Packaging structure of photoelectric semiconductor device

Abstract

The utility model provides a packaging structure of a photoelectric semiconductor device, which comprises a body and a plurality of semiconductor devices, the body comprises a plurality of packaging subunits which are adjacently connected, the semiconductor devices are arranged in the packaging subunits, and each semiconductor device comprises a metal support, a containing colloid, an optical ball head and a light-emitting chip. One end of the metal support is installed in the containing colloid in an inserted mode, the light-emitting chip is installed on the metal support and located at the end of the containing colloid, the optical ball head is installed on the end face of the containing colloid, the position of the optical ball head corresponds to the position of the light-emitting chip, and light of the light-emitting chip is emitted out through the optical ball head. The utility model provides a packaging structure of a photoelectric semiconductor device, which achieves the purpose of improving the detection capability of a detection system through structural optimization of a metal support and a light-emitting chip.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a packaging structure of a photoelectric semiconductor device. Background Art

[0002] Optoelectronic semiconductor components have good optoelectronic properties such as low power consumption, low heat generation, long operating life, impact resistance, small size, fast response speed, and the ability to emit color light of stable wavelength. With the advancement of optoelectronic technology, they have been regarded as one of the better choices for light sources in the new era. At present, in the field of optoelectronic semiconductor packaging, organic glue is mainly used to encapsulate optoelectronic semiconductor chips. The packaging structure of some optoelectronic semiconductor devices is to encapsulate the organic glue in the reflective cavity of the bracket, and there are also mold molding processes to form organic glue into various shapes to cover the optoelectronic semiconductor chip. The light emitted by the optoelectronic semiconductor chip is transmitted through the organic glue. However, the problem is that when the packaging structure of the optoelectronic semiconductor device realizes the application of motor speed, position determination and micro-control system, the sensing light needs to realize the level waveform change. Therefore, it is necessary to provide an advanced packaging structure of optoelectronic semiconductor devices to solve the known technical problems. Utility Model Content

[0003] In view of this, an embodiment of the present specification provides a packaging structure of an optoelectronic semiconductor device for improving the detection capability of a detection system.

[0004] In order to solve the technical problems, the utility model provides the following technical solutions: a packaging structure of an optoelectronic semiconductor device, comprising a main body and a plurality of semiconductor devices, the main body comprising a plurality of packaging sub-units arranged in adjacent connection, the semiconductor devices being installed in the packaging sub-units, the semiconductor devices comprising a metal bracket, a containing colloid, an optical ball head and a light-emitting chip, one end of the metal bracket being plugged and installed in the containing colloid, the light-emitting chip being installed on the metal bracket, the light-emitting chip being located at the end of the containing colloid, the optical ball head being installed on the end surface of the containing colloid, the position of the optical ball head corresponding to the position of the light-emitting chip, and the light of the light-emitting chip being emitted through the optical ball head.

[0005] In some embodiments, the packaging subunit includes a frame and connecting rods, and a plurality of semiconductor devices are staggered in the frame. The semiconductor devices adjacent to each other on the left and right are connected by connecting rods, and the connecting rods are fixed on the frame.

[0006] In some embodiments, the connecting rod includes a horizontal rod and a vertical rod, the semiconductor devices on the same side are connected by the same vertical rod, and adjacent vertical rods are connected by several horizontal rods.

[0007] In some embodiments, positioning holes are symmetrically arranged on the upper and lower sides of the frame.

[0008] In some embodiments, glue removal windows are symmetrically arranged on the upper and lower sides of the frame.

[0009] In some embodiments, the lower end of the light-emitting chip is a negative electrode, and the light-emitting chip is connected to the metal bracket through a conductive silver glue die-cement bottom electrode.

[0010] In some embodiments, the upper end of the light emitting chip is a positive electrode, the metal bracket includes a PIN end, and the upper end of the light emitting chip is connected to the PIN end through a bonding gold wire.

[0011] In some embodiments, the width of the colloid storage body is 3.0 mm-7.0 mm.

[0012] In some embodiments, the thickness of the containing colloid is 1.1 mm.

[0013] In some embodiments, the height of the colloid is 3.0 mm-7.00 mm.

[0014] Beneficial Effects

[0015] The utility model provides a packaging structure of an optoelectronic semiconductor device, in which a light-emitting chip is arranged at one end of a metal bracket, and light is emitted through a light-emitting sphere, and the light is gathered on a single side, so as to sense the change in the level waveform caused by the obstruction of the light, meet the application of motor speed, position determination and micro-control system, and achieve a better detection system.

[0016] Through the combination of the horizontal rod and the vertical rod, the packaging structure is more stable and not easy to deform. The positioning holes are symmetrically arranged on the upper and lower sides of the frame, and the positioning is accurate. The setting of the glue removal window facilitates the removal of residual glue waste after packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are only used to illustrate specific embodiments and are not considered to be limitations of the present invention. In the entire drawings, the same reference symbols represent the same components. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the encapsulation subunit of the utility model;

[0020] Figure 3 It is a schematic structural diagram of a semiconductor device of the utility model;

[0021] Figure 4 It is a schematic structural diagram of the semiconductor device of the utility model from another angle;

[0022] Figure 5For the utility model Figure 4 A is an enlarged structural diagram of FIG.

[0023] In the figure: 1. Semiconductor device; 2. Metal bracket; 2.1. PIN terminal; 3. Colloid storage; 4. Optical ball head; 5. Light-emitting chip; 6. Frame; 7. Connecting rod; 7.1. Horizontal rod; 7.2. Vertical rod; 8. Positioning hole; 9. Glue removal window; 10. Conductive silver glue solid crystal; 11. Bonding gold wire. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present utility model, the technical solutions of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of the embodiments. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of the present utility model.

[0025] Furthermore, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts disclosed in the present utility model.

[0026] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. The terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be a connection between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0027] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the utility model. Instead, they are only examples of methods and systems consistent with some aspects of the utility model as detailed in the attached claims.

[0028] The technical solutions provided by various embodiments of the present application are described below in conjunction with the accompanying drawings.

[0029] See also Figure 1-5 In the present embodiment: a packaging structure of an optoelectronic semiconductor device comprises a main body and a plurality of semiconductor devices 1, the main body comprises a plurality of packaging sub-units arranged in adjacent connection, the semiconductor device 1 is installed in the packaging sub-unit, the semiconductor device 1 comprises a metal bracket 2, a containing colloid 3, an optical ball head 4 and a light-emitting chip 5, one end of the metal bracket 2 is plugged and installed in the containing colloid 3, the light-emitting chip 5 is installed on the metal bracket 2, the light-emitting chip 5 is located at the end of the containing colloid 3, the optical ball head 4 is installed on the end surface of the containing colloid 3, the position of the optical ball head 4 corresponds to the position of the light-emitting chip 5, and the light of the light-emitting chip 5 is emitted through the optical ball head 4.

[0030] The light emitting chip 5 is disposed at one end of the metal bracket 2, and emits light through the light emitting sphere and gathers the light on a single side, so as to sense the change of the level waveform caused by the obstruction of the light, meet the application of motor speed, position determination and micro-control system, and achieve a better detection system.

[0031] It should be noted that the material of the containing colloid 3 is epoxy colloid.

[0032] In some embodiments, the packaging subunit includes a frame 6 and a connecting rod 7. Several semiconductor devices 1 are staggered in the frame 6. The adjacent semiconductor devices 1 on the left and right are connected by the connecting rod 7, and the connecting rod 7 is fixed on the frame 6. It should be noted that the packaging structure is more stable.

[0033] In some embodiments, the connecting rod 7 includes a horizontal rod 7.1 and a vertical rod 7.2. The semiconductor devices 1 on the same side are connected through the same vertical rod 7.2, and adjacent vertical rods 7.2 are connected through several horizontal rods 7.1. It should be noted that the setting of the horizontal rod 7.1 and the vertical rod 7.2 makes the connection between the semiconductor device 1 and the frame 6 tighter and more firmly.

[0034] In some embodiments, positioning holes 8 are symmetrically provided on the upper and lower sides of the frame 6. It should be noted that the provision of the positioning holes 8 enables a higher product positioning accuracy.

[0035] In some embodiments, the frame 6 is symmetrically provided with glue removal windows 9 on the upper and lower sides. It should be noted that the setting of the glue removal windows 9 facilitates the removal of residual glue waste after packaging.

[0036] In some embodiments, the lower end of the light emitting chip 5 is a cathode, and the light emitting chip 5 is connected to the metal support 2 via the bottom electrode of the conductive silver glue die-bonding 10 .

[0037] In some embodiments, the upper end of the light emitting chip 5 is a positive electrode, the metal bracket 2 includes a PIN terminal 2.1, and the upper end of the light emitting chip 5 is connected to the PIN terminal 2.1 through a bonding gold wire 11.

[0038] In some embodiments, the width of the accommodating colloid 3 is 3.0 mm-7.0 mm; the thickness of the accommodating colloid 3 is 1.1 mm; and the height of the accommodating colloid 3 is 3.0 mm-7.00 mm.

[0039] The packaging process of optoelectronic semiconductors: argon hydrogen plasma cleaning -> chip fixing -> silver glue curing and baking -> argon hydrogen plasma cleaning -> bonding gold wire 11 welding -> encapsulation epoxy resin colloid -> removal of excess glue -> electroplating tin -> appearance inspection -> test finished product optics.

[0040] Working principle: The bottom of the light-emitting chip 5 is the C-pole collector, and the bottom electrode of the conductive silver glue die-stud 10 is connected to the metal bracket 2 to form a finished collector, and the power supply Vce=3-5V voltage input terminal; the electrodes on the light-emitting chip 5 are the E-pole emitter and the B-pole base, where the B-pole base is a photosensitive area, which produces different level changes according to the received light, and the E-pole emitter needs to be connected using a bonding gold wire 11. Through ultrasonic heating and spherical welding, the bonding gold wire 11 forms a finished E-pole emitter on the light-emitting chip 5 and the PIN terminal 2.1 of the metal bracket 2, and the output level signal changes.

[0041] The same and similar parts between the various embodiments in this specification can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the utility model, rather than to limit them. Although the utility model has been described in detail with reference to the above embodiments, ordinary technicians in the field should understand that they can still modify the technical solutions recorded in the above embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model. Any changes or replacements that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the utility model should be covered within the protection scope of the utility model.

Claims

1. A packaging structure of an optoelectronic semiconductor device, comprising a body and a plurality of semiconductor devices, characterized in that: The main body includes a plurality of packaging sub-units that are adjacently connected and arranged, the semiconductor device is installed in the packaging sub-unit, the semiconductor device includes a metal bracket, a containing colloid, an optical ball head and a light-emitting chip, one end of the metal bracket is plugged and installed in the containing colloid, the light-emitting chip is installed on the metal bracket, the light-emitting chip is located at the end of the containing colloid, the optical ball head is installed on the end surface of the containing colloid, the position of the optical ball head corresponds to the position of the light-emitting chip, and the light of the light-emitting chip is emitted through the optical ball head.

2. The packaging structure of an optoelectronic semiconductor device according to claim 1, characterized in that: The packaging subunit comprises a frame and a connecting rod. A plurality of the semiconductor devices are arranged in a left-right staggered manner in the frame. The semiconductor devices adjacent to each other on the left and right are connected by the connecting rod. The connecting rod is fixed on the frame.

3. The packaging structure of an optoelectronic semiconductor device according to claim 2, characterized in that: The connecting rod comprises a horizontal rod and a vertical rod. The semiconductor devices on the same side are connected via the same vertical rod, and adjacent vertical rods are connected via a plurality of horizontal rods.

4. The packaging structure of an optoelectronic semiconductor device according to claim 2, characterized in that: Positioning holes are symmetrically arranged on the upper and lower sides of the frame.

5. The packaging structure of an optoelectronic semiconductor device according to claim 2, characterized in that: Glue removal windows are symmetrically arranged on the upper and lower sides of the frame.

6. The packaging structure of an optoelectronic semiconductor device according to claim 2, characterized in that: The lower end of the light-emitting chip is a negative electrode, and the light-emitting chip is connected to the metal bracket through a conductive silver glue solid crystal bottom electrode.

7. The packaging structure of an optoelectronic semiconductor device according to claim 6, characterized in that: The upper end of the light emitting chip is a positive pole, the metal bracket includes a PIN end, and the upper end of the light emitting chip is connected to the PIN end through a bonding gold wire.

8. The packaging structure of an optoelectronic semiconductor device according to claim 1, characterized in that: The width of the colloid storage is 3.0 mm to 7.0 mm.

9. The packaging structure of an optoelectronic semiconductor device according to claim 1, characterized in that: The thickness of the colloid containing body is 1.1 mm.

10. The packaging structure of an optoelectronic semiconductor device according to claim 1, characterized in that: The height of the colloid containing body is 3.0mm-7.00mm.

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