LED packaging structure
By introducing a light-concentrating layer and titanium dioxide material into the LED packaging structure, the problems of insufficient brightness and susceptibility to hydrogen sulfide are solved, and higher luminous brightness and anti-sulfide effect are achieved.
Patent Information
- Application Number
- CN202421226099.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-05-30
AI Technical Summary
The existing LED packaging structures have problems with insufficient brightness and susceptibility to hydrogen sulfide, especially in areas containing silver elements such as bonding lines and electrode pins.
An LED packaging structure including a bracket and a light-concentrating layer is adopted. The bracket is equipped with a packaging cavity. The bottom wall of the packaging cavity is equipped with a light-emitting module. The light-concentrating layer is arranged on the bottom wall of the packaging cavity and is arranged around the light-emitting module. The material of the light-concentrating layer is titanium dioxide, which is covered on the electrode pin and bonding line to achieve the effect of light-concentration and anti-sulfurization.
Through the reflection effect of the light-concentrating layer, the luminous brightness of the LED packaging structure is improved, and the electrode pins and bonding lines are covered to prevent sulfur from undergoing chemical reactions with silver, achieving the anti-sulfurization effect.
Smart Images
Figure CN222840032U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of LED chip packaging, and in particular to an LED packaging structure. Background Art
[0002] Color LED packaging is mostly achieved by placing the light-emitting component in a bracket and encapsulating it with a packaging adhesive. In the related technology, the LED packaging structure has the defect of insufficient brightness. At the same time, LED devices are easily attacked by hydrogen sulfide, which mainly occurs in the parts containing silver elements such as bonding wires and electrode pins. Utility Model Content
[0003] The present application provides an LED packaging structure, which can realize the function of light focusing and anti-sulfurization at the same time.
[0004] The present application provides an LED packaging structure, including:
[0005] A bracket, wherein the bracket is provided with a packaging cavity, and a light-emitting module is installed on the bottom wall of the packaging cavity;
[0006] A light-gathering layer is disposed on the bottom wall of the packaging cavity and surrounds the light-emitting module.
[0007] Furthermore, the height of the light-collecting layer is lower than the height of the light-emitting module.
[0008] Furthermore, the light-focusing layer is made of titanium dioxide.
[0009] Furthermore, the number of the packaging cavities is two, the two packaging cavities are arranged at an interval, and a light-emitting module is respectively arranged in the two packaging cavities.
[0010] Furthermore, the two packaging cavities are respectively a first packaging cavity and a second packaging cavity, the size of the first packaging cavity is smaller than the size of the second packaging cavity; the number of light-emitting modules arranged in the first packaging cavity is less than the number of light-emitting modules arranged in the second packaging cavity.
[0011] Furthermore, the light-emitting module in the first packaging cavity is a white light-emitting module; and the plurality of light-emitting modules in the second packaging cavity are respectively a blue light-emitting module, a red light-emitting module and a green light-emitting module.
[0012] Furthermore, the support comprises:
[0013] A bracket body, wherein the bracket body is provided with the packaging cavity; the bracket body is also provided with a pin cavity;
[0014] An electrode pin is disposed in the pin cavity; the light emitting module is electrically connected to the electrode pin; and the light focusing layer covers the surface of the electrode pin.
[0015] Furthermore, the material of the bracket body is an insulating material;
[0016] And / or, the bracket body and the electrode pin are integrally formed;
[0017] And / or, the cavity wall of the pin cavity is provided with a first protrusion and / or a first groove, the periphery of the electrode pin is provided with a second groove and / or a second protrusion, and the cavity wall of the pin cavity and the electrode pin are connected through the cooperation between the first protrusion and the second groove and / or the cooperation between the first groove and the second protrusion.
[0018] Furthermore, the longitudinal cross-sectional dimension of the packaging cavity gradually increases from the bottom wall to the cavity opening;
[0019] And / or, the cross section of the packaging cavity is a rectangle with rounded corners.
[0020] Furthermore, it also includes packaging glue, which is filled in the packaging cavity to seal the light emitting module.
[0021] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:
[0022] The LED packaging structure provided in the embodiment of the present application includes a bracket and a light-gathering layer, wherein the bracket is provided with a packaging cavity, and a light-emitting module is installed on the bottom wall of the packaging cavity; the light-gathering layer is provided on the bottom wall of the packaging cavity and is provided around the light-emitting module. In the present application, the bracket can provide an installation base for the light-emitting module, and the light emitted by the light-emitting module is emitted from the cavity opening of the packaging cavity. At the same time, a part of the light emitted by the light-emitting module is diverged to the light-gathering layer, and through the reflection effect of the light-gathering layer, this part of the light can also be emitted from the cavity opening, thereby achieving a light-gathering effect and improving the luminous brightness of the LED packaging structure. At the same time, the light-gathering layer is provided around the light-emitting module, which can achieve the goal of not blocking the light-emitting module while also covering the bonding position between the light-emitting module and the bracket, and can play an isolation and protection role, preventing sulfur from chemically reacting with silver, and having an anti-sulfurization effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The accompanying drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and together with the description, are used to explain the principles of the present utility model.
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0025] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0026] Figure 1 A schematic diagram of a LED packaging structure provided in an embodiment of the present application;
[0027] Figure 2 for Figure 1 Schematic diagram of the structure in which the light-gathering layer is removed;
[0028] Figure 3 for Figure 1 Schematic diagram of the cross section of the middle bracket;
[0029] Figure 4 for Figure 1 Schematic diagram of the longitudinal section of the middle bracket.
[0030] Description of reference numerals:
[0031] 1. bracket; 10. packaging cavity; 110. first packaging cavity; 120. second packaging cavity; 11. bracket body; 111. pin cavity; 112. first groove; 113. first protrusion; 12. electrode pin; 121. second protrusion; 122. second groove;
[0032] 21. White light emitting module; 22. Blue light emitting module; 23. Red light emitting module; 24. Green light emitting module;
[0033] 3. Focusing layer. DETAILED DESCRIPTION
[0034] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0035] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.
[0036] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.
[0037] Figures 1 to 4 An LED packaging structure provided in an embodiment of the present application includes a bracket 1 and a light-gathering layer 3. The bracket 1 is provided with a packaging cavity 10, and a light-emitting module is installed on the bottom wall of the packaging cavity 10; the light-gathering layer 3 is arranged on the bottom wall of the packaging cavity 10 and is arranged around the light-emitting module. It also includes a packaging glue, which is filled in the packaging cavity 10 to seal the light-emitting module. The light-emitting module is an LED chip that can emit light. Figure 1 and Figure 2 As shown, the light-gathering layer 3 is disposed around the light-emitting module and covers the bonding wire between the light-emitting module and the bracket 1 outside the light-emitting module, which can reduce the vulcanization of the bracket 1 and the light-emitting module.
[0038] It can be understood that the bracket 1 can provide an installation basis for the light-emitting module. The light emitted by the light-emitting module is emitted from the cavity mouth of the packaging cavity 10. At the same time, a part of the light emitted by the light-emitting module is diverged to the light-collecting layer 3. Through the reflection effect of the light-collecting layer 3, this part of the light can also be emitted from the cavity mouth, thereby realizing the focusing effect and improving the luminous brightness of the LED packaging structure. At the same time, the light-collecting layer 3 is arranged around the light-emitting module, which can achieve the goal of not blocking the light-emitting module while covering the bonding position of the light-emitting module and the bracket 1, which can play an isolation and protection role, prevent the chemical reaction between sulfur and silver, and has an anti-sulfurization effect.
[0039] In the technical solution of this embodiment, the light-concentrating layer 3 uses low-cost titanium dioxide. The main component of titanium dioxide is titanium dioxide, which can reflect light in this application to achieve the effect of focusing, and can also play a role of isolation to prevent sulfide.
[0040] In the technical solution of this embodiment, the packaging cavity 10 The inside is filled with packaging glue. It can be understood that through the packaging cavity 10 The sealing of the light-emitting module is achieved.
[0041] In the technical solution of this embodiment, the height of the light-collecting layer 3 is lower than the height of the light-emitting module.
[0042] It is understandable that setting the height of the light-gathering layer 3 lower than the height of the light-emitting module can avoid the light-gathering layer 3 itself from blocking the light emitted by the light-emitting module, so that more light can be emitted from the cavity opening of the packaging cavity 10 to improve the light brightness.
[0043] like Figure 1 and Figure 2 As shown, in the technical solution of this embodiment, the number of the packaging cavities 10 is two, and the two packaging cavities 10 are arranged at intervals. 10 Light-emitting modules are respectively arranged therein.
[0044] It can be understood that providing two packaging cavities 10 can improve the patch efficiency and reduce the packaging volume.
[0045] like Figure 1 and Figure 2 As shown, in the technical solution of this embodiment, the two packaging cavities 10 are respectively a first packaging cavity 110 and a second packaging cavity 120, and the size of the first packaging cavity 110 is smaller than the size of the second packaging cavity 120; the number of light-emitting modules arranged in the first packaging cavity 110 is less than the number of light-emitting modules arranged in the second packaging cavity 120. Among them, the light-emitting module in the first packaging cavity 110 is a white light-emitting module 21; the multiple light-emitting modules in the second packaging cavity 120 are respectively a blue light-emitting module 22, a red light-emitting module 23 and a green light-emitting module 24. The white light-emitting module 21 emits light, the blue light-emitting module 22 emits blue light, the red light-emitting module 23 emits red light, and the green light-emitting module 24 emits green light. Various colors can be obtained by changing the three color channels of red (R), green (G), and blue (B) and superimposing them on each other. Such a setting can realize the requirements of the LED packaging structure of the present application having RBG plus white light at the same time, and four colors are packaged on the same bracket 1, which can reduce the packaging volume.
[0046] In other embodiments, the light-emitting module in the first packaging cavity 110 is a white light-emitting module 21 ; the light-emitting module in the second packaging cavity 120 is one or more of a blue light-emitting module 22 , a red light-emitting module 23 and a green light-emitting module 24 .
[0047] like Figure 2 , Figure 3 and Figure 4 As shown, in the technical solution of this embodiment, the bracket 1 includes a bracket body 11 and an electrode pin 12, the bracket body 11 is provided with the packaging cavity 10; the bracket body 11 is also provided with a pin cavity 111; the electrode pin 12 is arranged in the pin cavity 111; the light-emitting module is electrically connected to the electrode pin 12; the light-gathering layer 3 covers the surface of the electrode pin 12. Among them, the light-emitting module is connected to the electrode pin 12 through a bonding wire, and the silver in the bonding wire and the electrode pin 12 will lose its luster if exposed to hydrogen sulfide. In this application, the light-gathering layer 3 covers the surface of the electrode pin 12 and covers the part of the bonding wire close to the electrode pin 12, so as to reduce the sulfidation.
[0048] In this embodiment, the bonding wire is made of gold wire and does not contain silver, so this embodiment can prevent sulfurization.
[0049] The electrode pins 12 include a positive electrode pin 12 and a negative electrode pin 12. The light emitting module is electrically connected to the electrode pins 12 via bonding wires, so that the light emitting module can be powered on to emit light.
[0050] The bracket body 11 provides a stable installation base for the electrode pins 12 . The bracket body 11 and the electrode pins 12 are integrally formed, which can improve the molding efficiency of the bracket 1 .
[0051] In the technical solution of this embodiment, the material of the bracket body 11 is an insulating material, which can play the role of insulation and heat resistance.
[0052] In the technical solution of this embodiment, the cavity wall of the pin cavity 111 is provided with a first protrusion 113 and / or a first groove 112, and the periphery of the electrode pin 12 is provided with a second groove 122 and / or a second protrusion 121. The cavity wall of the pin cavity 111 and the electrode pin 12 are connected by the cooperation between the first protrusion 113 and the second groove 122 and / or the cooperation between the first groove 112 and the second protrusion 121.
[0053] like Figure 4 As shown, a second protrusion 121 is provided on the upper portion of the electrode pin 12, and the second protrusion 121 and the lower portion of the electrode pin 12 form a second groove 122, a first protrusion 113 is provided on the lower portion of the cavity wall of the pin cavity 111, and the first protrusion 113 and the upper portion of the cavity wall of the pin cavity 111 form a first groove 112, the second protrusion 121 is adapted to the first groove 112, and the first protrusion 113 is adapted to the second groove 122. The above design can improve the connection strength and connection stability between the bracket body 11 and the electrode pin 12.
[0054] like Figure 4As shown, in the technical solution of this embodiment, the longitudinal cross-sectional size of the packaging cavity 10 gradually increases from the bottom wall to the cavity opening, which can achieve a better light focusing effect.
[0055] In the technical solution of this embodiment, the cross section of the packaging cavity 10 is a rectangle with rounded corners.
[0056] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.
[0057] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.
[0058] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features applied herein.
Claims
1. An LED packaging structure, characterized in that: include: A bracket (1), the bracket (1) being provided with a packaging cavity (10), a light-emitting module being installed on the bottom wall of the packaging cavity (10); A light-gathering layer (3), the light-gathering layer (3) being arranged on the bottom wall of the packaging cavity (10) and surrounding the light-emitting module; the height of the light-gathering layer (3) is lower than the height of the light-emitting module.
2. The LED packaging structure according to claim 1, characterized in that: The material of the light-collecting layer (3) is titanium dioxide.
3. The LED packaging structure according to claim 1, characterized in that: The number of the packaging cavities (10) is two, the two packaging cavities (10) are arranged at an interval, and a light-emitting module is respectively arranged in the two packaging cavities (10).
4. The LED packaging structure according to claim 3, characterized in that: The two packaging cavities (10) are respectively a first packaging cavity (110) and a second packaging cavity (120); the size of the first packaging cavity (110) is smaller than the size of the second packaging cavity (120); and the number of light-emitting modules arranged in the first packaging cavity (110) is less than the number of light-emitting modules arranged in the second packaging cavity (120).
5. The LED packaging structure according to claim 4, characterized in that: The light-emitting module in the first packaging cavity (110) is a white light-emitting module (21); and the plurality of light-emitting modules in the second packaging cavity (120) are respectively a blue light-emitting module (22), a red light-emitting module (23) and a green light-emitting module (24).
6. The LED packaging structure according to claim 1, characterized in that: The support (1) comprises: A bracket body (11), wherein the bracket body (11) is provided with the packaging cavity (10); the bracket body (11) is also provided with a pin cavity (111); An electrode pin (12), the electrode pin (12) being arranged in the pin cavity (111); the light-emitting module being electrically connected to the electrode pin (12); and the light-collecting layer (3) covering the surface of the electrode pin (12).
7. The LED packaging structure according to claim 6, characterized in that: The support body (11) is made of insulating material; And / or, the support body (11) and the electrode pin (12) are integrally formed; And / or, the cavity wall of the pin cavity (111) is provided with a first protrusion (113) and / or a first groove (112), and the periphery of the electrode pin (12) is provided with a second groove (122) and / or a second protrusion (121), and the cavity wall of the pin cavity (111) and the electrode pin (12) are connected by the cooperation between the first protrusion (113) and the second groove (122) and / or the cooperation between the first groove (112) and the second protrusion (121).
8. The LED packaging structure according to claim 1, characterized in that: The longitudinal cross-sectional dimension of the packaging cavity (10) gradually increases from the bottom wall to the cavity opening; And / or, the cross section of the packaging cavity (10) is a rectangle with rounded corners.
9. The LED packaging structure according to claim 1, characterized in that: It also comprises packaging glue, which is filled in the packaging cavity (10) to seal the light-emitting module.