Packaging structure of LED lamp bead

Abstract

The utility model relates to the technical field of LEDs, in particular to a packaging structure of an LED lamp bead, which overcomes the defects of poor light types such as astigmatism, parasitic light and the like of the LED lamp bead, improves the utilization rate of light, improves the heat dissipation effect of an LED chip, and comprises a substrate and the LED chip, a heat conduction column is arranged on the substrate and penetrates through the substrate, and the LED chip is arranged on the substrate. The LED chip is arranged at the top of the heat conduction column, a plurality of flow channels are arranged at the bottom end of the heat conduction column, a box dam is arranged on the substrate and located on the periphery of the LED chip, a reflecting cover is arranged on the inner wall of the box dam, fluorescent glue is filled in the box dam, a light-transmitting cover is arranged at the top of the box dam, the light-transmitting cover is in a plane shape or a ball head shape, and the LED chip is arranged on the light-transmitting cover. Heat-conducting glue is coated between the LED chip and the heat-conducting column, the inner diameter of the reflecting cover is gradually reduced from top to bottom to be in a bowl shape, and the outer wall of the reflecting cover and the inner wall of the box dam are attached together.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, in particular to a packaging structure of an LED lamp bead. Background Art

[0002] As we all know, LED lamp beads are a kind of semiconductor electronic components that can emit light. They are abbreviated as LED in English, also known as light-emitting diodes. They are widely used in the lighting industry because of their small size, low power, long service life and environmental protection. Traditional LED lamp beads include positive and negative pins, and the negative pins are provided with LED chips. The positive and negative pins are electrically connected to the LED chip through wires, and finally the positive pins, negative pins and LED chips are sealed with epoxy resin.

[0003] For example, a Chinese patent with authorization announcement number 204696117U and announcement date 2015.10.07 discloses an LED light source encapsulated by transparent dam glue, including transparent dam glue, gold wire, fluorescent colloid, substrate and LED light-emitting chip, a plurality of LED light-emitting chips are arranged on the substrate, two adjacent LED light-emitting chips are connected by gold wire, the outermost LED light-emitting chip is connected to the substrate by gold wire, the gold wire and the LED light-emitting chip are coated inside by fluorescent colloid, and transparent dam glue is arranged on the outside of the fluorescent colloid.

[0004] The light emitted by the LED will produce astigmatism, stray light, virtual light and other poor light conditions after passing through the fluorescent colloid. The light utilization rate of the LED is low, and the fluorescent colloid covers the LED chip, resulting in poor heat dissipation effect of the LED chip. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides a packaging structure for LED lamp beads, which overcomes the problems of LED lamp beads having poor light patterns such as scattered light and stray light producing virtual light, improves the low utilization rate of light, and improves the heat dissipation effect of LED chips.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a packaging structure of an LED lamp bead, comprising a substrate and an LED chip, wherein a heat-conducting column is arranged on the substrate, the heat-conducting column penetrates the substrate, the LED chip is arranged on the top of the heat-conducting column, a plurality of flow channels are arranged at the bottom end of the heat-conducting column, a dam is arranged on the substrate and around the LED chip, a reflective cover is arranged on the inner wall of the dam, the dam is filled with fluorescent glue, and a light-transmitting cover is arranged on the top of the dam.

[0009] Furthermore, the light-transmitting cover is in a plane shape or a spherical head shape.

[0010] Furthermore, thermal conductive glue is coated between the LED chip and the thermal conductive column.

[0011] Furthermore, the inner diameter of the reflector gradually decreases from top to bottom and is arranged in a bowl shape.

[0012] Furthermore, the outer wall of the reflector and the inner wall of the dam are attached together.

[0013] (III) Beneficial effects

[0014] Compared with the prior art, the utility model provides a packaging structure of LED lamp beads, which has the following beneficial effects:

[0015] 1. The packaging structure of the LED lamp bead improves the utilization rate of light by setting a reflector and using the reflector to reflect, so as to overcome the problem that the LED lamp bead has poor light type such as scattered light and stray light generating virtual light;

[0016] 2. The packaging structure of this LED lamp bead has a heat-conducting column that conducts heat for the LED chip. The flow channel increases the contact area between the heat-conducting column and the external environment, improves the heat dissipation efficiency of the heat-conducting column, and thus effectively improves the heat dissipation effect of the LED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 It is a schematic diagram of the three-dimensional structure of the substrate of the utility model when viewed from the front;

[0019] Figure 3 It is a three-dimensional structural schematic diagram of the substrate of the utility model from the rear view.

[0020] In the figure: 1. substrate; 2. thermal conductive column; 3. LED chip; 4. flow channel; 5. dam; 6. fluorescent glue; 7. light-transmitting cover; 8. reflective cover; 9. thermal conductive glue. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-3The utility model discloses a packaging structure of an LED lamp bead, comprising a substrate 1 and an LED chip 3. A heat-conducting column 2 is arranged on the substrate 1. The heat-conducting column 2 conducts heat for the LED chip 3. The heat-conducting column 2 runs through the substrate 1. The LED chip 3 is arranged on the top of the heat-conducting column 2. A plurality of flow channels are arranged at the bottom end of the heat-conducting column 2, which increases the contact area between the heat-conducting column 2 and the external environment, improves the heat dissipation efficiency of the heat-conducting column 2, and thus effectively improves the heat dissipation effect of the LED chip 3. A dam 5 is arranged on the substrate 1 and around the LED chip 3. A reflective cover 8 is arranged on the inner wall of the dam 5. The reflective cover 8 is used to reflect light to improve the utilization rate of light, so as to overcome the problem that the LED lamp bead has poor light type such as scattered light and stray light generating virtual light. The dam 5 is filled with fluorescent glue 6, and a light-transmitting cover 7 is arranged on the top of the dam 5.

[0023] The light-transmitting cover 7 is in a plane shape or a spherical head shape.

[0024] Wherein, a thermal conductive adhesive 9 is coated between the LED chip 3 and the thermal conductive column 2 .

[0025] The inner diameter of the reflector 8 decreases gradually from top to bottom.

[0026] The outer wall of the reflector 8 and the inner wall of the dam 5 are attached together.

[0027] To sum up, in the packaging structure of this LED lamp bead, when in use, the LED chip 3 is energized, the LED chip 3 emits light, and the reflection cover 8 is used to improve the utilization rate of light, so as to overcome the poor light type of the LED lamp bead such as scattered light, stray light and virtual light. The thermal conductive column 2 conducts heat for the LED chip 3, and the flow channel 4 increases the contact area between the thermal conductive column 2 and the external environment, thereby improving the heat dissipation efficiency of the thermal conductive column 2 to dissipate the heat of the LED chip 3. Especially when gas flows through the flow channel 4, the heat dissipation effect of the LED chip 3 is better.

[0028] The technical terms or scientific terms used in the description of this application should be the common meanings understood by ordinary technicians in the field to which this application belongs. The words "upper", "lower", "left", "right", "center", "vertical", "horizontal", "inside", "outside" and other words indicating orientation used in the description of this application are only used to indicate relative directions or positional relationships, and do not imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. When the absolute position of the described object changes, its relative positional relationship may also change accordingly, so it cannot be understood as a limitation on this application. The "first", "second", "third" and similar terms used in the description of this application are only used for descriptive purposes to distinguish different components, and cannot be understood as indicating or implying relative importance.

[0029] The words "one", "an" or "the" and the like used in the description of this application should not be understood as an absolute limitation on quantity, but should be understood as the existence of at least one. The words "include" or "comprise" and the like used in the description of this application mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, but do not exclude other elements or objects.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A packaging structure of an LED lamp bead, comprising a substrate (1) and an LED chip (3), characterized in that: A heat-conducting column (2) is arranged on the substrate (1), the heat-conducting column (2) penetrates the substrate (1), the LED chip (3) is arranged on the top of the heat-conducting column (2), and a plurality of flow channels are arranged at the bottom of the heat-conducting column (2). A dam (5) is arranged on the substrate (1) and around the LED chip (3), a reflective cover (8) is arranged on the inner wall of the dam (5), the dam (5) is filled with fluorescent glue (6), and a light-transmitting cover (7) is arranged on the top of the dam (5).

2. The packaging structure of an LED lamp bead according to claim 1, characterized in that: The light-transmitting cover (7) is in a plane shape or a spherical head shape.

3. The packaging structure of an LED lamp bead according to claim 1, characterized in that: A heat-conducting adhesive (9) is coated between the LED chip (3) and the heat-conducting column (2).

4. The packaging structure of an LED lamp bead according to claim 1, characterized in that: The inner diameter of the reflector (8) gradually decreases from top to bottom and is arranged in a bowl shape.

5. The packaging structure of an LED lamp bead according to claim 1, characterized in that: The outer wall of the reflector (8) and the inner wall of the dam (5) are attached together.

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