Semiconductor positioning jig and semiconductor equipment

Abstract

The utility model relates to a semiconductor positioning jig and semiconductor equipment. The semiconductor positioning jig comprises a bearing disc, a jig main body, at least one sensor and a controller, the jig main body is placed on the bearing disc and is used for positioning a wafer; the sensor is located on the outer side of the jig body and used for generating a first induction signal under the condition that it is detected that the jig body is placed in the bearing disc and further used for generating a second induction signal under the condition that it is not detected that the jig body is placed in the bearing disc. The controller is connected with the sensor, and the controller is used for generating a corresponding control instruction under the condition that the first induction signal or the second induction signal is received. According to the semiconductor positioning jig, whether the semiconductor positioning jig on the bearing disc is taken away or not can be accurately judged, and corresponding different control instructions are generated through the controller under different conditions that whether the semiconductor positioning jig is taken away or not, so that the situation that equipment crashes due to the fact that the semiconductor positioning jig is forgotten to be taken away is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a semiconductor positioning jig and semiconductor equipment. Background Art

[0002] In the field of semiconductor manufacturing technology, wafer positioning jigs are an important device for accurately positioning wafers. They are usually used for handling, transferring and positioning wafers to ensure that the wafers can maintain the correct position and alignment during lithography, etching and other processes.

[0003] In the specific use of the wafer positioning jig, the wafer positioning jig is usually placed in the semiconductor equipment first, and the wafer is placed in the wafer positioning jig. After the wafer is fixed by vacuum adsorption and other means, the wafer positioning jig is removed and the semiconductor process is started.

[0004] However, in daily operations, workers tend to forget to remove the wafer positioning jig after placing it on a fixture to fix the wafer. Starting the semiconductor process at this time can easily cause hardware damage and downtime on the semiconductor equipment machine side. Utility Model Content

[0005] Based on this, the embodiments of the present application provide a semiconductor positioning jig and a semiconductor device, which can avoid equipment downtime caused by forgetting to remove the positioning jig.

[0006] According to some embodiments, the present application provides a semiconductor positioning jig, including a carrier plate, a jig body, at least one sensor and a controller; the jig body is placed on the carrier plate for positioning the wafer; the sensor is located on the outside of the jig body, and is used to generate a first sensing signal when it detects that the jig body is placed in the carrier plate, and is also used to generate a second sensing signal when it does not detect that the jig body is placed in the carrier plate; the controller is connected to the sensor, and the controller is used to generate a corresponding control instruction when it receives the first sensing signal or the second sensing signal.

[0007] In the semiconductor positioning jig of the above-mentioned embodiment, since a sensor is provided on the outside of the jig body, the sensor generates a first sensing signal when it detects that the jig body is placed in the carrier plate, and is also used to generate a second sensing signal when it does not detect that the jig body is placed in the carrier plate, so as to accurately judge whether the semiconductor positioning jig on the carrier plate is taken away, and generate corresponding control instructions through the controller when receiving the first sensing signal or the second sensing signal, so as to generate corresponding different control instructions under different conditions of whether the semiconductor positioning jig is taken away, thereby avoiding equipment downtime caused by forgetting to take away the semiconductor positioning jig.

[0008] In some embodiments, there are multiple sensors; the controller is used to generate a corresponding control instruction when receiving a first sensing signal or a second sensing signal from at least one sensor among the multiple sensors.

[0009] In some embodiments, the sensor includes a receiving sensor and / or a transmitting sensor; the transmitting sensor is used to transmit the detection source; the receiving sensor is used to generate a first sensing signal when the detection source is not received, and is also used to generate a second sensing signal when the detection source is received.

[0010] In some embodiments, the number of receiving sensors is the same as the number of transmitting sensors, and the receiving sensors and the transmitting sensors are symmetrically arranged.

[0011] In some embodiments, the number of sensors is 2n, where n is a positive integer; the sensors are symmetrically arranged on both sides of the tool body.

[0012] In some embodiments, the jig body is circular; and the plurality of sensors are evenly arranged along the circumference of the jig body.

[0013] In some embodiments, the sensor is a photoelectric sensor.

[0014] In some embodiments, the semiconductor positioning jig further includes an alarm, which is connected to the sensor; the alarm is used to generate an alarm signal when the first sensing signal is received.

[0015] According to some embodiments, the present application further provides a semiconductor device, comprising the semiconductor positioning jig and the cavity in any of the above embodiments, wherein the semiconductor positioning jig is located in the cavity.

[0016] In the above-mentioned semiconductor equipment, since a sensor is arranged on the outside of the jig body, the sensor generates a first sensing signal when it detects that the jig body is placed in the carrier plate, and is also used to generate a second sensing signal when it does not detect that the jig body is placed in the carrier plate, so as to accurately judge whether the semiconductor positioning jig on the carrier plate is taken away, and generate corresponding control instructions through the controller when receiving the first sensing signal or the second sensing signal, so as to generate corresponding different control instructions under different conditions of whether the semiconductor positioning jig is taken away, thereby avoiding the semiconductor equipment downtime caused by forgetting to take away the semiconductor positioning jig.

[0017] In some embodiments, the semiconductor device is used to execute a preset process upon receiving a control instruction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A top view of a semiconductor positioning jig provided in one embodiment of the present application;

[0019] Figure 2 A top view of a semiconductor device provided in accordance with an embodiment of the present application.

[0020] Explanation of the reference numerals: 1. semiconductor positioning jig; 11. carrier plate; 12. jig body; 13. sensor; 14. wafer; 2. semiconductor equipment; 21. cavity. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings. The accompanying drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0023] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0024] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0025] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0026] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0027] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0028] Embodiments of the invention are described herein with reference to schematic diagrams that are ideal embodiments (and intermediate structures) of the invention, and variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances are anticipated. Therefore, embodiments of the invention should not be limited to the specific shapes of regions shown herein, but include deviations in shapes due to, for example, manufacturing techniques.

[0029] Wafer positioning jigs play a critical role in the production process, affecting the yield and quality of the entire semiconductor chip. Wafer positioning jigs are usually designed with mechanical structures and positioning pins to ensure that the wafer is accurately positioned in each processing step.

[0030] Especially in the semiconductor grinding process, the wafer positioning jig is a vital part of the semiconductor manufacturing process in the grinder. Grinding is a process used to flatten the surface of the wafer and remove excess material, which involves precise docking and positioning between the wafer and the grinding disc. The wafer positioning jig can ensure that the wafer maintains a stable and accurate position during the grinding process. This is the premise to ensure that the surface of the wafer is ground evenly and flat. Any slight deviation may cause the wafer surface to be uneven, affecting subsequent processes. By using high-precision positioning jigs, the grinding process can effectively reduce defects caused by inaccurate positioning, thereby improving the yield of the wafer. Good positioning ensures that each wafer can reach the predetermined thickness and smoothness.

[0031] In the semiconductor grinding process, the cover of the grinding machine chamber is usually opened manually, the wafer positioning jig is placed in the specified position of the grinding machine, and the wafer is placed in the wafer positioning jig. After fixing the wafer by vacuum adsorption and other means, the wafer positioning jig is removed, the cover of the grinding machine chamber is manually closed, the grinding program to be executed is selected, and the grinding process is started. The grinding process to be performed usually includes wafer back thinning, which is a physical mechanical back grinding to grind the wafer to the required target thickness. In the wafer back thinning process, coarse grinding is used in the Z1 stage and fine grinding is used in the Z2 stage. Different types of grinding wheels can be used in the Z1 stage and the Z2 stage. After the grinding process is completed, the wafer can also be subjected to an etching process or a deposition process. For example, the rough lines of the back grinding of the wafer are removed by a wet etching process, thereby effectively reducing the contact resistance; or, the target metal (such as metal aluminum, metal titanium, metal nickel, metal silver, etc.) is sputtered onto the back of the wafer using a physical vapor deposition machine. When performing etching or deposition processes, it is also necessary to try out wafer positioning jigs.

[0032] However, in daily operations, workers tend to forget to remove the wafer positioning jig after placing it on a fixture to fix the wafer. Starting the semiconductor process at this time can easily cause hardware damage and downtime on the semiconductor equipment machine side.

[0033] In order to solve the above problems, the present application provides a semiconductor positioning jig and semiconductor equipment.

[0034] Please refer to Figure 1 , a semiconductor positioning jig 1 is provided, which includes a carrier plate 11, a jig body 12, at least one sensor 13 and a controller.

[0035] For example, the carrier plate 11 is used to carry the wafer 14. It is understood that the design and material of the carrier plate 11 have an important impact on the processing quality, processing efficiency and the entire production process of the wafer 14. In some embodiments, the carrier plate 11 is generally designed as a disc with grooves to help filter out liquids and particulate matter during the grinding or polishing process to ensure the contact stability between the wafer 14 and the processing components.

[0036] In some embodiments, the carrier plate 11 is made of a material with high strength and good rigidity. For example, the carrier plate 11 can be made of materials including aluminum alloy, carbon fiber or special plastic. The above materials have low thermal expansion, high wear resistance and chemical stability, and can adapt to the harsh conditions in the semiconductor manufacturing process.

[0037] For example, the jig body 12 is placed on the carrier plate 11 for positioning the wafer 14. In some embodiments, the jig body 12 is circular. For example, the jig body 12 is a hollow ring. For example, the inner diameter of the annular jig body 12 is not less than the outer diameter of the wafer 14 to be positioned. Those skilled in the art can select a suitable jig body 12 according to the size of the wafer 14 to be positioned to achieve accurate positioning of the wafer 14, and the present application does not impose specific restrictions on this.

[0038] In some embodiments, the jig body 12 can be made of a material with low thermal expansion coefficient, high corrosion resistance, and high strength. For example, the jig body 12 can be made of a metal material. For example, the jig body 12 can be made of an aluminum alloy material, which has the advantages of light weight, easy processing, and good mechanical strength. Alternatively, the jig body 12 can also be made of stainless steel. Due to the excellent corrosion resistance and strength of stainless steel, the jig body 12 made of stainless steel can avoid corrosion in applications where acid and alkali corrosion resistance is required. For example, the jig body 12 can also be made of an inorganic material. For example, the jig body 12 can be made of a ceramic material, which has the advantages of excellent high temperature resistance and chemical stability, and a low friction coefficient. For example, the jig body 12 can also be made of an organic material. For example, the jig body 12 can also be made of polytetrafluoroethylene, which has excellent corrosion resistance and low friction characteristics, and can effectively prevent pollution and damage. For example, the jig body 12 can also be made of a composite material. For example, the jig body 12 may also be made of carbon fiber reinforced plastic, which has the advantages of being light, high-strength, and good in heat resistance, and can meet specific engineering requirements.

[0039] For example, the sensor 13 is located outside the jig body 12 and is used to generate a first sensing signal when the jig body 12 is detected to be placed in the carrier plate 11 , and is also used to generate a second sensing signal when the jig body 12 is not detected to be placed in the carrier plate 11 .

[0040] In some embodiments, there are multiple sensors 13. The setting of multiple sensors 13 can significantly increase the redundancy of detection. When the environment changes or a single sensor 13 fails, other sensors 13 can still work independently to ensure the normal operation of the system. Secondly, the setting of multiple sensors 13 can improve the credibility and accuracy of the signal. By comparing and fusing data from different sensors 13, abnormal values ​​can be automatically identified and corrected. If the signal reported by a sensor 13 is abnormal, the reliability of the signal can be judged by comparing the data of other sensors 13, thereby ensuring that the final output signal is more accurate.

[0041] In some embodiments, the type of sensor 13 is a photoelectric sensor 13. It can be understood that the photoelectric sensor 13 is a sensor 13 that uses the photoelectric effect or the change of light to detect objects, environments or specific conditions. For example, the photoelectric sensor 13 may include a photoelectric switch, a reflective photoelectric sensor 13, a transmissive photoelectric sensor 13, a laser photoelectric sensor 13 or an optical fiber sensor 13. Among them, the photoelectric switch works by emitting a light beam and receiving the light reflected by the object. When there is an object in the light beam path, the photoelectric switch will detect the change of light and trigger the corresponding output signal. The reflective photoelectric sensor 13 emits light and directly receives the reflected light from the object to be measured to detect the object. The transmissive photoelectric sensor 13 consists of a transmitter and a receiver. The transmitter projects the light beam onto the receiver. The penetration or obstruction of the object to be measured will affect the transmission of light, thereby changing the signal output of the receiver. The laser photoelectric sensor 13 uses a laser beam for object detection, which has the advantages of high precision and long-distance detection.

[0042] In some embodiments, the sensor 13 includes a receiving sensor 13 and / or a transmitting sensor 13; the transmitting sensor 13 is used to transmit the detection source; the receiving sensor 13 is used to generate a first sensing signal when the detection source is not received, and is also used to generate a second sensing signal when the detection source is received.

[0043] It should be noted that, in some embodiments, the same sensor 13 can be used as both a receiving sensor 13 and a transmitting sensor 13, so that the same sensor 13 is used to transmit the detection source, and a first sensing signal is generated when the sensor 13 does not receive the detection source, and a second sensing signal is generated when the sensor 13 receives the detection source. The sensor 13 in the above embodiment can be a photoelectric switch or a reflective photoelectric sensor 13, etc.

[0044] Alternatively, in some other embodiments, one sensor 13 is used as an emitting sensor 13 for emitting a detection source; another sensor 13 is used as a receiving sensor 13 for generating a first sensing signal when the detection source is not received, and for generating a second sensing signal when the detection source is received. The sensor 13 in the above embodiment may be a transmission type photoelectric sensor 13 or the like.

[0045] In a specific embodiment, the receiving sensor 13 is used to generate a high level signal as a first sensing signal when no detection source is received; and the receiving sensor 13 is also used to generate a low level signal as a second sensing signal when a detection source is received.

[0046] In a specific embodiment, the receiving sensor 13 is used to generate a digital signal "0" as a first sensing signal when no detection source is received; and the receiving sensor 13 is also used to generate a digital signal "1" as a second sensing signal when a detection source is received.

[0047] It is worth noting that the sensor 13 may include but is not limited to one receiving sensor 13 and one transmitting sensor 13. For example, the sensor 13 may include multiple receiving sensors 13 and multiple transmitting sensors 13. Specifically, it may be configured that one receiving sensor 13 corresponds to multiple transmitting sensors 13, or multiple receiving sensors 13 correspond to one transmitting sensor 13, or multiple receiving sensors 13 correspond to multiple transmitting sensors 13 one by one.

[0048] In an embodiment where a receiving sensor 13 corresponds to a plurality of transmitting sensors 13, a receiving sensor 13 is used to transmit a detection source. A plurality of receiving sensors 13 can detect the same detection source to obtain a plurality of first sensing signals. Accordingly, in an embodiment where a plurality of transmitting sensors 13 correspond to a receiving sensor 13, a plurality of transmitting sensors 13 are used to transmit a plurality of detection sources. The receiving sensor 13 can detect a plurality of detection sources to obtain a first sensing signal. Among them, the receiving sensor 13 can perform directionally collection and processing of the detected detection sources by means of beamforming technology. For example, beamforming can adjust the phase difference of detection sources in different directions to form a "beam" in a specific direction. According to the signal delay and amplitude of the plurality of detection sources transmitted by the plurality of transmitting sensors 13, the detected detection sources form a focused beam in a specific direction.

[0049] In some embodiments, the number of receiving sensors 13 is the same as the number of transmitting sensors 13, and the receiving sensors 13 and the transmitting sensors 13 are symmetrically arranged. That is, a plurality of receiving sensors 13 correspond to a plurality of transmitting sensors 13 one by one, and the corresponding receiving sensors 13 and the transmitting sensors 13 are symmetrically arranged.

[0050] In some embodiments, the number of sensors 13 is 2n, where n is a positive integer, that is, the number of sensors 13 is an even number. In the embodiment where the number of sensors 13 is an even number, the sensors 13 are symmetrically arranged on both sides of the tool body 12. In the embodiment where the tool body 12 is circular, the multiple sensors 13 are evenly arranged along the circumference of the tool body 12.

[0051] For example, the controller is connected to the sensor 13, and the controller is used to generate a corresponding control instruction when receiving the first sensing signal or the second sensing signal. In some embodiments, the controller is used to generate a first control instruction when receiving the first sensing signal, that is, the first control instruction is generated when the jig body 12 is placed in the carrier plate 11, and the semiconductor device executes the pause procedure of the preset process when receiving the first control instruction; since the jig body 12 is placed in the carrier plate 11, it can be concluded that the jig body 12 has not been taken out, so the preset process will be suspended to avoid damage to it. Correspondingly, the controller is also used to generate a second control instruction when receiving the second sensing signal, that is, the second control instruction is generated when the jig body 12 is not placed in the carrier plate 11, and the semiconductor device executes the start-up procedure of the preset process when receiving the second control instruction; since the jig body 12 is not placed in the carrier plate 11, it can be concluded that the jig body 12 has been taken out, so the preset process will be started.

[0052] In some embodiments, the controller is connected to the sensor 13 via a communication network. The communication network may be a wired network or a wireless network. For example, the communication network may be a local area network (LAN) or a wide area network (WAN), such as the Internet. The communication network may be implemented using any known network communication protocol, and the network communication protocol may be various wired or wireless communication protocols, such as Ethernet, universal serial bus (USB), FIREWIRE, global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), time-division code division multiple access (TDSCDMA), long term evolution (LTE), Bluetooth, wireless fidelity (WiFi), NFC, voice over Internet protocol (VoIP), communication protocols supporting network slicing architecture, or any other suitable communication protocols.

[0053] In an embodiment where there are multiple sensors 13 , the controller is configured to generate a corresponding control instruction upon receiving a first sensing signal or a second sensing signal from at least one sensor 13 among the multiple sensors 13 .

[0054] In the semiconductor positioning jig 1 of the above-mentioned embodiment, since the sensor 13 is arranged on the outside of the jig body 12, the sensor 13 generates a first sensing signal when it detects that the jig body 12 is placed in the carrier plate 11, and is also used to generate a second sensing signal when it does not detect that the jig body 12 is placed in the carrier plate 11, so as to accurately judge whether the semiconductor positioning jig 1 on the carrier plate 11 is taken away, and generate corresponding control instructions through the controller when receiving the first sensing signal or the second sensing signal, so as to generate corresponding different control instructions under different conditions of whether the semiconductor positioning jig 1 is taken away, thereby avoiding equipment downtime caused by forgetting to take away the semiconductor positioning jig 1.

[0055] In some embodiments, the semiconductor positioning jig 1 further includes an alarm, which is connected to the sensor 13; the alarm is used to generate an alarm signal when receiving the first sensing signal.

[0056] In some embodiments, the sensor 13 and the alarm may be connected by wire or wirelessly. In a wired connection, the signal is transmitted through a cable; in a wireless connection, the sensor 13 sends the signal to the alarm via radio frequency or other wireless communication protocols.

[0057] In some embodiments, the alarm includes an audible and visual alarm. When the alarm receives the first sensing signal, the generated alarm signal is usually output in the form of an audible and visual alarm, such as an alarm sound and a flashing indicator light. In some embodiments, the alarm is further configured to send the alarm signal to the controller after generating the alarm signal. By way of example, the controller is further configured to generate a second control instruction after receiving the alarm signal.

[0058] In some embodiments, the semiconductor positioning jig 1 may further include a fixing component. The fixing component is located on the carrier plate 11 and is used to fix the wafer 14. For example, in an embodiment of a circular jig body 12, the fixing component may be located in a hollow area inside the jig body 12, and fix the wafer 14 after the jig body 12 positions the wafer 14.

[0059] For example, the fixing component can be a vacuum adsorption device, which uses the vacuum negative pressure principle to firmly adsorb the wafer 14 on the carrier plate 11 to ensure stability and accuracy during the processing. It can be understood that the vacuum adsorption device can provide a more uniform contact force and reduce stress concentration to avoid displacement of the wafer 14 during the fixing process after positioning, thereby improving the positioning accuracy of the wafer 14. In addition, the vacuum adsorption device will not apply excessive mechanical pressure to the wafer, thereby reducing the risk of damage and defects to the wafer 14.

[0060] Please refer to Figure 2 According to some embodiments, a semiconductor device 2 is further provided, comprising the semiconductor positioning jig 1 and the cavity 21 in any of the above embodiments, wherein the semiconductor positioning jig 1 is located in the cavity 21 .

[0061] In the semiconductor device 2 of the above embodiment, since the sensor 13 is arranged on the outside of the jig body 12, the sensor 13 generates a first sensing signal when it detects that the jig body 12 is placed in the carrier plate 11, and is also used to generate a second sensing signal when it does not detect that the jig body 12 is placed in the carrier plate 11, so as to accurately judge whether the semiconductor positioning jig 1 on the carrier plate 11 is taken away, and generate corresponding control instructions through the controller when receiving the first sensing signal or the second sensing signal, so as to generate corresponding different control instructions under different conditions of whether the semiconductor positioning jig 1 is taken away, thereby avoiding the downtime of the semiconductor device 2 caused by forgetting to take away the semiconductor positioning jig 1.

[0062] In some embodiments, the semiconductor device 2 is used to perform a preset process when receiving a control instruction. For example, the semiconductor device 2 may include a grinder, and the preset process performed by the semiconductor device 2 includes a grinding process.

[0063] In some embodiments, the controller is used to generate a first control instruction when receiving a first sensing signal, and is also used to generate a second control instruction when receiving a second sensing signal. For example, the semiconductor device 2 is used to execute a pause procedure of a preset process when receiving the first control instruction; the semiconductor device 2 is used to execute a start procedure of a preset process when receiving the second control instruction.

[0064] In the above embodiment, the controller is used to generate a first control instruction when receiving a first sensing signal, that is, to generate a first control instruction when a jig body 12 is placed in the carrier 11, and the semiconductor device 2 is used to execute a pause procedure of a preset process when receiving the first control instruction; since the jig body 12 is placed in the carrier 11, it can be concluded that the jig body 12 has not been taken out, so the semiconductor device 2 will pause the preset process to avoid damage to it. Correspondingly, the controller is also used to generate a second control instruction when receiving a second sensing signal, that is, to generate a second control instruction when no jig body 12 is placed in the carrier 11, and the semiconductor device 2 is used to execute a start procedure of a preset process when receiving the second control instruction; since the jig body 12 is not placed in the carrier 11, it can be concluded that the jig body 12 has been taken out, so the semiconductor device 2 will start the preset process.

[0065] In some embodiments, there are multiple sensors 13 .

[0066] In some embodiments, the sensor 13 is a photoelectric sensor 13 .

[0067] In some embodiments, the sensor 13 includes a receiving sensor 13 and / or a transmitting sensor 13; the transmitting sensor 13 is used to transmit the detection source; the receiving sensor 13 is used to generate a first sensing signal when the detection source is not received, and is also used to generate a second sensing signal when the detection source is received.

[0068] In some embodiments, the number of receiving sensors 13 is the same as the number of transmitting sensors 13 , and the receiving sensors 13 and the transmitting sensors 13 are symmetrically arranged.

[0069] In some embodiments, the number of sensors 13 is 2n, where n is a positive integer.

[0070] In some embodiments, the semiconductor positioning jig 1 further includes an alarm, which is connected to the sensor 13; the alarm is used to generate an alarm signal when receiving the first sensing signal.

[0071] In some embodiments, the semiconductor positioning jig 1 may further include a fixing component. The fixing component is located on the carrier plate 11 and is used to fix the wafer 14 .

[0072] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A semiconductor positioning jig, characterized in that: include: Carrying tray; The main body of the tool is placed on the carrier plate and used for positioning the wafer; at least one sensor located outside the jig body; the sensor is used to generate a first sensing signal when the jig body is detected to be placed in the carrier plate, and is also used to generate a second sensing signal when the jig body is not detected to be placed in the carrier plate; A controller is connected to the sensor, and is used to generate a corresponding control instruction when receiving the first sensing signal or the second sensing signal.

2. The semiconductor positioning jig according to claim 1, characterized in that: The number of the sensors is multiple; The controller is configured to generate a corresponding control instruction when receiving the first sensing signal or the second sensing signal from at least one of the multiple sensors.

3. The semiconductor positioning jig according to claim 1, characterized in that: The sensor includes a receiving sensor and / or a transmitting sensor; The transmitting sensor is used to transmit a detection source; the receiving sensor is used to generate the first sensing signal when the detection source is not received, and is also used to generate the second sensing signal when the detection source is received.

4. The semiconductor positioning jig according to claim 3, characterized in that: The number of the receiving sensors is the same as the number of the transmitting sensors, and the receiving sensors and the transmitting sensors are symmetrically arranged.

5. The semiconductor positioning jig according to claim 1, characterized in that: The number of the sensors is 2n, where n is a positive integer; The sensors are symmetrically arranged on both sides of the jig body.

6. The semiconductor positioning jig according to claim 2, characterized in that: The main body of the tool is circular; The multiple sensors are evenly arranged along the circumference of the jig body.

7. The semiconductor positioning jig according to claim 1, characterized in that: The type of sensor is a photoelectric sensor.

8. The semiconductor positioning jig according to claim 1, characterized in that: It also includes an alarm, which is connected to the sensor; the alarm is used to generate an alarm signal when the first sensing signal is received.

9. A semiconductor device, characterized in that: It comprises a semiconductor positioning jig and a cavity as described in any one of claims 1 to 8, wherein the semiconductor positioning jig is located in the cavity.

10. The semiconductor device according to claim 9, characterized in that The semiconductor device is used to execute a preset process when receiving the control instruction.

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