welding area between the LED lamp bead 20 and the first metal layer 42, whereby the heat-conducting hole 46 in this welding area can be partially or completely adsorbed with solder, and even connected to the second metal layer 44 on the other side of the circuit board 40. Among them, the heat-conducting hole 46 adsorbed with solder is preferably only located in the welding area between the LED lamp bead 20 and the first metal layer 42, that is, the heat-conducting hole 46 outside the welding area is preferably not adsorbed with solder, thereby avoiding electrical conduction.

[0074] The first metal layer 42 of the circuit board 40 of the heat dissipation device 30 of the present invention is connected to the heat dissipation base 26 of the LED lamp bead 20 via the first thermal conductive material layer 70, so that the heat energy generated by the LED lamp bead 20 can be Figure 2 The second type of heat conduction path P2 shown is conducted from the heat dissipation base 26 through the first heat conductive material layer 70, the first metal layer 42 and the third metal layer 48 in the heat conductive hole 46 to the second metal layer 44 of the circuit board 40. In detail, the order of the second type of heat conduction path P2 provided by the utility model is (a) the heat dissipation base 26 of the LED lamp bead 20, (b) the first heat conductive material layer 70 / first metal layer 42 below the heat dissipation base 26, (c) the third metal layer 48 in the heat conductive hole 46 around the heat dissipation base 26, (d) the second heat conductive material layer 80 / second metal layer 44 on the other side of the circuit board 40, and (e) the heat sink 60.

[0075] In this embodiment, the heat-conducting hole 46 is selectively filled with at least one heat-conducting material column 50 connecting the first heat-conducting material layer 70 and the second heat-conducting material layer 80, so as to Figure 2The first type of heat conduction path P1 shown conducts the heat energy generated by the LED lamp bead 20 from the first heat conductive material layer 70 to the second heat conductive material layer 80 via the heat conductive material column 50 (even, or for example including via the first metal layer 42, the heat conductive material column 50 / third metal layer 48 and the second metal layer 44). The heat conductive material column 50 is located in the heat conductive hole 46 (for example, further protruding to the outside of one end or both ends of the heat conductive hole 46) and the position where the heat conductive hole 46 is formed on the circuit board 40 is, for example, located in the area where the heat dissipation base 26 of the LED lamp bead 20 is connected to the first metal layer 42 of the circuit board 40 via the first heat conductive material layer 70. For example, taking the material of the first heat conductive material layer 70 as solder, the position where the heat conductive material column 50 is formed in the heat conductive hole 46 on the circuit board 40 is located in the welding area between the LED lamp bead 20 and the first metal layer 42. The heat-conducting material column 50 is preferably disposed between the LED lamp bead 20 and the heat sink 60, for example, on the welding area between the heat sink 26 of the LED lamp bead 20 and the circuit board 40 and on the welding area between the heat sink 60 and the circuit board 40, so that the heat energy generated by the LED lamp bead 20 can be directly conducted from the heat sink 26 to the heat sink 60. In detail, the order of the first type of heat conduction path P1 provided by the utility model is (a) the heat sink 26 of the LED lamp bead 20, (b) the first heat-conducting material layer 70 below the heat sink 26 / the first metal layer 42 / the third metal layer 48 in the heat-conducting hole 46 / the heat-conducting material column 50, (c) the second heat-conducting material layer 80 / the second metal layer 44 on the other side of the circuit board 40, and (d) the heat sink 60.

[0076] The number of the heat-conducting holes 46 may be one or more, such as a plurality of first heat-conducting holes 46a and a plurality of second heat-conducting holes 46b. The number of the heat-conducting material column 50 may be one or more, and for example, it is located in all or part of the heat-conducting holes 46. Taking the heat-conducting holes 46 as a plurality and the heat-conducting material column 50 as a plurality as an example, the heat-conducting material column 50 is preferably filled only in part of the heat-conducting holes 46 (such as the first heat-conducting hole 46a), and the heat-conducting material column 50 is preferably only located in the welding area between the LED lamp bead 20 and the first metal layer 42 to improve the heat dissipation effect. The heat-conducting material column 50 is preferably not filled in another part of the heat-conducting hole 46 (such as the second heat-conducting hole 46b) to avoid conduction. The first heat-conducting hole 46a is preferably located on the welding area between the heat sink 60 and the circuit board 40, and on the welding area between the heat dissipation base 26 and the circuit board 40. The second heat-conducting hole 46b is preferably disposed on the welding area between the heat sink 60 and the circuit board 40, but outside the welding area between the heat dissipation base 26 and the circuit board 40. In the LED lamp 10 of the present invention, the first heat-conducting hole 46a and the heat-conducting material column 50 are, for example, distributed below the heat dissipation base 26 of the LED lamp bead 20, and the second heat-conducting hole 46b is, for example, distributed around the heat dissipation base 26 of the LED lamp bead 20. The materials of the first heat-conducting material layer 70, the second heat-conducting material layer 80 and / or the heat-conducting material column 50 are, for example, respectively heat-conducting adhesives, such as solder or silver glue, or are replaced by other high thermal conductivity solders, but are not limited thereto. The silver glue may, for example, have high thermal conductivity.

[0077] The heat dissipation device 30 of the present invention further has a heat sink 60, the material of which is, for example, pure copper metal, wherein the second metal layer 44 of the circuit board 40 is connected to the heat sink 60 via the second thermal conductive material layer 80, so that the heat energy of the LED lamp bead 20 can be conducted from the second metal layer 44 to the heat sink 60 via the second thermal conductive material layer 80 along the first type of thermal conduction path P1 and / or the second type of thermal conduction path P2. For example, if the material of the second thermal conductive material layer 80 is solder, the second metal layer 44 of the circuit board 40 is soldered to the heat sink 60 via the second thermal conductive material layer 80. Preferably, the area of ​​the second metal layer 44 needs to be larger than the area of ​​the welding area between the second metal layer 44 and the heat sink 60, for example, Figures 1 to 3As shown, the second metal layer 44 protrudes outside the above-mentioned welding area. The LED lamp 10 of the present invention allows the heat dissipation base 26 of the LED lamp bead 20 and the heat sink 60 of the heat dissipation device 30 to be directly connected to the first thermal conductive material layer 70 and the second thermal conductive material layer 80 respectively. The first thermal conductive material layer 70 and the second thermal conductive material layer 80 can be connected to each other through the thermal conductive material column 50 and / or the first metal layer 42, the second metal layer 44 and the third metal layer 48 of the circuit board 40. In other words, the LED lamp 10 of the present invention allows the LED lamp bead 20 and the heat sink 60 of the heat dissipation device 30 to be directly connected through solder / silver glue (i.e., the first thermal conductive material layer 70, the second thermal conductive material layer 80 and the thermal conductive material column 50), which can improve the heat dissipation effect and achieve effective heat dissipation.

[0078] Another feature of the present invention is that the circuit board 40 retains a large area of ​​the second metal layer 44, wherein the area of ​​the second metal layer 44 of the circuit board 40 is at least larger than the area of ​​the second metal layer 44 of the circuit board 40 connected to the heat sink 60 via the second thermal conductive material layer 80. For example, taking the second thermal conductive material layer 80 as an example of solder, the area of ​​the second metal layer 44 of the circuit board 40 is at least larger than the area of ​​the second metal layer 44 of the circuit board 40 soldered to the heat sink 60 via the second thermal conductive material layer 80 (i.e., the area of ​​the soldering area of ​​the second metal layer 44 and the heat sink 60), thereby improving the heat dissipation effect.

[0079] The material of the heat sink 60 is, for example, pure copper metal, but is not limited thereto. The heat sink 60 can be, for example, a copper column heat sink, a water-cooled heat sink, a fan-assisted copper column heat sink, or a fan-assisted water-cooled heat sink, etc., but is not limited thereto. For example, the heat sink 60 is a copper column heat sink, and the heat sink 60 has a plurality of copper columns, so that the heat energy generated by the LED lamp beads 20 can be discharged to the outside through the copper columns. For example, the heat sink 60 is a water-cooled heat sink (such as Figure 3 For example, the radiator 60 includes a water cooling head 62, two channel tubes 64 and a heat dissipator 66, wherein the two channel tubes 64 are respectively connected to the heat dissipator 66, wherein the flow direction of the aqueous solution is shown by the arrow, and the aqueous solution can transfer the heat energy of the water cooling head 62 to the heat dissipator 66 through one of the two channel tubes 64, and the cooled aqueous solution then flows back to the water cooling head 62 through the other of the two channel tubes 64 for continued circulation. In addition, the radiator 60 of the utility model can also be selectively equipped with a fan (not shown) to form a fan-assisted copper column heat sink or a fan-assisted water-cooled radiator.

[0080] In addition, in another embodiment of the present invention, the present invention provides an LED lamp 10 and a heat dissipation device 30 thereof, wherein the LED lamp bead 20 is disposed on the heat dissipation device 30, and the heat dissipation device 30 is adapted to remove heat energy generated by at least one LED lamp bead 20. The heat dissipation device 30 comprises a copper foil circuit board (i.e., circuit board 40) and a heat sink 60. The copper foil circuit board has a first copper foil (i.e., first metal layer 42) and a second copper foil (i.e., second metal layer 44) respectively located on two opposite sides, and the heat dissipation base 26 of the LED lamp bead 20 is soldered to the first copper foil, wherein the copper foil circuit board is penetrated by at least one copper-plated heat conduction hole (i.e., heat conduction hole 46) at least located on the welding area between the heat dissipation base 26 and the first copper foil. Some of the copper-plated heat conduction holes will absorb solder (i.e., heat conductive material column 50) and connect to the second copper foil on the other side of the copper foil circuit board. In addition, some copper-plated heat conduction holes are located around the heat dissipation base 26 of the LED lamp bead 20 and are not filled with solder to avoid electrical conduction. The second copper foil is connected to the heat sink 60 by solder or high thermal conductivity silver glue, so that the heat energy generated by the LED lamp bead 20 can be transferred to the heat sink 60 through the copper-plated thermal conductive holes with and without solder adsorption. Figure 2 The first type of heat conduction path P1 and the second type of heat conduction path P2 are shown. Moreover, the area of ​​the second copper foil is preferably larger than the connection area (eg, soldering area) between the second copper foil and the heat sink 60 .

[0081] In summary, the LED lamp and the heat dissipation device of the present invention have the following advantages:

[0082] (1) The present invention adopts materials with high thermal conductivity such as solder or silver glue and is equipped with thermal conductive holes to replace traditional heat dissipation glue and screws, so that the solder / silver glue is directly connected to the heat sink to achieve effective heat dissipation, thereby improving the heat dissipation effect.

[0083] (2) Compared with the prior art, the circuit board of the present invention can achieve good heat dissipation effect with commercially available circuit boards without the need for complex circuit design and excessively high process costs.

[0084] (3) The copper foil circuit board of the heat dissipation device of the present invention may have copper-plated thermal conductive holes, some of which are filled with thermal conductive material columns for connecting LED lamp beads and heat sinks, and some of which are not filled with thermal conductive material columns. The present invention can provide a first type of heat conduction path and a second type of heat conduction path, so that the LED lamp becomes a high heat dissipation LED lamp.

[0085] (4) The order of the first type of heat conduction path provided by the utility model is (a) the heat dissipation base of the LED lamp bead, (b) the first thermal conductive material layer / first metal layer / third metal layer in the thermal hole under the heat dissipation base / thermal conductive material column, (c) the second thermal conductive material layer / second metal layer on the other side of the circuit board, and (d) the heat sink. The order of the second type of heat conduction path is (a) the heat dissipation base, (b) the first thermal conductive material layer / first metal layer under the heat dissipation base, (c) the thermal holes around the heat dissipation base / third metal layer in the thermal holes, (d) the second thermal conductive material layer / second metal layer on the other side of the circuit board, and (e) the heat sink.

[0086] (5) The heat dissipation device of the present invention allows the first heat conductive material layer and the second heat conductive material layer to directly connect the LED lamp bead and the heat sink respectively, and the first heat conductive material layer and the second heat conductive material layer can be connected to each other through the heat conductive material column and / or the first metal layer, the second metal layer and the third metal layer of the circuit board. The LED lamp of the present invention can achieve effective heat dissipation and improve the heat dissipation effect by directly connecting the LED lamp bead and the heat sink, for example, with solder / silver glue.

[0087] (6) The area of ​​the second metal layer of the circuit board is larger than the area of ​​the second metal layer of the circuit board connected to the heat sink via the second thermal conductive material layer, thereby improving the heat dissipation effect.

[0088] (7) The heat conductive material column is disposed at the connection area (e.g., welding area) between the LED lamp bead and the circuit board and at the connection area (e.g., welding area) between the heat sink and the circuit board, thereby improving the heat dissipation effect.

[0089] (8) The LED lamp of the present invention can be a high-power LED lamp.

[0090] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or changes made to the present invention without departing from the spirit and scope of the present invention shall be included in the appended claims.

Claims

1. A heat dissipation device, characterized in that: Suitable for removing heat energy generated by at least one LED lamp bead, at least comprising: A circuit board has at least one first metal layer and at least one second metal layer located on two opposite sides, and the circuit board has at least one heat conduction hole, wherein The first metal layer of the circuit board is connected to a heat dissipation base of the LED lamp bead via a first heat conductive material layer, so that the heat energy generated by the LED lamp bead is transferred from the heat dissipation base via the first heat conductive material layer, the first metal layer and the heat conductive hole to the second metal layer of the circuit board; as well as A heat sink, wherein the second metal layer of the circuit board is connected to the heat sink via a second thermal conductive material layer, so that the heat energy of the LED lamp bead is conducted from the second metal layer via the second thermal conductive material layer to the heat sink.

2. The heat dissipation device as claimed in claim 1, characterized in that: An area of ​​the second metal layer of the circuit board is at least larger than an area of ​​the second metal layer of the heat sink connected to the circuit board via the second thermal conductive material layer.

3. The heat dissipation device as claimed in claim 1, characterized in that: The position where the heat-conducting hole is formed on the circuit board is located in the area where the heat dissipation base of the LED lamp bead is connected to the first metal layer of the circuit board via the first heat-conducting material layer.

4. The heat dissipation device according to claim 1 or 3, characterized in that: The heat-conducting hole is filled with at least one heat-conducting material column connecting the first heat-conducting material layer and the second heat-conducting material layer, so as to conduct the heat energy generated by the LED lamp bead from the first heat-conducting material layer to the second heat-conducting material layer via the heat-conducting material column.

5. The heat dissipation device as claimed in claim 4, characterized in that: The first thermally conductive material layer, the second thermally conductive material layer and / or the thermally conductive material column are respectively selected from a group consisting of solder and silver paste.

6. The heat dissipation device as claimed in claim 4, characterized in that: The first thermally conductive material layer, the second thermally conductive material layer and / or the thermally conductive material column are respectively adhesives with thermal conductivity.

7. The heat dissipation device as claimed in claim 1, characterized in that: The thermal conductive hole is formed on the inner wall of the circuit board with a third metal layer connecting the first metal layer and the second metal layer, and the heat energy generated by the LED lamp bead is conducted from the heat dissipation base through the first thermal conductive material layer, the first metal layer, the thermal conductive hole and the third metal layer in the thermal conductive hole to the second metal layer of the circuit board.

8. The heat dissipation device as claimed in claim 1, characterized in that: The circuit board is a copper foil circuit board, and the first metal layer and / or the second metal layer are / is a copper foil.

9. The heat dissipation device as claimed in claim 1, characterized in that: The heat sink is made of pure copper metal.

10. The heat dissipation device as claimed in claim 1, characterized in that: The radiator is a copper column radiator, a water-cooled radiator, a fan-assisted copper column radiator or a fan-assisted water-cooled radiator.

11. The heat dissipation device as claimed in claim 1, characterized in that: There are a plurality of heat-conducting holes, a plurality of first heat-conducting holes among the heat-conducting holes are respectively filled with a heat-conducting material column, and a plurality of second heat-conducting holes among the heat-conducting holes are hollow.

12. The heat dissipation device as claimed in claim 11, characterized in that: The positions where the first thermal conductive holes are formed on the circuit board are located in an area where the heat dissipation base of the LED lamp bead is connected to the first metal layer of the circuit board via the first thermal conductive material layer, and the positions where the second thermal conductive holes are formed on the circuit board are located outside the area where the heat dissipation base of the LED lamp bead is connected to the first metal layer of the circuit board via the first thermal conductive material layer.

13. The heat dissipation device as claimed in claim 1, characterized in that: The circuit board is a double-layer board or a multi-layer board.

14. An LED lamp, characterized in that: Include: At least one LED lamp bead; and The heat dissipation device as claimed in any one of claims 1 to 13, wherein the LED lamp bead is arranged on the heat dissipation device to remove heat energy generated by the LED lamp bead through the heat dissipation device.

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