Chip protection tool

Abstract

The utility model relates to the technical field of infrared detectors, and particularly discloses a chip protection tool which comprises a bottom plate and a cover plate. A limiting groove is formed in the bottom plate; the limiting groove is used for placing a chip; a separator is arranged on the cover plate; and the cover plate covers the bottom plate and is used for separating a PAD area from a non-PAD area on the chip. After the chip is put into the protection tool provided by the scheme, the PAD area and the non-PAD area on the chip can be separated through the cover plate, so that the abnormal conditions that the surface of the photosensitive element chip is polluted by photoresist, the coating is not uniform, the chip is scratched, the edge is broken and the like are not easy to occur when the photoresist is coated on the PAD area.

Description

Technical Field

[0001] The present application relates to the technical field of infrared detectors, and in particular to a chip protection tooling. Background Art

[0002] Infrared focal plane detectors are widely used in aerospace infrared remote sensing, national defense, meteorology, environment, medicine and scientific instruments. In the field of monochrome detection, indium antimonide (InSb) focal plane detectors have advantages in production cost, pixel uniformity and consistency. InSb focal plane detectors usually use flip-chip technology to interconnect the indium antimonide photosensitive element chip and the silicon readout circuit through an indium column array, and then fill the gap between the indium antimonide photosensitive element chip and the silicon readout circuit with bottom filling material to improve the reliability of the indium column solder joints. Then, the indium antimonide photosensitive element chip is back-thinned to 10μm through a back-thinning process to improve quantum efficiency.

[0003] In the back thinning process, chemical mechanical polishing (CMP) is a process to remove uneven materials on the chip surface and achieve atomic-level flatness. Before chemical mechanical polishing, photoresist is needed to cover the port (PAD) on the readout circuit to prevent the PAD from being corroded by the polishing liquid. After protecting the PAD, the chip is heated to solidify the photoresist.

[0004] In the existing indium antimonide chip polishing process, the way to apply photoresist is to clamp the chip with tweezers and then use a brush to apply photoresist on the PAD surface. This operation is prone to abnormal conditions such as photoresist contamination, uneven application, scratches, and edge collapse on the surface of the photosensitive element chip. Utility Model Content

[0005] In view of this, the purpose of this application is to provide a chip protection tooling to solve the problem that the existing method of applying photoresist on the chip PAD easily causes abnormal conditions in the photosensitive element chip.

[0006] In order to achieve the above technical purpose, the present application provides a chip protection tooling, including: a bottom plate and a cover plate;

[0007] The bottom plate is provided with a limiting groove;

[0008] The limiting groove is used for placing the chip;

[0009] The cover plate is provided with an isolating member;

[0010] The cover plate covers the bottom plate and is used to separate the PAD area from the non-PAD area on the chip.

[0011] Furthermore, the cover plate is provided with a through groove and a baffle;

[0012] The limiting groove includes a middle groove and a side groove which are interconnected;

[0013] After the chip is placed in the limiting groove, the PAD area is located in the side groove, and the non-PAD area is located in the middle groove;

[0014] The baffle covers the middle groove;

[0015] The through groove is connected to the side groove.

[0016] Furthermore, a chip hole is provided on the baffle;

[0017] The chip hole is connected to the middle groove.

[0018] Furthermore, a protrusion is arranged in the limiting groove between the middle groove and the side groove.

[0019] Furthermore, a plurality of the limiting grooves are arranged on the bottom plate.

[0020] Furthermore, the plurality of limit grooves are distributed in a matrix on the bottom plate;

[0021] The through slots and baffles each include a plurality;

[0022] The plurality of through slots and the plurality of baffles are distributed in a staggered manner in a plurality of rows.

[0023] Furthermore, codes are provided on the bottom plate corresponding to the plurality of limit grooves.

[0024] Furthermore, a coding hole is provided on the baffle;

[0025] The coding holes correspond to the coding positions one by one.

[0026] Furthermore, a first locking member is provided on the bottom plate;

[0027] The cover plate is provided with a second locking member;

[0028] The first locking member is connected to the second locking member in a limiting manner.

[0029] Furthermore, the first positioning member is a convex column;

[0030] The second clamping piece is a groove into which the first clamping piece extends.

[0031] It can be seen from the above technical solution that the present application provides a chip protection tooling, including: a base plate and a cover plate; a limiting groove is provided on the base plate; the limiting groove is used for placing the chip; an isolation piece is provided on the cover plate; the cover plate covers the base plate, and is used to separate the PAD area on the chip from the non-PAD area.

[0032] By placing the chip in the protective tooling provided by this solution, the PAD area on the chip can be separated from the non-PAD area by the cover plate, so that when applying photoresist to the PAD area, it is not easy for the surface of the photosensitive element chip to be contaminated by photoresist, unevenly applied, scratched, broken edges, and other abnormal situations to occur. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0034] Figure 1 A schematic diagram of a chip provided in an embodiment of the present application;

[0035] Figure 2 A schematic diagram of a bottom plate of a chip protection tooling provided in an embodiment of the present application;

[0036] Figure 3 A schematic diagram of a cover plate of a chip protection tooling provided in an embodiment of the present application;

[0037] Figure 4 A schematic diagram of a chip protection tooling provided in an embodiment of the present application after the base plate and the cover plate are combined. DETAILED DESCRIPTION

[0038] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the specification of the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection requested by the present application.

[0039] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0040] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0041] See also Figures 1 to 4 A chip protection tooling provided in an embodiment of the present application includes: a base plate 100 and a cover plate 200; a limiting groove 110 is provided on the base plate 100; the limiting groove 110 is used for placing a chip 300; an isolation piece is provided on the cover plate 200; the cover plate 200 covers the base plate 100, and is used to separate a PAD area 310 from a non-PAD area 320 on the chip 300.

[0042] In application, the size of the limiting groove 110 can be set to match the size of the chip 300 so that the chip 300 will not shake after being placed in the limiting groove 110 .

[0043] The chip protection tooling provided in this embodiment can place the chip 300 into the limiting groove 110 before chemical mechanical polishing, avoiding the need to use tweezers to clamp the chip 300 during the photoresist coating process, thereby preventing the chip from being damaged. At the same time, during the photoresist coating process, the cover plate 200 can separate the PAD area 310 from the non-PAD area 320, preventing the photoresist from being coated on the non-PAD area 320 on the chip 300, and helping the photoresist to be coated more evenly on the PAD area 310, thereby avoiding abnormal situations such as the photosensitive element chip surface being contaminated by the photoresist, uneven coating, scratches on the non-PAD area, and chip edge collapse.

[0044] For more specific examples, see Figures 2 to 4 The cover plate 200 is provided with a through groove 210 and a baffle 220; the limiting groove 110 includes a middle groove 111 and a side groove 112 which are connected to each other; after the chip is placed in the limiting groove 110, the PAD area 310 is located in the side groove 112, and the non-PAD area 320 is located in the middle groove 111; the baffle 220 covers the middle groove 111; the through groove 210 is connected to the side groove 112.

[0045] That is, in this embodiment, when the cover plate 200 covers the bottom plate 100 , the baffle plate 220 covers the middle groove 111 to shield the non-PAD area 320 , thereby separating the PAD area 310 from the non-PAD area 320 .

[0046] The through groove 210 penetrates the cover plate 200 along the normal direction of the cover plate 200 to connect the side groove 112 with the outside, making it easier to apply photoresist to the PAD area 310 in the side groove 112 .

[0047] It should be noted that if Figure 1 As shown, when two PAD regions 310 are provided on the chip 300 , the limiting groove 110 is correspondingly provided with two side grooves 112 .

[0048] In one embodiment, see Figure 3 A chip hole 221 is provided on the baffle plate 220 ; the chip hole 221 is connected to the middle groove 111 .

[0049] The chip hole 211 penetrates the cover plate 200 along the normal direction of the cover plate 200 , so that the non-PAD area of ​​the chip 300 can be exposed through the chip hole 211 .

[0050] In a further improved embodiment, see Figure 2 A protrusion 113 is provided in the limiting groove 110 between the middle groove 111 and the side groove 112 .

[0051] The protrusions 113 can enhance the blocking effect between the side grooves 112 and the middle grooves 111 , thereby preventing the photoresist from flowing into the side grooves 112 and then penetrating into the middle grooves 111 .

[0052] In one embodiment, a plurality of limiting grooves 110 are disposed on the bottom plate 100 , so that a plurality of chips 300 can be placed on the bottom plate 100 at the same time, and subsequent operations can be performed on the plurality of chips 300 at the same time, thereby improving operation efficiency.

[0053] In a more specific embodiment, the plurality of limiting grooves 110 are distributed in a matrix on the bottom plate 100 ; the through grooves 210 and the baffles 220 are both included in plurality; and the plurality of through grooves 210 and the plurality of baffles 220 are distributed in a plurality of rows and staggered.

[0054] In one embodiment, codes 120 are provided on the base plate 100 corresponding to the plurality of limiting grooves 110 , and the chips 300 in the limiting grooves 110 can be numbered through the codes 120 to avoid mixed batches.

[0055] Correspondingly, the baffle 220 is provided with a coding hole 222 ; the coding hole 222 corresponds to the position of the code 120 one by one.

[0056] In one embodiment, a first locking member 130 is disposed on the bottom plate 100 ; a second locking member 230 is disposed on the cover plate 200 ; and the first locking member 130 and the second locking member 230 are connected in a limiting manner.

[0057] The first locking member 130 and the second locking member 230 are used to play a positioning role when the cover plate 200 covers the bottom plate 100 .

[0058] As an implementation manner, the first locking member 130 may be a convex column; and the second locking member 230 may be a groove into which the first locking member 130 extends.

[0059] The above are only preferred embodiments of the present application and are not intended to limit the present utility model. Although the present application has been described in detail with reference to the examples, those skilled in the art can still modify the technical solutions recorded in the aforementioned examples or make equivalent substitutions for some of the technical features therein. However, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A chip protection tool, characterized in that: include: A bottom plate (100) and a cover plate (200); The bottom plate (100) is provided with a limiting groove (110); The limiting groove (110) is used for receiving the chip (300); The cover plate (200) is provided with an isolation piece; The cover plate (200) covers the base plate (100) and is used to separate a PAD area (310) from a non-PAD area (320) on the chip (300).

2. The chip protection tooling according to claim 1, characterized in that: The cover plate (200) is provided with a through groove (210) and a baffle (220); The limiting groove (110) comprises a middle groove (111) and a side groove (112) which are connected to each other; After the chip is placed in the limiting groove (110), the PAD area (310) is located in the side groove (112), and the non-PAD area (320) is located in the middle groove (111); The baffle (220) covers the middle groove (111); The through groove (210) is connected to the side groove (112).

3. The chip protection tooling according to claim 2, characterized in that: The baffle (220) is provided with a chip hole (221); The chip hole (221) is connected to the middle groove (111).

4. The chip protection tooling according to claim 2, characterized in that: A protrusion (113) is provided in the limiting groove (110) between the middle groove (111) and the side groove (112).

5. The chip protection tooling according to claim 2, characterized in that: A plurality of limiting grooves (110) are provided on the bottom plate (100).

6. The chip protection tooling according to claim 5, characterized in that: The plurality of limit grooves (110) are distributed in a matrix on the bottom plate (100); The through slot (210) and the baffle (220) each include a plurality; The plurality of through slots (210) and the plurality of baffles (220) are distributed in a staggered manner in a plurality of rows.

7. The chip protection tooling according to claim 5, characterized in that: The bottom plate (100) is provided with codes (120) corresponding to the plurality of limit grooves (110).

8. The chip protection tooling according to claim 7, characterized in that: The baffle (220) is provided with a coding hole (222); The coding holes (222) correspond to the positions of the codes (120) in a one-to-one manner.

9. The chip protection tooling according to claim 1, characterized in that: A first locking member (130) is provided on the bottom plate (100); A second locking member (230) is provided on the cover plate (200); The first locking member (130) and the second locking member (230) are connected in a limiting manner.

10. The chip protection tooling according to claim 9, characterized in that: The first locking member (130) is a convex column; The second locking member (230) is a groove into which the first locking member (130) extends.

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