Bonding device

Abstract

The bonding apparatus includes: a stage on which a display panel is disposed, the stage having a plane defined by a first direction and a second direction crossing the first direction; the heating part is arranged above the workbench, and a plurality of first combination opening parts are defined in the first direction; a pressing part provided between the stage and the heating part, and defining a plurality of second coupling openings overlapping the plurality of first coupling openings; and a plurality of screws provided in the plurality of first coupling openings and the plurality of second coupling openings, the length of the first coupling openings in the first direction being longer as the distance from the center of the heating unit is farther than the distance from the center of the heating unit is farther than the distance from the center of the heating unit is farther than the distance from the center of the heating unit.

Description

[0001] This application is a divisional application of the utility model patent application with application number CN202322581184.2, application date September 22, 2023, and utility model name “Bonding Device”. Technical Field

[0002] The utility model relates to a bonding device. Background Art

[0003] Electronic devices such as smart phones, digital cameras, notebook computers, navigation devices, and smart TVs that provide images to users include a display device for displaying images. The display device is used to generate images and provide the images to users through a display screen.

[0004] The display device includes a display panel for displaying an image, and the display panel includes a plurality of gate lines, a plurality of data lines, and a plurality of pixels connected to the plurality of gate lines and the plurality of data lines.

[0005] The display panel may be connected to a data driving part that provides electrical signals required for image display to the gate lines or the data lines. Utility Model Content

[0006] The utility model aims to provide a bonding device which can keep the lower surface of a pressurizing part in a flat state even if heat is applied to a pressurizing part and a heating part having different thermal expansion coefficients.

[0007] The bonding device of one embodiment of the utility model may include: a workbench for setting a display panel, the workbench having a plane defined by a first direction and a second direction intersecting the first direction; a heating portion, arranged above the workbench and defining a plurality of first combining openings along the first direction; a pressurizing portion, arranged between the workbench and the heating portion, and defining a plurality of second combining openings overlapping the plurality of first combining openings; and a plurality of screws, arranged in the plurality of first combining openings and the plurality of second combining openings, the farther away from the center of the heating portion, the longer the length of the first combining opening in the first direction.

[0008] The bonding device of one embodiment of the utility model may include: a workbench for setting a display panel, the workbench having a plane defined by a first direction and a second direction intersecting the first direction; a head portion arranged above the workbench; a connecting portion connected to the lower surface of the head portion; a heating portion including a first part and a second part, the first part being connected to the lower surface of the connecting portion, and the second part extending from the first part along a third direction intersecting the plane defined by the first direction and the second direction; and a pressurizing portion connected to the lower surface of the first part and one of the two side surfaces of the second part opposite to each other in the second direction, a plurality of first combining opening portions being defined on the one side surface of the second part, a plurality of second combining opening portions being defined on the side surface of the pressurizing portion opposite to the second part, and the difference between the length of the first combining opening portion in the first direction and the length of the second combining opening portion in the first direction increases as the distance from the center of the heating portion increases.

[0009] According to an embodiment of the utility model, a plurality of combining openings whose lengths increase as they are farther from the center of the heating part may be defined on the heating part. A plurality of screws may be disposed in the combining openings, and the heating part and the pressurizing part may be combined with each other. The length of the combining opening in the first direction may be greater than the length of the screw in the first direction. The screw may reciprocate along the first direction in the combining opening. Thus, even if heat is applied to the pressurizing part and the heating part having different thermal expansion coefficients from each other, the screw may not transmit the external force generated by the difference in length variation between the heating part and the pressurizing part to the pressurizing part. Therefore, the lower surface of the pressurizing part may be kept in a flat state, and the lower surface of the pressurizing part may pressurize the entire area of ​​the upper surface of the data driving part with a uniform pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a three-dimensional diagram of a bonding device according to an embodiment of the utility model.

[0011] Figure 2a yes Figure 1 A side view of the heating section is shown.

[0012] Figure 2b yes Figure 1 A side view of the pressurizing portion is shown.

[0013] Figure 2c and Figure 2d It is used to illustrate Figure 2a and Figure 2b A diagram showing a combination of a heating unit and a pressurizing unit.

[0014] Figure 2d yes Figure 1 A side view of the bonding apparatus is shown.

[0015] Figure 3 is to use Figure 1 A perspective view of an electronic device including a display panel manufactured by the bonding device shown.

[0016] Figure 4 yes Figure 3 An exploded perspective view of the electronic device shown.

[0017] Figure 5 yes Figure 4 A cross-sectional view of a display module is shown.

[0018] Figure 6 yes Figure 5 A top view of the display panel is shown.

[0019] Figure 7 yes Figure 6 A perspective view of the display panel shown.

[0020] Figures 8a to 8d It is used to illustrate the use of Figure 1 FIG. 1 is a diagram showing bonding of a display panel and a data driving unit performed by a bonding device.

[0021] Figures 9a to 9d It is a diagram for explaining a heating unit of a comparative example.

[0022] Fig.10a and Fig.10b It is a diagram for explaining a pressurizing portion according to another embodiment of the present invention.

[0023] Fig.11a and Fig.11b It is a diagram for explaining a pressurizing portion according to another embodiment of the present invention. DETAILED DESCRIPTION

[0024] The advantages, features and methods of achieving the advantages and features of the present invention will become clear by referring to the accompanying drawings and the embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms different from each other. The embodiments are provided only to fully disclose the present invention and fully inform the technical personnel in the technical field to which the present invention belongs of the scope of the present invention. The present invention is limited only by the scope of the claims. The same reference numerals in the entire specification represent the same structural elements.

[0025] When an element or layer is referred to as being "on" or "over" another element or layer, this includes both the case where the element or layer is directly over the other element or layer and the case where other layers or other elements are interposed. Conversely, when an element is referred to as being "directly on" or "directly above," this means that no other element or layer is interposed. "And / or" includes each of the items mentioned and all combinations of more than one item.

[0026] As shown in the figure, the terms "below", "beneath", "lower", "above", "upper" and the like as spatially relative terms may be used to easily describe the relationship between one element or structural element and another element or structural element. Spatially relative terms should be understood as terms that include different directions of elements when used or operated in addition to the directions shown in the figure. The same reference numerals throughout the specification represent the same structural elements.

[0027] Although the terms "first", "second", etc. are used to describe various elements, structural elements and / or parts, it is undoubted that these elements, structural elements and / or parts are not limited to these terms. These terms are only used to distinguish one element, structural element and / or part from other elements, structural elements and / or parts. Therefore, the first element, the first structural element or the first part mentioned below can also be the second element, the second structural element or the second part within the technical concept of the utility model.

[0028] The embodiments described in this specification will be described with reference to the top view and the cross-sectional view as the ideal schematic diagram of the utility model. Therefore, the form of the schematic diagram may change due to manufacturing technology and / or allowable error, etc. Therefore, the embodiments of the utility model are not limited by the specific form shown in the figure, but also include the change of form according to the manufacturing process. Therefore, the area illustrated in the figure has a schematic attribute, and the shape of the area illustrated in the figure is used to illustrate the specific form of the component area, and is not used to limit the scope of the utility model.

[0029] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0030] Figure 1 It is a three-dimensional diagram of a bonding device according to an embodiment of the utility model. Figure 2a yes Figure 1 A side view of the heating section is shown. Figure 2b yes Figure 1 A side view of the pressurizing portion is shown. Figure 2c and Figure 2d It is used to illustrate Figure 2a and Figure 2b A diagram showing a combination of a heating unit and a pressurizing unit. Figure 2d yes Figure 1 A side view of the bonding apparatus is shown.

[0031] Reference Figure 1 The bonding device BTA may include a workbench STG, a pressurizing part PP, a heating part HBP, a connecting part CST, a heat source HRS, a head HP and a guide part GP.

[0032] For example, the workbench STG may be in a rectangular parallelepiped shape. When viewed from above, the upper surface of the workbench STG may be in a rectangular shape having short sides extending along the first direction DR1 and long sides extending along the second direction DR2 intersecting the first direction DR1. However, the upper surface of the workbench STG is not limited thereto and may have various shapes.

[0033] Hereinafter, a direction substantially perpendicularly intersecting a plane defined by the first direction DR1 and the second direction DR2 is defined as a third direction DR3. In the present specification, "when viewed in a plan view" may mean a state viewed in the third direction DR3.

[0034] A plurality of suction holes VFH may be defined on the upper surface of the stage STG, and the suction holes VFH may be arranged along the first direction DR1 and the second direction DR2.

[0035] Although not shown in the figure, the workbench STG can be connected to a motor, and the adsorption hole VFH can be converted to a vacuum state. Figure 6 The display panel DP described in the figure is fixed on the workbench STG.

[0036] The guide portion GP may be disposed above the stage STG. The guide portion GP may be adjacent to one side of both sides of the stage STG that are opposite to each other in the second direction DR2.

[0037] Illustratively, the guide portion GP may be in a rectangular parallelepiped shape, but the shape of the guide portion GP is not limited thereto and may have various shapes.

[0038] The head HP may be disposed on one side of the two sides of the guide portion GP opposite to each other in the second direction DR2. One side of the guide portion GP may be defined as a side adjacent to one side of the workbench STG. The head HP may be disposed above the workbench STG. The head HP may be disposed adjacent to one side of the workbench STG.

[0039] The head HP can reciprocate along the third direction DR3. The head HP can move along the third direction DR3 along one side of the guide portion GP.

[0040] exist Figure 1 In the figure, the head HP is shown as a rectangular parallelepiped, but the shape of the head HP is not limited thereto and may have various shapes.

[0041] The connection portion CST may be connected to the lower surface of the head HP. The connection portion CST may be disposed above the work table STG. The connection portion CST may be disposed between the work table STG and the head HP.

[0042] As the connection portion CST is connected to the lower surface of the head HP, when the head HP moves in the third direction DR3, the connection portion CST may move in the third direction DR3.

[0043] Reference Figure 1 , Figure 2a and Figure 2d , for example, Figure 2a It is a side view of the heating part HBP viewed in the second direction DR2.

[0044] The heating part HBP may be connected to the lower surface of the connection part CST. The heating part HBP may be connected to the head HP through the connection part CST. When the head HP moves along the third direction DR3, the heating part HBP may move along the third direction DR3.

[0045] The heating part HBP may be disposed above the stage STG. The heating part HBP may be disposed between the stage STG and the connection part CST. The heating part HBP may be disposed adjacent to one side of the stage STG.

[0046] The heating part HBP may include a first portion PT1 and a second portion PT2. The first portion PT1 may be connected to a lower surface of the connection part CST. The connection part CST may be connected to an upper surface of the first portion PT1. The first portion PT1 may be disposed between the worktable STG and the connection part CST.

[0047] Illustratively, when viewed from the second direction DR2, the first portion PT1 may have a quadrangular shape. However, the shape of the first portion PT1 is not limited thereto, and may have various shapes.

[0048] The opening OP may be defined in the first portion PT1. The opening OP may extend along the first direction DR1. The opening OP may extend along the first direction DR1 and be defined in two opposite side surfaces of the first portion PT1 in the first direction DR1.

[0049] The second portion PT2 may extend from the lower surface of the first portion PT1 along the third direction DR3. The width of the second portion PT2 in the second direction DR2 may be smaller than the width of the first portion PT1 in the second direction DR2. The second portion PT2 may be adjacent to one of the two sides of the first portion PT1 opposite to each other in the second direction DR2. One side of the first portion PT1 may be defined as a side adjacent to one side of the workbench STG. In essence, the first portion PT1 and the second portion PT2 may be formed as one body.

[0050] A plurality of first coupling openings COP1 may be defined in the second portion PT2 , and the first coupling openings COP1 may be arranged along the first direction DR1 , and the first coupling openings COP1 may extend along the second direction DR2 .

[0051] The first combination opening portion COP1 may include a 1-1 combination opening portion COP1-1 and a 1-2 combination opening portion COP1-2. When viewed from the second direction DR2, the 1-1 combination opening portion COP1-1 may be defined as a first combination opening portion COP1 defined in the center of the second portion PT2. When viewed from the second direction DR2, the 1-2 combination opening portion COP1-2 may be defined as being spaced apart from the 1-1 combination opening portion COP1-1 in the first direction DR1.

[0052] Illustratively, when viewed from the second direction DR2, the 1-1 combined opening portion COP1-1 may be circular. Illustratively, when viewed from the second direction DR2, the 1-2 combined opening portion COP1-2 may be elliptical. When viewed from the second direction DR2, the length of the 1-2 combined opening portion COP1-2 in the first direction DR1 may be variable. The farther from the center of the second portion PT2, the longer the length of the 1-2 combined opening portion COP1-2 in the first direction DR1 may be. That is, the closer to the two opposite sides of the second portion PT2 in the first direction DR1, the longer the length of the 1-2 combined opening portion COP1-2 in the first direction DR1 may be.

[0053] Reference Figure 1 and Figure 2b , for example, Figure 2b 2 is a side view of the press part PP viewed from the second direction DR2. The press part PP may be disposed below the heating part HBP. The press part PP may be disposed between the work table STG and the heating part HBP.

[0054] The pressurizing portion PP may include a fastening portion CP and a tip portion TP. Illustratively, when viewed from the second direction DR2, the fastening portion CP may have a rectangular shape.

[0055] A plurality of second coupling openings COP2 may be defined on the fastening portion CP. The second coupling openings COP2 may be arranged along the first direction DR1. The second coupling openings COP2 may extend along the second direction DR2, respectively.

[0056] Illustratively, when viewed from the second direction DR2, the second coupling opening portion COP2 defined in the fastening portion CP may have a circular shape. Lengths of the second coupling opening portions COP2 in the first direction DR1 may be the same as each other.

[0057] The tip portion TP may be disposed at a lower portion of the fastening portion CP. The tip portion TP may extend from a lower surface of the fastening portion CP along a third direction DR3. The tip portion TP may extend from a portion of a lower surface of the fastening portion CP along the third direction DR3. In essence, the fastening portion CP and the tip portion TP may be formed as one body.

[0058] When viewed from the second direction DR2, the tip portion TP may have a length in the first direction DR1 smaller than the length of the fastening portion CP in the first direction DR1. When viewed from the second direction DR2, the tip portion TP may have a length in the third direction DR3 smaller than the length of the fastening portion CP in the third direction DR3.

[0059] Reference Figure 1 , Figure 2a to Figure 2d , the pressurizing part PP and the heating part HBP may be combined with each other. Specifically, the upper surface of the fastening part CP may be in contact with the lower surface of the first part PT1. One of the two side surfaces of the fastening part CP opposite to each other in the second direction DR2 may be in contact with the second part PT2. Hereinafter, one side surface of the fastening part CP may be defined as a side adjacent to one side of the workbench STG of the two side surfaces of the fastening part CP opposite to each other in the second direction DR2.

[0060] As one side of the fastening portion CP contacts the second portion PT2, Figure 2c As shown, the first coupling opening portion COP1 and the second coupling opening portion COP2 may overlap each other. The lengths of the 1-1th coupling opening portion COP1-1 and the second coupling opening portion COP2 in the first direction DR1 may be the same as each other.

[0061] When viewed from the second direction DR2, the length of the 1-2nd combination opening portion COP1-2 in the first direction DR1 may be greater than the length of the second combination opening portion COP2 in the first direction DR1. The farther away from the center of the pressurizing portion PP, the greater the difference between the length of the 1-2nd combination opening portion COP1-2 in the first direction DR1 and the length of the second combination opening portion COP2 in the first direction DR1.

[0062] The bonding device BTA may further include a plurality of screws SCW. The screws SCW may be disposed in the first and second coupling openings COP1 and COP2. With the screws SCW disposed in the first and second coupling openings COP1 and COP2, the heating part HBP and the pressurizing part PP may be coupled to each other.

[0063] When viewed from the second direction DR2, the screw SCW may illustratively have a circular shape, but the shape of the screw SCW is not limited thereto and may have various shapes.

[0064] When viewed from the second direction DR2, the length of the screw SCW in the first direction DR1 may be the same as the length of the 1-1 joint opening portion COP1-1 in the first direction DR1. When viewed from the second direction DR2, the length of the screw SCW in the first direction DR1 may be the same as the length of the second joint opening portion COP2 in the first direction DR1. Thus, the screw SCW may be disposed in the 1-1 joint opening portion COP1-1 and the second joint opening portion COP2, and fixed to the pressurizing portion PP.

[0065] When viewed from the second direction DR2, the length of the 1-2nd coupling opening COP1-2 in the first direction DR1 may be greater than the length of the screw SCW in the first direction DR1. Thus, the screw SCW may reciprocate in the 1-2nd coupling opening COP1-2 along the first direction DR1.

[0066] When viewed from the second direction DR2, the farther from the center of the pressurizing part PP, the greater the difference between the length of the screw SCW in the first direction DR1 and the length of the first-second combining opening COP1-2 in the first direction DR1. Thus, when viewed from the second direction DR2, the closer to the outside of the heating part HBP, the greater the moving distance of the screw SCW in the first direction DR1.

[0067] Reference Figure 1 , Figure 2c and Figure 2d , Figure 2d 1 is a diagram showing the workbench STG, the pressurizing unit PP, and the heating unit HBP as viewed from the first direction DR1. Figure 2d The head portion HP, the guide portion GP and the connecting portion CST are omitted.

[0068] The height of the lower surface of the second portion PT2 may be higher than that of the lower surface of the tip portion TP. The lower surface of the tip portion TP may be adjacent to the stage STG more than the lower surface of the second portion PT2.

[0069] When viewed from the first direction DR1, the distance between the lowermost end of the side surface of the fastening portion CP contacting the second portion PT2 and the lower surface of the tip portion TP may be defined as a first distance G. Illustratively, the first distance G may be 2.4 mm to 20 mm. The first distance G may vary in Fig.10a and Fig.10b Detailed description in.

[0070] With the press part PP connected to the heating part HBP, when the head HP moves in the third direction DR3, the press part PP can move in the third direction DR3. Figure 6 The data driving unit DDV is bonded to the display panel DP in the manner described in the previous section. Figure 8a Detailed description is given in .

[0071] When viewed from the second direction DR2, the first length L1 of the fastening part CP in the first direction DR1 may be the same as the first length L1 of the heating part HBP in the first direction DR1. The first length L1 may be defined as the length of the fastening part CP and the heating part HBP in the first direction DR1 before heat is transferred from a heat source HRS described later.

[0072] However, the lengths of the heating part HBP and the pressurizing part PP to which heat is transferred in the first direction DR1 may vary. The heating part HBP and the pressurizing part PP may have different thermal conductivity coefficients. Therefore, the length change of the heating part HBP and the length change of the pressurizing part PP may be different from each other. This will be Figure 8c Detailed description in.

[0073] The heat source HRS may be disposed in the opening OP. The heat source HRS may extend along the first direction DR1. Figure 1 In the embodiment, the heat source HRS is disposed in the opening portion OP defined in the heating portion HBP, but the invention is not limited thereto, and the heat source HRS may be disposed in the pressurizing portion PP.

[0074] Although not shown in the figure, the heat source HRS can generate heat from an external power source. The heat source HRS can transfer heat to the first part PT1 and the second part PT2. The heat conducted to the first part PT1 can be conducted to the upper surface of the fastening part CP and the second part PT2. The heat conducted to the second part PT2 can be conducted to a side surface of the fastening part CP. The heat conducted to the fastening part CP can be conducted to the tip part TP. That is, the pressurizing part PP can be heated from the upper surface and one side surface of the fastening part CP. As a result, the tip part TP can be heated at a high temperature. Figure 6 The data drive section DDV is pressurized. This will Figure 8a Detailed description in.

[0075] Figure 3 is to use Figure 1 A perspective view of an electronic device including a display panel prepared by the bonding device shown. Figure 4 yes Figure 3 An exploded perspective view of the electronic device shown.

[0076] Reference Figure 3 and Figure 4 , the electronic device EA may be a device that is activated according to an electrical signal and displays an image IM and senses an external input TC. For example, the electronic device EA may include electronic devices such as a monitor, a portable phone, a tablet, a navigator, and a game console. However, the above-mentioned embodiments of the electronic device EA are illustrative and are not limited to a certain one without departing from the concept of the present invention. In this embodiment, a portable phone is illustratively illustrated with respect to the electronic device EA.

[0077] The electronic device EA may be rectangular in a plan view, the rectangular shape having short sides extending along the first direction DR1 and long sides extending along the second direction DR2 . However, the electronic device EA is not limited thereto, and may have various shapes such as circular and polygonal in a plan view.

[0078] The electronic device EA may be a rigid or flexible device. "Flexible" refers to a bendable property, which may include a structure ranging from a completely folded structure to a structure that can be bent at a level of a few nanometers. For example, the flexible electronic device EA may include a curved electronic device, a rollable electronic device, or a foldable electronic device.

[0079] The electronic device EA can display an image IM through a display surface FS that is parallel to the first direction DR1 and the second direction DR2. The image IM may include not only a dynamic image but also a static image. Figure 3 , a clock and an icon are illustrated as an example of the image IM.

[0080] The display surface FS of the electronic device EA may include only a plane, or may further include a curved surface bent from at least one side of the plane. The display surface FS may correspond to the front surface of the electronic device EA, and may also correspond to the front surface of the window WM. In the following, the display surface FS of the electronic device EA and the front surface FS of the window WM use the same reference numerals.

[0081] The electronic device EA of one embodiment can sense external input TC applied from the outside. The external input TC may include inputs in various forms such as force, pressure, temperature, or light. In this embodiment, the external input TC is illustrated as a user's hand applied to the front of the electronic device EA. However, this is an illustrative illustration, and the external input TC may include input applied close to the electronic device EA such as by contact or hovering of a pen.

[0082] The electronic device EA can sense the user's input through the display surface FS limited to the front and respond to the sensed input signal. However, the area of ​​the electronic device EA that senses the external input TC is not limited to the front of the electronic device EA, and can be changed according to the design of the electronic device EA. For example, the electronic device EA can also sense the input applied by the user to the side or back of the electronic device EA.

[0083] The electronic device EA may include a window WM, a display module DM, an electronic module ELM, a power module PSM, and a housing HAU. The window WM and the housing HAU may be combined to form the appearance of the electronic device EA.

[0084] The window WM may be disposed on the display module DM. The window WM may cover the front surface IS of the display module DM and protect the display module DM from external impact and scratches. The window WM may be combined with the display module DM through an adhesive layer.

[0085] The window WM may include an optically transparent insulating material. For example, the window WM may include glass or a synthetic resin as a base film. The window WM may have a single-layer or multi-layer structure. For example, a multi-layer window WM may include a synthetic resin film bonded by an adhesive, or may include a glass film and a synthetic resin film bonded by an adhesive. The window WM may further include a functional layer such as an anti-fingerprint layer, a phase control layer, and a hard coating layer disposed on a transparent base film.

[0086] The front surface FS of the window WM may correspond to the front surface of the electronic device EA. The front surface FS of the window WM may include a transmission area TA and a bezel area BZA.

[0087] The transmission area TA may be an optically transparent area. The transmission area TA may transmit the image IM provided by the display module DM. In the present embodiment, the transmission area TA is illustrated as a quadrilateral shape, but is not limited thereto, and the transmission area TA may have various shapes.

[0088] The frame area BZA may be an area having a lower light transmittance than the transmission area TA. The frame area BZA may correspond to an area printed with a substance having a predetermined color. The frame area BZA may prevent light transmission, thereby preventing a portion of the display module DM structure overlapped with the frame area BZA from being visually recognized from the outside.

[0089] The border area BZA may be adjacent to the transmission area TA. The shape of the transmission area TA may be substantially defined by the border area BZA. For example, the border area BZA may be disposed outside the transmission area TA, thereby surrounding the transmission area TA. However, this is an exemplary illustration, and the border area BZA may be adjacent to only one side of the transmission area TA, or may be disposed on the side of the electronic device EA, but not on the front of the electronic device EA. In addition, the border area BZA may also be omitted.

[0090] The display module DM may be disposed between the window WM and the housing HAU. The display module DM may display an image IM and sense an external input TC. The image IM may be displayed on the front surface IS of the display module DM. The front surface IS of the display module DM may include an active area AA and a peripheral area NAA.

[0091] The active area AA may be an area activated according to an electrical signal. For example, the active area AA may be an area for displaying an image IM and may be an area for sensing an external input TC. The active area AA may overlap at least a portion of the transmissive area TA. Thus, a user may visually recognize the image IM through the transmissive area TA or provide an external input TC. However, this is exemplary, and the area for displaying the image IM and the area for sensing the external input TC in the active area AA may also be separated from each other, and is not limited to a certain embodiment.

[0092] The peripheral area NAA may be adjacent to the active area AA. For example, the peripheral area NAA may surround the active area AA. A driving circuit or driving wiring for driving the active area AA may be provided in the peripheral area NAA. The peripheral area NAA may overlap at least a portion of the border area BZA, and the border area BZA may prevent the structure provided in the peripheral area NAA from being visually recognized from the outside.

[0093] The display module DM may include a display panel and an input sensing unit. The display panel may display an image IM, and the input sensing unit may sense an external input TC. A detailed description of this will be described later.

[0094] A portion of the display module DM may be bent around a bending axis extending along the first direction DR1. That is, the portion of the display module DM may be bent toward the back side of the display module DM corresponding to the active area AA. A flexible circuit board FCB may be connected to the bent portion of the display module DM, so that the flexible circuit board FCB may overlap with the display module DM in a plan view.

[0095] The flexible circuit board FCB may be electrically connected to the display module DM at one side of the display module DM. The flexible circuit board FCB may generate an electrical signal provided to the display module DM, or may calculate a result value including position or intensity information of the sensed external input TC by receiving a signal generated by the display module DM.

[0096] The electronic module ELM and the power module PSM may be disposed below the display module DM and may be electrically connected to the electronic module ELM and the power module PSM via an additional circuit board.

[0097] The power supply module PSM may supply power required for the operation of the electronic device EA. For example, the power supply module PSM may include a conventional battery module.

[0098] The electronic module ELM may include various functional modules that enable the electronic device EA to operate. For example, the electronic module ELM may include a control module, a wireless communication module, an image input module, an audio input module, an audio output module, a memory, an optical module, and an external interface module, etc. The electronic module ELM may include a main circuit board, and the above modules of the electronic module ELM may be mounted on the main circuit board, or may be electrically connected to the main circuit board through an additional circuit board.

[0099] The control module in the electronic module ELM can control the overall operation of the electronic device EA. For example, the control module can activate or deactivate the display module DM in accordance with user input. The control module may include at least one microprocessor. The optical module in the electronic module ELM may include a camera module, a proximity sensor, a biometric sensor for identifying a part of the user's body (e.g., a fingerprint, an iris, or a face), or a lamp for outputting light, etc.

[0100] The housing HAU can provide an internal space for accommodating the display module DM, the electronic module ELM, the power module PSM and the flexible circuit board FCB by combining with the window WM. The housing HAU may include a material with relatively high rigidity. For example, the housing HAU may include glass, plastic or metal, or may include a plurality of frames and / or plates formed by a combination of these materials. The housing HAU may absorb impacts applied from the outside, or may prevent impurities / moisture, etc. from invading from the outside to protect the structure of the electronic device EA housed in the housing HAU.

[0101] Figure 5 yes Figure 4 A cross-sectional view of a display module is shown.

[0102] Reference Figure 5, the display module DM may include a display panel DP and an input sensing unit ISP. The input sensing unit ISP may be disposed on the display panel DP. For example, the input sensing unit ISP may be directly disposed on the display panel DP. In the present embodiment, “the input sensing unit ISP is directly disposed on the display panel DP” means that the input sensing unit ISP is formed on the display panel DP through a continuous process and the input sensing unit ISP is combined with the display panel DP without an additional adhesive layer. That is, the structure of the input sensing unit ISP may be formed on a substrate surface provided by the display panel DP.

[0103] The display panel DP may display an image according to an electrical signal. The display panel DP of one embodiment may be a light-emitting display panel DP, but is not limited thereto. For example, the display panel DP may be an organic light-emitting display panel, an inorganic light-emitting display panel, or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting substance, and the light-emitting layer of the inorganic light-emitting display panel may include an inorganic light-emitting substance. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots and quantum rods, etc. Below, the display panel DP is described as an organic light-emitting display panel.

[0104] The display panel DP may include a base substrate BS, a circuit layer DP-CL, a display element layer DP-OL, and an encapsulation layer ECL sequentially stacked along the third direction DR3.

[0105] The base substrate BS may be a rigid substrate or a flexible substrate that can be bent, folded, or rolled. For example, the base substrate BS may be a glass substrate, a metal substrate, or a polymer substrate. The base substrate BS may provide a base surface for arranging the circuit layer DP-CL.

[0106] The base substrate BS may include an inorganic layer, an organic layer or a composite material layer. The base substrate BS may have a single-layer or multi-layer structure. For example, a multi-layered base substrate BS may include a plurality of synthetic resin layers and a multi-layer or single-layer inorganic layer disposed between the plurality of synthetic resin layers. The synthetic resin layer may include acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyamide resin or perylene resin, etc., but the material of the synthetic resin layer is not limited thereto.

[0107] The circuit layer DP-CL may be disposed on the base substrate BS. The circuit layer DP-CL may include at least one insulating layer, a semiconductor pattern, and a conductive pattern. The insulating layer, the semiconductor pattern, and the conductive pattern included in the circuit layer DP-CL may form driving elements such as transistors, signal lines, and pads.

[0108] The display element layer DP-OL may be disposed on the circuit layer DP-CL. The display element layer DP-OL may include light emitting elements that emit light respectively. For example, the light emitting elements may include organic light emitting elements, inorganic light emitting elements, micro LEDs, or nano LEDs, etc. The light emitting elements of the display element layer DP-OL may be electrically connected to the driving elements of the circuit layer DP-CL, and emit light according to the electrical signals provided by the driving elements.

[0109] The encapsulation layer ECL may be disposed on the display element layer DP-OL to seal the light emitting element. The encapsulation layer ECL may include at least one thin film for improving the optical efficiency of the display element layer DP-OL or for protecting the display element layer DP-OL. For example, the encapsulation layer ECL may include at least one of an inorganic film and an organic film. The inorganic film of the encapsulation layer ECL may protect the light emitting element from moisture / oxygen. The organic film of the encapsulation layer ECL may protect the light emitting element from impurities such as dust particles.

[0110] The input sensing unit ISP can sense the external input TC and provide an input signal including information about the external input TC so that the display panel DP can display an image corresponding to the external input TC. The input sensing unit ISP can be driven by a variety of methods such as electrostatic capacity, resistance film, ultraviolet, sound wave or pressure, and the driving method of the input sensing unit ISP is not limited to a certain method as long as it can sense the external input TC. In this embodiment, the input sensing unit ISP is described as an input sensing panel driven by electrostatic capacity.

[0111] The input sensing unit ISP may include a base layer IL1, a first sensing conductive layer CL1, a first sensing insulating layer IL2, a second sensing conductive layer CL2, and a second sensing insulating layer IL3 sequentially stacked along a third direction DR3. The base layer IL1 of the input sensing unit ISP may be in contact with the encapsulation layer ECL. However, the embodiment is not limited thereto, and at least one of the base layer IL1 and the second sensing insulating layer IL3 may be omitted.

[0112] The first sensing conductive layer CL1 and the second sensing conductive layer CL2 may have a single layer or a multilayer structure, respectively. The conductive layer of the multilayer structure may include at least two of a plurality of transparent conductive layers and a plurality of metal layers. The conductive layer of the multilayer structure may include a plurality of metal layers including metals different from each other. The transparent conductive layer may include at least one of ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), PEDOT (polyethylene dioxythiophene), metal nanowires, and graphene. The metal layer may include at least one of molybdenum, silver, titanium, copper, aluminum, and alloys thereof. For example, the first sensing conductive layer CL1 and the second sensing conductive layer CL2 may have a double-layer structure (e.g., a double-layer structure of ITO / copper), respectively, but are not limited thereto, and may have a three-layer structure of titanium / aluminum / titanium.

[0113] The first sensing conductive layer CL1 and the second sensing conductive layer CL2 may include sensing conductive patterns, respectively. The sensing conductive patterns of the first sensing conductive layer CL1 and the second sensing conductive layer CL2 may form sensing electrodes constituting the input sensing unit ISP and sensing lines connected thereto.

[0114] The base layer IL1, the first sensing insulating layer IL2, and the second sensing insulating layer IL3 may include at least one of an inorganic film and an organic film, respectively. For example, the inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride oxide, zirconium oxide, and hafnium oxide, and the organic film may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. However, the materials of the inorganic film and the organic film are not limited to the above examples. In one embodiment, the base layer IL1 may include an inorganic film, and the first sensing insulating layer IL2 and the second sensing insulating layer IL3 may include an organic film, but the embodiment is not limited thereto.

[0115] Figure 6 yes Figure 5 A top view of the display panel DP is shown.

[0116] Reference Figure 6 The display panel DP may include a base substrate BS, pixels PX, signal lines SL1~SLm, DL1~DLn, EL1~ELm, CSL1, CSL2, PL electrically connected to the pixels PX, a scan driver SDV (scan driver), an emission driver EDV (emission driver), a data driver DDV (data driver) and a plurality of display pads D-PD.

[0117] The base substrate BS may provide a base surface for setting electrical elements, wires, etc. of the display panel DP. The base substrate BS may include a first base area AA1, a bending area BA, and a second base area AA2 divided in the second direction DR2. The bending area BA may extend from the first base area AA1 in the second direction DR2. The second base area AA2 may extend from the bending area BA in the second direction DR2. Therefore, the first base area AA1 and the second base area AA2 may be separated by the bending area BA.

[0118] The first substrate area AA1 may include a display area DA. The display area DA may be a region where a light emitting element of a pixel PX is disposed. Thus, the pixel PX may display an image through the display area DA. The display area DA may correspond to a display module DM (refer to Figure 4 ) in the active area AA (refer to Figure 4 ), and can be used with Windows WM (see Figure 4 ) in the transmissive area TA (refer to Figure 4 )overlapping.

[0119] The remaining first substrate area AA1, the bending area BA and the second substrate area AA2 except the display area DA may be defined as a non-display area NDA. The non-display area NDA may be an area adjacent to the display area DA and not displaying an image. The non-display area NDA may surround the display area DA. A scanning driving part SDV, a light emitting driving part EDV, a data driving part DDV for driving the pixels PX and a display pad D-PD electrically connected to the signal lines SL1~SLm, DL1~DLn, EL1~ELm, CSL1, CSL2, PL may be provided in the non-display area NDA. The signal lines SL1~SLm, DL1~DLn, EL1~ELm, CSL1, CSL2, PL electrically connected to the pixels PX may be extended on the non-display area NDA.

[0120] The bending area BA may be an area bent around a bending axis extending along the first direction DR1. That is, the bending area BA may be bent toward the back surface of the display panel DP corresponding to the first substrate area AA1. The second substrate area AA2 extending from one side of the bending area BA may overlap with the first substrate area AA1 in a plan view as the bending area BA is bent. That is, the second substrate area AA2 may be disposed on the back surface of the display panel DP corresponding to the first substrate area AA1.

[0121] In the first direction DR1, the width of each of the bending area BA and the second base area AA2 may be smaller than the width of the first base area AA1. Since the bending area BA has a narrower width than the first base area AA1 in the direction parallel to the bending axis, the bending area BA may be easily bent. However, this is an exemplary illustration, and in the first direction DR1, at least one of the width of the bending area BA and the width of the second base area AA2 may be the same as the width of the first base area AA1, but is not limited to one.

[0122] The second substrate area AA2 may be an area that is located below the first substrate area AA1 and is flatly provided by bending the bending area BA. The second substrate area AA2 may be an area where signal lines SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2, and PL extending toward the display pad D-PD through the bending area BA and the data driving part DDV are disposed.

[0123] The area where the display pad D-PD is disposed may be defined as a display pad area PD-A. Figure 7 The flexible circuit board FCB described in the above can be disposed on the second substrate area AA2 provided with the display pad D-PD, and is electrically connected to the display pad D-PD. The flexible circuit board FCB disposed adjacent to the lower end of the second substrate area AA2 (refer to Figure 7 ) can be located on the back side of the display panel DP as the bending area BA is bent. Figure 7 ) in the electronic device EA (refer to Figure 4 ) is located below the first substrate area AA1, which can reduce the size of the electronic device EA (refer to Figure 4 )’s border area.

[0124] Each pixel PX may include a pixel driving circuit and a light emitting element electrically connected to the pixel driving circuit, wherein the pixel driving circuit is composed of a transistor (e.g., a switching transistor, a driving transistor, etc.) and at least one capacitor. The pixel PX may generate light corresponding to an electrical signal applied to each pixel PX, and may display an image through the display area DA. According to an embodiment, a portion of the pixels PX may include a transistor disposed in the non-display area NDA, and is not limited to a certain one.

[0125] The scanning driving unit SDV and the light emitting driving unit EDV may be disposed in the non-display area NDA corresponding to the first substrate area AA1. The data driving unit DDV may be disposed in the non-display area NDA corresponding to the second substrate area AA2. In one embodiment, the data driving unit DDV may be provided in the form of an integrated circuit chip installed in the non-display area NDA of the display panel DP. However, this is not limited to this. The data driving unit DDV may be installed on a flexible circuit board FCB (refer to Figure 4 )superior.

[0126] The signal lines SL1-SLm, DL1-DLn, EL1-ELm, CSL1, CSL2, and PL may include scan lines SL1-SLm, data lines DL1-DLn, light lines EL1-ELm, first and second control lines CSL1 and CSL2, and a power line PL. Here, m and n represent natural numbers.

[0127] The data lines DL1-DLn may be insulated from and intersect the scan lines SL1-SLm and the light-emitting lines EL1-ELm. For example, the scan lines SL1-SLm may extend along the first direction DR1 and be electrically connected to the scan driving unit SDV. The data lines DL1-DLn may extend along the second direction DR2 and be electrically connected to the data driving unit DDV. The light-emitting lines EL1-ELm may extend along the first direction DR1 and be electrically connected to the light-emitting driving unit EDV.

[0128] The power line PL may include a portion extending in the first direction DR1 and a portion extending in the second direction DR2. The portion of the power line PL extending in the first direction DR1 and the portion extending in the second direction DR2 may be disposed on different layers from each other, or may be disposed integrally on the same layer. The portion of the power line PL extending in the first direction DR1 may be electrically connected to the pixel PX and the portion extending in the second direction DR2. The portion of the power line PL extending in the second direction DR2 may be disposed in the non-display area NDA, and may be electrically connected to the display pad D-PD from the first substrate area AA1 via the bending area BA and the second substrate area AA2. The power line PL may provide a first voltage to the pixel PX.

[0129] The first control line CSL1 may be electrically connected to the scan driving part SDV and extend toward the lower end of the second substrate area AA2 through the bending area BA. The second control line CSL2 may be electrically connected to the light emitting driving part EDV and extend toward the lower end of the second substrate area AA2 through the bending area BA.

[0130] The display pad D-PD may be disposed adjacent to the lower end of the second substrate area AA2. On the second substrate area AA2, the display pad D-PD may be disposed to be closer to the lower end of the base substrate BS than the data driving part DDV. The display pads D-PD may be disposed spaced apart along the first direction DR1. The power line PL, the first control line CSL1, and the second control line CSL2 may be electrically connected to corresponding display pads D-PD of the plurality of display pads D-PD, respectively. The data lines DL1 to DLn may be electrically connected to corresponding display pads D-PD of the plurality of display pads D-PD, respectively, through the data driving part DDV.

[0131] The display pad D-PD can be bonded to the flexible circuit board FCB through an anisotropic conductive adhesive layer (refer to Figure 4 ) is electrically connected by a flexible printed circuit board FCB (refer to Figure 4 ) can be transmitted to the display panel DP through the display pad D-PD. However, the display pad D-PD and the flexible circuit board FCB (refer to Figure 4 ) is not limited to this.

[0132] The scan driving part SDV may generate a scan signal in response to the scan control signal. The scan signal may be applied to the pixel PX through the scan lines SL1 to SLm. The data driving part DDV may generate a data voltage corresponding to the image signal in response to the data control signal. The data voltage may be applied to the pixel PX through the data lines DL1 to DLn. The light emitting driving part EDV may generate a light emitting signal in response to the light emitting control signal. The light emitting signal may be applied to the pixel PX through the light emitting lines EL1 to ELm.

[0133] The pixel PX may be supplied with a data voltage in response to the scan signal. The pixel PX may generate an image by emitting light of brightness corresponding to the data voltage in response to the light emission signal. The light emission time of the pixel PX may be controlled by the light emission signal.

[0134] Figure 7 yes Figure 6 A stereoscopic view of the display panel DP is shown.

[0135] Illustratively, Figure 7 2 is a diagram illustrating a partial region of the second substrate area AA2.

[0136] Illustratively, Figure 7 A portion of the structure provided corresponding to the second substrate area AA2 is briefly illustrated.

[0137] Reference Figure 7 In the second substrate area AA2, a region where the data driving part DDV is adhered may be defined as a first pad region PA1, and a region where the flexible circuit board FCB is adhered may be defined as a second pad region PA2.

[0138] The data driving unit DDV may be bonded to the first pad area PA1 through the first adhesive layer CF1, and the flexible circuit board FCB may be bonded to the second pad area PA2 through the second adhesive layer CF2. The first adhesive layer CF1 and the second adhesive layer CF2 may be anisotropic conductive films, respectively. For example, the first adhesive layer CF1 and the second adhesive layer CF2 may include an adhesive resin and conductive particles dispersed in the adhesive resin, respectively. Alternatively, the first adhesive layer CF1 and the second adhesive layer CF2 may be non-conductive films, respectively. For example, the first adhesive layer CF1 and the second adhesive layer CF2 may be adhesive resins that do not include conductive particles, respectively. The first adhesive layer CF1 and the second adhesive layer CF2 may include thermosetting resins. The bonding of the display panel DP and the data driving unit DDV will be at Figure 8a Detailed description is given in .

[0139] However, the present invention is not limited thereto, and in one embodiment, any one of the first adhesive layer CF1 and the second adhesive layer CF2 may be omitted. For example, the data driving part DDV and the flexible circuit board FCB may also be bonded to the first pad area PA1 and the second pad area PA2 respectively by ultrasonic bonding.

[0140] The display panel DP may include a plurality of pads PD. The plurality of pads PD may include a first signal pad PD1, a second signal pad PD2, and a display pad D-PD. The first signal pad PD1, the second signal pad PD2, and the display pad D-PD may be pads disposed on a signal transmission path.

[0141] The first signal pad PD1 may be an input pad provided corresponding to the output pad of the data driving part DDV and receiving a signal from the data driving part DDV. The second signal pad PD2 may be an output pad provided corresponding to the input pad of the data driving part DDV and outputting a signal to the data driving part DDV. The display pad D-PD may be a panel input pad receiving a signal from the flexible circuit board FCB.

[0142] Each first signal pad PD1 can be connected to a pixel PX of the display panel DP through a signal line (refer to Figure 6 ) is electrically connected, and can send a signal received from, for example, the data driving unit DDV to the pixel PX (refer to Figure 6 The second signal pad PD2 can be electrically connected to corresponding display pads D-PD among the plurality of display pads D-PD through signal wirings, and the display pad D-PD and the second signal pad PD2 electrically connected to each other can send and receive signals.

[0143] The first pad area PA1 may include a first sub-pad area PA1-1 and a second sub-pad area PA1-2. The first sub-pad area PA1-1 may be defined as an area where the first signal pad PD1 is disposed. The second sub-pad area PA1-2 may be defined as an area where the second signal pad PD2 is disposed.

[0144] The first signal pads PD1 may be arranged in the first direction DR1 and the second direction DR2 within the first sub pad area PA1-1. The first signal pads PD1 arranged in the first direction DR1 among the first signal pads PD1 may be defined as a pad row. Figure 7 Five pad rows are shown arranged along the second direction DR2 by way of example. The arrangement of the first signal pads PD1 is not limited to one type as long as at least two pad rows are arranged along the second direction DR2.

[0145] The second signal pads PD2 may be arranged along the first direction DR1 within the second sub pad area PA1-2. The second signal pads PD2 may be arranged as one pad row. However, the arrangement of the second signal pads PD2 is not limited thereto.

[0146] Figures 8a to 8d It is used to illustrate the use of Figure 1 FIG. 1 is a diagram showing bonding of a display panel and a data driving unit performed by a bonding device. Figures 9a to 9d It is a diagram for explaining a heating unit of a comparative example.

[0147] Illustratively, Figure 8a It is a stereogram. Figure 8b is the bonding device BTA viewed from a first direction DR1, Figure 8c The heating part HBP and the pressurizing part PP are viewed from the second direction DR2.

[0148] Illustratively, Figures 9a to 9c The pressurizing part PP and the heating part HBP' are viewed from the second direction DR2.

[0149] Illustratively, in Figure 8c The first joint opening COP1 is shown by a dotted line in FIG.

[0150] Figures 8a to 8c The pressurizing part PP and the heating part HBP shown in FIG. Figure 1 The pressurizing part PP and the heating part HBP shown are the same. Figure 8b The display panel DP and the data driving unit DDV shown in FIG. Figure 6 and Figure 7 The display panel DP and the data driving part DDV shown are the same, so the description will be omitted or simplified.

[0151] For ease of explanation, Figure 8b The head portion HP, the guide portion GP and the connecting portion CST are omitted.

[0152] Reference Figure 1 , Figure 8a and Figure 8b The display panel DP and the data driving part DDV may be disposed on the working stage STG. With the adsorption holes VFH (refer to Figure 1 ) is transformed into a vacuum state, and the display panel DP can be fixed on the upper surface of the workbench STG.

[0153] After the display panel DP is fixed on the workbench STG, the head HP may move along the third direction DR3 along one side of the guide part GP. As the head HP moves along the third direction DR3, the heating part HBP and the pressurizing part PP connected to the head HP may move along the third direction DR3. The pressurizing part PP may move along the third direction DR3 to pressurize the data driving part DDV.

[0154] Reference Figure 8a and Figure 8b , when the pressurizing part PP pressurizes the data driving part DDV, the heat source HRS may transfer heat to the heating part HBP and the pressurizing part PP. Specifically, the heat source HRS may generate heat through an external power source. The heat generated by the heat source HRS may be conducted to the first part PT1. The heat conducted to the first part PT1 may be conducted to the second part PT2 and the upper surface of the fastening part CP. The heat conducted to the second part PT2 may be conducted to a side surface of the fastening part CP. That is, the heat may be transferred to the fastening part CP through the upper surface of the fastening part CP and the side surface of the fastening part CP that contacts the second part PT2.

[0155] The heat conducted to the fastening part CP may be conducted to the tip portion TP. The first adhesive layer CF1 may be cured by transferring the heat through the data driving part DDV contacting the tip portion TP.

[0156] Reference Figure 2c and Figure 8c , the lengths of the heating part HBP and the press part PP to which heat is transferred from the heat source HRS in the first direction DR1 may vary. The heating part HBP and the press part PP may have different thermal conductivities. Therefore, the length change amount of the heating part HBP in the first direction DR1 and the length change amount of the press part PP in the first direction DR1 may be different from each other.

[0157] Illustratively, as Figure 8c As shown, the length of the heating portion HBP in the first direction DR1 may change from the first length L1 to the second length L2. The length of the fastening portion CP in the first direction DR1 may change from the first length L1 to the third length L3. The length change amount of the heating portion HBP in the first direction DR1 may be greater than the length change amount of the fastening portion CP in the first direction DR1.

[0158] Reference Figures 9a to 9d , the length of the 1st-2nd combining opening portion COP1-2' in the first direction DR1 and the length of the screw SCW in the first direction DR1 may be the same.

[0159] The lengths of the heating part HBP' and the press part PP to which heat is transferred from the heat source HRS in the first direction DR1 may vary. The thermal conductivity of the heating part HBP' and the press part PP may be different from each other. Therefore, the length change amount of the heating part HBP' in the first direction DR1 and the length change amount of the press part PP in the first direction DR1 may be different from each other.

[0160] As the length of the heating part HBP in the first direction DR1 changes, the screw SCW fixed to the heating part HBP' may move along the first direction DR1. At this time, the screw SCW is disposed in the first-second joint opening COP1-2' and the second joint opening COP2, and an external force generated by the difference in length change between the pressurizing part PP and the heating part HBP' may be applied to the pressurizing part PP.

[0161] The pressurized part PP to which the external force is transmitted may be deformed. Fig.9c As shown in FIG. 1 , the lower surface of the fastening portion CP and the lower surface of the tip portion TP may be deformed to be concave toward the upper surface. As the lower surface of the tip portion TP is deformed, as shown in FIG. Figure 9d As shown in FIG. 1 , the lower surface of the tip portion TP may not be pressed uniformly against the Figure 8b The entire area of ​​the upper surface of the data driving part DDV shown in FIG. Figure 8b ) and display panel DP (refer to Figure 8b ) is poorly bonded.

[0162] Reference Figure 8c and Figure 8d , when the length of the heating part HBP in the first direction DR1 changes, the screw SCW can move in the first direction DR1. When viewed from the second direction DR2, the length of the 1-2 joint opening COP1-2 in the first direction DR1 can be greater than the length of the screw SCW in the first direction DR1. Thus, the screw SCW can move in the 1-2 joint opening COP1-2 in the first direction DR1 without applying an external force generated by the difference in length change between the pressurizing part PP and the heating part HBP to the pressurizing part PP.

[0163] Thus, the pressurizing portion PP can be free from external force, and the lower surfaces of the fastening portion CP and the tip portion TP can be kept flat. Figure 8dAs shown, the tip portion TP can apply uniform pressure to the data driving portion DDV (refer to Figure 8b ) is pressed over the entire area of ​​the upper surface, and the data drive unit DDV (refer to Figure 8b ) and display panel DP (refer to Figure 8b ) causes poor adhesion between them.

[0164] Fig.10a and Fig.10b It is a diagram for explaining a pressurizing portion according to another embodiment of the present invention.

[0165] Illustratively, Fig.10a The second combination opening COP2 and Figure 2b The second combination opening portion COP2 is the same as that of the first embodiment, so the description will be omitted or simplified.

[0166] When viewed from the second direction DR2, the pressurizing portion PP (see Figure 2b ) and the first pressurizing portion PP1 may be substantially the same except that the lengths in the third direction DR3 are different from each other.

[0167] Reference Figure 8b , Figure 8c , Fig.10a and Fig.10b ,like Figure 8c As shown, the pressurizing portion PP may have a first height H1 in the third direction DR3. Fig.10a As shown, the pressurizing portion PP1 may have a second height H2. Hereinafter, the pressurizing portion PP1 having the second height H2 may be defined as a first pressurizing portion PP1.

[0168] When viewed from the first direction DR1, Figure 8b As shown, a distance between the lowermost end of one side surface of the fastening portion CP contacting the second portion PT2 and the lower surface of the tip portion TP may be defined as a first distance G.

[0169] The first distance G may be different according to the height of the pressurizing parts PP and PP1. As the height of the pressurizing parts PP and PP1 increases, the first distance G may become longer. For example, when the first pressurizing part PP1 has a second height H2, the first distance G of the first pressurizing part PP1 may be greater than the first distance G of the pressurizing part PP.

[0170] When heat is transferred from the heat source HRS to the pressurizing part PP, PP1 by conduction, the temperature of the pressurizing part PP, PP1 may increase. Specifically, the heat emitted from the heat source HRS may be conducted to the fastening part CP, CP1 through the heating part HBP. The heat may be conducted through the upper surface and one side surface of the fastening part CP, CP1 in contact with the heating part HBP.

[0171] Heat transferred to the fastening parts CP, CP1 may be transferred to the tip portion TP. The amount of heat transferred to the lower surface of the tip portion TP may differ according to the size of the first distance G. The amount of heat transferred to the lower surface of the tip portion TP may be inversely proportional to the size of the first distance G.

[0172] The first distance G may be 2.4 mm to 20 mm. In this case, the difference in heat transferred to the upper and lower surfaces of the tip portion TP may be small. Thus, the temperatures of the upper and lower surfaces of the tip portion TP may be the same.

[0173] In the case where the first distance G is greater than 20 mm, the amounts of heat transferred to the upper surface and the lower surface of the tip portion TP may be different from each other. Thus, the temperature of the upper surface and the temperature of the lower surface of the tip portion TP may be different from each other. For example, the temperature of the upper surface of the tip portion TP, which is relatively closer to the heat source HRS, may be higher than the temperature of the lower surface of the tip portion TP.

[0174] In this case, the length variation of the upper surface of the tip portion TP in the first direction DR1 and the length variation of the lower surface of the tip portion TP in the first direction DR2 may be different from each other. The length variation of the upper surface of the tip portion TP may be greater than the length variation of the lower surface of the tip portion TP. As a result, the lower surface of the tip portion TP may not maintain a flat state. Therefore, the lower surface of the tip portion TP may not pressurize the entire area of ​​the upper surface of the data driving part DDV with a uniform pressure, and poor adhesion between the data driving part DDV and the display panel DP may occur.

[0175] However, in the case where the first distance G is 2.4 mm to 20 mm, the temperature of the upper surface of the tip portion TP and the temperature of the lower surface may be the same. Thus, the length variation of the upper surface of the tip portion TP and the length variation of the lower surface of the tip portion TP may be the same as each other, and the lower surface of the tip portion TP may be kept flat. Fig.10b As shown, the lower surface of the tip portion TP may apply pressure to the entire area of ​​the upper surface of the data driving part DDV with uniform pressure, and poor adhesion between the data driving part DDV and the display panel DP may be avoided.

[0176] Fig.11a and Fig.11b It is a diagram for explaining a pressurizing portion according to another embodiment of the present invention.

[0177] Fig.11a The tip part TP and Figure 2b The tip portion TP is the same, so the description will be omitted or simplified.

[0178] When viewed from the second direction DR2, the fastening portion CP (see Figure 2b ) and the second fastening portion CP2 may be substantially the same except that their lengths in the first direction DR1 are different from each other.

[0179] Reference Figure 2b , Fig.11a and Fig.11b , Fig.11a The length of the fastening portion CP2 in the first direction DR1 may be defined as a fourth length L4. The fourth length L4 may be less than Figure 2b Hereinafter, the fastening portion CP2 having the fourth length L4 in the first direction DR1 may be defined as a second fastening portion CP2, and the pressurizing portion PP2 including the second fastening portion CP2 may be defined as a second pressurizing portion PP2.

[0180] The shorter the length of the second fastening portion CP2 in the first direction DR1, the more the temperatures of the two opposite sides of the second fastening portion CP2 in the first direction DR1 can be the same. Thus, the changes in the first direction DR1 of the two opposite sides of the second fastening portion CP2 in the first direction DR1 can be the same. Therefore, the lower surface of the tip portion TP can maintain a flat state.

[0181] The above description is made with reference to the embodiments, but it should be understood that a person skilled in the art can modify and change the present invention in various ways without departing from the scope of the concept and field of the present invention recorded in the claims. In addition, the embodiments disclosed in the present invention are not intended to limit the technical concept of the present invention, and all technical concepts in the claims and their equivalents should be interpreted as included in the scope of the rights of the present invention.

[0182] Description of Reference Numerals

[0183] BTA: bonding device STG: working table

[0184] GP: Guide part HP: Head part

[0185] CST: Connecting part HBP: Heating part

[0186] PT1: Part 1 PT2: Part 2

[0187] PP: Pressurized part CP: Fastening part

[0188] TP: tip section HRS: heat source.

Claims

1. A bonding device, characterized in that: include: A workbench, for setting a display panel, the workbench having a plane defined by a first direction and a second direction intersecting the first direction; A heating portion, disposed above the workbench and defining a plurality of first combining portions along the first direction; a pressurizing portion disposed between the workbench and the heating portion and defining a plurality of second combining portions overlapping the plurality of first combining portions; as well as A plurality of screws are disposed in the plurality of first coupling parts and the plurality of second coupling parts, The plurality of first combining portions include: The 1-1 combining portion is disposed at the center of the heating portion when viewed from the second direction; as well as A plurality of 1-2 combining portions are arranged to be spaced apart from the 1-1 combining portion in the first direction when viewed from the second direction, Among the plurality of 1-2 combining portions, a 1-2 combining portion adjacent to two opposite sides of the heating portion in the first direction has a length in the first direction greater than a length of the 1-1 combining portion in the first direction.

2. The bonding device according to claim 1, characterized in that The length of the 1-2 connecting portion in the first direction becomes longer toward two opposite sides of the heating portion in the first direction.

3. The bonding device according to claim 2, characterized in that When viewed from the second direction, the length of the 1-1 combining portion in the first direction is the same as the length of the second combining portion in the first direction. When observed from the second direction, the length of the 1-2 combining portion in the first direction is greater than the length of the second combining portion in the first direction. When observed from the second direction, the difference between the length of the 1-2 combining portion in the first direction and the length of the second combining portion in the first direction increases as the distance from the center of the heating portion increases.

4. The bonding device according to claim 1, characterized in that Further included is a heat source disposed in an opening portion defined in the heating portion.

5. The bonding device according to claim 1, characterized in that Further including: A head portion, arranged above the heating portion; as well as a connecting portion for connecting the head portion and the heating portion to each other, The head is reciprocally movable along a third direction intersecting the plane defined by the first direction and the second direction.

6. The bonding device according to claim 1, characterized in that The pressurizing unit comprises: a fastening portion connected to the heating portion and defining the second combining portion; and A tip portion extends from the fastening portion along a third direction intersecting the plane defined by the first direction and the second direction.

7. The bonding device according to claim 6, characterized in that A width of the tip portion in the first direction is smaller than a width of the fastening portion in the first direction.

8. The bonding device according to claim 1, characterized in that The plurality of first coupling portions are defined by grooves defined on a surface of the heating portion opposite to the pressurizing portion, The second coupling portion is defined by an opening portion extending from one side to the other side of both sides of the pressurizing portion that are opposite to each other in the second direction.

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